LCMXO3D-9400HC-6BG484C - 9400 LUT FPGA, 484-BGA | Lattice
부품 번호: LCMXO3D-9400HC-6BG484C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.1 | $2,810.00 |
| 500 | $22.05 | $11,025.00 |
| 1,000 | $18.4 | $18,400.00 |
LCMXO3D-9400HC-6BG484C 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can customize post-manufacturing. The MachXO3D belongs to Lattice's ultra-low-power control-FPGA hierarchy: control FPGA -> low-density FPGA -> programmable logic -> semiconductor. It augments conventional glue-logic CPLDs with deterministic fabric and parallel processing for bridging, control, and secure-boot tasks.
Key features include up to 9400 LUTs, 73 Kbits of distributed RAM, 96 Kbits of embedded block RAM (EBR), up to 383 user I/Os supporting LVCMOS 1.2/1.5/1.8/2.5/3.3 V, dual-configuration images via on-chip flash, and integrated security engines including AES-256, HMAC-SHA-256, ECDSA-256, and a unique device identifier. The -6 speed grade targets higher system-clock Fmax while retaining the ultra-low-power characteristics of the family.
The architecture combines a non-volatile configuration memory cell on a 40 nm CMOS process, embedded PLLs, hard I2C/SPI/UART controllers, and on-chip flash configuration storage, eliminating the external boot flash required by SRAM-based FPGAs. Hardened security blocks accelerate cryptographic operations and reduce fabric utilization for crypto functions.
Typical applications include secure platform boot and Root-of-Trust, industrial control bridging (I2C/SPI to RGMII), motor control and human-machine interface (HMI) glue logic, IoT edge-device secure attach, and automotive functional-safety co-processor functions in conjunction with a host MCU.
When designing with this device, follow Lattice's recommended decoupling strategy (typically 0.1 µF and 10 µF near each power pin) and verify JTAG/SPI programming timing against the chosen configuration image size. The -6 speed grade consumes marginally more power than -5/-4 grades, so power budgets should be revalidated against the firmware image.
드롭인 대체품: LCMXO3D-9400HC-6BG484C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LCMXO3D-9400HC-6BG484C (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, Mounting Type, Package Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
LCMXO3D-9400HC-5BG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LCMXO3D-9400HC-6BG484I
✅ 드롭인✓ 재고 있음
$71.1 / 개
데이터시트 보기 →LCMXO3-9400C-6BG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LCMXO3D-9400HC-6BG484C 최대 정격 & 전기적 특성
| Family | MachXO3D |
| Number of Logic Elements / LUTs | 9400 LUTs |
| Number of User I/O | 383 |
| Total Embedded Memory (bits) | 442368 |
| Embedded Block RAM - EBR (kbits) | 96 kbits |
| Number of PLLs | 2 |
| 공급 전압 | 2.5 V / 3.3 V (core 1.2 V) |
| Speed Grade | -6 |
| 동작 온도 | Commercial (0C to +85C) |
| Package Type | LFBGA-484 (BG484) |
| 실장 유형 | Surface Mount |
| Security Engines | AES-256, HMAC-SHA-256, ECDSA-256, unique ID |
| Configuration Memory | Internal flash + dual-boot external SPI |
| RoHS 상태 | Compliant |
LCMXO3D-9400HC-6BG484C lfbga-484 (bg484) 핀 구성 가이드
LCMXO3D-9400HC-6BG484C(lfbga-484 (bg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LCMXO3D-9400HC-6BG484C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LCMXO3D-9400HC-6BG484C 적합 용도: 6 애플리케이션s: Hardware Root-of-Trust (RoT) for Platform Boot, Industrial I/O Bridging and Glue Logic, Motor Control and HMI Front-End, Secure IoT Edge Device Attach, Automotive Functional-Safety Co-Processor, Display Aggregation and LED Matrix Driving.
Hardware Root-of-Trust (RoT) for Platform Boot
The LCMXO3D-9400HC-6BG484C's hardened AES-256, HMAC-SHA-256, and ECDSA-256 engines plus immutable boot ROM make it ideal as a platform Root-of-Trust companion to a host application processor. Placed upstream of the host MCU/MPU reset line, the FPGA verifies signed firmware on every power-up, refuses to release RESET until a valid signature is confirmed, and supports secure firmware rollback via dual-configuration flash. Per the Lattice MachXO3D product brief, the same fabric can simultaneously enforce measured boot, sealed-key storage, and TPM-like functions without external crypto ICs.
추천
Industrial I/O Bridging and Glue Logic
With 383 user I/Os across multiple banks supporting 1.2/1.5/1.8/2.5/3.3 V, the LCMXO3D-9400HC-6BG484C replaces multiple CPLDs and discrete level shifters when bridging RGMII, USB, I2C, SPI, UART, and parallel LVCMOS buses. The 9400 LUT fabric absorbs custom protocol conversion (e.g., SPI-to-I2C, UART-to-parallel) and the on-chip PLLs deskew incoming clocks. Industrial PLC and gateway designs use this density to consolidate multiple bridging macros onto a single non-volatile part.
추천
Motor Control and HMI Front-End
The 9400 LUT fabric and dual on-chip PLLs make the LCMXO3D-9400HC-6BG484C well suited as the front-end for field-oriented control (FOC) motor drives and HMI panels. The FPGA generates PWM/encoder timers, performs sigma-delta ADC interfacing, and drives RGB LCD/LED matrices with deterministic latency. Its instant-on non-volatile configuration boots in microseconds, eliminating the long FPGA-init delay that complicates safety-critical motor-start sequences.
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Secure IoT Edge Device Attach
IoT edge gateways leverage the LCMXO3D-9400HC-6BG484C for secure attach between a low-power MPU and cloud radios (LTE-M, NB-IoT, LoRa, Wi-Fi 6 modules). The FPGA handles authenticated provisioning (HMAC-SHA-256 device identity), key injection, and OTA-decryption offload, reducing MPU wake-time and energy budget. Because configuration lives in on-chip flash, the device survives brown-outs without bricking - critical for battery-powered edge nodes.
추천
Automotive Functional-Safety Co-Processor
For ISO 262ASIL-B and ASIL-D subsystems, the LCMXO3D-9400HC-6BG484C acts as a watchdog and safety co-processor supervising a host MCU through duplicated input sampling and Heartbeat/Safety-IO expansion. Automotive-grade MachXO3D members carry AEC-Q100 qualification; the commercial-temperature device shown here can be substituted by an equivalent automotive-grade MPN when targeting vehicle ECUs.
추천
Display Aggregation and LED Matrix Driving
The 383 user I/Os of the LCMXO3D-9400HC-6BG484C are sufficient to drive multi-panel RGB LED walls, LVDS display bridges, and HDMI-to-parallel aggregator boards. The fabric pipelines pixel data from one high-speed LVDS/HDMI input to multiple 24-bit parallel outputs at low latency, while the hardware crypto engines authenticate firmware updates to the LED-controller subsystem.
추천
추천 제품 요약
엔지니어링 참조 데이터: LCMXO3D-9400HC-6BG484C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LCMXO3D-9400HC-5BG484C | LCMXO3D-9400HC-6BG484I | LCMXO3-9400C-6BG484C | LCMXO3D-6900HC-6BG400C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | LFBGA-484 | LFBGA-484 - same | LFBGA-484 - same | LFBGA-484 - same | LFBGA-400 - different (smaller BGA) |
| LUTs | 9400 | 9400 | 9400 | 9400 | 6900 (-27%) |
| User I/O | 383 | 383 | 383 | 383 | 335 |
| Embedded Memory (kbits) | 442 | 442 | 442 | 442 | 320 |
| Speed Grade | -6 (highest Fmax) | -5 (lower Fmax) | -6 | -6 | -6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Security Engines (AES/HMAC/ECDSA) | Yes (hardware) | Yes | Yes | No (MachXO3 lacks RoT) | Yes |
| On-chip Flash Configuration | Dual-boot | Dual-boot | Dual-boot | Single image | Dual-boot |
주요 차별점
- Hardened hardware Root-of-Trust with AES-256 / HMAC / ECDSA (vs LCMXO3-9400C-6BG484C)
- Dual-boot on-chip flash configuration (vs LCMXO3-9400C-6BG484C)
- Instant-on non-volatile fabric boots in microseconds (vs SRAM-based FPGAs (e.g., Xilinx XC7A-series))
설계 노트
Estimated: the MachXO3D core draws roughly 1.2 V and each VCCIO bank can be set independently to 1.2-3.3 V. Decouple each supply pin with a 0.1 µF X7R ceramic placed within 5 mm of the ball, plus a bulk 10 µF per supply rail near the device. Unused VCCIO banks should still be tied to a valid rail, not floated, to avoid I/O behavior drift on power-up.
Estimated: the LFBGA-484 has 0.8 mm ball pitch on a 19 mm x 19 mm body. Use at least 4 PCB layers with one solid ground plane directly under the FPGA. Matched-length routing (within 150 mil) is required for high-speed LVDS pairs used in display bridges, and all JTAG/SPI programming pins should be brought out to test points to enable post-assembly firmware loading.
Estimated: when using the FPGA as an I2C/SPI/UART aggregator, enable the internal weak pull-ups only when no external pull-ups exist; mixing internal and external pull-ups can stretch rise times and break protocol compliance. Series-terminate clock lines running faster than 50 MHz with 33 Ω resistors placed close to the driver.
Estimated: never leave dual-boot SPI flash chip-select (SPID[7:0]) floating; the configuration controller requires deterministic logic levels at boot. During JTAG programming, ensure MSEL pins are in the JTAG mode (01) before powering up, or the part may attempt SPI boot and ignore the JTAG chain.
규정 준수 정보
RoHS/REACH compliant per Lattice materials declaration. Commercial temperature grade only - this part is not AEC-Q100. Pick the MachXO3D-9400HC automotive-grade equivalent for vehicle designs.
