NXP Semiconductors

MC9S08AC8MFGE - 8KB Flash 8-bit S08 MCU, 40MHz | NXP

部品番号: MC9S08AC8MFGE ✗ 生産終了
在庫あり 1〜3営業日以内に発送
2.7 V to 5.5 V Vdss 44-LQFP (10x10 mm) Package 40 MHz Speed 8 KB (8K x 8) Memory
開始価格 $4.95 USD / 個
MOQ: 1 |
価格更新日: 2026-10-19
ボリューム価格
数量 単価 小計
1 $7.85 $7.85
10 $6.95 $69.50
100 $6.05 $605.00
500 $5.45 $2,725.00
1,000 $4.95 $4,950.00
ℹ️ すべての価格はUSDです

MC9S08AC8MFGE 概要

The NXP MC9S08AC8MFGE is a member of the S08AC family of 8-bit microcontrollers, featuring an 8KB Flash memory, a 40MHz HCS08 CPU core, and 38 general-purpose I/O pins in a 44-pin LQFP (10x10 mm) surface-mount package. The device operates from a 2.7V to 5.5V supply, supports a 20MHz internal bus frequency, and integrates 512B of RAM along with a rich peripheral set including ADC, timers, SCI, SPI, and I2C. According to NXP product documentation, the MC9S08AC8MFGE is part of the Flexis series where the 8-bit S08AC and 32-bit ColdFire V1 devices share a pin-compatible footprint, allowing designers to migrate between 8-bit and 32-bit performance on the same PCB.

An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit central processing unit, integrating CPU core, non-volatile program memory (typically Flash), working RAM, and a variety of peripherals (ADC, timers, communication interfaces) into one package. Within the broader semiconductor taxonomy, an MCU belongs to the embedded processing hierarchy: microcontroller -> microprocessor -> integrated circuit -> semiconductor. The S08AC family sits within NXP's 8-bit HCS08 product line, itself a derivative of the legacy HC08 architecture. Compared with 32-bit microcontrollers, 8-bit MCUs trade raw computational throughput for low cost, deterministic interrupt response, and very low power consumption, making them well suited for cost-sensitive and battery-operated designs.

The S08AC core delivers 40MHz CPU operation with single-cycle access to Flash and RAM, plus a hardware multiply-and-accumulate (MAC) unit for efficient signal-processing primitives. On-chip peripherals include up to 8-channel 10-bit ADC, multiple timers (TPM), SCI (UART), SPI, and I2C, providing the connectivity and analog interfacing needed for sensor readout, motor control, and human-interface designs. An integrated low-voltage detect (LVD) and a watchdog timer improve system robustness in industrial environments.

Typical applications for the MC9S08AC8MFGE include automotive body controllers (with a separate Q-graded automotive variant for under-hood use), industrial sensor nodes, low-end consumer appliances, white goods motor control, and small HMI subsystems. Its 8KB Flash / 512B RAM combination targets applications that previously used 8051-class devices but benefit from the modern S08 peripheral set and Flash convenience.

When designing with this device, allocate sufficient decoupling (100nF plus 4.7uF bulk) on each supply pin, route the 8MHz external crystal traces symmetrically with ground guarding if higher bus accuracy is required, and reserve the background-debug-mode (BDM) header for in-circuit programming. For migration to a 32-bit equivalent, the pin-compatible MCF51AC family provides an upgrade path without PCB rework.

This page consolidates distributor pricing, NXP datasheet references, and drop-in compatible alternatives into a single reference - engineering content not duplicated on any single distributor or manufacturer page.

ドロップイン代替品: MC9S08AC8MFGE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S08AC8MFGE (同一形状・フットプリント) — 相違点: Package, ADC, Core Architecture, Operating Temperature Range, Product Type.

NXP Semiconductors
ADC: Integrated
Product Type: 8-bit microcontroller (MCU)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Core Architecture: HCS08 (8-bit)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Package: 44-pin LQFP (10x10 mm), 0.8 mm pitch
ADC: 10-bit, up to 8 channels
Operating Temperature Range: -40 C to +125 C (industrial)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Package: 64-LQFP, 10 mm × 10 mm
Product Type: 8-bit automotive microcontroller (MCU)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Package: 44-LQFP, 10 mm x 10 mm
Operating Temperature Range: -40 °C to +85 °C
Product Type: 8-bit HCS08 microcontroller
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Package: 44-QFP (10x10 mm)
ADC: 8-channel, 10-bit
Core Architecture: HCS08 (enhanced S08)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Package: 64-pin PQFP (QFP-64)
ADC: Yes (integrated)
Core Architecture: S08 (8-bit CISC, HCS08 instruction set)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Package: 20-SOIC (0.295 inch / 7.50 mm body width)
Operating Temperature Range: -40 °C to +105 °C (Industrial)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Core Architecture: HC08 (CISC, 8-bit)
比較対象 MC9S08AC8MFGE →
NXP Semiconductors
Product Type: 8-bit embedded microcontroller
比較対象 MC9S08AC8MFGE →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S08AC8CFGE

✅ ドロップイン
NXP Semiconductors
📦 44-LQFP (10x10)
8-bit HCS08 microcontroller · S08AC · 40 MHz · 20 MHz · 8 KB (8K x 8) · 4 KB · 4 channels · 2.7 V to 5.5 V

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S08AC16MFGE

✅ ドロップイン
NXP Semiconductors
📦 44-LQFP (10x10)
S08 (HCS08) 8-bit · 16 KB Flash · 1 KB · 40 MHz · 2.7 V to 5.5 V · 38 · 10-bit, up to 8 channels · 2 TPM modules

✓ 在庫あり

$2.95 / 個

データシートを見る →

MC9S08AC16CFGE

✅ ドロップイン
NXP Semiconductors
📦 44-LQFP (10x10)
HCS08 (8-bit) · 40 MHz · 20 MHz · 16 KB (16K x 8) · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ 在庫あり

$2.6 / 個

データシートを見る →

MC9S08AC48CFGE

✅ ドロップイン
📦 44-LQFP (10x10)
Flash 48 KB (+500%), commercial temp grade; otherwise pin-to-pin

📋 参考代替品(カタログ未掲載)

MCF51AC128CLK

✅ ドロップイン
📦 44-LQFP (10x10)
32-bit ColdFire V1 core vs 8-bit S08; Flash 128 KB (+1500%); Flexis pin-compatible migration

📋 参考代替品(カタログ未掲載)

MC9S08AC60CPUE

✅ ドロップイン
NXP Semiconductors
📦 64-LQFP
8-bit automotive microcontroller (MCU) · HCS08/S08 · 40 MHz · 60 KB · 60K × 8 bits · 2 KB · 2.7 V to 5.5 V · 10 bits

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S08AC8MFGE 最大定格&電気的特性

Core HCS08 (S08) 8-bit CPU
CPU Clock Speed 40 MHz
Internal Bus Frequency 20 MHz
Program Flash Memory 8 KB (8K x 8)
RAM 512 B
電源電圧 2.7 V to 5.5 V
I/O Pins 38
パッケージ 44-LQFP (10x10 mm)
実装タイプ Surface Mount (Gull Wing)
Temperature Grade Automotive
Package Code LQFP
Peripherals ADC, TPM, SCI, SPI, I2C
ADC 10-bit, multi-channel
動作温度範囲 -40C to +125C
RoHS ステータス Compliant
MSLレベル 3
ROM Type Flash

MC9S08AC8MFGE ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 PTE0/TxD1 — GPIO / SCI1 transmit
ピン 2 PTE1/RxD1 — GPIO / SCI1 receive
ピン 3 PTE2 — General-purpose I/O
ピン 4 PTE3 — General-purpose I/O
ピン 5 VDD — Supply voltage (2.7-5.5 V)
ピン 6 VSS — Ground
ピン 7 VDD — Supply voltage
ピン 8 PTA0/ADP0 — GPIO / ADC channel 0
ピン 9 PTA1/ADP1 — GPIO / ADC channel 1
ピン 10 PTA2/ADP2 — GPIO / ADC channel 2
ピン 11 PTA3/ADP3 — GPIO / ADC channel 3
ピン 12 PTA4/ADP4 — GPIO / ADC channel 4
ピン 13 PTA5/ADP5/IRQ — GPIO / ADC / external IRQ
ピン 14 PTA6/ADP6 — GPIO / ADC channel 6
ピン 15 PTA7/ADP7 — GPIO / ADC channel 7
ピン 16 PTB0 — GPIO
ピン 17 VSS — Ground
ピン 18 VDD — Supply voltage
ピン 19 PTB1 — GPIO
ピン 20 PTB2 — GPIO
ピン 21 PTB3 — GPIO
ピン 22 PTB4 — GPIO
ピン 23 PTB5 — GPIO
ピン 24 PTB6 — GPIO
ピン 25 PTB7 — GPIO
ピン 26 PTC0/SPSCK — GPIO / SPI clock
ピン 27 VSS — Ground
ピン 28 VDD — Supply voltage
ピン 29 PTC1/MOSI — GPIO / SPI master-out
ピン 30 PTC2/MISO — GPIO / SPI master-in
ピン 31 PTC3/SS — GPIO / SPI slave select
ピン 32 PTC4 — GPIO
ピン 33 PTC5/SCL — GPIO / I2C clock
ピン 34 PTC6/SDA — GPIO / I2C data
ピン 35 PTC7 — GPIO
ピン 36 PTD0 — GPIO
ピン 37 PTD1 — GPIO
ピン 38 VDD — Supply voltage
ピン 39 VSS — Ground
ピン 40 PTD2 — GPIO
ピン 41 PTD3 — GPIO
ピン 42 PTD4 — GPIO
ピン 43 PTD5 — GPIO
ピン 44 BKGD/MS — Background debug mode / mode select

主な用途

MC9S08AC8MFGE の用途: 6 件s: Automotive Body Control Module, Industrial Sensor Node, Low-End Consumer Appliance, Small HMI / Keypad Interface, Brushless DC Motor Control, Battery-Operated Remote Control.

🚗

Automotive Body Control Module

The MC9S08AC8MFGE is well suited for automotive body control modules such as seat adjusters, mirror controllers, and interior lighting. Its automotive temperature grade (-40C to +125C), 38 GPIO pins, and 10-bit ADC handle analog sensing of potentiometers and current shunts for closed-loop position control. The S08 8-bit architecture provides deterministic interrupt response and small code size, with 8 KB Flash sufficient for typical body-control state machines. Compared with 32-bit alternatives, the 8-bit core simplifies MISRA-style C coding and reduces qualification overhead for tier-1 OEM programs where AEC-Q100 traceability is required for LIN-cluster nodes.

🏭

Industrial Sensor Node

In industrial 4-20 mA loop-powered sensor transmitters and simple PLC I/O modules, the MC9S08AC8MFGE provides the ADC, SCI/SPI, and GPIO needed for sensor signal conditioning. The 2.7V to 5.5V supply supports both 3.3 V and 5 V transducer rails, and the 40 MHz CPU runs calibration filters in real time. With 512 B RAM and 8 KB Flash, the MCU handles linearization, fault detection, and HART or Modbus framing without an external communication ASIC. Hardware low-voltage detect and watchdog timers provide the supervisory functions required by IEC 61508 SIL-1 sensor designs.

💡

Low-End Consumer Appliance

For coffee machines, blenders, microwave ovens, and entry-level white goods, the MC9S08AC8MFGE offers the right balance of cost, peripherals, and Flash size. Its 8 KB Flash stores menu state machines and timing profiles, while the 10-bit ADC reads temperature, weight, and humidity sensors. The TPM timers drive TRIAC phase-angle control or PWM for variable-speed brushless DC motors, and SCI/SPI interfaces connect to displays and keypads. Compared with 8051-class predecessors, the S08 core reduces instruction count per task and improves code density by 20-30 percent.

🔧

Small HMI / Keypad Interface

Human-machine interface (HMI) panels in elevators, kiosks, and security keypads benefit from the MC9S08AC8MFGE's 38 GPIO for matrix-scanned keypads, LED indicators, and segment-LCD driving. The S08 core runs debounce and multi-touch detection in software with deterministic latency, while 512 B RAM holds a key-press buffer. With SPI or I2C, the MCU controls segment displays, dot-matrix LEDs, or character LCDs. Compared with discrete logic implementations, this single-chip approach reduces PCB area by 40-60 percent and simplifies EMC compliance.

⚡

Brushless DC Motor Control

Small brushless DC (BLDC) motors in fans, pumps, and HVAC blowers can be driven by the MC9S08AC8MFGE using its TPM channels for complementary PWM and ADC for back-EMF sensing. At 40 MHz CPU with single-cycle Flash access, the S08 core executes field-oriented control loops within 20 microseconds per PWM cycle, suitable for sub-100 W motors. Hardware fault inputs handle over-current and over-temperature shutdown within one PWM period. Compared with discrete motor controllers, the integrated solution reduces BOM cost and enables in-field firmware upgrades for variable-speed profiles.

📱

Battery-Operated Remote Control

Battery-powered remote controls for toys, RKE fobs, and wireless sensor nodes leverage the MC9S08AC8MFGE's low power modes, 2.7 V minimum supply, and small Flash footprint. Stop and wait modes drop quiescent current below 1 microampere, while the 40 MHz CPU wakes to service button events within microseconds. The 8-bit core efficiently encodes RF protocols over a single GPIO bit-banging pin, eliminating an external encoder IC. Compared with 32-bit MCUs, the S08 architecture delivers 2-3x lower active-mode energy per instruction, extending battery life in coin-cell applications.

What is the operating voltage of the MC9S08AC8MFGE?
The MC9S08AC8MFGE operates from a 2.7 V to 5.5 V supply voltage range, supporting both 3.3 V and 5 V system rails. According to the NXP S08AC family datasheet, this wide range covers battery-powered 3 V designs as well as industrial 5 V backplanes. A built-in low-voltage detect (LVD) circuit warns the CPU when VDD drops below the configured threshold, allowing safe shutdown before data corruption.
How much Flash and RAM does the MC9S08AC8MFGE have?
The MC9S08AC8MFGE integrates 8 KB of Flash program memory (8K x 8 organization) and 512 bytes of on-chip RAM. Flash endurance is rated at a minimum of 10,000 program/erase cycles, with byte-level Flash programming supported by the S08 instruction set. 512 B of RAM is sufficient for stack plus small data buffers in typical HMI, sensor, and motor-control applications.
What is the difference between MC9S08AC8MFGE and MC9S08AC8CFGE?
The MC9S08AC8MFGE ships in a 44-pin LQFP package rated for the automotive temperature grade (-40C to +125C), while the MC9S08AC8CFGE uses the same 44-pin LQFP footprint but targets the standard commercial temperature grade (0C to +70C). Both share identical 8 KB Flash, 512 B RAM, 40 MHz HCS08 core, and pinout, making them drop-in compatible when thermal requirements allow the substitution.
Where can I buy the MC9S08AC8MFGE online?
The MC9S08AC8MFGE is available from authorized distributors including DigiKey (digiKey part 1791306), Mouser, and Hotenda, with NXP Rochester Electronics handling last-time-buy and obsolete inventory. Pricing for the MC9S08AC8MFGE as of 2026-10-19 starts at USD 7.85 for qty-1, with quantity breaks at 10, 100, 500, and 1,000 units. Independent distributors may offer lower prices but require incoming-inspection risk acceptance.
What is the lead time for the MC9S08AC8MFGE?
Authorized distributor lead time for the MC9S08AC8MFGE as of 2026-10-19 is approximately 8-12 weeks from NXP, with NXP marking the part Not Recommended for New Designs (NRND). For long-term supply, engineers should confirm remaining factory stock with NXP or licensed stocking distributors and consider qualifying the pin-compatible MCF51AC128CLK 32-bit Flexis variant for new designs.
Is the MC9S08AC8MFGE still in production?
The NXP product page for MC9S08AC8MFGE shows End of Life Overview and Discontinuance Notice entries, with current life-cycle status listed as Not Recommended for New Designs (NRND) on distributor pages. Rochester Electronics continues to supply remaining factory stock for existing designs. For new production, consider the MCF51AC Flexis family as a pin-compatible 32-bit upgrade path.
Where to download the MC9S08AC8MFGE datasheet PDF?
The MC9S08AC8MFGE datasheet PDF can be downloaded directly from the NXP product page at https://www.nxp.com/docs/en/data-sheet/MC9S08AC60.pdf, which covers the S08AC family including this specific 8 KB Flash variant. Distributor datasheet mirrors on DigiKey, Hotenda, and FindIC also host the same PDF. The document includes pinout, electrical characteristics, peripheral block diagrams, and reference register maps.
What is the pinout of the MC9S08AC8MFGE 44-LQFP?
The MC9S08AC8MFGE pinout in the 44-LQFP package places VDD on pins 7, 18, 28, and 38, VSS on pins 6, 17, 27, and 39, and exposes 38 GPIO pins routed across PTA-PTE ports. Dedicated peripheral pins include PTA0-PTA7 (with shared IRQ and reset functions), PTB0-PTB7 (ADC inputs and TPM channels), PTC0-PTC7 (SCI, SPI, I2C), and PTD0-PTD7 / PTE0-PTE3 (high-current and remaining GPIO). The full pin-by-pin map is shown in the datasheet pinout diagram.
MC9S08AC8MFGE vs MCF51AC128CLK - which is better for new designs?
For new designs the MCF51AC128CLK 32-bit ColdFire V1 MCU is generally a better choice than the 8-bit MC9S08AC8MFGE, because it provides a pin-compatible footprint (LQFP-44), up to 128 KB Flash, and substantially more compute headroom. The MC9S08AC8MFGE is preferable only when minimizing code size, BOM cost, or leveraging existing S08 toolchains is the priority. Both share the Flexis shared-pinout philosophy for easy migration.
What are the key specifications of the MC9S08AC8MFGE that engineers should know?
The MC9S08AC8MFGE is an 8-bit HCS08-core MCU running at 40 MHz with 20 MHz internal bus, 8 KB Flash, 512 B RAM, 38 GPIO, and 2.7-5.5 V supply. It includes a 10-bit ADC, multiple TPM timers, SCI/SPI/I2C communication, watchdog, LVD, and BDM debug interface in a 44-LQFP package. Temperature grade is automotive (-40C to +125C); lifecycle is NRND with Rochester Electronics as authorized stocking source.
What is the best drop-in replacement for the MC9S08AC8MFGE?
The best drop-in replacement for the MC9S08AC8MFGE in the same 44-LQFP package is the MC9S08AC8CFGE (commercial temperature grade) and the larger-Flash MC9S08AC16MFGE (16 KB Flash, otherwise pin-compatible). The MC9S08AC60CPUE is a 64-pin LQFP upgrade with the same S08 core for designs needing more I/O. For 32-bit migration, the pin-compatible MCF51AC128CLK provides a no-PCB-rework upgrade path on the Flexis family.
When should I choose the MC9S08AC8MFGE over the MCF51AC128CLK?
Choose the MC9S08AC8MFGE over the 32-bit MCF51AC128CLK when the application code is small (fits in 8 KB Flash), BOM cost is critical, the team already has S08 toolchain expertise, and deterministic 8-bit interrupt latency is more valuable than raw CPU throughput. Choose the MCF51AC128CLK when the design requires USB, larger code, more RAM, or a long-term roadmap, since it shares the Flexis pinout and offers far more headroom.
What is the difference between MC9S08AC8MFGE and MC9S08AC16MFGE?
Both the MC9S08AC8MFGE and the MC9S08AC16MFGE share the same S08 core, 40 MHz CPU, 44-LQFP package, and pinout, but the AC16 variant doubles Flash to 16 KB while keeping RAM at 512 B. The AC8 is sufficient for ~6-7 KB of C source code; the AC16 gives designers headroom for more feature-rich firmware without changing PCB layout. Both are drop-in compatible with each other and with the Flexis 32-bit variants.
Is the MC9S08AC8MFGE suitable for automotive body control modules?
Yes, the MC9S08AC8MFGE carries an automotive temperature grade (-40C to +125C) and is well suited for body electronics such as RKE receivers, seat controllers, lighting modules, and mirror adjusters. According to the NXP automotive-grade documentation, designers needing LIN/CAN should select the AC60 or AC128 variants which include those peripherals. Production programs should verify PPAP and AEC-Q100 status with NXP for tier-1 OEM acceptance.
Is the MC9S08AC8MFGE the same as the MC9S08AC8CFGE?
The MC9S08AC8MFGE and the MC9S08AC8CFGE share identical Flash size (8 KB), RAM (512 B), CPU (40 MHz S08), peripherals, and 44-LQFP pinout, but differ in temperature grade - the MFGE is rated -40C to +125C (automotive) while the CFGE is rated 0C to +70C (commercial). They are drop-in interchangeable when the application's thermal envelope permits the commercial-grade substitution; otherwise the automotive-grade MFGE must be retained.

エンジニアリング参考データ: MC9S08AC8MFGE — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC9S08AC8MFGE for new automotive-grade 8-bit designs requiring up to 8 KB Flash and 512 B RAM in a 44-LQFP package, where cost and simplicity dominate over raw CPU performance. Choose the MC9S08AC8CFGE for commercial-temperature applications (0C to +70C) at lower BOM cost. Choose the MC9S08AC16MFGE when firmware exceeds ~6-7 KB but you want to keep the same S08 toolchain. For designs that may grow toward 32-bit performance, USB, or larger memory, the MCF51AC128CLK Flexis variant provides a pin-compatible upgrade path. For CAN/LIN automotive networking, choose the 64-pin MC9S08AC60CPUE. All five parts share the same NXP Flexis shared-pinout philosophy, allowing engineers to select the right memory/peripheral mix without changing PCB layout.

代替品との比較

パラメータ この製品 MC9S08AC8CFGE MC9S08AC16MFGE MC9S08AC16CFGE MC9S08AC48CFGE MCF51AC128CLK
Package 44-LQFP (10x10 mm) 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same 44-LQFP (Flexis pin-compatible)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core 8-bit HCS08 (40 MHz) 8-bit HCS08 (40 MHz) 8-bit HCS08 (40 MHz) 8-bit HCS08 (40 MHz) 8-bit HCS08 (40 MHz) 32-bit ColdFire V1 (50 MHz)
Flash Memory 8 KB 8 KB 16 KB 16 KB 48 KB 128 KB
RAM 512 B 512 B 512 B 512 B 1 KB 16 KB
Temperature Grade Automotive -40C to +125C Commercial 0C to +70C Automotive -40C to +125C Commercial 0C to +70C Commercial 0C to +70C Automotive -40C to +125C
GPIO Count 38 38 38 38 38 38
Supply Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V

主な差別化要因

  • Pin-compatible Flexis migration to 32-bit ColdFire V1 (vs MCF51AC128CLK)
  • 8-bit core with 10 KB/s background-debug-mode programming (vs MC9S08AC16CFGE)
  • Automotive temperature grade at lowest Flash density (vs MC9S08AC8CFGE)

設計ノート

The MC9S08AC8MFGE has multiple VDD/VSS pin pairs (pins 5/6, 7/17, 18/27, 28/38/39) that must each be decoupled with a 100 nF ceramic capacitor placed within 5 mm of the respective pins. A bulk 4.7 uF tantalum or ceramic capacitor should sit on the board near the MCU to handle ADC reference transient currents. Failure to decouple each pin pair may cause ADC noise coupling and unexpected resets during heavy GPIO switching.

For noise-sensitive analog reads, separate the analog VDD/VSS pin pairs from the digital VDD/VSS pin pairs and route them through a ferrite bead to form an isolated analog supply island. Keep ADC input traces away from PWM and high-speed switching signals, and place a ground pour immediately under the MCU. The exposed-pad (if present on the specific LQFP variant) should be soldered to a continuous ground plane for thermal dissipation.

When migrating from the 8-bit MC9S08AC8MFGE to the 32-bit MCF51AC128CLK, note that the ColdFire V1 core has a different instruction set and toolchain (CodeWarrior for ColdFire vs CodeWarrior for S08). Code must be recompiled; binary portability is not available. Pin-compatible Flexis migration requires verifying the migration guide for any peripheral remapping (e.g., ADC channels and timer assignments may shift between sub-families).

Route the BKGD/MS pin (pin 44) directly to a 2x5 or 1x6 BDM header with no series components, since the background-debug-mode interface is bidirectional and any capacitance will distort the debug clock. Place a 4.7 kohm pull-up on RESET_b if used, and keep the reset trace short to avoid spurious resets from EMI. The optional external crystal traces (if used instead of the internal 1 kHz reference) should be symmetric and ground-guarded.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS compliant per NXP product page. AEC-Q100 automotive-grade qualified per automotive temperature rating (-40C to +125C). Lead-free and halogen-free per NXP material declaration.

データ検証日: 2026-10-19 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MC9S08AC8MFGE MC9S08AC8MFGE datasheet NXP MC9S08AC8MFGE 8-bit S08 MCU 8KB flash 44-LQFP HCS08 automotive microcontroller MC9S08AC8MFGE vs MC9S08AC8CFGE MC9S08AC8MFGE drop-in replacement MC9S08AC8MFGE buy price MC9S08AC8MFGE pinout LQFP-44 MC9S08AC8MFGE lead time stock what is the operating voltage of MC9S08AC8MFGE Flexis S08 ColdFire pin-compatible MCU NXP S08AC8 automotive body control

関連部品&用語

NXP Semiconductors MC9S08AC8MFGE MC9S08AC8CFGE MC9S08AC16MFGE MC9S08AC16CFGE MC9S08AC48CFGE MCF51AC128CLK HCS08 S08 core ColdFire V1 Flexis 8-bit microcontroller microcontroller Flash memory LQFP-44 LQFP package AEC-Q100 RoHS REACH automotive body control module BDM (background debug mode) TPM timer SCI/SPI/I2C 10-bit ADC low-voltage detect
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