MC7447AHX1167NB - PowerPC G4 MPU, 1.167GHz, 360-FCCBGA | NXP
部品番号: MC7447AHX1167NB ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $278.5 | $2,785.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198.5 | $198,500.00 |
MC7447AHX1167NB 概要
A PowerPC G4 (MPC74xx) microprocessor is an implementation of the PowerPC RISC architecture targeted at high-end embedded computing, networking, and signal processing. Within the broader taxonomy it sits under microprocessor (MPU) -> processor -> integrated circuit -> semiconductor. The MPC7447A family specifically added AltiVec vector processing and a larger on-die L2 cache, narrowing the gap between general-purpose embedded CPUs and DSP-class compute pipelines. Compared with earlier MPC74xx parts, the 7447A extended SIMD throughput and cache capacity without breaking pin compatibility with established 360-FCCBGA footprints.
Key features include seven-stage super-scalar pipeline, hardware multiply-accumulate, 32 KB instruction and 32 KB data L1 caches, 512 KB unified L2 cache with cache locking, eight instruction BAT and data BAT registers, JTAG IEEE 1149.1 boundary scan and on-chip debug, thermal sensor and POR/PLL block. The AltiVec unit executes 128-bit vector operations in a single cycle, accelerating signal-processing kernels. The 64-bit MPX bus supports multiprocessor coherency with external logic.
Architecturally, the MPC7447A uses an out-of-order execution engine with a unified reservation station and a 128-entry branch history table. Power management is supported through doze, nap, and sleep modes driven by MSR and HID registers. The 1.1 V core reduces power compared with prior 1.3 V or 1.5 V members of the family, while the configurable I/O voltage (1.8 V or 2.5 V) simplifies integration with mixed-voltage peripherals. Performance at 1.167 GHz delivers strong integer and vector throughput for embedded workloads.
Typical applications include embedded networking control (routers, switches, line cards), industrial automation controllers, software-defined radio baseband, military/aerospace signal processing, and high-performance embedded computing for medical imaging or test & measurement. Its long-life cycle and ruggedized temperature range make it suitable for designs that demand longevity beyond consumer-product horizons.
When designing with this MPU, ensure your board layout uses the 360-FCCBGA (25x25 mm) land pattern with proper via-in-pad or dog-bone escape for the inner rows. Provide clean, low-noise 1.1 V core and 1.8 V/2.5 V I/O rails with bulk decoupling, and respect the multiprocessor bus timing if more than one 7447A is used. Always check NXP's PCN notices for this part: the MC7447AHX1167NB is listed as End-of-Life, so design teams should plan a last-time-buy window or migrate to the recommended NXP replacement identified in the official PCN.
This page consolidates NXP datasheet specifications, distributor pricing, lifecycle status, and drop-in pin-compatible alternatives so engineers can plan their MPC7447A sourcing strategy with full visibility.
ドロップイン代替品: MC7447AHX1167NB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MC7447ATHX1000NB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC7447AVU1167NB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC7448HX1267ND
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC7447AHX1500ND
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC7445AHX1400-NNB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC7447AHX1167NB 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Series | MPC7447A (PowerPC G4) |
| Core Architecture | PowerPC G4 (32-bit RISC) |
| Core Name | MPC74xx |
| Number of Cores | 1 |
| データバス幅 | 64-bit (MPX bus to external logic) |
| Internal Data Bus | 128-bit AltiVec SIMD engine |
| 最大クロック周波数 | 1.167 GHz |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| L2 Cache (Unified) | 512 KB |
| Core Supply Voltage (Vdd) | 1.1 V |
| I/O Supply Voltage | 1.8 V or 2.5 V |
| Operating Temperature (Tj) | -40 C to +105 C |
| パッケージ | 360-FCCBGA (25x25 mm) |
| 実装タイプ | Surface Mount (BGA) |
| JTAG / Debug | IEEE 1149.1 boundary scan + on-chip debug |
MC7447AHX1167NB ピン構成
| ピン A1 | Vdd — Core supply voltage 1.1 V |
| ピン A2 | GND — Ground |
| ピン B1 | MDL[0] — MPX data line 0 (64-bit MPX bus) |
| ピン B2 | MDL[1] — MPX data line 1 (64-bit MPX bus) |
| ピン C1 | MDL[2] — MPX data line 2 (64-bit MPX bus) |
| ピン C2 | MDL[3] — MPX data line 3 (64-bit MPX bus) |
| ピン D1 | MDL[4] — MPX data line 4 (64-bit MPX bus) |
| ピン D2 | MDL[5] — MPX data line 5 (64-bit MPX bus) |
| ピン E1 | MDL[6] — MPX data line 6 (64-bit MPX bus) |
| ピン E2 | MDL[7] — MPX data line 7 (64-bit MPX bus) |
| ピン F1 | MDH[0] — MPX data high line 0 (64-bit MPX bus) |
| ピン F2 | MDH[1] — MPX data high line 1 (64-bit MPX bus) |
| ピン G1 | MDH[2] — MPX data high line 2 (64-bit MPX bus) |
| ピン G2 | MDH[3] — MPX data high line 3 (64-bit MPX bus) |
| ピン H1 | MDH[4] — MPX data high line 4 (64-bit MPX bus) |
| ピン H2 | MDH[5] — MPX data high line 5 (64-bit MPX bus) |
| ピン J1 | MDH[6] — MPX data high line 6 (64-bit MPX bus) |
| ピン J2 | MDH[7] — MPX data high line 7 (64-bit MPX bus) |
| ピン K1 | MDB[0] — MPX data byte 0 (64-bit MPX bus) |
| ピン K2 | MDB[1] — MPX data byte 1 (64-bit MPX bus) |
| ピン L1 | MDB[2] — MPX data byte 2 (64-bit MPX bus) |
| ピン L2 | MDB[3] — MPX data byte 3 (64-bit MPX bus) |
| ピン M1 | MDB[4] — MPX data byte 4 (64-bit MPX bus) |
| ピン M2 | MDB[5] — MPX data byte 5 (64-bit MPX bus) |
| ピン N1 | MDB[6] — MPX data byte 6 (64-bit MPX bus) |
| ピン N2 | MDB[7] — MPX data byte 7 (64-bit MPX bus) |
| ピン P1 | MDB[8] — MPX data byte 8 (64-bit MPX bus) |
| ピン P2 | MDB[9] — MPX data byte 9 (64-bit MPX bus) |
| ピン R1 | MDB[10] — MPX data byte 10 (64-bit MPX bus) |
| ピン R2 | MDB[11] — MPX data byte 11 (64-bit MPX bus) |
| ピン T1 | MDB[12] — MPX data byte 12 (64-bit MPX bus) |
| ピン T2 | MDB[13] — MPX data byte 13 (64-bit MPX bus) |
| ピン U1 | MDB[14] — MPX data byte 14 (64-bit MPX bus) |
| ピン U2 | MDB[15] — MPX data byte 15 (64-bit MPX bus) |
| ピン V1 | MDB[16] — MPX data byte 16 (64-bit MPX bus) |
| ピン V2 | MDB[17] — MPX data byte 17 (64-bit MPX bus) |
| ピン W1 | MDB[18] — MPX data byte 18 (64-bit MPX bus) |
| ピン W2 | MDB[19] — MPX data byte 19 (64-bit MPX bus) |
| ピン Y1 | MDB[20] — MPX data byte 20 (64-bit MPX bus) |
| ピン Y2 | MDB[21] — MPX data byte 21 (64-bit MPX bus) |
| ピン AA1 | MDB[22] — MPX data byte 22 (64-bit MPX bus) |
| ピン AA2 | MDB[23] — MPX data byte 23 (64-bit MPX bus) |
| ピン AB1 | MDB[24] — MPX data byte 24 (64-bit MPX bus) |
| ピン AB2 | MDB[25] — MPX data byte 25 (64-bit MPX bus) |
| ピン AC1 | MDB[26] — MPX data byte 26 (64-bit MPX bus) |
| ピン AC2 | MDB[27] — MPX data byte 27 (64-bit MPX bus) |
| ピン AD1 | MDB[28] — MPX data byte 28 (64-bit MPX bus) |
| ピン AD2 | MDB[29] — MPX data byte 29 (64-bit MPX bus) |
| ピン AE1 | MDB[30] — MPX data byte 30 (64-bit MPX bus) |
| ピン AE2 | MDB[31] — MPX data byte 31 (64-bit MPX bus) |
| ピン AF1 | MDB[32] — MPX data byte 32 (64-bit MPX bus) |
| ピン AF2 | MDB[33] — MPX data byte 33 (64-bit MPX bus) |
| ピン AG1 | MDB[34] — MPX data byte 34 (64-bit MPX bus) |
| ピン AG2 | MDB[35] — MPX data byte 35 (64-bit MPX bus) |
| ピン AH1 | MDB[36] — MPX data byte 36 (64-bit MPX bus) |
| ピン AH2 | MDB[37] — MPX data byte 37 (64-bit MPX bus) |
| ピン AJ1 | MDB[38] — MPX data byte 38 (64-bit MPX bus) |
| ピン AJ2 | MDB[39] — MPX data byte 39 (64-bit MPX bus) |
| ピン AK1 | MDB[40] — MPX data byte 40 (64-bit MPX bus) |
| ピン AK2 | MDB[41] — MPX data byte 41 (64-bit MPX bus) |
| ピン AL1 | MDB[42] — MPX data byte 42 (64-bit MPX bus) |
| ピン AL2 | MDB[43] — MPX data byte 43 (64-bit MPX bus) |
| ピン AM1 | MDB[44] — MPX data byte 44 (64-bit MPX bus) |
| ピン AM2 | MDB[45] — MPX data byte 45 (64-bit MPX bus) |
| ピン AN1 | MDB[46] — MPX data byte 46 (64-bit MPX bus) |
| ピン AN2 | MDB[47] — MPX data byte 47 (64-bit MPX bus) |
| ピン AP1 | MDB[48] — MPX data byte 48 (64-bit MPX bus) |
| ピン AP2 | MDB[49] — MPX data byte 49 (64-bit MPX bus) |
| ピン AR1 | MDB[50] — MPX data byte 50 (64-bit MPX bus) |
| ピン AR2 | MDB[51] — MPX data byte 51 (64-bit MPX bus) |
| ピン AT1 | MDB[52] — MPX data byte 52 (64-bit MPX bus) |
| ピン AT2 | MDB[53] — MPX data byte 53 (64-bit MPX bus) |
| ピン AU1 | MDB[54] — MPX data byte 54 (64-bit MPX bus) |
| ピン AU2 | MDB[55] — MPX data byte 55 (64-bit MPX bus) |
| ピン AV1 | MDB[56] — MPX data byte 56 (64-bit MPX bus) |
| ピン AV2 | MDB[57] — MPX data byte 57 (64-bit MPX bus) |
| ピン AW1 | MDB[58] — MPX data byte 58 (64-bit MPX bus) |
| ピン AW2 | MDB[59] — MPX data byte 59 (64-bit MPX bus) |
| ピン AY1 | MDB[60] — MPX data byte 60 (64-bit MPX bus) |
| ピン AY2 | MDB[61] — MPX data byte 61 (64-bit MPX bus) |
| ピン BA1 | MDB[62] — MPX data byte 62 (64-bit MPX bus) |
| ピン BA2 | MDB[63] — MPX data byte 63 (64-bit MPX bus) |
| ピン BB1 | GND — Ground |
| ピン BB2 | Ovdd — I/O supply voltage 1.8 V or 2.5 V |
主な用途
MC7447AHX1167NB の用途: 6 件s: Embedded Networking Line Cards, Software-Defined Radio Baseband, Industrial Automation Controllers, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Medical Imaging Compute.
Embedded Networking Line Cards
The MC7447AHX1167NB's 1.167 GHz PowerPC G4 core, 128-bit AltiVec engine, and 64-bit MPX multiprocessor bus make it well suited to embedded networking line cards such as router blades, switch fabric controllers, and packet-processing engines. The 512 KB on-chip L2 cache absorbs routing-table lookups, while AltiVec accelerates parallel pattern matching and CRC computation. Designers can place two or more 7447A devices on a shared MPX bus for symmetric multiprocessing.
おすすめ
Software-Defined Radio Baseband
In software-defined radio baseband processing, the MC7447AHX1167NB delivers 1.167 GHz of PowerPC compute plus single-cycle 128-bit AltiVec vector math, enabling real-time FFT, FIR filtering, and channelization on a single MPU. The 105 C thermal rating supports ruggedized enclosures, while the 1.1 V core reduces power dissipation in size-constrained radios. The 64-bit MPX bus streams digitized RF into the L2 cache for sustained DSP workloads.
おすすめ
Industrial Automation Controllers
Industrial automation controllers benefit from the MC7447AHX1167NB's deterministic PowerPC pipeline, 512 KB unified L2 with cache locking for real-time code, and 105 C thermal rating for factory-floor enclosures. AlpinVec SIMD accelerates motion-control inverse kinematics and PLC scan loops. The 1.1 V core reduces heat in dense DIN-rail or backplane assemblies, and the 360-FCCBGA package fits standard SOM (system-on-module) form factors.
おすすめ
Military and Aerospace Signal Processing
Military and aerospace signal-processing subsystems often require long-life-cycle, ruggedized MPUs - exactly the niche the MC7447AHX1167NB was designed for. Its 1.167 GHz core and AltiVec vector engine handle radar pulse compression, electronic-warfare demodulation, and image-processing chains. The 105 C junction rating and ceramic-style FCCBGA package support harsh-environment deployments. Designers should consult NXP PCN status carefully for last-time-buy planning.
おすすめ
Test and Measurement Instrumentation
Test and measurement instruments such as oscilloscopes, protocol analyzers, and logic analyzers need a fast deterministic CPU plus vector DSP - both delivered by the MC7447AHX1167NB. AltiVec accelerates FFT-based spectrum analysis, while the 64-bit MPX bus keeps deep acquisition memory streaming to the processor. The 360-FCCBGA fits modular instrument card cages that follow the established MPC7447A reference designs.
おすすめ
Medical Imaging Compute
Medical imaging platforms such as ultrasound beamformers and portable MRI front-ends benefit from the MC7447AHX1167NB's AltiVec SIMD, which accelerates image-reconstruction kernels including FFT, convolution, and back-projection. The 512 KB L2 cache keeps working image data on-chip for high throughput, while the 1.1 V core supports fanless designs required in clinical environments. Designers should follow IEC 60601 isolation guidance around the MPU's I/O rails.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC7447AHX1167NB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC7447ATHX1000NB | MC7447AVU1167NB | MC7448HX1267ND | MC7447AHX1500ND | MC7445AHX1400-NNB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25) | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same |
| Core Family | MPC7447A (PowerPC G4) | MPC7447A (PowerPC G4) | MPC7447A (PowerPC G4) | MPC7448 (PowerPC G4) | MPC7447A (PowerPC G4) | MPC7445 (PowerPC G4) |
| Maximum Clock Frequency | 1.167 GHz | 1.0 GHz | 1.167 GHz | 1.267 GHz | 1.5 GHz | 1.4 GHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB | 256 KB |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.3 V |
| AltiVec Support | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Operating Junction Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
主な差別化要因
- Faster speed bin than the 1.0 GHz MPC7447A member （vs MC7447ATHX1000NB)
- Larger L2 cache than the lower-cost MPC7445 family （vs MC7445AHX1400-NNB)
- Pin-compatible path to the higher-clock MPC7448 family （vs MC7448HX1267ND)
設計ノート
The 360-FCCBGA (25x25 mm) package requires a high-density PCB stack-up. Use 0.8 mm or 1.0 mm pitch BGA land patterns with non-solder-mask-defined pads and via-in-pad micro-vias (typically 0.1 mm laser-drilled) for inner-row signal escape. Match trace impedance to 50 ohms for the MPX bus and provide solid ground/power planes adjacent to every signal layer to control the 64-bit bus skew budget.
Estimated: At 1.167 GHz with a typical MPC7447A power envelope near 10-12 W, design a 6-layer board with at least two dedicated core 1.1 V planes and one Ovdd 1.8 V / 2.5 V plane. Place 22 uF bulk + 100 nF high-frequency ceramic decouplers within 5 mm of each BGA power quadrant. Use a remote-sense feedback to the regulator to compensate for board-level IR drop on the 1.1 V core rail.
Estimated: The 360-FCCBGA thermal resistance (theta_JA) is approximately 12 C/W with proper thermal-via array under the die, allowing 10-12 W dissipation at 105 C junction in still air. Drill a 4x4 thermal-via array under the central die flag and tie them to internal ground planes for heat spreading. In enclosed industrial enclosures, derate ambient by 10-15 C or add a small heatsink.
Do not use the MC7447AHX1167NB in new designs without first reviewing NXP's PCN. The family is End-of-Life, so plan a last-time-buy window or migrate to the recommended NXP replacement. Ensure your bootloader/OS image targets the same MPC7447A mask revision, otherwise power-on reset behavior, HID bits, and PLL configuration may differ between speed bins.
コンプライアンス情報
RoHS, REACH, lead-free and halogen-free compliance were not stated in the retrieved snippets and require confirmation against the manufacturer's latest PCN or material declaration.