LCMXO3D-9400HC-6BG484C - 9400 LUT FPGA, 484-BGA | Lattice
部品番号: LCMXO3D-9400HC-6BG484C ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.1 | $2,810.00 |
| 500 | $22.05 | $11,025.00 |
| 1,000 | $18.4 | $18,400.00 |
LCMXO3D-9400HC-6BG484C 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can customize post-manufacturing. The MachXO3D belongs to Lattice's ultra-low-power control-FPGA hierarchy: control FPGA -> low-density FPGA -> programmable logic -> semiconductor. It augments conventional glue-logic CPLDs with deterministic fabric and parallel processing for bridging, control, and secure-boot tasks.
Key features include up to 9400 LUTs, 73 Kbits of distributed RAM, 96 Kbits of embedded block RAM (EBR), up to 383 user I/Os supporting LVCMOS 1.2/1.5/1.8/2.5/3.3 V, dual-configuration images via on-chip flash, and integrated security engines including AES-256, HMAC-SHA-256, ECDSA-256, and a unique device identifier. The -6 speed grade targets higher system-clock Fmax while retaining the ultra-low-power characteristics of the family.
The architecture combines a non-volatile configuration memory cell on a 40 nm CMOS process, embedded PLLs, hard I2C/SPI/UART controllers, and on-chip flash configuration storage, eliminating the external boot flash required by SRAM-based FPGAs. Hardened security blocks accelerate cryptographic operations and reduce fabric utilization for crypto functions.
Typical applications include secure platform boot and Root-of-Trust, industrial control bridging (I2C/SPI to RGMII), motor control and human-machine interface (HMI) glue logic, IoT edge-device secure attach, and automotive functional-safety co-processor functions in conjunction with a host MCU.
When designing with this device, follow Lattice's recommended decoupling strategy (typically 0.1 µF and 10 µF near each power pin) and verify JTAG/SPI programming timing against the chosen configuration image size. The -6 speed grade consumes marginally more power than -5/-4 grades, so power budgets should be revalidated against the firmware image.
ドロップイン代替品: LCMXO3D-9400HC-6BG484C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LCMXO3D-9400HC-6BG484C （同一形状・フットプリント） — 相違点: Configuration Memory, Mounting Type, Package Type, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
LCMXO3D-9400HC-5BG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3D-9400HC-6BG484I
✅ ドロップイン✓ 在庫あり
$71.1 / 個
データシートを見る →LCMXO3-9400C-6BG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3D-9400HC-6BG484C 最大定格＆電気的特性
| Family | MachXO3D |
| Number of Logic Elements / LUTs | 9400 LUTs |
| Number of User I/O | 383 |
| Total Embedded Memory (bits) | 442368 |
| Embedded Block RAM - EBR (kbits) | 96 kbits |
| Number of PLLs | 2 |
| 電源電圧 | 2.5 V / 3.3 V (core 1.2 V) |
| Speed Grade | -6 |
| 動作温度 | Commercial (0C to +85C) |
| Package Type | LFBGA-484 (BG484) |
| 実装タイプ | Surface Mount |
| Security Engines | AES-256, HMAC-SHA-256, ECDSA-256, unique ID |
| Configuration Memory | Internal flash + dual-boot external SPI |
| RoHS ステータス | Compliant |
LCMXO3D-9400HC-6BG484C lfbga-484 (bg484) ピン配置ガイド
LCMXO3D-9400HC-6BG484C (lfbga-484 (bg484) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LCMXO3D-9400HC-6BG484C.
詳細は データシート をご参照ください。
主な用途
LCMXO3D-9400HC-6BG484C の用途: 6 件s: Hardware Root-of-Trust (RoT) for Platform Boot, Industrial I/O Bridging and Glue Logic, Motor Control and HMI Front-End, Secure IoT Edge Device Attach, Automotive Functional-Safety Co-Processor, Display Aggregation and LED Matrix Driving.
Hardware Root-of-Trust (RoT) for Platform Boot
The LCMXO3D-9400HC-6BG484C's hardened AES-256, HMAC-SHA-256, and ECDSA-256 engines plus immutable boot ROM make it ideal as a platform Root-of-Trust companion to a host application processor. Placed upstream of the host MCU/MPU reset line, the FPGA verifies signed firmware on every power-up, refuses to release RESET until a valid signature is confirmed, and supports secure firmware rollback via dual-configuration flash. Per the Lattice MachXO3D product brief, the same fabric can simultaneously enforce measured boot, sealed-key storage, and TPM-like functions without external crypto ICs.
おすすめ
Industrial I/O Bridging and Glue Logic
With 383 user I/Os across multiple banks supporting 1.2/1.5/1.8/2.5/3.3 V, the LCMXO3D-9400HC-6BG484C replaces multiple CPLDs and discrete level shifters when bridging RGMII, USB, I2C, SPI, UART, and parallel LVCMOS buses. The 9400 LUT fabric absorbs custom protocol conversion (e.g., SPI-to-I2C, UART-to-parallel) and the on-chip PLLs deskew incoming clocks. Industrial PLC and gateway designs use this density to consolidate multiple bridging macros onto a single non-volatile part.
おすすめ
Motor Control and HMI Front-End
The 9400 LUT fabric and dual on-chip PLLs make the LCMXO3D-9400HC-6BG484C well suited as the front-end for field-oriented control (FOC) motor drives and HMI panels. The FPGA generates PWM/encoder timers, performs sigma-delta ADC interfacing, and drives RGB LCD/LED matrices with deterministic latency. Its instant-on non-volatile configuration boots in microseconds, eliminating the long FPGA-init delay that complicates safety-critical motor-start sequences.
おすすめ
Secure IoT Edge Device Attach
IoT edge gateways leverage the LCMXO3D-9400HC-6BG484C for secure attach between a low-power MPU and cloud radios (LTE-M, NB-IoT, LoRa, Wi-Fi 6 modules). The FPGA handles authenticated provisioning (HMAC-SHA-256 device identity), key injection, and OTA-decryption offload, reducing MPU wake-time and energy budget. Because configuration lives in on-chip flash, the device survives brown-outs without bricking - critical for battery-powered edge nodes.
おすすめ
Automotive Functional-Safety Co-Processor
For ISO 262ASIL-B and ASIL-D subsystems, the LCMXO3D-9400HC-6BG484C acts as a watchdog and safety co-processor supervising a host MCU through duplicated input sampling and Heartbeat/Safety-IO expansion. Automotive-grade MachXO3D members carry AEC-Q100 qualification; the commercial-temperature device shown here can be substituted by an equivalent automotive-grade MPN when targeting vehicle ECUs.
おすすめ
Display Aggregation and LED Matrix Driving
The 383 user I/Os of the LCMXO3D-9400HC-6BG484C are sufficient to drive multi-panel RGB LED walls, LVDS display bridges, and HDMI-to-parallel aggregator boards. The fabric pipelines pixel data from one high-speed LVDS/HDMI input to multiple 24-bit parallel outputs at low latency, while the hardware crypto engines authenticate firmware updates to the LED-controller subsystem.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LCMXO3D-9400HC-6BG484C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LCMXO3D-9400HC-5BG484C | LCMXO3D-9400HC-6BG484I | LCMXO3-9400C-6BG484C | LCMXO3D-6900HC-6BG400C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | LFBGA-484 | LFBGA-484 - same | LFBGA-484 - same | LFBGA-484 - same | LFBGA-400 - different (smaller BGA) |
| LUTs | 9400 | 9400 | 9400 | 9400 | 6900 (-27%) |
| User I/O | 383 | 383 | 383 | 383 | 335 |
| Embedded Memory (kbits) | 442 | 442 | 442 | 442 | 320 |
| Speed Grade | -6 (highest Fmax) | -5 (lower Fmax) | -6 | -6 | -6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Security Engines (AES/HMAC/ECDSA) | Yes (hardware) | Yes | Yes | No (MachXO3 lacks RoT) | Yes |
| On-chip Flash Configuration | Dual-boot | Dual-boot | Dual-boot | Single image | Dual-boot |
主な差別化要因
- Hardened hardware Root-of-Trust with AES-256 / HMAC / ECDSA （vs LCMXO3-9400C-6BG484C)
- Dual-boot on-chip flash configuration （vs LCMXO3-9400C-6BG484C)
- Instant-on non-volatile fabric boots in microseconds （vs SRAM-based FPGAs (e.g., Xilinx XC7A-series))
設計ノート
Estimated: the MachXO3D core draws roughly 1.2 V and each VCCIO bank can be set independently to 1.2-3.3 V. Decouple each supply pin with a 0.1 µF X7R ceramic placed within 5 mm of the ball, plus a bulk 10 µF per supply rail near the device. Unused VCCIO banks should still be tied to a valid rail, not floated, to avoid I/O behavior drift on power-up.
Estimated: the LFBGA-484 has 0.8 mm ball pitch on a 19 mm x 19 mm body. Use at least 4 PCB layers with one solid ground plane directly under the FPGA. Matched-length routing (within 150 mil) is required for high-speed LVDS pairs used in display bridges, and all JTAG/SPI programming pins should be brought out to test points to enable post-assembly firmware loading.
Estimated: when using the FPGA as an I2C/SPI/UART aggregator, enable the internal weak pull-ups only when no external pull-ups exist; mixing internal and external pull-ups can stretch rise times and break protocol compliance. Series-terminate clock lines running faster than 50 MHz with 33 Ω resistors placed close to the driver.
Estimated: never leave dual-boot SPI flash chip-select (SPID[7:0]) floating; the configuration controller requires deterministic logic levels at boot. During JTAG programming, ensure MSEL pins are in the JTAG mode (01) before powering up, or the part may attempt SPI boot and ignore the JTAG chain.
コンプライアンス情報
RoHS/REACH compliant per Lattice materials declaration. Commercial temperature grade only - this part is not AEC-Q100. Pick the MachXO3D-9400HC automotive-grade equivalent for vehicle designs.
