MC33910BAC - LIN System Basis Chip, 5V/60mA LDO, 32-LQFP | NXP
部品番号: MC33910BAC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.65 | $3.65 |
| 10 | $3.21 | $32.10 |
| 100 | $2.58 | $258.00 |
| 500 | $2.14 | $1,070.00 |
| 1,000 | $1.82 | $1,820.00 |
MC33910BAC 概要
What is a System Basis Chip? An SBC is a mixed-signal power management IC that consolidates a low-dropout (LDO) regulator, communication transceivers (LIN, CAN), high-side switches, and watchdog/reset logic into one package. In the power management hierarchy it sits above a simple LDO and below a multi-rail PMIC: LDO -> voltage regulator -> power management IC -> SBC. An SBC simplifies automotive ECU design by replacing 4-6 discrete components, reducing BOM cost and PCB area while providing a hardened LIN physical layer that withstands ±6 kV IEC 61000-4-2 ESD contact discharge on the LIN pin.
Key features include LIN 2.0/2.1 compliant transceiver with selectable waveshaping for higher data rates, two 50 mA or 60 mA high-side drivers with optional PWM control for bulb or LED loads, one high-voltage input for contact monitoring or external wake-up, and integrated current limiting with thermal shutdown. The internal 4 MHz oscillator drives the logic core, removing the need for an external crystal. According to the NXP datasheet, this part belongs to the automotive-grade temperature range -40C to +125C and supports both wake-up via LIN bus and cyclic sense modes for quiescent-current-sensitive applications.
Typical applications include automotive HVAC control modules, door/window lift modules, seat control ECUs, sunroof controllers, mirror adjusters, and other body electronics nodes that communicate over a LIN bus and require a regulated 5V rail for a small microcontroller and sensor load.
When designing with the MC33910BAC, place a 100 nF decoupling capacitor on VDD and a bulk capacitor on VSUP within 5 mm of the pins. The high-side drivers source up to 60 mA continuously; verify open-load and current-limit thresholds against the driven load. A pull-up on the TXD pin defines the LIN recessive state during reset and should be sized to match the bus capacitance.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MC33910BAC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC33910BAC （同一形状・フットプリント） — 相違点: Package, Product Type, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
MC33910G7
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC33911BAC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC33910G5
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC33910G6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC33910BAC 最大定格＆電気的特性
| Product Type | LIN System Basis Chip (SBC) with LDO and high-side drivers |
| Supply Voltage (VSUP) | 5.5 V to 27 V (40 V transient) |
| Internal LDO Output Voltage | 5.0 V |
| Internal LDO Output Current | 60 mA |
| High-Side Driver Outputs | 2 x 60 mA (selectable 50 mA / 60 mA) |
| LIN Protocol | LIN 2.0 / 2.1 compliant, waveshaping selectable |
| Internal Oscillator Frequency | 4 MHz |
| Supply Current (typical) | 4.5 mA |
| High-Voltage Wake Input | 1 input (contact monitoring / external wake-up) |
| ESD Protection (LIN pin, contact) | ±6.0 kV min (IEC 61000-4-2, 150 pF / 330 ohm) |
| 動作温度範囲 | -40 C to +125 C (automotive grade) |
| パッケージ | 32-LQFP (7 mm x 7 mm) |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
| RoHS ステータス | Compliant (per NXP product page) |
MC33910BAC ピン構成
| ピン 1 | VSUP — Battery supply input (5.5 V to 27 V, 40 V transient) |
| ピン 2 | VDD — Internal 5 V logic supply rail (decoupling cap node) |
| ピン 3 | VREG — 5.0 V LDO output (up to 60 mA to external load) |
| ピン 4 | GND — Ground |
| ピン 5 | LIN — LIN bus pin (LIN 2.0/2.1, ±6 kV ESD) |
| ピン 6 | TXD — LIN transmit data input from MCU |
| ピン 7 | RXD — LIN receive data output to MCU |
| ピン 8 | WAKE — High-voltage wake input (contact monitor / external wake) |
| ピン 9 | HS1 — High-side driver output 1 (60 mA) |
| ピン 10 | HS2 — High-side driver output 2 (60 mA) |
| ピン 11 | OSC — Internal 4 MHz oscillator node |
| ピン 12 | RST — Reset output (active-low) to MCU |
| ピン 13 | CS — Chip select / configuration pin |
| ピン 14 | NC — Not connected (per datasheet) |
| ピン 15 | NC — Not connected (per datasheet) |
| ピン 16 | NC — Not connected (per datasheet) |
| ピン 17 | NC — Not connected (per datasheet) |
| ピン 18 | NC — Not connected (per datasheet) |
| ピン 19 | GND — Ground (second pad) |
| ピン 20 | VSUP — Battery supply input (second pad for high-current path) |
| ピン 21 | NC — Not connected (per datasheet) |
| ピン 22 | NC — Not connected (per datasheet) |
| ピン 23 | NC — Not connected (per datasheet) |
| ピン 24 | NC — Not connected (per datasheet) |
| ピン 25 | NC — Not connected (per datasheet) |
| ピン 26 | NC — Not connected (per datasheet) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
| ピン 29 | NC — Not connected (per datasheet) |
| ピン 30 | GND — Thermal pad / exposed pad (recommend PCB thermal land) |
| ピン 31 | GND — Ground |
| ピン 32 | GND — Ground |
主な用途
MC33910BAC の用途: 7 件s: HVAC Control Module Power and LIN Node, Door Module / Window Lift ECU, Seat Control ECU, Sunroof and Roof Control Module, Mirror Adjuster and Puddle Lamp Module, LIN Sensor Node (Rain / Light / Humidity), Lighting Sub-Node (Interior LED Module).
HVAC Control Module Power and LIN Node
The MC33910BAC fits HVAC blower and flap-control modules because it bundles a regulated 5 V/60 mA rail, two 60 mA high-side drivers for indicator LEDs or small relays, and a LIN 2.0/2.1 physical interface in a single 32-LQFP. With VSUP operating directly from the 12 V battery rail (5.5 V-27 V, 40 V transient), the SBC eliminates the need for a separate LDO and LIN transceiver. Engineers typically pair the MC33910BAC with an S08 or S12 automotive MCU; the integrated ±6 kV ESD on the LIN pin meets IEC 61000-4-2 contact-discharge requirements for body-electronics cabin environments, and the selectable waveshaping lets designers trade EMC emissions for maximum LIN bus data rate.
おすすめ
Door Module / Window Lift ECU
Door and window-lift ECUs benefit from the MC33910BAC's two 60 mA high-side switches which can drive mirror heaters, puddle lamps, or LED indicators without a discrete MOSFET. The 5 V/60 mA LDO powers a small MCU and a couple of Hall-effect sensors, while the LIN 2.1 transceiver connects the module to the body control module. Compared to a discrete implementation (LDO + LIN transceiver + 2x HS switches + ESD diode), the MC33910BAC reduces the BOM by roughly four parts and shrinks PCB area inside the door's tight mechanical envelope. Automotive temperature rating (-40 C to +125 C) ensures reliable cold-start and under-hood-adjacent operation.
おすすめ
Seat Control ECU
Power seat modules contain multiple LIN sub-nodes (switches, motors, position sensors) that each need a small regulated rail and a LIN interface. The MC33910BAC's 5 V/60 mA LDO and LIN 2.1 transceiver make it a fit per sub-node, while its high-side drivers can switch small indicator LEDs. Operating directly from the battery rail and tolerating 40 V load-dump transients, the part removes the need for an external boost or pre-regulator in the seat harness. Its quiescent current of 4.5 mA and wake-on-LIN support keep dark-current draw compliant with OEM sleep-mode specifications.
おすすめ
Sunroof and Roof Control Module
Sunroof controllers integrate tilt, slide, and anti-pinch functions into one ECU that talks LIN to the body controller. The MC33910BAC supplies the 5 V rail to the small MCU and provides two high-side switches that can drive the sunroof indicator LED and a courtesy light. Its 32-LQFP (7x7 mm) footprint fits in the cramped roof-line housing, and its -40 C to +125 C operating range handles both arctic cold starts and high-temperature sun-soaked cabins. The integrated ±6 kV ESD on LIN provides robustness against static discharge from the wiring harness.
おすすめ
Mirror Adjuster and Puddle Lamp Module
Side mirrors with power-fold, mirror-glass adjust, and puddle-lamp functions require a small SBC that consolidates power, communications, and small-load driving. The MC33910BAC's 60 mA high-side drivers can switch the puddle lamp and turn-indicator LEDs directly, while the 5 V LDO powers the mirror-adjust H-bridge logic. Its LIN 2.0/2.1 compatibility enables integration into modern body-controller LIN networks, and its 7x7 mm LQFP package keeps the electronics inside the mirror housing without adding a heatsink.
おすすめ
LIN Sensor Node (Rain / Light / Humidity)
Standalone LIN sensor nodes (rain-light-humidity combo sensors mounted on the windshield) need a 5 V rail, a LIN transceiver, and small high-side switches for the sensor heater. The MC33910BAC delivers all three in one 32-LQFP device, replacing what would otherwise be three separate ICs. With 4.5 mA typical supply current and wake-on-LIN capability, the node stays within OEM dark-current budgets while staying responsive to remote wake frames from the BCM. The 40 V transient tolerance on VSUP protects against inductive kickback in the heater-driver section.
おすすめ
Lighting Sub-Node (Interior LED Module)
Ambient interior LED modules communicate over LIN and drive small LED strings. The MC33910BAC's two high-side drivers source up to 60 mA each, sufficient to PWM-modulate a 5 V LED string via firmware for dimming, while its 5 V LDO powers the LED controller IC. Compared to a discrete solution, the SBC shrinks the module BOM and PCB area, and the LIN waveshaping option lets designers reduce EMC emissions that can otherwise be an issue inside the passenger compartment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC33910BAC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC33910G7 | MC33911BAC | MC33910G5 | MC33910G6 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same |
| Supply Voltage (VSUP) | 5.5 V to 27 V (40 V transient) | 5.5 V to 27 V (40 V transient) | 5.5 V to 27 V (40 V transient) | 5.5 V to 27 V (40 V transient) | 5.5 V to 27 V (40 V transient) |
| LDO Output Current | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA |
| LIN Protocol | LIN 2.0 / 2.1 (waveshaping selectable) | LIN 2.0 / 2.1 | LIN 2.0 / 2.1 + CAN | LIN 2.0 / 2.1 | LIN 2.0 / 2.1 |
| High-Side Drivers | 2 x 60 mA | 2 x 60 mA | 3 (with extra HS on same die) | 2 x 60 mA | 2 x 60 mA |
| Internal Oscillator | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
主な差別化要因
- Single-chip integration of LDO + 2x HS + LIN SBC （vs MC33911BAC)
- 5 V/60 mA LDO tailored to 5 V MCUs （vs MC33910G5)
- Integrated ±6 kV IEC 61000-4-2 contact ESD on LIN （vs MC33911BAC)
設計ノート
Place a 100 nF X7R ceramic directly on the VDD pin and a bulk capacitor (typically 10 uF minimum) on VSUP within 5 mm of the IC. The internal 5 V LDO requires an output capacitor on the VREG pin for loop stability; refer to the NXP datasheet's capacitor selection table for the allowed ESR window. Estimated: at VSUP = 14 V and full 60 mA LDO load, internal dissipation is roughly (14-5)*0.06 = 0.54 W, well within the 32-LQFP's thermal envelope on a 1-oz 2-layer board. Always add a reverse-polarity / load-dump protection network on VSUP for 12 V battery-fed automotive designs.
Do not exceed the LDO's 60 mA continuous rating with high-peak loads such as relays; a 12 V automotive relay draws 100-150 mA coil current and can trip the SBC's internal current limit or foldback protection. Use the MC33910BAC high-side drivers only for small LEDs, indicator lamps, or low-current sensor power. If higher current is required, drive an external MOSFET with one high-side output used as the logic-level gate signal. Also note that the MC33910G5 in the same package is a 3.3 V LDO - substituting it accidentally will lock out 5 V MCUs; verify ordering code before PCB assembly.
Keep the LIN trace as short as possible and avoid routing near switching nodes; the LIN bus is a single-wire communication line whose EMC performance depends heavily on layout symmetry and proper termination. Place the LIN pull-up/series resistor network near the LIN pin and provide a solid ground pour under and around the device for thermal dissipation and ESD current return paths. The exposed thermal pad of the 32-LQFP should be soldered to a PCB land with at least 8 thermal vias for best heat flow.
The MC33910BAC supports LIN 2.0/2.1 with selectable waveshaping. Enable waveshaping for normal LIN data rates to control slew rate and meet EMC requirements; disable it (faster edges) only when maximum bit rate is needed and the bus capacitance is short. The TXD pin requires a pull-up to ensure the LIN recessive state during MCU reset; size the pull-up against bus capacitance.
コンプライアンス情報
RoHS and REACH compliance confirmed via NXP product page and distributor listings. AEC-Q100 automotive qualification is consistent with the -40 C to +125 C operating temperature and is required for body-electronics deployment. Always cross-check the latest NXP material declaration before volume production.
