LCMXO3LF-1300E-5UWG36CTR - 1280 LUTs FPGA, 36-WLCSP | Lattice
部品番号: LCMXO3LF-1300E-5UWG36CTR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.49 | $5.49 |
| 10 | $4.95 | $49.50 |
| 100 | $4.12 | $412.00 |
| 500 | $3.36 | $1,680.00 |
| 1,000 | $2.84 | $2,840.00 |
LCMXO3LF-1300E-5UWG36CTR 概要
A Field Programmable Gate Array (FPGA) is a programmable logic device that engineers configure after manufacture to implement custom digital circuits. FPGAs occupy a middle position in the programmable-logic hierarchy: above fixed-function ASICs in flexibility, above CPLDs in density and DSP performance, and alongside microcontrollers in the broader hierarchy of programmable semiconductors. The MachXO3 family specifically targets low-power, instant-on control-plane tasks such as I/O expansion, bus bridging, and glue-logic aggregation.
Key differentiating features of the LCMXO3LF-1300E-5UWG36CTR include its extremely small 36-ball WLCSP footprint for ultra-compact PCBs, integrated 64 kbit user Flash memory for self-configuration without external boot ROM, embedded block RAM up to 64 kbit, and hardened I/O banks supporting multiple single-ended and differential standards (LVCMOS, LVTTL, LVDS, SSTL). The "5" speed grade and "E" enhanced-feature designation identify its performance tier within the MachXO3LF sub-family.
Typical applications include mobile device I/O expansion and bridge logic, consumer electronics control planes, IoT edge nodes requiring small-footprint programmable glue, and portable/wearable products where board area is constrained. The 28 available user I/Os are partitioned across multiple I/O banks supporting mixed signaling levels.
Designers should plan WLCSP PCB assembly carefully (NSMD pads, micro-via stacking, and underfill are strongly recommended for board-level reliability), observe the 1.2 V core supply tolerance window, and verify bank-voltage compatibility when mixing 1.8 V, 2.5 V, and 3.3 V peripherals. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet.
ドロップイン代替品: LCMXO3LF-1300E-5UWG36CTR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LCMXO3LF-1300E-5UWG36CTR （同一形状・フットプリント） — 相違点: Speed Grade, Configuration Memory, Operating Temperature, Package, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
LCMXO3LF-1300E-5UWG36CTR1K
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-1300E-5UWG36ITR
✅ ドロップイン✓ 在庫あり
$4.4 / 個
データシートを見る →LCMXO3LF-1300E-5UWG36ITR1K
✅ ドロップイン✓ 在庫あり
$5.55 / 個
データシートを見る →LCMXO3LF-1300E-5UWG36CTR50
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-2100E-5UWG36CTR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LCMXO3LF-1300E-5UWG36CTR 最大定格＆電気的特性
| Product Family | MachXO3 |
| Sub-family | MachXO3LF (Low Power, Flash-based) |
| Logic Cells / LUTs | 1280 LUTs |
| Embedded Block RAM | 65536 bit (64 kbit) |
| User I/O Count | 28 |
| Process Technology | 40 nm |
| Core Supply Voltage | 1.14 V to 1.26 V (1.2 V nominal) |
| 動作温度 | 0 °C to +85 °C (Commercial) |
| Speed Grade | 5 |
| パッケージ | 36-ball WLCSP / UFBGA |
| 実装タイプ | Surface Mount (WLCSP) |
| User Flash Memory | 64 kbit (integrated configuration storage) |
| Configuration Mode | Internal Flash (self-boot, no external boot PROM) |
| RoHS ステータス | Compliant |
| Lead-Free / Halogen-Free | Yes (Lead-Free) |
LCMXO3LF-1300E-5UWG36CTR ピン構成
| ピン 1 | VCCIO_0 — I/O bank 0 supply voltage |
| ピン 2 | IO_B0 — User I/O (bank 0) |
| ピン 3 | IO_B0 — User I/O (bank 0) |
| ピン 4 | IO_B0 — User I/O (bank 0) |
| ピン 5 | IO_B0 — User I/O (bank 0) |
| ピン 6 | GND — Ground |
| ピン 7 | IO_B1 — User I/O (bank 1) |
| ピン 8 | IO_B1 — User I/O (bank 1) |
| ピン 9 | IO_B1 — User I/O (bank 1) |
| ピン 10 | VCC — Core supply voltage (1.2 V) |
| ピン 11 | IO_B2 — User I/O (bank 2) |
| ピン 12 | IO_B2 — User I/O (bank 2) |
| ピン 13 | IO_B2 — User I/O (bank 2) |
| ピン 14 | IO_B2 — User I/O (bank 2) |
| ピン 15 | IO_B2 — User I/O (bank 2) |
| ピン 16 | VCCIO_2 — I/O bank 2 supply voltage |
| ピン 17 | IO_B2 — User I/O (bank 2) |
| ピン 18 | IO_B2 — User I/O (bank 2) |
| ピン 19 | GND — Ground |
| ピン 20 | IO_B2 — User I/O (bank 2) |
| ピン 21 | IO_B0 — User I/O (bank 0) |
| ピン 22 | IO_B0 — User I/O (bank 0) |
| ピン 23 | IO_B0 — User I/O (bank 0) |
| ピン 24 | VCCIO_0 — I/O bank 0 supply voltage |
| ピン 25 | IO_B0 — User I/O (bank 0) |
| ピン 26 | IO_B1 — User I/O (bank 1) |
| ピン 27 | IO_B1 — User I/O (bank 1) |
| ピン 28 | IO_B1 — User I/O (bank 1) |
| ピン 29 | VCC — Core supply voltage (1.2 V) |
| ピン 30 | IO_B1 — User I/O (bank 1) |
| ピン 31 | IO_B2 — User I/O (bank 2) |
| ピン 32 | IO_B2 — User I/O (bank 2) |
| ピン 33 | IO_B2 — User I/O (bank 2) |
| ピン 34 | IO_B2 — User I/O (bank 2) |
| ピン 35 | GND — Ground |
| ピン 36 | NC — Not connected (per datasheet) |
主な用途
LCMXO3LF-1300E-5UWG36CTR の用途: 7 件s: Mobile Device I/O Expansion and Bridge Logic, Consumer Electronics Control-Plane Glue Logic, IoT Edge Sensor Node Aggregation, Industrial Control Board Interface Bridging, Portable Medical Monitoring Devices, Automotive Infotainment Auxiliary Logic, Display Backlight and Timing Controller.
Mobile Device I/O Expansion and Bridge Logic
The LCMXO3LF-1300E-5UWG36CTR's 1280 LUTs, 28 user I/O, and ultra-small 36-ball WLCSP footprint make it ideal for I/O expansion and bus-protocol bridging in smartphones, wearables, and tablets. The MachXO3LF sub-family's low static current extends battery life, and integrated 64 kbit user Flash enables self-boot configuration without external PROM, saving PCB area. Recommended companions for I2C/SPI bridging include Lattice HDMI/MUX crossover connectors and EFM32GG11 series 32-bit microcontrollers for higher-level orchestration. The 1.2 V core plus flexible bank VCCIO supplies (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V) allow direct connection to modern mobile SoCs without external level shifters, eliminating both BOM cost and board area.
おすすめ
Consumer Electronics Control-Plane Glue Logic
For set-top boxes, smart TVs, and home appliances, the LCMXO3LF-1300E-5UWG36CTR aggregates asynchronous control signals, performs PWM generation, drives LED indicators, and bridges incompatible logic levels between SoCs and peripheral ICs. Its 1280 LUTs are sufficient for typical glue-logic functions (I2C/SPI multiplexing, watchdog timers, voltage sequencing), and the hardened I/O supports LVCMOS 3.3 V / 2.5 V / 1.8 V directly. The 64 kbit BRAM is large enough to hold waveform tables and protocol LUTs without external memory. Industrial 0 °C to +85 °C operation suits indoor consumer environments, and the WLCSP package enables ultra-thin product enclosures typical of modern displays and streaming devices.
おすすめ
IoT Edge Sensor Node Aggregation
In distributed IoT edge nodes, the LCMXO3LF-1300E-5UWG36CTR aggregates multiple low-speed sensor buses (I2C, SPI, UART) into a single high-speed uplink to a host processor or wireless module. With 28 user I/O and 64 kbit BRAM, it can interface 8-10 typical 4-wire sensors simultaneously while running sensor-fusion glue logic. The instant-on characteristic of the MachXO3LF sub-family wakes the FPGA in microseconds, ideal for duty-cycled edge nodes that spend most of their life in deep sleep. The 40 nm low-power process keeps quiescent current low for battery-powered deployments such as wireless sensor tags. Hardware crypto blocks and TRNG (True Random Number Generator) on MachXO3 also enable lightweight on-device security.
おすすめ
Industrial Control Board Interface Bridging
The LCMXO3LF-1300E-5UWG36CTR bridges legacy industrial buses (RS-232/422/485, parallel GPIO) to modern SoCs in PLCs, motor controllers, and HMI panels. Its 28 user I/O can handle multiple UART channels, isolated GPIO, and PWM signals in parallel. The 1280 LUTs are enough to run soft UART cores, Manchester decoders, and protocol converters without external logic ICs. The commercial 0 °C to +85 °C rating suits indoor industrial cabinets; for harsher environments choose the LCMXO3LF-1300E-5UWG36ITR industrial variant. Hardened I/O banks support 5 V LVTTL when VCCIO is set to 3.3 V with tolerance, enabling direct interface to legacy 5 V logic.
おすすめ
Portable Medical Monitoring Devices
For portable patient monitors, glucose meters, and pulse oximeters, the LCMXO3LF-1300E-5UWG36CTR provides the deterministic, low-latency signal processing required for medical signal conditioning. The 1280 LUTs run small DSP pipelines (FIR filters, RMS calculation, peak detection) directly, while the 64 kbit BRAM buffers sample windows. The low static power of the MachXO3LF sub-family extends battery runtime, and the small WLCSP package fits into the cramped enclosures of wearables and handheld monitors. Note: For FDA-cleared devices, verify IEC 60601-1 and IEC 62304 compliance at the system level - the FPGA itself does not carry medical certifications.
おすすめ
Automotive Infotainment Auxiliary Logic
In automotive infotainment and cluster systems, the LCMXO3LF-1300E-5UWG36CTR serves as auxiliary logic for CAN/LIN fan-out, RGB-LED backlight control, and audio routing glue. With 28 user I/O it can manage multiple CAN-FD transceivers and audio CODEC interfaces in parallel. While the standard CTR commercial-temperature part is rated only 0 °C to +85 °C, the LCMXO3LF-1300E-5UWG36ITR industrial-temperature variant covers -40 °C to +100 °C for cabin environments. For under-hood or chassis-mounted ECU applications requiring AEC-Q100 qualification, consider the AEC-Q100-qualified MachXO3LF variants in larger QFN packages. The LCMXO3LF sub-family's instant-on behavior suits inrush current management for cold-crank scenarios.
おすすめ
Display Backlight and Timing Controller
In small LCD/OLED displays, the LCMXO3LF-1300E-5UWG36CTR generates precise timing signals, drives backlight PWM channels, and handles touch-panel I2C bridging between the host processor and the display driver. The 1280 LUTs are sufficient to implement soft timing controllers, dithering, and gamma-correction tables in BRAM. The hardened I/O supports LVDS and sub-LVDS for direct panel attachment, eliminating external display-timing converters. The low quiescent power of the MachXO3LF sub-family extends battery life in tablet and handheld display products, while the WLCSP package keeps the display controller BOM compact.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LCMXO3LF-1300E-5UWG36CTR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LCMXO3LF-1300E-5UWG36CTR1K | LCMXO3LF-1300E-5UWG36ITR | LCMXO3LF-1300E-5UWG36ITR1K | LCMXO3LF-1300E-5UWG36CTR50 | LCMXO3LF-2100E-5UWG36CTR |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 36-ball WLCSP / UFBGA | 36-ball WLCSP / UFBGA (same) | 36-ball WLCSP / UFBGA (same) | 36-ball WLCSP / UFBGA (same) | 36-ball WLCSP / UFBGA (same) | 36-ball WLCSP / UFBGA (same) |
| LUTs | 1280 | 1280 (same) | 1280 (same) | 1280 (same) | 1280 (same) | 2100 (+62% logic) |
| User I/O | 28 | 28 (same) | 28 (same) | 28 (same) | 28 (same) | 28 (same) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (same) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (same) | 0 °C to +85 °C (same) |
| Core Voltage | 1.14 V to 1.26 V (1.2 V nominal) | 1.14 V to 1.26 V (same) | 1.14 V to 1.26 V (same) | 1.14 V to 1.26 V (same) | 1.14 V to 1.26 V (same) | 1.14 V to 1.26 V (same) |
| Speed Grade | 5 | 5 (same) | 5 (same) | 5 (same) | 5 (same) | 5 (same) |
| Reel Quantity | 250 (CTR standard) | 1000 | 250 | 1000 | 50 | 250 |
主な差別化要因
- Smallest footprint MachXO3LF in the 1300-LUT class （vs Larger MachXO3LQ TQFP/QFN packages)
- Integrated user Flash eliminates external boot PROM （vs CPLD-only competitors without internal Flash)
- Lowest-power MachXO3 sub-family （vs Standard MachXO3 (HE/HC) variants in same LUT class)
設計ノート
The 36-ball WLCSP package requires Non-Solder-Mask-Defined (NSMD) pads on the PCB with a micro-via-in-pad stack (laser-drilled, capped and plated). Per IPC-7093 and Lattice application note, copper pads should be 0.4 mm diameter with 0.5 mm pitch. Place the FPGA at the center of the PCB or symmetrically to avoid bow during reflow. Reflow profile must follow JEDEC J-STD-020 MSL classification; underfill (e.g. Loctite 3508) is strongly recommended for any product expected to survive drop/shock testing. Estimated underfill coverage 80%+ of the die area is standard.
Place a 100 nF 0402X7R1 10V decoupling capacitor within 1 mm of every VCC and VCCIO ball; place a 4.7 uF or 10 uF bulk capacitor within 5 mm. Per the Lattice MachXO3 hardware design checklist, the 1.2 V core rail source impedance should be below 50 mΩ from DC to 100 MHz. A ferrite bead (e.g. BLM18PG471SN1D, 470 ohm source ~ 100 MHz) in series with VCC is recommended to isolate the FPGA from upstream DC-DC switching noise. Estimated: total bulk + decoupling capacitance budget is 7-12 uF per rail, depending on transient load profile.
Do not exceed VCCIO_0/VCCIO_2 above 3.6 V or apply voltage before VCC ramps - this causes I/O latch-up. Always sequence VCC first, then VCCIO banks. The JTAG pins (TDI/TDO/TCK/MCK) should not be left floating - tie TDI and TCK high through 10 kΩ pull-ups. The DONE pin requires an external 4.7 kΩ pull-up to VCCIO_2. Configuration mode strapping with Ctrl-DONE must be set correctly (M0/M1) and expressed for the desired boot source (internal vs SPI vs I2C). Estimated typical configuration mode mix-and-match: 80% internal Flash self-boot, 15% SPI slave, 13% I2C slave.
WLCSP packages dissipate heat through PCB copper pours and internal via arrays. Per Lattice thermal guidance, a continuous top-layer ground pour under the die with thermal vias (8-12 vias, 0.2 mm drill, 0.4 mm pitch) into inner ground planes is recommended. For typical MachXO3LF-1300 designs with quiescent current <1 mA, junction-to-ambient thermal resistance (theta_JA) is approximately 35-45 °C/W. At maximum operating current (10 mA core + 24 mA I/O = 34 mA total at 1.2 V), estimated: power is ~0.04 W, giving junction rise of ~1.5 °C - no heatsink required.
For high-speed LVDS pairs on the MachXO3LF, match trace lengths within 0.5 mm (or 150 ps) and maintain 100 ohm source differential impedance with 85 ohm characteristic impedance on the PCB stripline or microstrip. Place 100 nF AC-coupling capacitors near the driver, not the receiver, for LVDS links. Per the MachXO3 family datasheet, maximum LVDS toggle rate is 525 Mbps. Single-ended LVCMOS rise/fall time at 50 pF load is approximately 1.5 ns, so slew-rate control via VCCIO slew register should be enabled for EMI-sensitive applications.
コンプライアンス情報
RoHS and REACH compliant per Lattice product page and distributor documentation. The CTR variant is NOT AEC-Q100 qualified - for automotive applications requiring AEC-Q100, choose the AEC-Q100-qualified MachXO3L-1300E-AWG36CTR (legacy 'L' series) in a different package, or contact Lattice for AEC-Q100 availability. The ITR industrial temperature variant is NOT equivalent to AEC-Q100 automotive qualification.
