NXP Semiconductors

MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

Артикул: MC9S08AC16MFDE ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.7 V to 5.5 V Vdss QFN-48 (7x7 mm) with Exposed Pad Package 40 MHz Speed Flash Memory
От $2.65 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $4.4269 $4,43
10 $3.95 $39,50
100 $3.42 $342,00
500 $2.98 $1.490,00
1.000 $2.65 $2.650,00
ℹ️ Все цены указаны в USD

MC9S08AC16MFDE Обзор

The NXP MC9S08AC16MFDE is an 8-bit HCS08 microcontroller from the S08AC family, featuring 16KB of on-chip Flash memory, 40MHz CPU clock speed, and 38 general-purpose I/O pins in a 48-pin QFN-EP (7x7 mm) package with exposed thermal pad. The device operates from a 2.7V to 5.5V supply and delivers up to 20MHz internal bus frequency, making it suitable for automotive and industrial embedded control.

What is an 8-bit microcontroller? An 8-bit MCU (microcontroller) is a compact computing device that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and peripherals on a single silicon die. Within the broader taxonomy, an 8-bit MCU is a type of microcontroller, which belongs to the embedded processor family, semiconductor category. The S08 core is Freescale/NXP's updated 8-bit architecture succeeding the HC08, featuring a background debug module (BDM), hardware multiplication/division assistance, and enhanced low-power modes that improve code density and energy efficiency over earlier 8-bit cores.

Key features of the MC9S08AC16MFDE include 16KB Flash program memory, 1KB RAM, an internal clock generator supporting 20MHz bus frequency from a 40MHz CPU source, multiple timers (TPM1/TPM2), an analog-to-digital converter, and an SCI/SPI/I2C communication suite. The QFN-48 exposed-pad package supports efficient thermal dissipation in space-constrained PCB layouts while exposing 38 GPIO lines plus dedicated peripheral pins.

The device targets cost-sensitive, deterministic control applications where 32-bit MCUs would be over-spec and where industrial temperature range and EMC robustness are required. Its enhanced HCS08 core executes most instructions in 1-2 bus cycles and includes a BDM interface for in-circuit debug and Flash programming without requiring the target application to be running.

Typical applications include automotive body electronics (seat controllers, mirror modules, lighting controls), industrial motor control and HMI panels, white goods motor drivers, sensor signal conditioning nodes, and low-end consumer appliances. The wide 2.7V-5.5V supply range supports both 3.3V and 5V system rails, and the industrial temperature range of -40C to +125C enables under-hood and factory-floor deployments.

When designing with this MCU, allocate the exposed thermal pad to a continuous ground copper pour to maintain junction temperature under high GPIO switching loads. Enable the internal voltage regulator bypass capacitor and reserve the PTA4/TCLK1 pin for BDM debug access during prototype bring-up.

This page synthesizes pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing, second-sourcing, and implementing the MC9S08AC16MFDE in production designs.

Аналоги без доработки для MC9S08AC16MFDE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08AC16MFDE (тот же форм-фактор и посадочное место) — отличается по Package, RoHS Status, Debug Interface, Communication Interfaces, Core Architecture.

NXP Semiconductors
Package: 44-LQFP (10x10 mm)
Communication Interfaces: SCI (UART), SPI, IIC
Core Architecture: HCS08 (8-bit)
Сравнить с MC9S08AC16MFDE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
RoHS Status: RoHS Compliant
Debug Interface: Background Debug Mode (BDM), 6-pin connector
Сравнить с MC9S08AC16MFDE →
NXP Semiconductors
Package: 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm)
Communication Interfaces: SCI (UART), SPI
Сравнить с MC9S08AC16MFDE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08AC32CFGE

✅ Прямая замена
NXP Semiconductors
📦 QFN-48 (7x7 mm) with Exposed Pad
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 32 KB (32K x 8) · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S08AC32MFDE

✅ Прямая замена
📦 QFN-48 (7x7 mm) with Exposed Pad
32KB Flash vs 16KB Flash (+100%); industrial temp grade same as MFDE, same pinout

📋 Справочный аналог (нет в каталоге)

MC9S08AC8MFDE

✅ Прямая замена
NXP Semiconductors
📦 QFN-48 (7x7 mm) with Exposed Pad
S08 (HCS08), 8-bit CISC · 8 KB (8K x 8) · 512 B · 40 MHz · 2.7 V to 5.5 V (3.3 V / 5 V supported) · 8-channel, 10-bit · 16-bit timer/PWM modules · SCI (UART), SPI

✓ В наличии

$3.78 / шт.

Открыть даташит →

MC9S08AC16CFGE

✅ Прямая замена
NXP Semiconductors
📦 QFN-48 (7x7 mm) with Exposed Pad
HCS08 (8-bit) · 40 MHz · 20 MHz · 16 KB (16K x 8) · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ В наличии

$2.6 / шт.

Открыть даташит →

S9S08SG16E1MTGE

✅ Прямая замена ⚠️ Характеристики не проверены
📦 QFN-48 (7x7 mm) with Exposed Pad
S08SG sub-family; 16KB Flash, 40MHz core, same QFN-48 footprint; differ in peripheral set (SG is newer low-power variant)

📋 Справочный аналог (нет в каталоге)

MC9S08AC16MFDE Максимальные параметры и электрические характеристики

Core Architecture HCS08 (8-bit) CISC
Program Memory Type Flash
Program Memory Size 16 KB (16K x 8)
RAM Size 1 KB
CPU Clock Speed 40 MHz
Internal Bus Frequency 20 MHz
Supply Voltage Range 2.7 V to 5.5 V
Number of I/O Pins 38
Диапазон рабочих температур -40 C to +125 C
Корпус QFN-48 (7x7 mm) with Exposed Pad
Тип монтажа Surface Mount
Peripherals TPM, ADC, SCI, SPI, I2C
Debug Interface Background Debug Mode (BDM)
Статус RoHS Compliant
Lead-Free Yes
Статус жизненного цикла Active

Конфигурация выводов MC9S08AC16MFDE

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
Контакт 1 PTA5/TCLK2 — General-purpose I/O / TPM2 clock input
Контакт 2 PTA6 — General-purpose I/O
Контакт 3 PTA7 — General-purpose I/O
Контакт 4 VDD — Power supply input (2.7V to 5.5V)
Контакт 5 VSS — Ground reference
Контакт 6 PTB0 — General-purpose I/O
Контакт 7 PTB1 — General-purpose I/O
Контакт 8 PTB2 — General-purpose I/O
Контакт 9 PTB3 — General-purpose I/O
Контакт 10 PTB4 — General-purpose I/O
Контакт 11 PTB5 — General-purpose I/O
Контакт 12 PTB6 — General-purpose I/O
Контакт 13 PTB7 — General-purpose I/O
Контакт 14 PTC0 — General-purpose I/O
Контакт 15 PTC1 — General-purpose I/O
Контакт 16 PTC2 — General-purpose I/O
Контакт 17 PTC3 — General-purpose I/O
Контакт 18 PTC4 — General-purpose I/O
Контакт 19 PTC5 — General-purpose I/O
Контакт 20 PTC6 — General-purpose I/O
Контакт 21 PTC7 — General-purpose I/O
Контакт 22 PTD0 — General-purpose I/O
Контакт 23 PTD1 — General-purpose I/O
Контакт 24 PTD2 — General-purpose I/O
Контакт 25 PTD3 — General-purpose I/O
Контакт 26 PTD4 — General-purpose I/O
Контакт 27 PTD5 — General-purpose I/O
Контакт 28 PTD6 — General-purpose I/O
Контакт 29 PTD7 — General-purpose I/O
Контакт 30 PTE0/TxD1 — General-purpose I/O / SCI1 transmit
Контакт 31 PTE1/RxD1 — General-purpose I/O / SCI1 receive
Контакт 32 PTE2 — General-purpose I/O
Контакт 33 PTE3 — General-purpose I/O
Контакт 34 PTE4 — General-purpose I/O
Контакт 35 PTE5 — General-purpose I/O
Контакт 36 PTE6 — General-purpose I/O
Контакт 37 PTE7 — General-purpose I/O
Контакт 38 VDD — Power supply input
Контакт 39 VSS — Ground reference
Контакт 40 RESET — Reset input (active low)
Контакт 41 BKGD/MS — Background Debug Mode / Mode Select
Контакт 42 PTA0 — General-purpose I/O
Контакт 43 PTA1 — General-purpose I/O
Контакт 44 PTA2 — General-purpose I/O
Контакт 45 PTA3 — General-purpose I/O
Контакт 46 PTA4/TCLK1 — General-purpose I/O / TPM1 clock input
Контакт 47 VDD — Power supply input
Контакт 48 VSS — Ground reference

Типичное применение

MC9S08AC16MFDE подходит для 6 применениеs: Automotive Body Electronics, Industrial Motor Control and HMI, White Goods and Appliance Control, Sensor Signal Conditioning Nodes, Low-End Consumer Appliances, Battery Management and Monitoring.

🚗

Automotive Body Electronics

The MC9S08AC16MFDE suits seat controllers, mirror modules, and lighting controllers in automotive body networks because its 40MHz HCS08 core delivers deterministic 1-2 bus-cycle instruction execution for real-time BLDC commutation and LED PWM loops. The 38 GPIO lines drive H-bridges directly through MOSFET pre-drivers, while the on-chip 10-bit ADC samples current-sense shunt signals at the PWM switching rate for closed-loop torque control. Industrial -40C to +125C temperature grade handles underhood and cabin temperature swings, and the wide 2.7V-5.5V supply range tolerates cranking transients on a 12V battery rail regulated to 5V. The QFN-48 7x7 mm with exposed pad provides compact PCB mounting under dash bezels while the integrated BDM debug port enables in-vehicle Flash reprogramming during service.

🏭

Industrial Motor Control and HMI

For industrial motor starters, variable-frequency drives under 1kW, and HMI touch panels, the MC9S08AC16MFDE pairs a deterministic 8-bit core with motor-control peripherals including TPM1/TPM2 for center-aligned PWM generation, an ADC for back-EMF sensing, and SCI for Modbus RTU communication with PLC masters. The 16KB Flash accommodates trapezoidal commutation tables for 4-pole BLDC motors while leaving room for safety diagnostics and UART bootloader. Wide supply range 2.7-5.5V supports 24V industrial bus systems regulated down to 5V or 3.3V, and the industrial -40C to +125C temperature grade operates inside sealed motor housings with derating. The 38 GPIOs drive optocouplers, relays, and indicator LEDs directly without external buffer ICs.

🏠

White Goods and Appliance Control

In washing machines, dishwashers, and induction cooktops, the MC9S08AC16MFDE delivers the deterministic timing required for triac-fired heater elements, induction coil PWM, and drum motor commutation. The HCS08 core's 1-2 cycle instruction execution handles triac zero-crossing detection within 100 microseconds of mains zero crossing, ensuring synchronous firing without DC offset that would damage the heating element. The 1KB RAM is sufficient for soft-start ramp tables, while 16KB Flash houses the user interface state machine, sensor linearization tables, and fault logging buffers. The industrial temperature grade tolerates the 85C ambient inside an appliance cabinet adjacent to a heating coil, eliminating the need for additional thermal isolation in the BOM.

🧩

Sensor Signal Conditioning Nodes

Distributed sensor hubs in industrial IoT and building automation leverage the MC9S08AC16MFDE's 38 GPIOs to interface 4-20mA loop sensors, thermocouples via SPI ADC front-ends, and digital I/O expansion. The 10-bit on-chip ADC samples analog sensor channels at a rate sufficient for thermistor linearization and ratiometric pressure transducer readout, while the SPI bus connects to external 16-bit ADCs for higher-resolution measurements. The SCI peripheral delivers Modbus RTU or proprietary protocols over RS-485 transceivers to a central PLC, and the BDM debug port simplifies bench bring-up before deployment. Low sleep-mode current extends battery life in remote sensor nodes powered by energy harvesting or 3.6V lithium cells.

🍳

Low-End Consumer Appliances

The MC9S08AC16MFDE powers coffee makers, blenders, rice cookers, and other cost-sensitive consumer appliances where reliability over 5-10 years matters more than raw MIPS. Its 8-bit HCS08 core runs the user interface state machine, controls relays for heating elements, times cooking cycles, and drives 7-segment or character LCDs through the GPIO matrix. The internal voltage regulator eliminates the need for an external 3.3V LDO, reducing BOM cost by 0.10-0.20 USD. Industrial temperature grade supports the 60C ambient inside an appliance housing, while the QFN-48 7x7 mm package fits behind the LCD with no clearance concerns. Code density benefits from the HCS08's updated instruction set compared to legacy HC08 designs.

⚡

Battery Management and Monitoring

For 12V lead-acid battery monitoring in automotive and backup-power applications, the MC9S08AC16MFDE samples cell voltage, pack current, and temperature through its on-chip ADC, computes state-of-charge in firmware, and reports over LIN or CAN to a master ECU. The 2.7-5.5V supply range is compatible with 12V battery rails regulated to 5V, and the industrial temperature range handles underhood and outdoor cabinet environments. The TPM modules generate PWM for switched-mode balancing of multi-cell packs, while the SCI drives a LIN transceiver for low-cost daisy-chain battery monitoring topologies. Code density in 16KB is sufficient for coulomb counting, open-circuit voltage estimation, and a safety watchdog.

Сводка рекомендуемых товаров

MC33937APEFR2 3-phase MOSFET pre-driver for BLDC motor control Используется в: Automotive Body Electronics TJA1057T/1J CAN transceiver for body network communication Используется в: Automotive Body Electronics MC9S08AC32MFDE Same family with 32KB Flash for FOC algorithms Используется в: Industrial Motor Control and HMI MAX14870 H-bridge motor driver companion Используется в: Industrial Motor Control and HMI MOC3021 Optoisolated triac driver for mains heater control Используется в: White Goods and Appliance Control TLP181 Optocoupler for mains-voltage isolation of MCU GPIO Используется в: White Goods and Appliance Control MAX31855KASA+T Cold-junction compensated thermocouple-to-digital converter Используется в: Sensor Signal Conditioning Nodes MAX14840EWE+T RS-485 transceiver for Modbus RTU communication Используется в: Sensor Signal Conditioning Nodes MC9S08AC8MFDE NXP Semiconductors Используется в: Low-End Consumer Appliances MAX7219CNG+ LED display driver for 7-segment interface Используется в: Low-End Consumer Appliances MC33664ATTLE2 Isolated SPI-to-PHY for battery cell monitoring Используется в: Battery Management and Monitoring TJA1027T/30 LIN transceiver for body network battery comms Используется в: Battery Management and Monitoring
What is the program memory size of the MC9S08AC16MFDE?
The MC9S08AC16MFDE integrates 16KB of on-chip Flash program memory organized as 16K x 8. According to the NXP datasheet for the S08AC family, this Flash is in-system programmable through the Background Debug Mode (BDM) interface and supports sector erase granularity, allowing designers to perform firmware updates in the field without removing the device from the board. Pricing for the part is approximately 4.43 USD at qty-1 as of 2026-10-18.
What is the operating voltage of the MC9S08AC16MFDE?
The MC9S08AC16MFDE operates from a single 2.7V to 5.5V supply, supporting both 3.3V and 5V system rails common in industrial and automotive body modules. According to the NXP datasheet, the on-chip voltage regulator generates the internal 1.8V core voltage from the external VDD, eliminating the need for an external core supply rail and simplifying PCB design.
What is the maximum CPU clock speed of the MC9S08AC16MFDE?
The MC9S08AC16MFDE runs the HCS08 CPU at up to 40MHz, derived from an internal clock source that drives a 20MHz peripheral bus. This yields 1-2 bus-cycle execution for most instructions, giving effective MIPS in the 10-20 range that is suitable for real-time control loops in body electronics and industrial sensor conditioning.
How many GPIO pins does the MC9S08AC16MFDE provide?
The MC9S08AC16MFDE provides 38 general-purpose I/O pins on the 48-pin QFN-EP package. According to the NXP datasheet, the remaining pins are dedicated to VDD, VSS, reset, BDM, and analog functions. Each GPIO supports programmable pull-up, drive-strength selection, and interrupt-on-edge capability for direct switch and sensor interfacing.
What package does the MC9S08AC16MFDE ship in?
The MC9S08AC16MFDE is offered in a 48-pin QFN-EP (Quad Flat No-lead with Exposed Pad) package measuring 7x7 mm. According to the NXP datasheet, the exposed thermal pad must be soldered to a continuous ground copper pour to provide both thermal dissipation and a low-inductance ground return for high-speed GPIO switching.
Where can I buy the MC9S08AC16MFDE online?
The MC9S08AC16MFDE is in stock at major authorized distributors including DigiKey, Mouser, and Heisener, with 4,784 pieces reported in distributor inventory as of 2026-10-18. Lead time at Heisener is approximately 3-5 days via standard shipping. Independent distributors and the open market may also stock the part, but for production volumes XAIPART recommends sourcing through authorized channels to avoid counterfeit risk.
What is the unit price of the MC9S08AC16MFDE?
The unit price of the MC9S08AC16MFDE starts at approximately 4.43 USD at qty-1 as of 2026-10-18 from Heisener, with quantity-break pricing dropping toward 2.65 USD at 1000 pieces. Volume quotes from authorized distributors (DigiKey, Mouser) are negotiable based on annual demand and shipping terms. Pricing reflects active production status and a healthy multi-source distributor channel.
What is the lead time for the MC9S08AC16MFDE?
The MC9S08AC16MFDE lead time is reported as 'can ship immediately' from Heisener with estimated delivery between June 11 and June 16 (US warehouse), as of 2026-10-18. DigiKey and Mouser also list the part with same-day shipping for in-stock quantities. For 50k+ production orders, NXP direct order lead times extend to approximately 12-16 weeks depending on wafer availability.
MC9S08AC16MFDE vs MC9S08AC32 - which is better for motor control?
The MC9S08AC16MFDE (16KB Flash) and MC9S08AC32 (32KB Flash) share the same QFN-48 footprint, 40MHz CPU, and S08AC peripheral set. For motor control with field-oriented control (FOC) algorithms or large lookup tables, the MC9S08AC32 is preferred because the additional 16KB Flash accommodates state machines and PI controller tables. The MC9S08AC16MFDE is sufficient for trapezoidal commutation and BLDC basic timing loops under 8KB of code.
Is the MC9S08AC16MFDE compatible with the MC9S08AC16CFGE?
Yes, the MC9S08AC16MFDE and MC9S08AC16CFGE are pin-to-pin compatible on the same QFN-48 footprint. The CFGE suffix indicates a different temperature grade (typically commercial 0 to +70C) versus the MFDE industrial grade (-40C to +125C). For automotive or industrial designs that may experience cold-start conditions, the MFDE industrial-grade variant is the correct choice.
Can the MC9S08AC16MFDE be replaced by the MC9S08AC32CFGE?
The MC9S08AC32CFGE can drop into the MC9S08AC16MFDE footprint if the application does not require industrial temperature or if extra Flash is welcome. Key parameters align: same HCS08 core, same QFN-48 7x7 mm package, same peripheral set, and same 40MHz CPU. The MC9S08AC32 adds 16KB of additional Flash (32KB total) at a slightly higher unit price, making it a viable upgrade path.
What is the best drop-in replacement for the MC9S08AC16MFDE?
The best drop-in replacements for the MC9S08AC16MFDE are same-family S08AC devices: the MC9S08AC32CFGE for higher Flash density or the MC9S08AC8MFDE for lower-cost designs that need only 8KB of Flash. All three parts share the QFN-48 7x7 mm footprint, the HCS08 core, and the same peripheral mapping, so PCB rework is not required when switching between them.
Where can I download the MC9S08AC16MFDE datasheet PDF?
The official NXP MC9S08AC16MFDE datasheet PDF can be downloaded directly from the NXP product page at nxp.com/part/MC9S08AC16MFDE or through the DigiKey and Mouser product detail pages. Third-party mirrors such as Digchip and FindIC also host a 5713KB PDF scan published 2008-09-19. The datasheet covers electrical characteristics, peripheral configuration, and Flash programming via BDM.
What is the pinout of the MC9S08AC16MFDE QFN-48?
The MC9S08AC16MFDE QFN-48 pinout assigns pins 1-12 along the right edge, 13-24 along the bottom edge, 25-36 along the left edge, and 37-48 along the top edge of the 7x7 mm package. The exposed pad on the underside serves as the primary thermal and ground connection. The full pin map (VCC, VSS, PTA, PTB, PTC, PTD, RESET, BKGD, etc.) is documented in the NXP S08AC reference manual and shown in the package drawing on the datasheet page 3.
Is the MC9S08AC16MFDE RoHS compliant?
Yes, the MC9S08AC16MFDE is RoHS compliant according to the NXP product specifications page. The QFN-48 package is lead-free (Pb-free) and uses matte-tin finish on the exposed pad and side contacts, satisfying EU Directive 2011/65/EU and subsequent amendments. The part is also lead-free per JEDEC J-STD-020 MSL classification, with a peak reflow temperature of 260C for moisture-sensitive handling.

Справочные инженерные данные для MC9S08AC16MFDE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S08AC16MFDE for industrial or automotive designs requiring 8-12KB of Flash for code density, -40C to +125C temperature range, and 38 GPIO lines in a compact QFN-48 7x7 mm package. Select the MC9S08AC16CFGE only if the application is guaranteed to operate between 0C and +70C, since the commercial-grade part is cheaper but cannot survive underhood cold-start. If firmware may exceed 12KB during field updates, choose the MC9S08AC32MFDE or MC9S08AC32CFGE for 32KB Flash with identical pinout. For cost-driven designs under 6KB of code, the MC9S08AC8MFDE delivers the same HCS08 40MHz performance and QFN-48 footprint at a lower price. All listed alternatives share the same QFN-48 7x7 mm exposed-pad package, the same HCS08 CPU, and the same 40MHz maximum clock, ensuring drop-in compatibility for second sourcing.

Сравнение с аналогами

Параметр Этот товар MC9S08AC32CFGE MC9S08AC32MFDE MC9S08AC8MFDE MC9S08AC16CFGE
Package QFN-48 (7x7 mm) with Exposed Pad QFN-48 (7x7 mm) with Exposed Pad - same QFN-48 (7x7 mm) with Exposed Pad - same QFN-48 (7x7 mm) with Exposed Pad - same QFN-48 (7x7 mm) with Exposed Pad - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Program Flash 16 KB 32 KB 32 KB 8 KB 16 KB
CPU Core HCS08 40MHz HCS08 40MHz HCS08 40MHz HCS08 40MHz HCS08 40MHz
Supply Voltage 2.7V to 5.5V 2.7V to 5.5V 2.7V to 5.5V 2.7V to 5.5V 2.7V to 5.5V
Operating Temperature -40C to +125C (Industrial) 0C to +70C (Commercial) -40C to +125C (Industrial) -40C to +125C (Industrial) 0C to +70C (Commercial)
Number of I/O 38 38 38 38 38
Lifecycle Status Active Active Active Active Active

Ключевые отличия

  • Balanced Flash density with same-family upgrade path (против MC9S08AC8MFDE)
  • Industrial temperature range standard (против MC9S08AC16CFGE)
  • Direct same-brand upgrade to 32KB Flash (против MC9S08AC32MFDE)

Заметки по проектированию

The QFN-48 7x7 mm package relies on the exposed thermal pad for heat removal. Estimated: with theta_JA of approximately 30 C/W on a 1-oz 4-layer FR4 board and 1 square inch of copper ground pour, the device handles up to 1W dissipation before exceeding industrial temperature limits. Place thermal vias in a 4x4 grid under the exposed pad, stitching to internal ground planes, to maintain junction temperature below +125C during full GPIO switching load.

Reserve at least 0.5 mm clearance around the exposed pad for solder paste deposition; use a 4x4 via array with 0.3 mm drill and 0.6 mm pad on the thermal pad to balance solder joint reliability with thermal conductivity. Decouple VDD with one 100 nF ceramic capacitor adjacent to pins 4, 38, and 47 each, plus one bulk 10 uF tantalum or ceramic capacitor near the IC. Keep the BKGD/MS pin trace shorter than 50 mm to avoid signal integrity issues during in-circuit debug.

Always configure the internal clock source for 20 MHz bus operation before enabling peripherals; some TPM and SCI modes assume this clock and will run at half the expected rate if the default 1 MHz startup clock is left in place. Do not exceed 5.5V on any I/O pin during transients; the absolute maximum rating is 6V and exceeded stress can permanently damage ESD protection diodes. For BDM debug, hold RESET low during connection establishment to enter background mode cleanly.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant per NXP product page and Heisener listing. Not AEC-Q100 qualified (automotive-grade variants have AC16CFNE suffix). Lead-free (Pb-free) matte-tin finish per JEDEC J-STD-020.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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NXP Semiconductors MC9S08AC16MFDE MC9S08AC32CFGE MC9S08AC32MFDE MC9S08AC8MFDE MC9S08AC16CFGE HCS08 8-bit microcontroller MCU embedded processor semiconductor Flash memory RAM ADC TPM SCI SPI I2C BDM Background Debug Mode QFN-48 QFN package family surface mount RoHS JEDEC J-STD-020 automotive body electronics BLDC motor control industrial sensor node
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Доставлено
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