LPC1766FBD100 - 100MHz Cortex-M3 MCU | NXP | Ethernet
部品番号: LPC1766FBD100 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
LPC1766FBD100 概要
A microcontroller is a compact computer integrated onto one semiconductor package. It executes firmware in a Cortex-M3 processor core and connects to sensors, actuators, communications circuits, memory, and human-machine interfaces. The LPC1766 belongs to the 32-bit MCU hierarchy, where integrated peripherals reduce component count and simplify embedded-system design compared with a processor implemented from separate logic devices.
The verified manufacturer and distributor information identifies a 100 MHz maximum operating frequency, 256 kB flash memory, 64 kB SRAM, Ethernet, USB 2.0, and CAN capability. The LQFP-100 package provides 100 accessible leads for power, ground, clock, communications, and digital I/O. Low-power operation is a stated product feature, although exact voltage, current, temperature, flash-endurance, and Ethernet performance limits are not supplied in the provided verified data and therefore are not inferred here.
The integrated communications architecture makes the device suitable for networked embedded equipment. Ethernet supports wired network connectivity, USB 2.0 Host, Device, and OTG operation provides peripheral and portable-device interfaces, and CAN supports robust controller-area-network communications. These interfaces make the MCU suitable for gateways, data loggers, industrial controllers, USB adapters, and equipment that exchanges data through more than one communications standard.
Firmware migration requires particular care even when a device uses the same processor core. A replacement should be checked for identical package dimensions, lead assignments, power architecture, peripheral pin multiplexing, bootloader behavior, interrupt vectors, and memory-map details. The package drawing and datasheet pin table must be compared rather than relying only on the orderable MPN or its temperature suffix.
A practical design should route high-speed Ethernet and USB signals as controlled-impedance differential pairs, keep switching and high-current paths away from sensitive clocks, and provide local decoupling at supply pins. Firmware should enable clock, cache, and peripheral blocks incrementally while checking reset behavior, which makes startup faults easier to isolate than configuring every subsystem simultaneously.
This page consolidates verified manufacturer and distributor facts, distinguishes direct device identity from unconfirmed replacement assumptions, and highlights package, firmware, PCB-layout, and procurement checks that are not apparent from a basic distributor listing alone.
ドロップイン代替品: LPC1766FBD100 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストLPC1766FBD100 最大定格＆電気的特性
| Product Type | 32-bit embedded microcontroller |
| Processor Core | Arm Cortex-M3 |
| Maximum CPU Frequency | 100 MHz |
| Flash Memory | 256 kB |
| Flash Organization | 256K x 8 bits |
| SRAM | 64 kB |
| Ethernet Support | Integrated Ethernet |
| USB Support | USB 2.0 Host, Device, and OTG |
| CAN Support | Controller Area Network |
| パッケージ | 100-lead LQFP, 14 mm x 14 mm |
| 実装タイプ | Surface mount |
| Power Consumption | Low-power operation; exact current values not provided |
LPC1766FBD100 100-lead lqfp, 14 mm x 14 mm ピン配置ガイド
LPC1766FBD100 (100-lead lqfp, 14 mm x 14 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1766FBD100.
詳細は データシート をご参照ください。
主な用途
LPC1766FBD100 の用途: 6 件s: Industrial Ethernet Controller, USB-to-Ethernet Communication Gateway, USB Data Acquisition Controller, CAN Network Control Node, Data Logger with USB and Ethernet, Connected Embedded Control Panel.
Industrial Ethernet Controller
The LPC1766FBD100 fits an industrial Ethernet gateway because it combines a 100 MHz Cortex-M3 core with 256 kB flash, 64 kB SRAM, and integrated Ethernet. The MCU can handle protocol processing and local control without relying on a separate host processor. Place the MCU beneath the Ethernet physical layer and route its differential pairs on a controlled-impedance board layer. Because the verified material does not specify temperature limits or PHY details, those qualifications and the required network magnetics must be confirmed before industrial deployment.
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USB-to-Ethernet Communication Gateway
LPC1766FBD100 can bridge USB 2.0 Host, Device, or OTG connectivity to Ethernet within one 100 MHz microcontroller. Its 256 kB flash and 64 kB SRAM provide dedicated on-chip resources for gateway firmware, while integrated USB and Ethernet reduce controller count. The design must account for cable protection, connector power, Ethernet magnetics, and independent supply requirements. Exact USB electrical limits and Ethernet timing should be taken from the NXP documentation because those values are absent from the verified search snippets.
おすすめ
USB Data Acquisition Controller
The LPC1766FBD100 is suitable for a USB-connected acquisition unit when control software must sample local inputs and transfer data to a host. Its Cortex-M3 architecture executes at up to 100 MHz, while 256 kB flash stores firmware and 64 kB SRAM supports acquisition buffering and USB protocol work. Use USB Device or OTG mode according to the product architecture and preserve clean separation from analog and switching circuits. Application-level timing and throughput must be validated because the supplied data confirms interface support but not performance limits.
おすすめ
CAN Network Control Node
The integrated CAN capability and 100 MHz Cortex-M3 core make LPC1766FBD100 appropriate for a distributed industrial control node. Firmware can handle sensor acquisition, local logic, network management, and diagnostic reporting in one device, while 256 kB flash and 64 kB SRAM provide dedicated code and working memory. The PCB must include an approved CAN transceiver and termination arranged only at intended network endpoints. Bus timing, transceiver tolerances, and fault behavior must be verified from official NXP and transceiver documentation.
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Data Logger with USB and Ethernet
LPC1766FBD100 suits a connected data logger that records local events, buffers them in 64 kB SRAM, and transfers files through Ethernet or USB 2.0. The 256 kB flash capacity accommodates embedded firmware, and the 100 MHz core provides compute headroom for protocol and control tasks. A robust implementation should include write-safe storage, timestamps, buffer-full handling, and recovery after power loss. Exact flash endurance and write timing are not present in the supplied data and must not be assumed.
おすすめ
Connected Embedded Control Panel
LPC1766FBD100 can serve as the central controller in a connected industrial panel because Ethernet, USB, and CAN cover service, host, and field-bus connectivity. The 100 MHz Cortex-M3 core manages local user-interface logic and communications, while 256 kB flash and 64 kB SRAM support embedded software. Separate low-noise analog supplies from Ethernet magnetics and transceiver circuitry, and validate EMC requirements before installation. The verified sources do not establish display timing or regulatory approvals, so those requirements remain application-specific.
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おすすめ製品の概要
エンジニアリング参考データ: LPC1766FBD100 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Package | 100-lead LQFP, 14 mm x 14 mm |
| Brand | NXP Semiconductors |
| Processor Core | Arm Cortex-M3 |
| Maximum CPU Frequency | 100 MHz |
| Flash Memory | 256 kB |
| SRAM | 64 kB |
| Ethernet | Integrated |
| USB Support | USB 2.0 Host, Device, and OTG |
| CAN Support | Integrated |
| Power Profile | Low-power operation; exact current values not provided |
主な差別化要因
- Integrated multi-protocol communications （vs Generic Cortex-M3 MCUs without verified integrated Ethernet, USB, and CAN)
- Balanced compute and memory for connected embedded control （vs Lower-frequency general-purpose Cortex-M3 devices)
- Established 100-lead system integration target （vs MCUs in packages with different dimensions or pin assignments)
設計ノート
The verified package is a 100-lead, 14 mm by 14 mm LQFP. Before PCB release, compare the selected symbol, courtyard, exposed thermal area status, pin-1 orientation, and paste mask against the official package drawing and complete datasheet pin table. The provided search snippets do not expose all 100 pin assignments, so generating a pinout from package count alone would be unsafe.
Treat Ethernet and USB routes as high-speed differential interfaces. Use the NXP hardware guidance and the actual PCB stackup to establish controlled impedance, maintain continuous return paths, avoid stubs and unnecessary vias, and isolate switching nodes from communication circuitry. Exact impedance targets are not included in the verified data and must be derived from the board fabricator and interface specification.
Do not approve a substitute solely because it uses a Cortex-M3 core, the same LQFP pin count, or a similar family name. Verify pin assignment, supply pins, I/O voltage tolerance, memory organization, peripheral instances, interrupt behavior, bootloader operation, and firmware compatibility. The supplied cross-reference results do not prove a strict drop-in replacement for LPC1766FBD100.
Decouple each supported supply rail according to the complete NXP datasheet and place the required capacitors close to their pins with short return paths. Ethernet magnetics, USB protection components, and CAN transceivers can add transient loads beyond MCU supply current. Current limits, voltage ranges, and startup sequencing are unavailable in the verified snippets and must be established before power budgeting.
コンプライアンス情報
The supplied product and distributor snippets do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance. No compliance status has been assumed.
