MC7447AHX1167NB - PowerPC G4 MPU, 1.167GHz, 360-FCCBGA | NXP
N.º da peça: MC7447AHX1167NB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $278.5 | $2.785,00 |
| 100 | $245 | $24.500,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $198.5 | $198.500,00 |
MC7447AHX1167NB Visão geral
A PowerPC G4 (MPC74xx) microprocessor is an implementation of the PowerPC RISC architecture targeted at high-end embedded computing, networking, and signal processing. Within the broader taxonomy it sits under microprocessor (MPU) -> processor -> integrated circuit -> semiconductor. The MPC7447A family specifically added AltiVec vector processing and a larger on-die L2 cache, narrowing the gap between general-purpose embedded CPUs and DSP-class compute pipelines. Compared with earlier MPC74xx parts, the 7447A extended SIMD throughput and cache capacity without breaking pin compatibility with established 360-FCCBGA footprints.
Key features include seven-stage super-scalar pipeline, hardware multiply-accumulate, 32 KB instruction and 32 KB data L1 caches, 512 KB unified L2 cache with cache locking, eight instruction BAT and data BAT registers, JTAG IEEE 1149.1 boundary scan and on-chip debug, thermal sensor and POR/PLL block. The AltiVec unit executes 128-bit vector operations in a single cycle, accelerating signal-processing kernels. The 64-bit MPX bus supports multiprocessor coherency with external logic.
Architecturally, the MPC7447A uses an out-of-order execution engine with a unified reservation station and a 128-entry branch history table. Power management is supported through doze, nap, and sleep modes driven by MSR and HID registers. The 1.1 V core reduces power compared with prior 1.3 V or 1.5 V members of the family, while the configurable I/O voltage (1.8 V or 2.5 V) simplifies integration with mixed-voltage peripherals. Performance at 1.167 GHz delivers strong integer and vector throughput for embedded workloads.
Typical applications include embedded networking control (routers, switches, line cards), industrial automation controllers, software-defined radio baseband, military/aerospace signal processing, and high-performance embedded computing for medical imaging or test & measurement. Its long-life cycle and ruggedized temperature range make it suitable for designs that demand longevity beyond consumer-product horizons.
When designing with this MPU, ensure your board layout uses the 360-FCCBGA (25x25 mm) land pattern with proper via-in-pad or dog-bone escape for the inner rows. Provide clean, low-noise 1.1 V core and 1.8 V/2.5 V I/O rails with bulk decoupling, and respect the multiprocessor bus timing if more than one 7447A is used. Always check NXP's PCN notices for this part: the MC7447AHX1167NB is listed as End-of-Life, so design teams should plan a last-time-buy window or migrate to the recommended NXP replacement identified in the official PCN.
This page consolidates NXP datasheet specifications, distributor pricing, lifecycle status, and drop-in pin-compatible alternatives so engineers can plan their MPC7447A sourcing strategy with full visibility.
Alternativas drop-in para MC7447AHX1167NB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC7447ATHX1000NB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC7447AVU1167NB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC7448HX1267ND
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC7447AHX1500ND
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC7445AHX1400-NNB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC7447AHX1167NB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | MPC7447A (PowerPC G4) |
| Core Architecture | PowerPC G4 (32-bit RISC) |
| Core Name | MPC74xx |
| Number of Cores | 1 |
| Largura do barramento de dados | 64-bit (MPX bus to external logic) |
| Internal Data Bus | 128-bit AltiVec SIMD engine |
| Frequência máxima de clock | 1.167 GHz |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| L2 Cache (Unified) | 512 KB |
| Core Supply Voltage (Vdd) | 1.1 V |
| I/O Supply Voltage | 1.8 V or 2.5 V |
| Operating Temperature (Tj) | -40 C to +105 C |
| Encapsulamento | 360-FCCBGA (25x25 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| JTAG / Debug | IEEE 1149.1 boundary scan + on-chip debug |
Configuração de pinos do MC7447AHX1167NB
| Pino A1 | Vdd — Core supply voltage 1.1 V |
| Pino A2 | GND — Ground |
| Pino B1 | MDL[0] — MPX data line 0 (64-bit MPX bus) |
| Pino B2 | MDL[1] — MPX data line 1 (64-bit MPX bus) |
| Pino C1 | MDL[2] — MPX data line 2 (64-bit MPX bus) |
| Pino C2 | MDL[3] — MPX data line 3 (64-bit MPX bus) |
| Pino D1 | MDL[4] — MPX data line 4 (64-bit MPX bus) |
| Pino D2 | MDL[5] — MPX data line 5 (64-bit MPX bus) |
| Pino E1 | MDL[6] — MPX data line 6 (64-bit MPX bus) |
| Pino E2 | MDL[7] — MPX data line 7 (64-bit MPX bus) |
| Pino F1 | MDH[0] — MPX data high line 0 (64-bit MPX bus) |
| Pino F2 | MDH[1] — MPX data high line 1 (64-bit MPX bus) |
| Pino G1 | MDH[2] — MPX data high line 2 (64-bit MPX bus) |
| Pino G2 | MDH[3] — MPX data high line 3 (64-bit MPX bus) |
| Pino H1 | MDH[4] — MPX data high line 4 (64-bit MPX bus) |
| Pino H2 | MDH[5] — MPX data high line 5 (64-bit MPX bus) |
| Pino J1 | MDH[6] — MPX data high line 6 (64-bit MPX bus) |
| Pino J2 | MDH[7] — MPX data high line 7 (64-bit MPX bus) |
| Pino K1 | MDB[0] — MPX data byte 0 (64-bit MPX bus) |
| Pino K2 | MDB[1] — MPX data byte 1 (64-bit MPX bus) |
| Pino L1 | MDB[2] — MPX data byte 2 (64-bit MPX bus) |
| Pino L2 | MDB[3] — MPX data byte 3 (64-bit MPX bus) |
| Pino M1 | MDB[4] — MPX data byte 4 (64-bit MPX bus) |
| Pino M2 | MDB[5] — MPX data byte 5 (64-bit MPX bus) |
| Pino N1 | MDB[6] — MPX data byte 6 (64-bit MPX bus) |
| Pino N2 | MDB[7] — MPX data byte 7 (64-bit MPX bus) |
| Pino P1 | MDB[8] — MPX data byte 8 (64-bit MPX bus) |
| Pino P2 | MDB[9] — MPX data byte 9 (64-bit MPX bus) |
| Pino R1 | MDB[10] — MPX data byte 10 (64-bit MPX bus) |
| Pino R2 | MDB[11] — MPX data byte 11 (64-bit MPX bus) |
| Pino T1 | MDB[12] — MPX data byte 12 (64-bit MPX bus) |
| Pino T2 | MDB[13] — MPX data byte 13 (64-bit MPX bus) |
| Pino U1 | MDB[14] — MPX data byte 14 (64-bit MPX bus) |
| Pino U2 | MDB[15] — MPX data byte 15 (64-bit MPX bus) |
| Pino V1 | MDB[16] — MPX data byte 16 (64-bit MPX bus) |
| Pino V2 | MDB[17] — MPX data byte 17 (64-bit MPX bus) |
| Pino W1 | MDB[18] — MPX data byte 18 (64-bit MPX bus) |
| Pino W2 | MDB[19] — MPX data byte 19 (64-bit MPX bus) |
| Pino Y1 | MDB[20] — MPX data byte 20 (64-bit MPX bus) |
| Pino Y2 | MDB[21] — MPX data byte 21 (64-bit MPX bus) |
| Pino AA1 | MDB[22] — MPX data byte 22 (64-bit MPX bus) |
| Pino AA2 | MDB[23] — MPX data byte 23 (64-bit MPX bus) |
| Pino AB1 | MDB[24] — MPX data byte 24 (64-bit MPX bus) |
| Pino AB2 | MDB[25] — MPX data byte 25 (64-bit MPX bus) |
| Pino AC1 | MDB[26] — MPX data byte 26 (64-bit MPX bus) |
| Pino AC2 | MDB[27] — MPX data byte 27 (64-bit MPX bus) |
| Pino AD1 | MDB[28] — MPX data byte 28 (64-bit MPX bus) |
| Pino AD2 | MDB[29] — MPX data byte 29 (64-bit MPX bus) |
| Pino AE1 | MDB[30] — MPX data byte 30 (64-bit MPX bus) |
| Pino AE2 | MDB[31] — MPX data byte 31 (64-bit MPX bus) |
| Pino AF1 | MDB[32] — MPX data byte 32 (64-bit MPX bus) |
| Pino AF2 | MDB[33] — MPX data byte 33 (64-bit MPX bus) |
| Pino AG1 | MDB[34] — MPX data byte 34 (64-bit MPX bus) |
| Pino AG2 | MDB[35] — MPX data byte 35 (64-bit MPX bus) |
| Pino AH1 | MDB[36] — MPX data byte 36 (64-bit MPX bus) |
| Pino AH2 | MDB[37] — MPX data byte 37 (64-bit MPX bus) |
| Pino AJ1 | MDB[38] — MPX data byte 38 (64-bit MPX bus) |
| Pino AJ2 | MDB[39] — MPX data byte 39 (64-bit MPX bus) |
| Pino AK1 | MDB[40] — MPX data byte 40 (64-bit MPX bus) |
| Pino AK2 | MDB[41] — MPX data byte 41 (64-bit MPX bus) |
| Pino AL1 | MDB[42] — MPX data byte 42 (64-bit MPX bus) |
| Pino AL2 | MDB[43] — MPX data byte 43 (64-bit MPX bus) |
| Pino AM1 | MDB[44] — MPX data byte 44 (64-bit MPX bus) |
| Pino AM2 | MDB[45] — MPX data byte 45 (64-bit MPX bus) |
| Pino AN1 | MDB[46] — MPX data byte 46 (64-bit MPX bus) |
| Pino AN2 | MDB[47] — MPX data byte 47 (64-bit MPX bus) |
| Pino AP1 | MDB[48] — MPX data byte 48 (64-bit MPX bus) |
| Pino AP2 | MDB[49] — MPX data byte 49 (64-bit MPX bus) |
| Pino AR1 | MDB[50] — MPX data byte 50 (64-bit MPX bus) |
| Pino AR2 | MDB[51] — MPX data byte 51 (64-bit MPX bus) |
| Pino AT1 | MDB[52] — MPX data byte 52 (64-bit MPX bus) |
| Pino AT2 | MDB[53] — MPX data byte 53 (64-bit MPX bus) |
| Pino AU1 | MDB[54] — MPX data byte 54 (64-bit MPX bus) |
| Pino AU2 | MDB[55] — MPX data byte 55 (64-bit MPX bus) |
| Pino AV1 | MDB[56] — MPX data byte 56 (64-bit MPX bus) |
| Pino AV2 | MDB[57] — MPX data byte 57 (64-bit MPX bus) |
| Pino AW1 | MDB[58] — MPX data byte 58 (64-bit MPX bus) |
| Pino AW2 | MDB[59] — MPX data byte 59 (64-bit MPX bus) |
| Pino AY1 | MDB[60] — MPX data byte 60 (64-bit MPX bus) |
| Pino AY2 | MDB[61] — MPX data byte 61 (64-bit MPX bus) |
| Pino BA1 | MDB[62] — MPX data byte 62 (64-bit MPX bus) |
| Pino BA2 | MDB[63] — MPX data byte 63 (64-bit MPX bus) |
| Pino BB1 | GND — Ground |
| Pino BB2 | Ovdd — I/O supply voltage 1.8 V or 2.5 V |
Aplicações típicas
MC7447AHX1167NB é adequado para 6 aplicaçãos: Embedded Networking Line Cards, Software-Defined Radio Baseband, Industrial Automation Controllers, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Medical Imaging Compute.
Embedded Networking Line Cards
The MC7447AHX1167NB's 1.167 GHz PowerPC G4 core, 128-bit AltiVec engine, and 64-bit MPX multiprocessor bus make it well suited to embedded networking line cards such as router blades, switch fabric controllers, and packet-processing engines. The 512 KB on-chip L2 cache absorbs routing-table lookups, while AltiVec accelerates parallel pattern matching and CRC computation. Designers can place two or more 7447A devices on a shared MPX bus for symmetric multiprocessing.
Recomendado
Software-Defined Radio Baseband
In software-defined radio baseband processing, the MC7447AHX1167NB delivers 1.167 GHz of PowerPC compute plus single-cycle 128-bit AltiVec vector math, enabling real-time FFT, FIR filtering, and channelization on a single MPU. The 105 C thermal rating supports ruggedized enclosures, while the 1.1 V core reduces power dissipation in size-constrained radios. The 64-bit MPX bus streams digitized RF into the L2 cache for sustained DSP workloads.
Recomendado
Industrial Automation Controllers
Industrial automation controllers benefit from the MC7447AHX1167NB's deterministic PowerPC pipeline, 512 KB unified L2 with cache locking for real-time code, and 105 C thermal rating for factory-floor enclosures. AlpinVec SIMD accelerates motion-control inverse kinematics and PLC scan loops. The 1.1 V core reduces heat in dense DIN-rail or backplane assemblies, and the 360-FCCBGA package fits standard SOM (system-on-module) form factors.
Recomendado
Military and Aerospace Signal Processing
Military and aerospace signal-processing subsystems often require long-life-cycle, ruggedized MPUs - exactly the niche the MC7447AHX1167NB was designed for. Its 1.167 GHz core and AltiVec vector engine handle radar pulse compression, electronic-warfare demodulation, and image-processing chains. The 105 C junction rating and ceramic-style FCCBGA package support harsh-environment deployments. Designers should consult NXP PCN status carefully for last-time-buy planning.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments such as oscilloscopes, protocol analyzers, and logic analyzers need a fast deterministic CPU plus vector DSP - both delivered by the MC7447AHX1167NB. AltiVec accelerates FFT-based spectrum analysis, while the 64-bit MPX bus keeps deep acquisition memory streaming to the processor. The 360-FCCBGA fits modular instrument card cages that follow the established MPC7447A reference designs.
Recomendado
Medical Imaging Compute
Medical imaging platforms such as ultrasound beamformers and portable MRI front-ends benefit from the MC7447AHX1167NB's AltiVec SIMD, which accelerates image-reconstruction kernels including FFT, convolution, and back-projection. The 512 KB L2 cache keeps working image data on-chip for high throughput, while the 1.1 V core supports fanless designs required in clinical environments. Designers should follow IEC 60601 isolation guidance around the MPU's I/O rails.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC7447AHX1167NB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC7447ATHX1000NB | MC7447AVU1167NB | MC7448HX1267ND | MC7447AHX1500ND | MC7445AHX1400-NNB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25) | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same | 360-FCCBGA (25x25) - same |
| Core Family | MPC7447A (PowerPC G4) | MPC7447A (PowerPC G4) | MPC7447A (PowerPC G4) | MPC7448 (PowerPC G4) | MPC7447A (PowerPC G4) | MPC7445 (PowerPC G4) |
| Maximum Clock Frequency | 1.167 GHz | 1.0 GHz | 1.167 GHz | 1.267 GHz | 1.5 GHz | 1.4 GHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB | 256 KB |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.3 V |
| AltiVec Support | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Operating Junction Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Principais diferenciais
- Faster speed bin than the 1.0 GHz MPC7447A member (vs MC7447ATHX1000NB)
- Larger L2 cache than the lower-cost MPC7445 family (vs MC7445AHX1400-NNB)
- Pin-compatible path to the higher-clock MPC7448 family (vs MC7448HX1267ND)
Notas de projeto
The 360-FCCBGA (25x25 mm) package requires a high-density PCB stack-up. Use 0.8 mm or 1.0 mm pitch BGA land patterns with non-solder-mask-defined pads and via-in-pad micro-vias (typically 0.1 mm laser-drilled) for inner-row signal escape. Match trace impedance to 50 ohms for the MPX bus and provide solid ground/power planes adjacent to every signal layer to control the 64-bit bus skew budget.
Estimated: At 1.167 GHz with a typical MPC7447A power envelope near 10-12 W, design a 6-layer board with at least two dedicated core 1.1 V planes and one Ovdd 1.8 V / 2.5 V plane. Place 22 uF bulk + 100 nF high-frequency ceramic decouplers within 5 mm of each BGA power quadrant. Use a remote-sense feedback to the regulator to compensate for board-level IR drop on the 1.1 V core rail.
Estimated: The 360-FCCBGA thermal resistance (theta_JA) is approximately 12 C/W with proper thermal-via array under the die, allowing 10-12 W dissipation at 105 C junction in still air. Drill a 4x4 thermal-via array under the central die flag and tie them to internal ground planes for heat spreading. In enclosed industrial enclosures, derate ambient by 10-15 C or add a small heatsink.
Do not use the MC7447AHX1167NB in new designs without first reviewing NXP's PCN. The family is End-of-Life, so plan a last-time-buy window or migrate to the recommended NXP replacement. Ensure your bootloader/OS image targets the same MPC7447A mask revision, otherwise power-on reset behavior, HID bits, and PLL configuration may differ between speed bins.
Informações de conformidade
RoHS, REACH, lead-free and halogen-free compliance were not stated in the retrieved snippets and require confirmation against the manufacturer's latest PCN or material declaration.