LS1012ASN7EKA - QorIQ 600MHz ARM A53 MPU, 211-FCLGA | NXP
部品番号: LS1012ASN7EKA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $39.5 | $39.50 |
| 10 | $35.55 | $355.50 |
| 100 | $31.6 | $3,160.00 |
| 500 | $28.44 | $14,220.00 |
| 1,000 | $25.28 | $25,280.00 |
LS1012ASN7EKA 概要
What is a Layerscape SoC? A Layerscape system-on-chip (SoC) is a class of low-power embedded networking processors from NXP that integrate CPU cores, packet processing engines, and high-speed I/O on a single die. Within the broader taxonomy, Layerscape devices sit below general-purpose application processors and above discrete microcontrollers, occupying the network-edge SoC niche where deterministic throughput, hardware-accelerated packet handling, and deep-sleep power states are essential for edge gateways, industrial routers, and IoT concentrators.
Key features include single-core 64-bit Arm Cortex-A53 with NEON and floating-point unit, integrated 2-port Gigabit Ethernet switch with line-rate PFE, hardware cryptography accelerators (disabled in this NoSEC variant), 16-bit DDR3L controller up to 1 GHz, and a wide operating temperature range of 0 C to 105 C. The part is qualified for industrial-grade embedded networking designs.
The LS1012A architecture pairs the Cortex-A53 application core with a dedicated hardware packet forwarding engine that offloads L2/L3 processing, enabling line-rate throughput while the A53 runs control-plane software. This heterogeneous split allows the device to deliver GbE wire-speed forwarding at sub-1 W power envelopes, which is unique versus monolithic A53-only designs.
Typical applications include industrial IoT gateways, low-power fanless routers, smart home edge nodes, battery-backed secure access points, and USB-powered networking appliances. The compact 9.6 x 9.6 mm FCLGA package suits thermally constrained enclosures where 1 W typical SoC power keeps the design passively cooled.
When designing with the LS1012ASN7EKA, allocate adequate PCB layers for the DDR3L byte lane routing (the controller targets 1 GHz) and follow NXP hardware design guide for 0.5 mm pitch BGA escape. The NoSEC suffix means the ARM TrustZone secure boot and cryptographic engines are fused off, so plan your boot integrity and key storage on an external secure element if required.
ドロップイン代替品: LS1012ASN7EKA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LS1012ASN7EKA （同一形状・フットプリント） — 相違点: Ethernet, Maximum Core Frequency, Mounting Type, Operating Temperature, Package.
クイック比較ツール — 並列比較する代替部品を選択:
LS1012ASE7EKA
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LS1012AXN7EKA
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LS1012AXN7HKA
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$19.127 / 個
データシートを見る →LS1012ASN7HKA
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LS1012ASE7HKA
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LS1012ASN7EKA 最大定格＆電気的特性
| Product Type | Microprocessor (MPU) |
| Series | QorIQ Layerscape LS1012A |
| Core | ARM Cortex-A53 (single-core) |
| Bit Width | 64-bit |
| Maximum Core Frequency | 600 MHz |
| 動作温度 | 0 C to +105 C |
| パッケージ | 211-FCLGA (9.6 x 9.6 mm) |
| 実装タイプ | Surface Mount |
| DDR3L Memory Controller | 16-bit, up to 1 GHz |
| Ethernet | 2 x Gigabit Ethernet with PFE |
| PCIe | PCIe Gen2 |
| USB | USB 3.0 + USB 2.0 |
| SATA | SATA 3.0 |
| Security Engine | Disabled (NoSEC) |
| Typical Power Dissipation | 1 W |
| RoHS ステータス | Compliant |
| MSLレベル | 3 |
LS1012ASN7EKA 211-fclga (9.6 x 9.6 mm) ピン配置ガイド
LS1012ASN7EKA (211-fclga (9.6 x 9.6 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LS1012ASN7EKA.
詳細は データシート をご参照ください。
主な用途
LS1012ASN7EKA の用途: 7 件s: Industrial IoT Gateway, Low-Power Fanless Router, Battery-Backed Edge Sensor Node, USB-Powered Networking Appliance, Smart Home Edge Concentrator, Network-Attached Storage Controller, Industrial Protocol Bridge.
Industrial IoT Gateway
The LS1012ASN7EKA fits industrial IoT gateways because its hardware-accelerated packet forwarding engine delivers line-rate GbE throughput at a typical 1 W SoC power budget, while the Cortex-A53 application core runs Linux-based protocol stacks (MQTT, OPC-UA, Modbus/TCP). The 16-bit DDR3L controller at 1 GHz supplies the bandwidth needed for in-memory aggregation of sensor telemetry, and the 2-port GbE switch enables a WAN/LAN topology without an external Ethernet controller. Placed on a fanless industrial gateway PCB, the device removes the cost and MTBF penalty of forced-air cooling. Unlike a discrete A53 + external GbE design, the integrated PFE saves roughly 0.4 W of switching and PHY-host CPU overhead.
おすすめ
Low-Power Fanless Router
The LS1012ASN7EKA is well suited to fanless residential or SMB routers because its 1 W typical dissipation keeps the thermal envelope small enough for plastic enclosures without heat sinks. The hardware PFE delivers NAT/firewall throughput that competing A53-only SoCs require software threads to match, and the integrated 2-port GbE switch provides WAN + LAN connectivity with no external Ethernet bridge. DDR3L at 1 GHz sustains routing-table lookups without off-chip memory pressure. Compared with a switched-mode router SoC, the LS1012ASN7EKA trades peak throughput for much lower idle power, which suits always-on consumer gateways.
おすすめ
Battery-Backed Edge Sensor Node
Battery-backed edge sensor nodes benefit from the LS1012ASN7EKA's deep-sleep power states combined with fast Cortex-A53 wake-up, enabling years of operation on a single battery pack when most of the time the node is asleep. The 211-FCLGA package at 9.6 x 9.6 mm is small enough for wearable-form-factor industrial sensors, and the NoSEC fuse map is acceptable when paired with a discrete secure element for cryptographic identity. PFE offloads L2/L3 forwarding during wake bursts so the A53 can stay in low-power states longer between bursts.
おすすめ
USB-Powered Networking Appliance
USB-powered networking appliances - such as travel routers, USB-tethered gateways, or portable diagnostics - leverage the LS1012ASN7EKA's 1 W typical power envelope, which is comfortably under the 2.5 W USB 3.0 bus-power budget when paired with a USB Type-C PD controller. The integrated USB 3.0 + USB 2.0 controllers remove the need for an external USB hub, and the integrated SATA 3.0 port supports a local SSD or eMMC for logging. The Cortex-A53 application core runs a Yocto-based Linux with limited RAM footprint thanks to DDR3L efficiency.
おすすめ
Smart Home Edge Concentrator
Smart home edge concentrators aggregating Zigbee, Thread, BLE, and Wi-Fi traffic benefit from the LS1012ASN7EKA's GbE uplinks and Cortex-A53 headroom for protocol translation stacks. The hardware PFE keeps the concentrator responsive under multicast/broadcast pressure from many low-rate wireless devices, and the 0 C to 105 C standard temperature range covers indoor enclosure operating conditions. The 211-FCLGA 9.6 x 9.6 mm footprint simplifies routing on a 4-layer consumer-grade PCB stack-up.
おすすめ
Network-Attached Storage Controller
Network-attached storage (NAS) controller boards can use the LS1012ASN7EKA to drive a SATA 3.0 port, a GbE LAN, and a USB 3.0 backup port while running a lightweight NAS distribution on the Cortex-A53. The hardware PFE ensures file-transfer throughput is not bottlenecked by software TCP stacks, and DDR3L at 1 GHz supplies the memory bandwidth required for SMB/NFS operations. The 1 W typical SoC power keeps fanless 2-bay enclosures thermally viable.
おすすめ
Industrial Protocol Bridge
Industrial protocol bridges converting between EtherCAT, PROFINET, EtherNet/IP, and legacy fieldbuses leverage the LS1012ASN7EKA's Cortex-A53 core for real-time protocol translation while the hardware PFE handles L2 forwarding. The 0 C to 105 C temperature grade suits cabinet-mounted deployments, and DDR3L at 1 GHz keeps cycle times short. Compared with PLC-class microcontrollers, the LS1012ASN7EKA delivers the headroom required for full TCP/IP stacks with TLS.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LS1012ASN7EKA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LS1012ASE7EKA | LS1012AXN7EKA | LS1012AXN7HKA | LS1012ASN7HKA | LS1012ASE7HKA |
|---|---|---|---|---|---|---|
| Package | 211-FCLGA (9.6 x 9.6 mm) | 211-FCLGA (9.6 x 9.6 mm) | 211-FCLGA (9.6 x 9.6 mm) | 211-FCLGA (9.6 x 9.6 mm) | 211-FCLGA (9.6 x 9.6 mm) | 211-FCLGA (9.6 x 9.6 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | Cortex-A53 single-core | Cortex-A53 single-core | Cortex-A53 single-core | Cortex-A53 single-core | Cortex-A53 single-core | Cortex-A53 single-core |
| Maximum CPU Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| Security Engine | Disabled (NoSEC) | Enabled (SEC) | Disabled (NoSEC) | Disabled (NoSEC) | Disabled (NoSEC) | Enabled (SEC) |
| Operating Temperature | 0 C to +105 C (Std) | 0 C to +105 C (Std) | Extended | Extended | 0 C to +105 C (Std) | 0 C to +105 C (Std) |
| DDR3L Controller | 16-bit up to 1 GHz | 16-bit up to 1 GHz | 16-bit up to 1 GHz | 16-bit up to 1 GHz | 16-bit up to 1 GHz | 16-bit up to 1 GHz |
| Typical Power | 1 W | 1 W | 1 W | 1 W | 1 W | 1 W |
主な差別化要因
- Hardware packet forwarding engine integrated on-die （vs LS1012ASE7EKA)
- NoSEC variant lowers BOM cost for non-secure IoT nodes （vs LS1012ASE7EKA)
- Compact 9.6 x 9.6 mm FCLGA package for space-constrained designs （vs LS1023A)
設計ノート
Estimated: the 211-FCLGA uses a 0.5 mm terminal pitch and a 9.6 x 9.6 mm body. Designers should follow the NXP LS1012A hardware design guide for BGA escape, allocating at least 4 PCB layers with microvia-in-pad and 1 oz copper on outer layers. Maintain a continuous reference-plane under the SoC for DDR3L byte-lane impedance control of 100 ohms differential.
Estimated: the LS1012ASN7EKA dissipates roughly 1 W typical. At 0 C to 105 C operating range, a 4-layer PCB with 1 square inch of unbroken inner copper typically delivers theta_JA around 25-30 C/W, leaving ~75 C headroom. For sealed enclosures without airflow, derate ambient or add a small heat-spreader to keep junction below 125 C.
Because the NoSEC suffix disables the cryptographic accelerators and TrustZone secure boot, any design that originally specified LS1012ASE7EKA but is loaded with LS1012ASN7EKA will silently lose IPsec and secure-boot functionality. Validate the suffix on the top marking before PCB assembly and confirm with NXP's product change notifications if the variant changes during production.
Estimated: at full GbE line-rate with PFE active, expect SoC + PHY combined power near 3 W. A 5 V/3 A USB Type-C PD source is the typical supply rail; add bulk capacitance close to the SoC input rails to handle PFE burst activity. Sequencing of the 0.9 V core, 1.35 V DDR3L, and 3.3 V I/O rails must follow the LS1012A power-up sequence to avoid POR latch-up.
コンプライアンス情報
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Lifecycle status flagged as end-of-life on NXP's website; consult last-time-buy PCN for production planning.
