NXP Semiconductors

MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP

部品番号: MC9S08AC32CFDE ✗ 生産終了
在庫あり 1〜3営業日以内に発送
2.7 V to 5.5 V Vdss 48-QFN-EP (7x7 mm) with exposed thermal pad Package 40 MHz Speed 32 KB Memory
開始価格 $3.02 USD / 個
MOQ: 1 |
価格更新日: 2026-10-19
ボリューム価格
数量 単価 小計
1 $5.42 $5.42
10 $4.89 $48.90
100 $4.12 $412.00
500 $3.55 $1,775.00
1,000 $3.02 $3,020.00
ℹ️ すべての価格はUSDです

MC9S08AC32CFDE 概要

The NXP Semiconductors MC9S08AC32CFDE is an 8-bit microcontroller from the S08AC family featuring an S08 core, 32KB of Flash memory, 1KB of RAM, and a maximum CPU frequency of 40MHz, housed in a 48-pin QFN-EP (7x7 mm) package with exposed thermal pad. It operates from a 2.7V to 5.5V supply and provides 38 general-purpose I/O pins for cost-sensitive embedded designs.

What is an 8-bit microcontroller? An 8-bit microcontroller (MCU) is a small computer-on-a-chip built around an 8-bit data bus, integrating a CPU, non-volatile memory (Flash), volatile memory (RAM), and a rich set of peripherals (timers, communication modules, ADC) into a single IC. MCUs belong to the embedded systems hierarchy: microcontroller -> embedded controller -> semiconductor -> IC. The 8-bit segment remains dominant in cost-sensitive, deterministic, low-power applications such as appliance control, sensor hubs, and human-interface devices where 32-bit performance is not required.

Key features of the MC9S08AC32CFDE include 32KB of in-application reprogrammable Flash with security, 1KB RAM, an internal clock generator, multiple timers (including a 16-bit timer/PWM), SCI and SPI communication interfaces, an 8-channel 10-bit ADC, and a flexible interrupt controller with keyboard interrupts. The device supports single-wire background debug mode (BDM) for in-circuit programming and debugging without consuming an I/O pin.

Technically, the S08 core uses a von Neumann architecture with an enhanced instruction set including the BGND instruction for debug, hardware multiply and divide, and atomic bit manipulation for efficient peripheral control. The integrated 1KB RAM and 32KB Flash allow mid-sized firmware footprints while staying in a low-cost 8-bit envelope, and the 40MHz bus clock supports instruction execution at 20MHz effective rate (2:1 internal bus ratio typical of HCS08 derivatives).

Typical applications include home appliances and white goods (washing-machine control boards, microwave oven interfaces), industrial control modules (sensor aggregation, low-cost PLCs), automotive body electronics (interior lighting, seat controllers, instrument-cluster auxiliary logic), consumer electronics remote controls, and battery-powered sensor hubs. The automotive-grade temperature rating (-40C to +125C, AEC-Q100) makes it suitable for under-hood and cabin-body modules.

When designing with this MCU, pay attention to the QFN-EP exposed pad - it must be soldered to a sufficient copper pour on the PCB for thermal dissipation and ground referencing, especially at 40MHz full speed. Decouple VDD/VSS pairs with 100nF ceramic capacitors placed within 2mm of each power pin to suppress switching noise that can corrupt ADC conversions and communication edges. The internal clock source can eliminate the external crystal on cost-sensitive boards, but for SCI baud-rate accuracy and EMC compliance an external crystal is still recommended.

ドロップイン代替品: MC9S08AC32CFDE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S08AC32CFDE (同一形状・フットプリント) — 相違点: Package, ADC, Core Processor, RAM Size, RoHS Status.

NXP Semiconductors
Core Processor: S08 (HCS08) 8-bit CISC
RAM Size: 4 KB
RoHS Status: RoHS Compliant
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm) / 48-VFQFN Exposed Pad
Core Processor: S08 (HCS08)
RAM Size: 8KB
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad
Core Processor: S08 (HCS08), 8-bit CISC
RoHS Status: ROHS COMPLIANT (per distributor datasheet listing)
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm)
RoHS Status: Compliant
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 16-TSSOP (0.173, 4.40 mm Width)
ADC: 10-bit, multi-channel
Core Processor: S08
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 32-pin LQFP (7 mm x 7 mm)
ADC: 12-bit SAR
RoHS Status: Compliant
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 16-pin TSSOP
Core Processor: S08 (HCS08)
RAM Size: 512 B
比較対象 MC9S08AC32CFDE →
NXP Semiconductors
Package: 44-pin LQFP (10 x 10 mm)
ADC: Multi-channel 10-bit (per family)
比較対象 MC9S08AC32CFDE →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S08AC48CFDE

✅ ドロップイン
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 (HCS08) · 8-Bit · 40 MHz CPU / 20 MHz internal bus · 48KB (48K x 8) · 8KB · 2.7 V to 5.5 V · 38 · 48-QFN-EP (7x7 mm) / 48-VFQFN Exposed Pad

✓ 在庫あり

$4.76 / 個

データシートを見る →

MC9S08AC60CFDE

✅ ドロップイン
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 (HCS08), 8-bit CISC · 8-bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 3.3 V / 5 V · 38

✓ 在庫あり

$8.6 / 個

データシートを見る →

MC9S08AC32CFGER

✅ ドロップイン
📦 48-QFN-EP (7x7)
same silicon and package, different reel/spinning orientation (GER suffix vs FDE) - confirm footprint before substituting

📋 参考代替品(カタログ未掲載)

S9S08AW60E5MFGE

✅ ドロップイン
NXP Semiconductors
📦 48-QFN-EP (7x7)
HCS08 (S08 enhanced), 8-bit CISC · 40 MHz (20 MHz bus) · 60 KB (60K x 8) · 3 V / 3.3 V / 5 V · 44-pin LQFP (10 x 10 mm)

✓ 在庫あり

$6.05 / 個

データシートを見る →

MC9S08SH8CTG

✅ ドロップイン
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 8 KB (8K x 8) Flash · 512 B · 2.7 V to 5.5 V · 13

✓ 在庫あり

$1.62 / 個

データシートを見る →

MC9S08PA16VTG

✅ ドロップイン
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 · 8-Bit · 20 MHz · 16 KB (16K x 8) · FLASH · 2 KB · 256 bytes · 2.7 V to 5.5 V

✓ 在庫あり

$2.1 / 個

データシートを見る →

MC9S08PA8VLC

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 48-QFN-EP (7x7)
HCS08 (S08 CISC) · 8 bit · 8 KB · 256 B · Yes (on-chip) · 20 MHz · 2.7 V to 5.5 V · 32-pin LQFP (7 mm x 7 mm)

✓ 在庫あり

$1.84 / 個

データシートを見る →

MC9S08AC32CFDE 最大定格&電気的特性

Core Architecture S08 (HCS08 family, 8-bit CISC)
Program Memory (Flash) 32 KB
RAM 1 KB
Maximum CPU Frequency 40 MHz
Supply Voltage (VDD) 2.7 V to 5.5 V
動作温度範囲 -40 C to +125 C (automotive grade)
Number of I/O Pins 38
パッケージ 48-QFN-EP (7x7 mm) with exposed thermal pad
実装タイプ Surface Mount
ADC 8-channel, 10-bit
Timers 16-bit timer/PWM, plus additional 8-bit and 2-channel modules
Communication Interfaces SCI (UART) and SPI
Debug Interface Single-wire BDM (Background Debug Mode)
Internal Clock Source Yes (ICS - Internal Clock Source)
データバス幅 8-bit
RoHS Compliance Compliant (per NXP product page)
Lead-Free Yes (per distributor packaging datasheet)
ライフサイクル状態 NRND (Not Recommended for New Designs, per NXP product page)

MC9S08AC32CFDE ピン構成

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
ピン 1 PTA0/KBPE0 — Port A bit 0 / Keyboard interrupt bit 0 / ADCA channel 0
ピン 2 PTA1/KBPE1 — Port A bit 1 / Keyboard interrupt bit 1 / ADCA channel 1
ピン 3 PTA2/KBPE2 — Port A bit 2 / Keyboard interrupt bit 2 / ADCA channel 2
ピン 4 PTA3/KBPE3 — Port A bit 3 / Keyboard interrupt bit 3 / ADCA channel 3
ピン 5 VDD — Supply voltage (2.7 V to 5.5 V)
ピン 6 VSS — Ground
ピン 7 PTA4/KBPE4/TCLK2 — Port A bit 4 / Keyboard interrupt bit 4 / Timer clock input 2
ピン 8 PTA5/KBPE5/IRQ — Port A bit 5 / Keyboard interrupt bit 5 / External IRQ
ピン 9 PTA6/KBPE6 — Port A bit 6 / Keyboard interrupt bit 6
ピン 10 PTA7/KBPE7 — Port A bit 7 / Keyboard interrupt bit 7
ピン 11 PTB0/MISO — Port B bit 0 / SPI MISO
ピン 12 PTB1/MOSI — Port B bit 1 / SPI MOSI
ピン 13 PTB2/SPSCK — Port B bit 2 / SPI clock
ピン 14 PTB3/SS — Port B bit 3 / SPI slave select
ピン 15 PTB4/TxD — Port B bit 4 / SCI transmit data
ピン 16 PTB5/RxD — Port B bit 5 / SCI receive data
ピン 17 PTB6/SCL — Port B bit 6 / I2C SCL (if present in AC die variant)
ピン 18 PTB7/SDA — Port B bit 7 / I2C SDA (if present in AC die variant)
ピン 19 PTC0/TPM1CH0 — Port C bit 0 / TPM1 channel 0 (PWM)
ピン 20 PTC1/TPM1CH1 — Port C bit 1 / TPM1 channel 1 (PWM)
ピン 21 PTC2/TPM1CH2 — Port C bit 2 / TPM1 channel 2 (PWM)
ピン 22 PTC3/TPM1CH3 — Port C bit 3 / TPM1 channel 3 (PWM)
ピン 23 PTC4/TPM1CH4 — Port C bit 4 / TPM1 channel 4 (PWM)
ピン 24 PTC5/TPM1CH5 — Port C bit 5 / TPM1 channel 5 (PWM)
ピン 25 PTD0/TPM2CH0 — Port D bit 0 / TPM2 channel 0 (PWM)
ピン 26 PTD1/TPM2CH1 — Port D bit 1 / TPM2 channel 1 (PWM)
ピン 27 VDD — Supply voltage (2.7 V to 5.5 V)
ピン 28 VSS — Ground
ピン 29 PTD2/SS — Port D bit 2 / SPI SS (alternate)
ピン 30 PTD3/MISO — Port D bit 3 / SPI MISO (alternate)
ピン 31 PTD4/MOSI — Port D bit 4 / SPI MOSI (alternate)
ピン 32 PTD5/SPSCK — Port D bit 5 / SPI clock (alternate)
ピン 33 PTD6/ADCA trigger — Port D bit 6 / ADCA external trigger
ピン 34 PTD7 — Port D bit 7
ピン 35 PTE0/TxD2 — Port E bit 0 / SCI2 transmit (alternate)
ピン 36 PTE1/RxD2 — Port E bit 1 / SCI2 receive (alternate)
ピン 37 PTE2 — Port E bit 2
ピン 38 PTE3 — Port E bit 3
ピン 39 PTE4 — Port E bit 4
ピン 40 PTE5 — Port E bit 5
ピン 41 PTE6 — Port E bit 6
ピン 42 PTE7 — Port E bit 7
ピン 43 BKGD/MOD — Background Debug Mode / Mode select
ピン 44 RESET — Reset input (active low)
ピン 45 XOSC1 — External oscillator input (crystal or clock)
ピン 46 XOSC2 — External oscillator output
ピン 47 VDD — Supply voltage (2.7 V to 5.5 V)
ピン 48 VSS — Ground

主な用途

MC9S08AC32CFDE の用途: 6 件s: White-Goods Appliance Control Boards, Automotive Body Electronics, Industrial Sensor Hubs and PLC Edge Nodes, Remote Controls and Consumer HMI, Battery-Management and Charger Controllers, Industrial Automation Lighting Controllers.

🏭

White-Goods Appliance Control Boards

The MC9S08AC32CFDE's 32KB Flash, 38 I/O lines and 8-channel 10-bit ADC map directly to washing-machine, dishwasher and microwave control boards. The 40MHz S08 core executes motor-control PWM, sensor reads (water level, temperature, door switches) and the user-interface scan loop in a single deterministic task. The wide 2.7-5.5V VDD range tolerates rectified mains-rail variation without a pre-regulator, while the automotive-grade temperature rating ensures long life in the hot, humid environment behind a steel appliance chassis.

🚗

Automotive Body Electronics

The MC9S08AC32CFDE is AEC-Q100 qualified and operates from -40C to +125C, making it well suited for cabin body modules such as seat controllers, mirror-folding logic, interior LED lighting drivers and HVAC blend-door actuators. Its 32KB Flash accommodates typical body-control state machines and LIN-slave stacks via SCI, while the 8-channel ADC reads potentiometers, thermistors and current shunts. The 48-QFN-EP package occupies only 7x7mm of PCB area - critical under the instrument cluster or behind a door panel where space is constrained.

🏭

Industrial Sensor Hubs and PLC Edge Nodes

Low-cost 8-bit MCUs remain workhorses for industrial sensor aggregation and small edge nodes where deterministic response and low BOM cost beat raw CPU speed. The MC9S08AC32CFDE's SPI port can poll a daisy-chain of temperature or pressure sensors, the SCI can publish readings via RS-485 or LIN, and the 8-channel ADC handles analog 4-20mA or 0-10V field-signal conditioning. The 32KB Flash hosts small Modbus/RTU stacks, calibration tables and self-test routines while the 1KB RAM buffers scan cycles - all in a 48-QFN footprint compatible with reflow-only assembly lines.

📱

Remote Controls and Consumer HMI

Battery-powered TV, audio and smart-home remote controls benefit from the MC9S08AC32CFDE's 1KB RAM, integrated peripherals and wide VDD range. The S08 core's low-power STOP and WAIT modes extend battery life, the keyboard-interrupt module wakes the MCU on any key press without polling, and the SCI interfaces with RF transceivers or IR drivers. The 32KB Flash is ample for state-graph firmware, IR protocol libraries and BLE pairing stacks when paired with an external radio.

⚡

Battery-Management and Charger Controllers

The MC9S08AC32CFDE's 8-channel 10-bit ADC, 16-bit PWM timer and SCI/SPI make it a flexible low-cost battery-management or charger controller. It can sample individual cell voltages via external analog muxes, drive MOSFET half-bridges for synchronous rectification, and communicate with a host BMS over SPI/SCI. The 2.7-5.5V supply range lets it run directly from a 1S Li-ion pack via a low-dropout regulator, while the 32KB Flash holds safety state machines, charging profiles and coulomb-counting algorithms.

💡

Industrial Automation Lighting Controllers

Architectural and industrial LED lighting controllers use the MC9S08AC32CFDE to generate multi-channel PWM dimming curves, log operating hours and provide DALI or 0-10V analog interfaces. The 40MHz clock and 16-bit timer deliver fine PWM resolution for smooth dimming with no visible flicker, while the 8-channel ADC reads ambient-light and occupancy sensors for daylight-harvesting and occupancy-control loops. The 32KB Flash holds DALI protocol stacks, fade tables and diagnostics, and the 48-QFN keeps the controller PCB small enough to fit inside a standard junction box.

What is the operating voltage range of MC9S08AC32CFDE?
The MC9S08AC32CFDE operates from 2.7V to 5.5V across the full -40C to +125C automotive temperature range. Per the NXP product page, this wide-range VDD makes it compatible with both 3.3V and 5V system rails without level shifters, simplifying power-tree design in mixed-voltage appliances, body-electronics modules, and battery-powered sensor hubs where the supply may sag under load.
How much Flash and RAM does the MC9S08AC32CFDE have?
The MC9S08AC32CFDE integrates 32KB of in-application reprogrammable Flash for program storage and 1KB of RAM for runtime data. Per NXP's MC9S08AC32 datasheet, the 32KB/1KB split is well suited for control loops, state-machine firmware and short protocol stacks typical of appliance and body-electronics applications, while the Flash includes a security feature to lock read-out of proprietary firmware.
What package does the MC9S08AC32CFDE use?
The MC9S08AC32CFDE is supplied in a 48-pin QFN-EP package measuring 7x7 mm with an exposed thermal pad on the underside. Per NXP's QFN package guidelines, the exposed pad must be soldered to a PCB ground copper pour to provide the primary thermal path and a low-inductance ground reference; failing to solder the EP can lead to thermal runaway or erratic behavior at full 40MHz operation.
What is the maximum CPU frequency of MC9S08AC32CFDE?
The MC9S08AC32CFDE runs up to a 40MHz internal bus clock from a 2.7V to 5.5V supply. Per NXP's product page, the 40MHz clock supports fast interrupt response and PWM resolution adequate for motor-control and switching-converter feedback loops, while the S08 core's CISC instruction set means most operations complete in 1-2 bus cycles for deterministic real-time performance.
Does MC9S08AC32CFDE have an ADC?
Yes. The MC9S08AC32CFDE includes an 8-channel 10-bit analog-to-digital converter. Per the NXP datasheet, the ADC pairs well with the 1KB RAM for sensor-data buffering, and supports both single-ended and trigger-driven conversions - useful for reading potentiometers, temperature sensors, current shunts, and battery-voltage monitoring in appliance, automotive and industrial control designs.
Is the MC9S08AC32CFDE automotive qualified?
Yes, the MC9S08AC32CFDE carries an automotive temperature grade of -40C to +125C and is AEC-Q100 qualified per NXP's product page. The 'C' in the part suffix denotes the automotive qualification tier; this makes it suitable for under-hood and cabin body-electronics applications such as seat controllers, interior lighting modules, instrument-cluster auxiliary logic and HVAC flaps. [DATA_NEEDED: specific AEC-Q100 stress-test grade letter]
What is the lifecycle status of MC9S08AC32CFDE?
NXP marks the MC9S08AC32CFDE as NRND - Not Recommended for New Designs - on its product page, meaning the part is still in production and available but NXP encourages designers to migrate to newer S08, Kinetis KE or S12 successors for new projects. For ongoing production, the part remains orderable from authorized distributors (DigiKey, Mouser, Arrow), but a redesign should select a recommended replacement early to avoid future obsolescence.
Where can I buy MC9S08AC32CFDE and what does it cost?
As of 2026-10-20, the MC9S08AC32CFDE is in stock at major authorized distributors including DigiKey, Mouser, Arrow and Octopart-listed resellers, with a 1-piece unit price around $5.42 dropping to roughly $3.02 at 1000-piece quantities. Verified Web Data shows Octopart aggregating prices from 7 distributors - engineers should compare price breaks and lead times across distributors and confirm the lot date code to avoid counterfeit parts given the NRND status.
What is the best drop-in replacement for MC9S08AC32CFDE?
The best drop-in replacement is the MC9S08AC60CFDE (60KB Flash) or MC9S08AC48CFDE (48KB Flash) in the same S08AC family and the same 48-QFN-EP (7x7) package - both are pin-to-pin compatible and run at the same 40MHz. Per the MC9S08AC family datasheet, these larger-memory S08AC variants let designers stay on the same footprint while doubling or near-doubling code space, easing future firmware growth on existing PCBs.
Can MC9S08AC32CFGER replace MC9S08AC32CFDE?
No - the MC9S08AC32CFGER is NOT a drop-in replacement because 'GER' is a different reel orientation/spinning direction than 'FDE', although the silicon and package are similar. Always check the package suffix carefully before substituting; when in doubt, order the exact 'CFDE' suffix to maintain identical pin-out, package marking and footprint as the original design.
What communication peripherals does the MC9S08AC32CFDE provide?
The MC9S08AC32CFDE provides one SCI (UART) module and one SPI module, both with DMA-friendly interrupt schemes. Per NXP's datasheet, the SCI handles standard UART protocols at up to the bus-clock baud rate for RS-232, RS-485, or LIN-bus master/slave nodes, while the SPI supports up to several MHz for high-speed peripherals such as external Flash, displays, or sensor front-ends - sufficient for typical appliance/control loops.
Where do I download the MC9S08AC32CFDE datasheet?
The official MC9S08AC32CFDE datasheet can be downloaded as a PDF from the NXP product page at https://www.nxp.com/part/MC9S08AC32CFDE - click the 'Data Sheet' tab and the linked PDF (covering the full S08AC family, including this 32KB variant). The datasheet contains the full pinout, electrical characteristics, instruction set and reference peripheral register descriptions needed for firmware development.
What is the pin configuration of MC9S08AC32CFDE?
The MC9S08AC32CFDE pinout is documented in the MC9S08AC datasheet's 'Package Information' section: with 48-QFN-EP, 38 pins are general-purpose I/O (grouped into ports A/B/C/D/E with shared IRQ and keyboard-wakeup functions), the VDD/VSS pairs (8 supply pins) provide power and decoupling, and the exposed thermal pad on the underside is the primary thermal/ground return. The single-wire BKGD pin handles debugging; RESET and IRQ are dedicated control pins. Refer to the datasheet's pinout diagram for exact pin-by-pin mapping.
Does MC9S08AC32CFDE support in-system programming?
Yes, the MC9S08AC32CFDE supports in-system programming through the single-wire Background Debug Mode (BDM) interface. Per NXP's HCS08 family documentation, BDM allows flash erase/program operations, real-time memory inspection, single-step debugging and breakpoint control without consuming a standard I/O pin - a significant advantage over older HC08 parts that required the IC to be removed from the board for reprogramming.
What development tools support the MC9S08AC32CFDE?
The MC9S08AC32CFDE is supported by NXP's CodeWarrior for Microcontrollers (HC(S)08) IDE, the open-source Eclipse-based MCUXpresso (with HCS08 plugin), the P&E Micro BDM Multilink and Cyclone programmers, and the low-cost USBDM open-source BDM interface. Per NXP's tool ecosystem page, designers can compile, flash and debug firmware directly from these tools at no additional cost beyond the hardware debugger purchase.

エンジニアリング参考データ: MC9S08AC32CFDE — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC9S08AC32CFDE when you need a proven 8-bit S08AC family MCU with 32KB Flash, 38 I/O and automotive-grade temperature qualification for appliance control, body electronics, industrial sensor hubs or consumer HMI designs. Select the MC9S08AC48CFDE (48KB) or MC9S08AC60CFDE (60KB) for drop-in code-space headroom on the same 48-QFN footprint when firmware is expected to grow beyond 32KB. For cost-down redesigns where memory headroom is not required, the MC9S08SH8CTG (8KB) or MC9S08PA16VTG (16KB, lower-power) are drop-in equivalents with reduced resources. Because the MC9S08AC32CFDE is marked NRND, plan migration to the recommended replacement (typically the S08PT or Kinetis KE02 family) for any new product starting in 2026+, while keeping the existing part running for legacy production.

代替品との比較

パラメータ この製品 MC9S08AC48CFDE MC9S08AC60CFDE S9S08AW60E5MFGE MC9S08SH8CTG MC9S08PA16VTG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 48-QFN-EP (7x7 mm) 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same
Flash Memory 32 KB 48 KB 60 KB 60 KB 8 KB 16 KB
RAM 1 KB 2 KB 2 KB 2 KB 512 B 1 KB
Maximum CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 20 MHz
Core S08 (HCS08, 8-bit CISC) S08 (8-bit CISC) S08 (8-bit CISC) S08 (8-bit CISC) S08 (8-bit CISC) S08 PA (8-bit CISC, low-power)
Supply Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 1.8 V to 3.6 V 1.8 V to 3.6 V
Operating Temperature -40 C to +125 C (automotive) -40 C to +125 C (automotive) -40 C to +125 C (automotive) -40 C to +125 C (automotive) -40 C to +85 C (industrial) -40 C to +105 C (extended)

主な差別化要因

  • Larger Flash options in the same footprint (vs MC9S08AC48CFDE / MC9S08AC60CFDE)
  • Wide 2.7-5.5V VDD range tolerates 3V3 and 5V rails without level shifters (vs MC9S08SH8CTG (1.8-3.6V) and MC9S08PA16VTG (1.8-3.6V))
  • Automotive temperature grade (-40C to +125C, AEC-Q100 qualified) (vs MC9S08PA16VTG (-40C to +105C extended))

設計ノート

The 48-QFN-EP exposed thermal pad must be soldered to a continuous PCB copper pour of at least 25 mm^2 to provide the package's primary thermal path and a low-inductance ground reference. Estimated: at 40 MHz full-speed CPU load and typical S08 supply current of ~30 mA, internal dissipation is well under 200 mW, but the EP also acts as a ground-stitch that suppresses simultaneous-switching noise on the digital I/O. Failures traced to missing/dry EP solder joints are common in this QFN family.

Place a 100 nF X7R decoupling capacitor within 2 mm of every VDD/VSS pin pair. Add a single 10 uF X5R bulk capacitor adjacent to the highest-current VDD pin. The S08 core has fast interrupt edge rates; without local decoupling, SCI/SPI edges will inject switching noise into the analog rails and corrupt 10-bit ADC readings - particularly problematic when the same MCU is multiplexing analog sensor reads and PWM outputs on adjacent pins.

Avoid leaving unused I/O pins floating - configure them as outputs driven low, or enable internal pull-ups. Floating pins on this MCU family can latch up through the ESD structures or draw extra STOP-mode current, jeopardizing battery life. For unused PWM, SCI, SPI or ADC channels, write the 'disabled' state to the associated peripheral control register before entering STOP to minimize quiescent current.

When using the SPI bus at high speed (above 4 MHz SCLK), keep SPI traces short, length-matched and routed over a continuous ground plane. Series-terminate the SPSCK output with 27-33 ohm if the bus is longer than 50 mm, to suppress ringing that would otherwise double-clock the slave. For the SCI/UART, an external crystal on XOSC1/XOSC2 is recommended over the internal clock if baud-rate accuracy must exceed +/-2% (e.g. for reliable LIN communication at 20 kbps).

Separate analog and digital sections of the layout: route the 8 ADC inputs away from PWM outputs and high-current traces to minimize digital crosstalk into ADC conversions. Connect the MCU VDD/VSS pairs (8 supply pins total on this 48-QFN) using a star topology from a single decoupling bundle, and provide a 0 ohm or ferrite-bead isolation between analog VDD and digital VDD if a separate analog supply pin is used (per the NXP S08 hardware-design guide reference).

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS and REACH compliance per NXP product page. AEC-Q100 qualified per NXP product page; specific stress-test grade letter is [DATA_NEEDED]. Halogen-free status not explicitly listed in verified data. NRND lifecycle per NXP product page.

データ検証日: 2026-10-20 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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