Altera

EPF6024ATC144-3N - 24K Gates FLEX 6000 FPGA, 144-LQFP | Altera / Intel

N.º da peça: EPF6024ATC144-3N ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

3.3 V Vdss 144-pin LQFP (TQFP, 1.4 mm height) Package 142.86 MHz Speed

A partir de $21.4 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-11

Preços por volume

Qtd.	Preço unitário	Total
1	$38.5	$38,50
10	$34.2	$342,00
100	$28.75	$2.875,00
500	$24.1	$12.050,00
1.000	$21.4	$21.400,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

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EPF6024ATC144-3N Visão geral

The Altera (now Intel) EPF6024ATC144-3N is a member of the FLEX 6000 family of Field-Programmable Gate Array (FPGA) devices, delivering 24,000 typical gates and 1,960 logic elements in a 144-pin LQFP surface-mount package. It is fabricated on a 0.42 µm CMOS process and operates from a 3.3 V core supply with user I/O banks that support 3.3 V and 5.0 V mixed-voltage interfacing. The device provides 117 user I/O pins, 196 Logic Array Blocks (LABs), and an internal performance grade supporting up to 142.86 MHz (speed grade -3).

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architecture of gate arrays with user-programmable interconnect and logic resources. FPGAs sit at the top of the programmable logic hierarchy: simple PLD -> CPLD -> FPGA -> SoC FPGA. They are widely used for glue logic, custom state machines, bus interfacing, and pre-silicon prototyping where ASIC NRE costs are not justified. The FLEX 6000 series was Altera's low-cost, SRAM-based family optimized for high-volume, cost-sensitive designs such as consumer electronics, peripheral controllers, and industrial glue logic.

Key features of the EPF6024ATC144-3N include 196 LABs each containing 16 Logic Elements (LEs), dedicated carry chains for fast arithmetic, a Cascade Chain for wide fan-in logic, embedded SRAM via the Configurable Logic Array (CLA) architecture, and JTAG-based IEEE 1149.1 boundary-scan support. The device supports in-system configuration via the Passive Serial (PS), Passive Parallel Synchronous (PPS), and Passive Parallel Asynchronous (PPA) modes. MultiVolt I/O allows each I/O bank to be powered independently at 3.3 V or 5.0 V for mixed-voltage designs.

Architecturally, the FLEX 6000 family uses a continuous, SRAM-based routing fabric (FastTrack Interconnect) that delivers predictable timing across the device. The 0.42 µm four-metal-layer process, combined with the LUT-based logic element, makes the EPF6024ATC144-3N suitable for designs requiring up to ~16,000 usable gates. Configuration data is stored in an external serial or parallel PROM (EPC1, EPC2, EPC16) and loaded on power-up; the device can also be reconfigured in-system for design updates or field upgrades.

Typical applications include peripheral bus bridging (PCI, ISA, VME), custom peripheral controllers in telecom line cards, industrial glue logic, glue and bridging logic in legacy system designs, low-cost DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 144-LQFP footprint is friendly to standard SMT assembly lines and 4-layer FR-4 PCB designs, making it ideal for cost-driven production where fine-pitch BGA rework is undesirable.

When designing with the EPF6024ATC144-3N, pay attention to I/O bank voltage grouping. The VCCINT pins must connect to a tightly-decoupled 3.3 V rail, while VCCIO pins can be grouped per-bank at 3.3 V or 5.0 V. Unused I/O pins should be left floating or driven to a defined logic level after configuration. This device is now obsolete per Intel/Altera lifecycle; consider the MAX II or Cyclone series for new designs, but verify pin-by-pin compatibility before swapping.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers an actionable reference for sourcing the EPF6024ATC144-3N and qualifying alternates for obsolete-stock designs.

Alternativas drop-in para EPF6024ATC144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6024ATC144-3N (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Speed Grade, Configuration Memory.

EPF6016ATC144-3N

Intel

Package: TQFP-144

Process Technology: 0.42 micron CMOS

Operating Temperature: Commercial (0C to +70C)