LPC1114LVFHN24/303 - 50MHz Cortex-M0 32KB MCU | NXP
部品番号: LPC1114LVFHN24/303 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.2 | $1.20 |
| 10 | $1.08 | $10.80 |
| 100 | $0.96 | $96.00 |
| 500 | $0.86 | $430.00 |
| 1,000 | $0.78 | $780.00 |
LPC1114LVFHN24/303 概要
A microcontroller (MCU) is a single-chip computer integrating a processor core, memory, and peripherals, used as the control element in embedded systems. Within this hierarchy, the Cortex-M0 is a 32-bit ARM core, and the LPC11xxLV family from NXP is positioned as a low-cost 32-bit replacement for 8-bit and 16-bit MCU applications, offering higher performance, lower power, and a simple instruction set with reduced code size compared to existing 8/16-bit architectures.
Key features of the LPC1114LVFHN24/303 include the ARM Cortex-M0 core running at 50 MHz, 32 kB on-chip flash (32K x 8), 8 kB SRAM, and a low-voltage supply operation consistent with the LPC1100LV series designation. The compact 24-HVQFN exposed-pad package suits space-constrained designs, and peripherals such as USART, SPI/SSP, I2C, timers, and the 8-bit ADC support typical embedded connectivity and sensing tasks.
The Cortex-M0 architecture uses a von Neumann structure with a 32-bit instruction set subset (56 instructions) and Thumb code density, making code smaller than comparable 8/16-bit cores while delivering deterministic interrupt handling via the Nested Vectored Interrupt Controller (NVIC). The single-cycle I/O porting and configurable pin function multiplexing on the LPC1114 allow flexible peripheral mapping on the limited 24-pin footprint.
According to NXP and Arm Keil documentation, typical applications for the LPC1100LV series include 8/16-bit application migration, eMetering, lighting, alarm systems, and general embedded control. The LPC1114LVFHN24/303 fits designs needing 32-bit performance and 32 kB flash in a 4x4 mm QFN.
Important design consideration: NXP lists the LPC1114LVFHN24 base part as End of Life (per the NXP product page), so verify stock and plan a replacement strategy before new designs; consult the manufacturer datasheet for exact supply voltage limits and pin mapping.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: LPC1114LVFHN24/303 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LPC1114LVFHN24/303 （同一形状・フットプリント） — 相違点: Package.
クイック比較ツール — 並列比較する代替部品を選択:
LPC1114FHN33/303
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LPC1112LVFHN24/003
✅ ドロップイン✓ 在庫あり
$1.62 / 個
データシートを見る →LPC1113LVFHN24/003
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1112LVFHN24/303
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1114FHN33/333
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1114LVFHN24/303 最大定格＆電気的特性
| Core Processor | ARM Cortex-M0 |
| Core Size | 32-Bit |
| 最大クロック周波数 | 50 MHz |
| Flash Memory Size | 32 KB (32K x 8) |
| SRAM Size | 8 KB |
| Series | LPC1100LV |
| ADC Resolution | 8-bit |
| Connectivity | I2C, SPI/SSP, UART/USART |
| パッケージ | 24-HVQFN (4x4 mm), Exposed Pad |
| 実装タイプ | Surface Mount |
| Data Sheet Pages | 53 Pages (per alldatasheet listing) |
| ライフサイクル状態 | End of Life (per NXP product page) |
LPC1114LVFHN24/303 24-hvqfn (4x4 mm), exposed pad ピン配置ガイド
LPC1114LVFHN24/303 (24-hvqfn (4x4 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1114LVFHN24/303.
詳細は データシート をご参照ください。
主な用途
LPC1114LVFHN24/303 の用途: 6 件s: eMetering, Lighting Control (LED and ballast), Alarm and Security Systems, 8/16-bit Application Migration, Industrial Sensing Nodes, IoT Sensor End Nodes.
eMetering
Electricity, water, and gas metering electronics demand long service life, low cost, and reliable serial communication with measurement front-ends. The LPC1114LVFHN24/303 fits this profile: its ARM Cortex-M0 core at 50 MHz delivers far more computation headroom than 8-bit predecessors while the simple 56-instruction Thumb set keeps code compact within the 32 kB flash budget. Its I2C and UART interfaces connect to metrology ADCs and communication modules, and the 8-bit ADC handles auxiliary analog supervision such as tamper detection. Because NXP explicitly lists eMetering as a target application for the LPC1100 series, reference firmware and toolchain support are mature. Designers should manage the 8 kB SRAM carefully for cumulative energy registers and buffering.
おすすめ
Lighting Control (LED and ballast)
Advanced lighting systems require PWM dimming, sensor inputs, and communication (DALI/DMX-over-UART), typically within tight cost and board-area budgets. The LPC1114LVFHN24/303 addresses this with multiple timer outputs on its 24-pin HVQFN footprint, a 50 MHz Cortex-M0 core for smooth high-resolution PWM, and UART/I2C links to drivers and occupancy sensors. The low-voltage LV supply class suits dimmer electronics powered from auxiliary low-voltage rails. The 4x4 mm QFN with exposed pad fits into compact LED driver PCBs, and the 32 kB flash accommodates a full lighting protocol stack. Confirm the LV voltage range against the driver auxiliary supply and use the exposed pad for ground return to reduce switching noise coupling into ADC readings.
おすすめ
Alarm and Security Systems
Alarm panels and security sensors combine low standby power, multiple digital inputs, and reliable communication - a natural fit for the LPC1114LVFHN24/303. The Cortex-M0's deterministic interrupt handling via the NVIC processes sensor events promptly, while the 32 kB flash stores detection algorithms and protocol handling for UART or I2C links to panels and RF modules. The 8-bit ADC supervises battery voltage and tamper loops. NXP names alarm systems explicitly among LPC1100 target applications, so the family's track record in this space eases qualification. In battery-backed sensors, the LV variant's low-voltage operation helps extend runtime from primary cells; verify sleep and deep-sleep currents in the datasheet for your power budget.
おすすめ
8/16-bit Application Migration
The primary purpose of the LPC1100LV family is replacing legacy 8-bit (8051, PIC16) and 16-bit MCUs with a 32-bit ARM core at comparable cost. The LPC1114LVFHN24/303 offers a single-cycle Cortex-M0, free GCC/Keil toolchains, and CMSIS-compliant libraries, so firmware productivity improves even though the instruction set differs. The 32 kB flash and 8 kB SRAM comfortably host applications that challenged 8-bit parts' 16-bit address spaces. Migration requires a new PCB unless the legacy part already used a similar QFN footprint, but hardware BOM cost often falls because fewer external glue components are needed. NXP positions the family explicitly as a performance, power, and code-size upgrade over existing 8/16-bit architectures.
おすすめ
Industrial Sensing Nodes
Factory sensing nodes - temperature probes, limit switches, simple actuators - benefit from the LPC1114LVFHN24/303's combination of an 8-bit ADC, USART, and I2C/SPI peripherals in a compact 4x4 mm QFN. The 50 MHz Cortex-M0 processes sensor linearization and filtering locally, while the UART connects to RS-485 transceivers for noisy industrial buses. The exposed pad provides a solid ground connection important for EMC in electrically harsh environments. Because the part is EOL, industrial users should either secure last-time-buy stock or qualify the pin-compatible LPC1114FHN33/303 as a substitution path. Verify the operating temperature grade and supply range in the datasheet against the node's enclosure thermal profile before deployment.
おすすめ
IoT Sensor End Nodes
Low-cost IoT end nodes pair a small MCU with a radio module and one or two sensors, exactly the role of the LPC1114LVFHN24/303. The Cortex-M0 handles sensor acquisition and protocol framing while a separate BLE or sub-GHz radio (connected via UART/SPI) manages the air interface, keeping the MCU's 32 kB flash and 8 kB SRAM well within budget. The LV low-voltage supply class supports single-cell or low-rail designs typical of battery-powered nodes, and the 4x4 mm QFN preserves board space for the antenna section. Since the part is EOL, prototype with it only if production stock is secured; otherwise select an active MCU with an equivalent footprint-compatible NXP alternative from the LPC11xx HVQFN-24 family.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LPC1114LVFHN24/303 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LPC1114FHN33/303 | LPC1112LVFHN24/003 | LPC1113LVFHN24/003 | LPC1112LVFHN24/303 | LPC1114FHN33/333 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-HVQFN (4x4 mm), Exposed Pad | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same | 24-HVQFN (4x4 mm) - same |
| Core | ARM Cortex-M0, 32-bit | ARM Cortex-M0, 32-bit | ARM Cortex-M0, 32-bit | ARM Cortex-M0, 32-bit | ARM Cortex-M0, 32-bit | ARM Cortex-M0, 32-bit |
| Max Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 32 KB | 32 KB | 16 KB | 24 KB | 16 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Supply Voltage Class | Low-voltage (LPC1100LV series) | Standard (3.3V class) | Low-voltage (LV) | Low-voltage (LV) | Low-voltage (LV) | Standard (3.3V class) |
主な差別化要因
- Full 32 kB flash in the LV low-voltage class （vs LPC1112LVFHN24/003)
- Identical pin-compatible 32 kB option in standard voltage class （vs LPC1114FHN33/303)
- Trade-off: EOL lifecycle status （vs LPC1113LVFHN24/003)
設計ノート
As a member of the LPC1100LV low-voltage family, this MCU targets reduced supply rails compared to the standard 3.3V-class LPC1114FHN33 parts. Before layout, confirm the exact VDD range from the manufacturer datasheet and ensure the local regulator's tolerance stays inside it. Decouple VDD with a 100 nF ceramic placed within 2-3 mm of the HVQFN power pin plus a 4.7-10 uF bulk capacitor per rail. Solder the exposed pad to a grounded copper pour for both thermal relief and a low-inductance ground return - omitting this connection is a common field-failure cause on QFN microcontrollers.
The most frequent integration mistake with EOL LPC111x parts is reusing an outdated schematic-capture symbol with wrong pin-multiplexing defaults. GPIO functions on the LPC1114 are assigned via IOCON registers per pin; UART, I2C (which needs external pull-ups, typically 4.7 kohm at 3V-class rails), and ADC functions must be explicitly enabled. Also, since NXP has published discontinuance notices for the LPC1114LVFHN24, freeze the firmware binary and CMSIS pack versions in your release management so legacy builds remain reproducible when tool vendors deprecate the target.
The 4x4 mm 24-HVQFN footprint requires a 0.5 mm pitch land pattern with the center pad connected to ground via a 4x4 array of 0.3 mm vias for solder pasting and outgassing during reflow. Keep the crystal (XTALIN/XTALOUT) traces under 10 mm, guard them with ground pour, and place 1 mm-maximum-distance load capacitors. Route SWD (SWCLK/SWDIO) to a 2x5 or 1x4 debug header even in production boards - field firmware updates on EOL silicon depend on retained debug access. Follow the footprint and land-pattern recommendations in the NXP datasheet package chapter.
コンプライアンス情報
Compliance data not present in the verified web data; consult the NXP product page Environmental Quality section for the LPC1114LVFHN24 official RoHS/REACH declarations.
