MC9S08GT32ACFDER - 8-Bit S08 MCU 32KB Flash 40MHz | NXP
部品番号: MC9S08GT32ACFDER ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.84 | $6.84 |
| 10 | $6.18 | $61.80 |
| 100 | $5.47 | $547.00 |
| 500 | $4.95 | $2,475.00 |
| 1,000 | $4.42 | $4,420.00 |
MC9S08GT32ACFDER 概要
A microcontroller (MCU) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and GPIO. The HCS08/S08 core from NXP is a CISC 8-bit architecture that has powered automotive body electronics, white goods, and industrial sensor nodes for over a decade. Within the broader semiconductor taxonomy, an MCU sits under microcontroller -> embedded processor -> semiconductor device. The GT-series MCUs specifically target general-purpose 8-bit designs where footprint, BOM count, and peripheral integration dominate the design trade-off.
Key features include 32KB (32K x 8) of embedded Flash with in-application programmability, 2KB of RAM, 39 general-purpose I/O lines, and an internal bus clock of up to 40MHz derived from the on-chip FLL. Integrated peripherals include PWM channels, an LVD (low-voltage detect) and POR (power-on reset), a watchdog timer (WDT), and communication interfaces (I2C, SCI, SPI). The 48-QFN-EP package exposes a thermal pad that reduces junction-to-ambient thermal resistance, improving continuous high-current I/O operation. Operating voltage spans 2.7V to 5.5V with industrial temperature grade support.
The architecture relies on the S08 CISC core with a single 16-bit index register, HX, plus a 16-bit stack pointer. The Flash controller supports byte-erase and security features; the on-chip clock module supports an internal reference and external crystal, enabling flexible clock-tree design. The 8-bit datapath, 40MHz core clock, and single-cycle bus at half the bus rate give deterministic instruction timing suitable for hard-real-time loops in motor control, lighting, and sensor conditioning.
Typical applications include HVAC control boards, appliance user-interface panels, automotive body controllers, battery-powered sensor transmitters, low-end BLDC motor drivers, and LED lighting controllers. Design considerations include providing a 0.1uF decoupling capacitor on each VDD pin, exposing the thermal pad to a continuous copper pour on the top layer for heat spreading, and reserving the reset pin for an external supervisor or RC network when battery-supplied cold-start behavior matters.
ドロップイン代替品: MC9S08GT32ACFDER — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S08GT32ACFDER （同一形状・フットプリント） — 相違点: Package, RAM.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S08GT60ACFDER
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08GT16ACFDER
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08GT32ACFDE
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MC9S08GT32CFDE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S9S08AW32MFGE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08AW32MFGE
✅ ドロップイン✓ 在庫あり
$3.15 / 個
データシートを見る →MC9S08GT32ACFDER 最大定格＆電気的特性
| Core Processor | S08 |
| Core Size | 8-Bit |
| Core Architecture | CISC |
| Maximum Clock Speed | 40 MHz |
| Program Memory Size | 32 KB (32K x 8) FLASH |
| RAM Size | 2 KB |
| EEPROM Size | Not specified in datasheet excerpt |
| Number of I/O | 39 |
| Connectivity | I2C, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| 電源電圧 | 2.7 V to 5.5 V |
| 動作温度 | -40 C to +85 C (industrial) |
| パッケージ | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MC9S08GT32ACFDER ピン構成
| ピン 1 | PTB0 — General-purpose I/O / TCLK |
| ピン 2 | PTB1 — General-purpose I/O |
| ピン 3 | PTB2 — General-purpose I/O / SDA |
| ピン 4 | PTB3 — General-purpose I/O / SCL |
| ピン 5 | VDD — Supply voltage (2.7V-5.5V) |
| ピン 6 | VSS — Ground |
| ピン 7 | PTA0 — General-purpose I/O / RxD |
| ピン 8 | PTA1 — General-purpose I/O / TxD |
| ピン 9 | PTA2 — General-purpose I/O |
| ピン 10 | PTA3 — General-purpose I/O |
| ピン 11 | PTA4 — General-purpose I/O |
| ピン 12 | PTA5 — General-purpose I/O / IRQ |
| ピン 13 | PTA6 — General-purpose I/O |
| ピン 14 | PTA7 — General-purpose I/O |
| ピン 15 | PTC0 — General-purpose I/O |
| ピン 16 | PTC1 — General-purpose I/O |
| ピン 17 | PTC2 — General-purpose I/O |
| ピン 18 | PTC3 — General-purpose I/O |
| ピン 19 | PTC4 — General-purpose I/O |
| ピン 20 | PTC5 — General-purpose I/O |
| ピン 21 | PTC6 — General-purpose I/O |
| ピン 22 | PTC7 — General-purpose I/O |
| ピン 23 | PTD0 — General-purpose I/O |
| ピン 24 | PTD1 — General-purpose I/O |
| ピン 25 | PTD2 — General-purpose I/O |
| ピン 26 | PTD3 — General-purpose I/O |
| ピン 27 | PTD4 — General-purpose I/O |
| ピン 28 | PTD5 — General-purpose I/O |
| ピン 29 | PTD6 — General-purpose I/O |
| ピン 30 | PTD7 — General-purpose I/O |
| ピン 31 | PTE0 — General-purpose I/O |
| ピン 32 | PTE1 — General-purpose I/O |
| ピン 33 | PTE2 — General-purpose I/O |
| ピン 34 | PTE3 — General-purpose I/O |
| ピン 35 | PTE4 — General-purpose I/O |
| ピン 36 | PTE5 — General-purpose I/O |
| ピン 37 | PTE6 — General-purpose I/O |
| ピン 38 | PTE7 — General-purpose I/O |
| ピン 39 | RESET — Bidirectional reset (active low) |
| ピン 40 | BKGD — Background debug mode |
| ピン 41 | XOSC1 — External crystal oscillator input |
| ピン 42 | XOSC2 — External crystal oscillator output |
| ピン 43 | TCLK — Timer clock input / PTF0 |
| ピン 44 | PTF1 — General-purpose I/O |
| ピン 45 | PTF2 — General-purpose I/O |
| ピン 46 | PTF3 — General-purpose I/O |
| ピン 47 | VDD — Supply voltage (second pin) |
| ピン 48 | VSS — Ground (second pin) / exposed pad |
主な用途
MC9S08GT32ACFDER の用途: 6 件s: HVAC Control Boards, White Goods / Appliance User Interface, Automotive Body Controllers, Battery-Powered Sensor Transmitters, Low-End BLDC Motor Drivers, LED Lighting Controllers.
HVAC Control Boards
The MC9S08GT32ACFDER fits HVAC control boards thanks to its 40MHz S08 core and 32KB Flash, which comfortably hosts a real-time control loop plus user-interface state machine in a single device. The 39 GPIO lines drive relay coils, triac triggers, and key-scan matrices for thermostat or fan-controller front panels without external mux ICs. Integrated PWM channels generate the carrier for TRIAC-fired AC loads or BLDC commutation timing, while the SCI peripheral links to a wall-mounted display module. The 48-QFN-EP package's 7x7 mm footprint plus exposed thermal pad suits the densely packed HVAC control PCB where heatsinking is impractical but continuous I/O current is high.
おすすめ
White Goods / Appliance User Interface
The MC9S08GT32ACFDER powers washing machine, dishwasher, and oven user-interface panels where 32KB of Flash hosts the menu tree plus diagnostics, and the 39 GPIO drive seven-segment displays and key matrices. The S08 core's deterministic interrupt latency keeps button debouncing and display-multiplexing code responsive even at 40MHz. The 2.7V-5.5V supply range accepts 3.3V or 5V rails from the appliance power supply, and the 48-QFN-EP package fits behind the front panel. On-chip LVD and WDT guard against brown-out events common in motor-driven appliances.
おすすめ
Automotive Body Controllers
The MC9S08GT32ACFDER handles non-safety body-controller tasks such as mirror positioning, lighting sequencer, and accessory multiplex nodes. Its 32KB Flash accommodates the lighting state machine plus diagnostics, while the I2C/SPI/SCI peripherals link to other body ECUs and switch panels. The integrated PWM drives LED strings with 16-bit resolution for fade effects, and the LVD/POR guard against automotive cranking transients. The 48-QFN-EP package's small footprint suits space-constrained door-module or overhead-console PCBs.
おすすめ
Battery-Powered Sensor Transmitters
The MC9S08GT32ACFDER suits industrial sensor transmitters operating from a 3.6V lithium primary cell, where the 2.7V-5.5V supply range and on-chip LVD maximize battery-life by flagging end-of-life early. The 32KB Flash stores sensor-calibration tables plus the wireless protocol stack when paired with an external sub-GHz transceiver over SPI. The SCI peripheral supports RS-485 wired comms for industrial field-bus nodes. Low GPIO count (39) suits single-sensor PCB designs.
おすすめ
Low-End BLDC Motor Drivers
The MC9S08GT32ACFDER drives low-end BLDC motors in fans, pumps, and small appliances, where the 40MHz S08 core runs the commutation state machine plus speed-control loop. Its PWM channels generate the complementary 6-step drive signals for the three-phase inverter, while ADC sampling (when present on related AW variants) measures back-EMF for sensorless control. The 32KB Flash fits sensorless start-up firmware plus field-weakening tables. The QFN-EP package mounts directly above the half-bridge driver to minimize gate-loop inductance.
おすすめ
LED Lighting Controllers
The MC9S08GT32ACFDER runs DMX-512 or DALI lighting fixtures where the 32KB Flash stores the fixture personality, color-mixing coefficients, and dimming curves. Its I2C/SPI peripherals connect to constant-current LED drivers, and PWM channels provide dimming at 16-bit resolution. The 39 GPIO suits RGBW plus white-strip fixtures with multiple zones. The 48-QFN-EP package's small footprint fits inside the fixture housing, while the 2.7V-5.5V supply accepts PoE or 24V LED-driver rails.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S08GT32ACFDER — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S08GT60ACFDER | MC9S08GT16ACFDER | MC9S08GT32ACFDE | S9S08AW32MFGE | MC9S08AW32MFGE |
|---|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7) | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-LQFP - same pin count, different footprint | 48-LQFP - same pin count, different footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit AW-series | S08 8-bit AW-series |
| Max Clock Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Size | 32 KB | 60 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| RAM Size | 2 KB | 4 KB | 1 KB | 2 KB | 2 KB | 2 KB |
| GPIO Count | 39 | 39 | 39 | 39 | 38 | 38 |
| Supply Voltage | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V |
| Connectivity | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI |
主な差別化要因
- Doubling Flash without PCB change （vs MC9S08GT16ACFDER)
- Field-upgrade path without redesign （vs MC9S08GT60ACFDER)
- Same-brand S08 family breadth （vs MC9S08AW32MFGE)
設計ノート
Estimated - Decouple each VDD pin (5 and 47) with a 100nF ceramic capacitor placed within 3 mm of the pin. Add a bulk 4.7uF tantalum or ceramic on the main supply rail. The on-chip voltage regulator generates 1.8V for the core; the 2.7V minimum VDD ensures regulator headroom under 40MHz core clock and full GPIO toggling.
The 48-QFN-EP exposed thermal pad must be soldered to a continuous copper pour on the top PCB layer, with thermal vias to inner planes. Estimated theta_JA for a 4-layer board with 1 sq inch copper pour is approximately 35 C/W. Without the thermal pad soldered, junction temperature can exceed 125 C under full I/O load at industrial ambient.
Keep the BKGD / RESET trace short (under 25 mm) and route away from switching signals. The crystal traces (XOSC1, XOSC2) should be guarded by a ground ring to prevent noise injection from PWM outputs. Place the 0.1uF VDD caps before the I/O connector pin to suppress cable-discharge transients in appliance and industrial enclosures.
Avoid using PTA5/IRQ as a general output without confirming the IRQ-edge-select register is cleared, otherwise spurious interrupts wake the CPU. Do not exceed 5.5V on any pin; transients above 6V can trigger latch-up. Always vector the reset handler to clear the COP (watchdog) enable bit before any main-loop delay that exceeds the WDT timeout.
コンプライアンス情報
RoHS and lead-free confirmed by NXP product page. Industrial temperature grade -40C to +85C. AEC-Q100 not applicable for this MPN suffix; the automotive-qualified variant uses a different device designation.
