MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP
部品番号: MC9S08AC16MFDE ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.4269 | $4.43 |
| 10 | $3.95 | $39.50 |
| 100 | $3.42 | $342.00 |
| 500 | $2.98 | $1,490.00 |
| 1,000 | $2.65 | $2,650.00 |
MC9S08AC16MFDE 概要
What is an 8-bit microcontroller? An 8-bit MCU (microcontroller) is a compact computing device that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and peripherals on a single silicon die. Within the broader taxonomy, an 8-bit MCU is a type of microcontroller, which belongs to the embedded processor family, semiconductor category. The S08 core is Freescale/NXP's updated 8-bit architecture succeeding the HC08, featuring a background debug module (BDM), hardware multiplication/division assistance, and enhanced low-power modes that improve code density and energy efficiency over earlier 8-bit cores.
Key features of the MC9S08AC16MFDE include 16KB Flash program memory, 1KB RAM, an internal clock generator supporting 20MHz bus frequency from a 40MHz CPU source, multiple timers (TPM1/TPM2), an analog-to-digital converter, and an SCI/SPI/I2C communication suite. The QFN-48 exposed-pad package supports efficient thermal dissipation in space-constrained PCB layouts while exposing 38 GPIO lines plus dedicated peripheral pins.
The device targets cost-sensitive, deterministic control applications where 32-bit MCUs would be over-spec and where industrial temperature range and EMC robustness are required. Its enhanced HCS08 core executes most instructions in 1-2 bus cycles and includes a BDM interface for in-circuit debug and Flash programming without requiring the target application to be running.
Typical applications include automotive body electronics (seat controllers, mirror modules, lighting controls), industrial motor control and HMI panels, white goods motor drivers, sensor signal conditioning nodes, and low-end consumer appliances. The wide 2.7V-5.5V supply range supports both 3.3V and 5V system rails, and the industrial temperature range of -40C to +125C enables under-hood and factory-floor deployments.
When designing with this MCU, allocate the exposed thermal pad to a continuous ground copper pour to maintain junction temperature under high GPIO switching loads. Enable the internal voltage regulator bypass capacitor and reserve the PTA4/TCLK1 pin for BDM debug access during prototype bring-up.
This page synthesizes pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing, second-sourcing, and implementing the MC9S08AC16MFDE in production designs.
ドロップイン代替品: MC9S08AC16MFDE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S08AC16MFDE （同一形状・フットプリント） — 相違点: Package, RoHS Status, Debug Interface, Communication Interfaces, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S08AC32CFGE
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MC9S08AC32MFDE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08AC8MFDE
✅ ドロップイン✓ 在庫あり
$3.78 / 個
データシートを見る →MC9S08AC16CFGE
✅ ドロップイン✓ 在庫あり
$2.6 / 個
データシートを見る →S9S08SG16E1MTGE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S08AC16MFDE 最大定格＆電気的特性
| Core Architecture | HCS08 (8-bit) CISC |
| Program Memory Type | Flash |
| Program Memory Size | 16 KB (16K x 8) |
| RAM Size | 1 KB |
| CPU Clock Speed | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Number of I/O Pins | 38 |
| 動作温度範囲 | -40 C to +125 C |
| パッケージ | QFN-48 (7x7 mm) with Exposed Pad |
| 実装タイプ | Surface Mount |
| Peripherals | TPM, ADC, SCI, SPI, I2C |
| Debug Interface | Background Debug Mode (BDM) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| ライフサイクル状態 | Active |
MC9S08AC16MFDE ピン構成
| ピン 1 | PTA5/TCLK2 — General-purpose I/O / TPM2 clock input |
| ピン 2 | PTA6 — General-purpose I/O |
| ピン 3 | PTA7 — General-purpose I/O |
| ピン 4 | VDD — Power supply input (2.7V to 5.5V) |
| ピン 5 | VSS — Ground reference |
| ピン 6 | PTB0 — General-purpose I/O |
| ピン 7 | PTB1 — General-purpose I/O |
| ピン 8 | PTB2 — General-purpose I/O |
| ピン 9 | PTB3 — General-purpose I/O |
| ピン 10 | PTB4 — General-purpose I/O |
| ピン 11 | PTB5 — General-purpose I/O |
| ピン 12 | PTB6 — General-purpose I/O |
| ピン 13 | PTB7 — General-purpose I/O |
| ピン 14 | PTC0 — General-purpose I/O |
| ピン 15 | PTC1 — General-purpose I/O |
| ピン 16 | PTC2 — General-purpose I/O |
| ピン 17 | PTC3 — General-purpose I/O |
| ピン 18 | PTC4 — General-purpose I/O |
| ピン 19 | PTC5 — General-purpose I/O |
| ピン 20 | PTC6 — General-purpose I/O |
| ピン 21 | PTC7 — General-purpose I/O |
| ピン 22 | PTD0 — General-purpose I/O |
| ピン 23 | PTD1 — General-purpose I/O |
| ピン 24 | PTD2 — General-purpose I/O |
| ピン 25 | PTD3 — General-purpose I/O |
| ピン 26 | PTD4 — General-purpose I/O |
| ピン 27 | PTD5 — General-purpose I/O |
| ピン 28 | PTD6 — General-purpose I/O |
| ピン 29 | PTD7 — General-purpose I/O |
| ピン 30 | PTE0/TxD1 — General-purpose I/O / SCI1 transmit |
| ピン 31 | PTE1/RxD1 — General-purpose I/O / SCI1 receive |
| ピン 32 | PTE2 — General-purpose I/O |
| ピン 33 | PTE3 — General-purpose I/O |
| ピン 34 | PTE4 — General-purpose I/O |
| ピン 35 | PTE5 — General-purpose I/O |
| ピン 36 | PTE6 — General-purpose I/O |
| ピン 37 | PTE7 — General-purpose I/O |
| ピン 38 | VDD — Power supply input |
| ピン 39 | VSS — Ground reference |
| ピン 40 | RESET — Reset input (active low) |
| ピン 41 | BKGD/MS — Background Debug Mode / Mode Select |
| ピン 42 | PTA0 — General-purpose I/O |
| ピン 43 | PTA1 — General-purpose I/O |
| ピン 44 | PTA2 — General-purpose I/O |
| ピン 45 | PTA3 — General-purpose I/O |
| ピン 46 | PTA4/TCLK1 — General-purpose I/O / TPM1 clock input |
| ピン 47 | VDD — Power supply input |
| ピン 48 | VSS — Ground reference |
主な用途
MC9S08AC16MFDE の用途: 6 件s: Automotive Body Electronics, Industrial Motor Control and HMI, White Goods and Appliance Control, Sensor Signal Conditioning Nodes, Low-End Consumer Appliances, Battery Management and Monitoring.
Automotive Body Electronics
The MC9S08AC16MFDE suits seat controllers, mirror modules, and lighting controllers in automotive body networks because its 40MHz HCS08 core delivers deterministic 1-2 bus-cycle instruction execution for real-time BLDC commutation and LED PWM loops. The 38 GPIO lines drive H-bridges directly through MOSFET pre-drivers, while the on-chip 10-bit ADC samples current-sense shunt signals at the PWM switching rate for closed-loop torque control. Industrial -40C to +125C temperature grade handles underhood and cabin temperature swings, and the wide 2.7V-5.5V supply range tolerates cranking transients on a 12V battery rail regulated to 5V. The QFN-48 7x7 mm with exposed pad provides compact PCB mounting under dash bezels while the integrated BDM debug port enables in-vehicle Flash reprogramming during service.
おすすめ
Industrial Motor Control and HMI
For industrial motor starters, variable-frequency drives under 1kW, and HMI touch panels, the MC9S08AC16MFDE pairs a deterministic 8-bit core with motor-control peripherals including TPM1/TPM2 for center-aligned PWM generation, an ADC for back-EMF sensing, and SCI for Modbus RTU communication with PLC masters. The 16KB Flash accommodates trapezoidal commutation tables for 4-pole BLDC motors while leaving room for safety diagnostics and UART bootloader. Wide supply range 2.7-5.5V supports 24V industrial bus systems regulated down to 5V or 3.3V, and the industrial -40C to +125C temperature grade operates inside sealed motor housings with derating. The 38 GPIOs drive optocouplers, relays, and indicator LEDs directly without external buffer ICs.
おすすめ
White Goods and Appliance Control
In washing machines, dishwashers, and induction cooktops, the MC9S08AC16MFDE delivers the deterministic timing required for triac-fired heater elements, induction coil PWM, and drum motor commutation. The HCS08 core's 1-2 cycle instruction execution handles triac zero-crossing detection within 100 microseconds of mains zero crossing, ensuring synchronous firing without DC offset that would damage the heating element. The 1KB RAM is sufficient for soft-start ramp tables, while 16KB Flash houses the user interface state machine, sensor linearization tables, and fault logging buffers. The industrial temperature grade tolerates the 85C ambient inside an appliance cabinet adjacent to a heating coil, eliminating the need for additional thermal isolation in the BOM.
おすすめ
Sensor Signal Conditioning Nodes
Distributed sensor hubs in industrial IoT and building automation leverage the MC9S08AC16MFDE's 38 GPIOs to interface 4-20mA loop sensors, thermocouples via SPI ADC front-ends, and digital I/O expansion. The 10-bit on-chip ADC samples analog sensor channels at a rate sufficient for thermistor linearization and ratiometric pressure transducer readout, while the SPI bus connects to external 16-bit ADCs for higher-resolution measurements. The SCI peripheral delivers Modbus RTU or proprietary protocols over RS-485 transceivers to a central PLC, and the BDM debug port simplifies bench bring-up before deployment. Low sleep-mode current extends battery life in remote sensor nodes powered by energy harvesting or 3.6V lithium cells.
おすすめ
Low-End Consumer Appliances
The MC9S08AC16MFDE powers coffee makers, blenders, rice cookers, and other cost-sensitive consumer appliances where reliability over 5-10 years matters more than raw MIPS. Its 8-bit HCS08 core runs the user interface state machine, controls relays for heating elements, times cooking cycles, and drives 7-segment or character LCDs through the GPIO matrix. The internal voltage regulator eliminates the need for an external 3.3V LDO, reducing BOM cost by 0.10-0.20 USD. Industrial temperature grade supports the 60C ambient inside an appliance housing, while the QFN-48 7x7 mm package fits behind the LCD with no clearance concerns. Code density benefits from the HCS08's updated instruction set compared to legacy HC08 designs.
おすすめ
Battery Management and Monitoring
For 12V lead-acid battery monitoring in automotive and backup-power applications, the MC9S08AC16MFDE samples cell voltage, pack current, and temperature through its on-chip ADC, computes state-of-charge in firmware, and reports over LIN or CAN to a master ECU. The 2.7-5.5V supply range is compatible with 12V battery rails regulated to 5V, and the industrial temperature range handles underhood and outdoor cabinet environments. The TPM modules generate PWM for switched-mode balancing of multi-cell packs, while the SCI drives a LIN transceiver for low-cost daisy-chain battery monitoring topologies. Code density in 16KB is sufficient for coulomb counting, open-circuit voltage estimation, and a safety watchdog.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S08AC16MFDE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S08AC32CFGE | MC9S08AC32MFDE | MC9S08AC8MFDE | MC9S08AC16CFGE |
|---|---|---|---|---|---|
| Package | QFN-48 (7x7 mm) with Exposed Pad | QFN-48 (7x7 mm) with Exposed Pad - same | QFN-48 (7x7 mm) with Exposed Pad - same | QFN-48 (7x7 mm) with Exposed Pad - same | QFN-48 (7x7 mm) with Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Program Flash | 16 KB | 32 KB | 32 KB | 8 KB | 16 KB |
| CPU Core | HCS08 40MHz | HCS08 40MHz | HCS08 40MHz | HCS08 40MHz | HCS08 40MHz |
| Supply Voltage | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V |
| Operating Temperature | -40C to +125C (Industrial) | 0C to +70C (Commercial) | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +70C (Commercial) |
| Number of I/O | 38 | 38 | 38 | 38 | 38 |
| Lifecycle Status | Active | Active | Active | Active | Active |
主な差別化要因
- Balanced Flash density with same-family upgrade path （vs MC9S08AC8MFDE)
- Industrial temperature range standard （vs MC9S08AC16CFGE)
- Direct same-brand upgrade to 32KB Flash （vs MC9S08AC32MFDE)
設計ノート
The QFN-48 7x7 mm package relies on the exposed thermal pad for heat removal. Estimated: with theta_JA of approximately 30 C/W on a 1-oz 4-layer FR4 board and 1 square inch of copper ground pour, the device handles up to 1W dissipation before exceeding industrial temperature limits. Place thermal vias in a 4x4 grid under the exposed pad, stitching to internal ground planes, to maintain junction temperature below +125C during full GPIO switching load.
Reserve at least 0.5 mm clearance around the exposed pad for solder paste deposition; use a 4x4 via array with 0.3 mm drill and 0.6 mm pad on the thermal pad to balance solder joint reliability with thermal conductivity. Decouple VDD with one 100 nF ceramic capacitor adjacent to pins 4, 38, and 47 each, plus one bulk 10 uF tantalum or ceramic capacitor near the IC. Keep the BKGD/MS pin trace shorter than 50 mm to avoid signal integrity issues during in-circuit debug.
Always configure the internal clock source for 20 MHz bus operation before enabling peripherals; some TPM and SCI modes assume this clock and will run at half the expected rate if the default 1 MHz startup clock is left in place. Do not exceed 5.5V on any I/O pin during transients; the absolute maximum rating is 6V and exceeded stress can permanently damage ESD protection diodes. For BDM debug, hold RESET low during connection establishment to enter background mode cleanly.
コンプライアンス情報
RoHS compliant per NXP product page and Heisener listing. Not AEC-Q100 qualified (automotive-grade variants have AC16CFNE suffix). Lead-free (Pb-free) matte-tin finish per JEDEC J-STD-020.
