MC9S08AC8MFGE - 8KB Flash 8-bit S08 MCU, 40MHz | NXP
Référence : MC9S08AC8MFGE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $6.95 | $69,50 |
| 100 | $6.05 | $605,00 |
| 500 | $5.45 | $2 725,00 |
| 1 000 | $4.95 | $4 950,00 |
MC9S08AC8MFGE Présentation
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit central processing unit, integrating CPU core, non-volatile program memory (typically Flash), working RAM, and a variety of peripherals (ADC, timers, communication interfaces) into one package. Within the broader semiconductor taxonomy, an MCU belongs to the embedded processing hierarchy: microcontroller -> microprocessor -> integrated circuit -> semiconductor. The S08AC family sits within NXP's 8-bit HCS08 product line, itself a derivative of the legacy HC08 architecture. Compared with 32-bit microcontrollers, 8-bit MCUs trade raw computational throughput for low cost, deterministic interrupt response, and very low power consumption, making them well suited for cost-sensitive and battery-operated designs.
The S08AC core delivers 40MHz CPU operation with single-cycle access to Flash and RAM, plus a hardware multiply-and-accumulate (MAC) unit for efficient signal-processing primitives. On-chip peripherals include up to 8-channel 10-bit ADC, multiple timers (TPM), SCI (UART), SPI, and I2C, providing the connectivity and analog interfacing needed for sensor readout, motor control, and human-interface designs. An integrated low-voltage detect (LVD) and a watchdog timer improve system robustness in industrial environments.
Typical applications for the MC9S08AC8MFGE include automotive body controllers (with a separate Q-graded automotive variant for under-hood use), industrial sensor nodes, low-end consumer appliances, white goods motor control, and small HMI subsystems. Its 8KB Flash / 512B RAM combination targets applications that previously used 8051-class devices but benefit from the modern S08 peripheral set and Flash convenience.
When designing with this device, allocate sufficient decoupling (100nF plus 4.7uF bulk) on each supply pin, route the 8MHz external crystal traces symmetrically with ground guarding if higher bus accuracy is required, and reserve the background-debug-mode (BDM) header for in-circuit programming. For migration to a 32-bit equivalent, the pin-compatible MCF51AC family provides an upgrade path without PCB rework.
This page consolidates distributor pricing, NXP datasheet references, and drop-in compatible alternatives into a single reference - engineering content not duplicated on any single distributor or manufacturer page.
Alternatives de remplacement direct pour MC9S08AC8MFGE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08AC8MFGE (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, RAM, Operating Temperature Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08AC8CFGE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S08AC16MFGE
✅ Remplacement direct✓ En stock
$2.95 / unité
Voir la fiche technique →MC9S08AC16CFGE
✅ Remplacement direct✓ En stock
$2.6 / unité
Voir la fiche technique →MC9S08AC48CFGE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF51AC128CLK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08AC60CPUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S08AC8MFGE Valeurs maximales et caractéristiques électriques
| Core | HCS08 (S08) 8-bit CPU |
| CPU Clock Speed | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Program Flash Memory | 8 KB (8K x 8) |
| RAM | 512 B |
| Tension d'alimentation | 2.7 V to 5.5 V |
| I/O Pins | 38 |
| Boîtier | 44-LQFP (10x10 mm) |
| Type de montage | Surface Mount (Gull Wing) |
| Temperature Grade | Automotive |
| Package Code | LQFP |
| Peripherals | ADC, TPM, SCI, SPI, I2C |
| ADC | 10-bit, multi-channel |
| Plage de température de fonctionnement | -40C to +125C |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
| ROM Type | Flash |
Configuration des broches de MC9S08AC8MFGE
| Broche 1 | PTE0/TxD1 — GPIO / SCI1 transmit |
| Broche 2 | PTE1/RxD1 — GPIO / SCI1 receive |
| Broche 3 | PTE2 — General-purpose I/O |
| Broche 4 | PTE3 — General-purpose I/O |
| Broche 5 | VDD — Supply voltage (2.7-5.5 V) |
| Broche 6 | VSS — Ground |
| Broche 7 | VDD — Supply voltage |
| Broche 8 | PTA0/ADP0 — GPIO / ADC channel 0 |
| Broche 9 | PTA1/ADP1 — GPIO / ADC channel 1 |
| Broche 10 | PTA2/ADP2 — GPIO / ADC channel 2 |
| Broche 11 | PTA3/ADP3 — GPIO / ADC channel 3 |
| Broche 12 | PTA4/ADP4 — GPIO / ADC channel 4 |
| Broche 13 | PTA5/ADP5/IRQ — GPIO / ADC / external IRQ |
| Broche 14 | PTA6/ADP6 — GPIO / ADC channel 6 |
| Broche 15 | PTA7/ADP7 — GPIO / ADC channel 7 |
| Broche 16 | PTB0 — GPIO |
| Broche 17 | VSS — Ground |
| Broche 18 | VDD — Supply voltage |
| Broche 19 | PTB1 — GPIO |
| Broche 20 | PTB2 — GPIO |
| Broche 21 | PTB3 — GPIO |
| Broche 22 | PTB4 — GPIO |
| Broche 23 | PTB5 — GPIO |
| Broche 24 | PTB6 — GPIO |
| Broche 25 | PTB7 — GPIO |
| Broche 26 | PTC0/SPSCK — GPIO / SPI clock |
| Broche 27 | VSS — Ground |
| Broche 28 | VDD — Supply voltage |
| Broche 29 | PTC1/MOSI — GPIO / SPI master-out |
| Broche 30 | PTC2/MISO — GPIO / SPI master-in |
| Broche 31 | PTC3/SS — GPIO / SPI slave select |
| Broche 32 | PTC4 — GPIO |
| Broche 33 | PTC5/SCL — GPIO / I2C clock |
| Broche 34 | PTC6/SDA — GPIO / I2C data |
| Broche 35 | PTC7 — GPIO |
| Broche 36 | PTD0 — GPIO |
| Broche 37 | PTD1 — GPIO |
| Broche 38 | VDD — Supply voltage |
| Broche 39 | VSS — Ground |
| Broche 40 | PTD2 — GPIO |
| Broche 41 | PTD3 — GPIO |
| Broche 42 | PTD4 — GPIO |
| Broche 43 | PTD5 — GPIO |
| Broche 44 | BKGD/MS — Background debug mode / mode select |
Applications typiques
MC9S08AC8MFGE convient pour 6 applications: Automotive Body Control Module, Industrial Sensor Node, Low-End Consumer Appliance, Small HMI / Keypad Interface, Brushless DC Motor Control, Battery-Operated Remote Control.
Automotive Body Control Module
The MC9S08AC8MFGE is well suited for automotive body control modules such as seat adjusters, mirror controllers, and interior lighting. Its automotive temperature grade (-40C to +125C), 38 GPIO pins, and 10-bit ADC handle analog sensing of potentiometers and current shunts for closed-loop position control. The S08 8-bit architecture provides deterministic interrupt response and small code size, with 8 KB Flash sufficient for typical body-control state machines. Compared with 32-bit alternatives, the 8-bit core simplifies MISRA-style C coding and reduces qualification overhead for tier-1 OEM programs where AEC-Q100 traceability is required for LIN-cluster nodes.
Recommandé
Industrial Sensor Node
In industrial 4-20 mA loop-powered sensor transmitters and simple PLC I/O modules, the MC9S08AC8MFGE provides the ADC, SCI/SPI, and GPIO needed for sensor signal conditioning. The 2.7V to 5.5V supply supports both 3.3 V and 5 V transducer rails, and the 40 MHz CPU runs calibration filters in real time. With 512 B RAM and 8 KB Flash, the MCU handles linearization, fault detection, and HART or Modbus framing without an external communication ASIC. Hardware low-voltage detect and watchdog timers provide the supervisory functions required by IEC 61508 SIL-1 sensor designs.
Recommandé
Low-End Consumer Appliance
For coffee machines, blenders, microwave ovens, and entry-level white goods, the MC9S08AC8MFGE offers the right balance of cost, peripherals, and Flash size. Its 8 KB Flash stores menu state machines and timing profiles, while the 10-bit ADC reads temperature, weight, and humidity sensors. The TPM timers drive TRIAC phase-angle control or PWM for variable-speed brushless DC motors, and SCI/SPI interfaces connect to displays and keypads. Compared with 8051-class predecessors, the S08 core reduces instruction count per task and improves code density by 20-30 percent.
Recommandé
Small HMI / Keypad Interface
Human-machine interface (HMI) panels in elevators, kiosks, and security keypads benefit from the MC9S08AC8MFGE's 38 GPIO for matrix-scanned keypads, LED indicators, and segment-LCD driving. The S08 core runs debounce and multi-touch detection in software with deterministic latency, while 512 B RAM holds a key-press buffer. With SPI or I2C, the MCU controls segment displays, dot-matrix LEDs, or character LCDs. Compared with discrete logic implementations, this single-chip approach reduces PCB area by 40-60 percent and simplifies EMC compliance.
Recommandé
Brushless DC Motor Control
Small brushless DC (BLDC) motors in fans, pumps, and HVAC blowers can be driven by the MC9S08AC8MFGE using its TPM channels for complementary PWM and ADC for back-EMF sensing. At 40 MHz CPU with single-cycle Flash access, the S08 core executes field-oriented control loops within 20 microseconds per PWM cycle, suitable for sub-100 W motors. Hardware fault inputs handle over-current and over-temperature shutdown within one PWM period. Compared with discrete motor controllers, the integrated solution reduces BOM cost and enables in-field firmware upgrades for variable-speed profiles.
Recommandé
Battery-Operated Remote Control
Battery-powered remote controls for toys, RKE fobs, and wireless sensor nodes leverage the MC9S08AC8MFGE's low power modes, 2.7 V minimum supply, and small Flash footprint. Stop and wait modes drop quiescent current below 1 microampere, while the 40 MHz CPU wakes to service button events within microseconds. The 8-bit core efficiently encodes RF protocols over a single GPIO bit-banging pin, eliminating an external encoder IC. Compared with 32-bit MCUs, the S08 architecture delivers 2-3x lower active-mode energy per instruction, extending battery life in coin-cell applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08AC8MFGE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08AC8CFGE | MC9S08AC16MFGE | MC9S08AC16CFGE | MC9S08AC48CFGE | MCF51AC128CLK |
|---|---|---|---|---|---|---|
| Package | 44-LQFP (10x10 mm) | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same | 44-LQFP (10x10 mm) - same | 44-LQFP (Flexis pin-compatible) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | 8-bit HCS08 (40 MHz) | 8-bit HCS08 (40 MHz) | 8-bit HCS08 (40 MHz) | 8-bit HCS08 (40 MHz) | 8-bit HCS08 (40 MHz) | 32-bit ColdFire V1 (50 MHz) |
| Flash Memory | 8 KB | 8 KB | 16 KB | 16 KB | 48 KB | 128 KB |
| RAM | 512 B | 512 B | 512 B | 512 B | 1 KB | 16 KB |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +70C | Automotive -40C to +125C | Commercial 0C to +70C | Commercial 0C to +70C | Automotive -40C to +125C |
| GPIO Count | 38 | 38 | 38 | 38 | 38 | 38 |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
Principaux différenciateurs
- Pin-compatible Flexis migration to 32-bit ColdFire V1 (vs MCF51AC128CLK)
- 8-bit core with 10 KB/s background-debug-mode programming (vs MC9S08AC16CFGE)
- Automotive temperature grade at lowest Flash density (vs MC9S08AC8CFGE)
Notes de conception
The MC9S08AC8MFGE has multiple VDD/VSS pin pairs (pins 5/6, 7/17, 18/27, 28/38/39) that must each be decoupled with a 100 nF ceramic capacitor placed within 5 mm of the respective pins. A bulk 4.7 uF tantalum or ceramic capacitor should sit on the board near the MCU to handle ADC reference transient currents. Failure to decouple each pin pair may cause ADC noise coupling and unexpected resets during heavy GPIO switching.
For noise-sensitive analog reads, separate the analog VDD/VSS pin pairs from the digital VDD/VSS pin pairs and route them through a ferrite bead to form an isolated analog supply island. Keep ADC input traces away from PWM and high-speed switching signals, and place a ground pour immediately under the MCU. The exposed-pad (if present on the specific LQFP variant) should be soldered to a continuous ground plane for thermal dissipation.
When migrating from the 8-bit MC9S08AC8MFGE to the 32-bit MCF51AC128CLK, note that the ColdFire V1 core has a different instruction set and toolchain (CodeWarrior for ColdFire vs CodeWarrior for S08). Code must be recompiled; binary portability is not available. Pin-compatible Flexis migration requires verifying the migration guide for any peripheral remapping (e.g., ADC channels and timer assignments may shift between sub-families).
Route the BKGD/MS pin (pin 44) directly to a 2x5 or 1x6 BDM header with no series components, since the background-debug-mode interface is bidirectional and any capacitance will distort the debug clock. Place a 4.7 kohm pull-up on RESET_b if used, and keep the reset trace short to avoid spurious resets from EMI. The optional external crystal traces (if used instead of the internal 1 kHz reference) should be symmetric and ground-guarded.
Informations de conformité
RoHS compliant per NXP product page. AEC-Q100 automotive-grade qualified per automotive temperature rating (-40C to +125C). Lead-free and halogen-free per NXP material declaration.
