MC34PF3001A7EP - i.MX7 PMIC, 3 Buck + 6 LDO | NXP Semiconductors
部品番号: MC34PF3001A7EP ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.88 | $8.88 |
| 10 | $8.1 | $81.00 |
| 100 | $6.85 | $685.00 |
| 500 | $5.95 | $2,975.00 |
| 1,000 | $5.2 | $5,200.00 |
MC34PF3001A7EP 概要
A PMIC (Power Management Integrated Circuit) is a highly integrated semiconductor that consolidates multiple voltage regulators, supervisory functions, and power-path control into one device. In the broader taxonomy, a PMIC belongs to power management ICs -> voltage regulators -> power management semiconductors. By replacing dozens of discrete regulators, a PMIC reduces PCB area, simplifies power sequencing, improves conversion efficiency, and enables tighter voltage accuracy for processor cores, memory interfaces, and I/O rails.
Key features of the PF3001 include a wide input voltage range of 2.8V to 5.5V (5V typical), pre-programmed output voltages tailored for i.MX 7 boot, programmable sequencing, hardware reset signaling, and I2C control interface. The device is designed for industrial-grade operation over -40C to +105C, and is pin-to-pin compatible with the PF3000 family, allowing reuse of the Board Support Package (BSP) across i.MX platforms.
From an architectural perspective, the PF3001 uses three synchronous buck converters for the high-current processor core, memory, and SoC rails, while six general-purpose LDOs power lower-current peripherals and dual-voltage SD card interfaces. The always-on LDO supplies a low-current rail that remains active during system sleep, supporting RTC and wake-up logic. This configurable architecture supports numerous outputs with various current ratings, programmable voltage, and predefined sequencing.
Typical applications include i.MX 7 Solo and i.MX 6 SoloLite/SoloX/UltraLite based single-board computers, IoT edge devices, industrial HMI panels, portable medical electronics, and wearable platforms. The wide input range and high level of integration make it a strong fit for space-constrained battery-powered designs.
When designing with the PF3001, follow the manufacturer reference schematic and decoupling recommendations exactly; the I2C-controlled DVS (dynamic voltage scaling) feature must be configured through the BSP for proper i.MX boot sequencing. The exposed pad must be soldered to a sufficient ground copper pour for thermal dissipation.
This page synthesizes NXP product-page information, distributor pricing, drop-in pin-compatible alternatives from the same NXP PF3000/1 family, and practical design notes not consolidated in the manufacturer datasheet PDF.
ドロップイン代替品: MC34PF3001A7EP — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC34PF3001A7EP （同一形状・フットプリント） — 相違点: Package, Input Voltage Range, Topology, Operating Temperature Range, Control Interface.
クイック比較ツール — 並列比較する代替部品を選択:
MC34PF3000A7EP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC33PF3000A5ES
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34PF3001A4EPR2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34PF3000A5EP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34PF3001A7EP 最大定格＆電気的特性
| トポロジー | 3 Buck + 6 LDO + Always-On LDO |
| Target Processor | i.MX 7, i.MX 6 SoloLite/SoloX/UltraLite |
| 入力電圧範囲 | 2.8 V to 5.5 V |
| Typical Input Voltage | 5 V |
| Buck Converter Count | 3 |
| LDO Regulator Count | 6 |
| Always-On LDO | Yes |
| Output Voltage Programming | Pre-programmed for i.MX 7 (configurable via I2C) |
| Control Interface | I2C |
| 動作温度範囲 | -40 C to +105 C |
| パッケージ | 48-VFQFN Exposed Pad (QFN-48, 7x7 mm) |
| 実装タイプ | Surface Mount |
| Supplier Device Package | 48-QFN (7x7) |
| Application | Processor / SoC power management |
| Grade | Industrial |
MC34PF3001A7EP 48-qfn (7x7) ピン配置ガイド
MC34PF3001A7EP (48-qfn (7x7) パッケージ) のピン配置。 このパワーデバイスは、ゲート、ドレイン、ソース端子を備えています。非極性パッケージの場合、正確なピン1の向きとフットプリントの詳細については、メーカーのデータシートを参照してください。主な用途には、電源設計、モータ駆動、負荷スイッチングがあります。
詳細なピン配置データはありません: MC34PF3001A7EP.
詳細は データシート をご参照ください。
主な用途
MC34PF3001A7EP の用途: 7 件s: i.MX 7 Solo Single-Board Computer, i.MX 6 SoloLite Wearable Platform, Industrial IoT Edge Gateway, Portable Medical Diagnostic Device, Smart Home Hub with Touch Display, Human-Machine Interface (HMI) Panel, Connected Drone Flight Controller.
i.MX 7 Solo Single-Board Computer
The MC34PF3001A7EP is purpose-built for the NXP i.MX 7 Solo application processor, supplying all core, memory, and peripheral rails from a single 5V input. Its pre-programmed voltage table eliminates external feedback resistor networks and accelerates BSP bring-up for i.MX 7 Solo reference designs. Designers get 3 synchronous bucks for the high-current core and DDR rails, 6 LDOs for peripherals, and an always-on LDO for RTC, all in a 48-QFN (7x7 mm) package. The wide 2.8V to 5.5V input range allows direct connection to a USB 5V or single-cell Li-ion rail, simplifying power-path design.
おすすめ
i.MX 6 SoloLite Wearable Platform
Wearable and ultra-low-power IoT platforms based on the i.MX 6 SoloLite benefit from the MC34PF3001A7EP's integrated buck + LDO architecture, which fits a 7x7 mm QFN footprint ideal for space-constrained wearables. The always-on LDO keeps the RTC and wake-up logic powered during deep sleep, while the dynamic voltage scaling via I2C lets the SoloLite cores run at reduced voltage for sub-mW standby power. The 2.8V to 5.5V input range supports single-cell Li-ion battery packs directly, removing the need for an external boost converter and extending battery life.
おすすめ
Industrial IoT Edge Gateway
Industrial IoT gateways based on i.MX 7 Dual or i.MX 6 SoloX need robust, wide-temperature power management. The MC34PF3001A7EP's industrial-grade -40C to +105C specification and integrated 10 rails allow designers to consolidate the entire power tree onto a single 48-QFN IC. Its pin-compatibility with the PF3000 family lets a single PCB support multiple i.MX SKUs via a rework-only BOM change, reducing SKU proliferation and accelerating time-to-market. Pre-programmed sequencing aligns with the i.MX 7 power-up requirements, removing the need for an external sequencer.
おすすめ
Portable Medical Diagnostic Device
Portable medical devices such as glucose meters, patient monitors, and ultrasound probes leverage the MC34PF3001A7EP for its compact 48-QFN footprint, low quiescent current on the always-on LDO, and high accuracy on the buck outputs to power precision analog front ends. The integrated architecture reduces the PCB area needed for power, which is critical for handheld medical form factors. The I2C interface allows the host processor to dynamically adjust voltage rails based on operating mode (active, sleep, deep sleep), preserving battery life during intermittent measurements and improving overall patient safety.
おすすめ
Smart Home Hub with Touch Display
Smart home hubs based on i.MX 7 or i.MX 6 use the MC34PF3001A7EP to power the application processor, display backlight, Wi-Fi/BLE module, and touch controller. Its 6 LDOs can each be individually enabled via I2C, allowing unused peripherals to be powered down for standby efficiency. The synchronous buck converters deliver high efficiency (>90%) at the 1A+ core current, keeping the hub cool without a heatsink. The 48-QFN package's exposed pad provides enough thermal headroom for fan-less smart home enclosures.
おすすめ
Human-Machine Interface (HMI) Panel
Industrial HMI panels with touchscreens run on i.MX 6 or i.MX 7 processors and require reliable, deterministic power-up. The MC34PF3001A7EP's pre-programmed sequencing matches the i.MX 7 power-on requirements, eliminating external sequencer ICs. The 3 buck converters deliver high-current rails to the LCD backlight driver and processor core, while the LDOs supply the touch controller and audio codec. The wide operating temperature range of -40C to +105C supports factory floor environments where ambient temperatures can swing dramatically.
おすすめ
Connected Drone Flight Controller
Drone flight controllers based on i.MX 7 use the MC34PF3001A7EP to consolidate power distribution from the Li-Po battery pack through the 2.8V to 5.5V input range. The high-efficiency synchronous bucks power the flight MCU, IMU sensors, and radio module, while the LDOs supply GPS, magnetometer, and telemetry subsystems. The exposed pad on the 48-QFN package aids thermal dissipation during high-current draw phases such as motor transients. The pre-programmed sequencing ensures deterministic boot, which is critical for aviation safety.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC34PF3001A7EP — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC34PF3000A7EP | MC33PF3000A5ES | MC34PF3001A4EPR2 | MC34PF3000A5EP |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Target Processor | i.MX 7 / i.MX 6 SoloLite/SoloX/UltraLite | i.MX 6 SoloLite/SoloX/UltraLite | i.MX 6 (automotive) | i.MX 7 / i.MX 6 SoloLite/SoloX/UltraLite | i.MX 6 SoloLite/SoloX/UltraLite |
| Buck Converters | 3 | 3 | 3 | 3 | 3 |
| LDO Regulators | 6 + 1 always-on | 6 + 1 always-on | 6 + 1 always-on | 6 + 1 always-on | 6 + 1 always-on |
| Input Voltage Range | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V |
| Grade | Industrial | Industrial | Automotive (AEC-Q100) | Industrial | Industrial |
| Lifecycle Status | End of Life | End of Life | Active (automotive) | End of Life | End of Life |
主な差別化要因
- Pre-programmed for i.MX 7 boot sequence out of the box （vs MC34PF3000A7EP)
- Industrial grade over automotive-qualified sibling （vs MC33PF3000A5ES)
- Pin-compatible firmware-revision upgrade path （vs MC34PF3001A4EPR2)
設計ノート
The MC34PF3001A7EP exposes its central thermal pad on the bottom of the 48-QFN (7x7 mm) package. This pad MUST be soldered to a continuous ground copper pour, ideally with thermal vias connecting to inner ground planes. At full load with all 3 bucks delivering 1A+ and several LDOs active, total dissipation can exceed 1W; without adequate copper area, junction temperature may exceed the 105C industrial rating.
Place input bulk capacitors (10uF minimum) as close as possible to the VIN pins of each buck regulator. Use 4-layer PCB with dedicated power and ground planes. Route the SW (switch node) traces short and narrow to minimize EMI; surround them with ground pour stitched with vias to suppress switching noise from coupling into sensitive analog rails.
Do NOT attempt to program the PF3001 output voltages without first loading the matching i.MX 7 BSP. The default OTP (one-time programmable) voltages are pre-configured for the i.MX 7 boot sequence; overwriting them with incorrect I2C commands can prevent the processor from booting. Always consult NXP application note AN4531 before changing factory defaults.
Decouple each LDO output with a 1uF X7R ceramic capacitor placed within 2 mm of the LDO output pin. The VCC_SD LDO supports dual-voltage SD card signaling (3.3V / 1.8V); for SD card hot-swap reliability, follow NXP's recommended 2.2uF output capacitance on this rail and never place series inductance between the LDO and the SD card connector.
コンプライアンス情報
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified; choose MC33PF3000A5ES for automotive. Halogen-free status not explicitly stated in retrieved data.
