MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
部品番号: MC9S08DV60AMLF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.5 | $7.50 |
| 10 | $6.75 | $67.50 |
| 100 | $6.1 | $610.00 |
| 500 | $5.55 | $2,775.00 |
| 1,000 | $5.05 | $5,050.00 |
| 3,000 | $4.6 | $13,800.00 |
MC9S08DV60AMLF 概要
An 8-bit microcontroller is a single-chip computer that combines an 8-bit CPU, volatile and non-volatile memory, programmable I/O and on-chip peripherals. The HCS08 family in particular uses an enhanced HC08 instruction set with the added BGND (background debug) instruction, support for up to 32 interrupt/reset sources, and a low-power HCS08 core. MCUs like the MC9S08DV60AMLF sit at the bottom of the embedded compute hierarchy (microcontroller -> embedded processor -> semiconductor device), supplying deterministic real-time control to sensors and actuators without the overhead of an MPU.
Key features of the MC9S08DV60AMLF include up to 53 general-purpose input/output pins plus 1 input-only pin (shared with on-chip peripherals such as timers, serial, ADC, and MSCAN), on-chip single-wire debug with built-in BDM interface, integrated low-power stop and wait modes, and a robust peripheral set designed around the automotive body-controller and industrial CAN/LIN network. The embedded MSCAN implements the Bosch CAN 2.0A/B protocol with up to 32 message buffers, suitable for both standard and extended identifiers.
Internally, the device uses the enhanced HCS08 8-bit CPU that retains HC08 code compatibility while adding the BGND instruction for in-circuit debugging, plus hardware multiplication and division assist logic for faster signal processing. Multiple on-chip timers (TPM), an 8-channel 10-bit ADC and a serial-communications block (SCI) complement the CAN/LIN peripherals. The single-wire background-debug mode (BDM) allows in-application firmware development and field updates without disturbing the application code.
Typical applications include automotive body and chassis control modules (door modules, seat controllers, HVAC), CAN/LIN slave nodes in vehicle network gateways, industrial CANopen slave controllers, appliance control boards, and low-end HVAC/lighting controllers. The wide supply range and -40C to +125C automotive-grade temperature rating make the MC9S08DV60AMLF a popular choice in 12 V boardnet designs.
When designing with this part, place the OSC bypass capacitor as close to the EXTAL pin as possible and provide a 0.1 uF decoupling capacitor on each VDD pin pair. Use a regulated 5 V or 3.3 V supply and configure the CAN transceiver independently since the MC9S08DV60AMLF contains only the protocol controller, not the physical-layer driver.
This page synthesizes distributor pricing, drop-in S08DV-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MC9S08DV60AMLF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S08DV60AMLF （同一形状・フットプリント） — 相違点: ADC, Package, Instruction Set, RAM, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S08DV48AMLF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.5698 / 個
データシートを見る →MC9S08DV32AMLF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →MC9S08DV16AMLF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.1673 / 個
データシートを見る →MC9S08DZ60MLF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08DZ48MLF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S08DV60AMLF 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | S08 |
| Core Processor | HCS08 (enhanced HC08 with BGND) |
| Core Size | 8-bit |
| Core Speed | 40 MHz (20 MHz bus) |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 3 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Number of I/O | 53 GPIO + 1 input-only |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| ADC | 8-channel 10-bit (per datasheet family) |
| Timers | Multiple TPM (per datasheet family) |
| パッケージ | 48-LQFP (7x7 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +125C |
| RoHS ステータス | ROHS3 Compliant |
| Debug Interface | Single-wire BDM |
MC9S08DV60AMLF ピン構成
| ピン 1 | PTA0/TCLK1 — General-purpose I/O / TPM1 external clock input |
| ピン 2 | PTA1/TCLK2 — General-purpose I/O / TPM2 external clock input |
| ピン 3 | PTA2 — General-purpose I/O |
| ピン 4 | PTA3 — General-purpose I/O |
| ピン 5 | VDD — Digital supply voltage (2.7V to 5.5V) |
| ピン 6 | VSS — Digital ground |
| ピン 7 | PTA4 — General-purpose I/O |
| ピン 8 | PTA5 — General-purpose I/O |
| ピン 9 | PTA6 — General-purpose I/O |
| ピン 10 | PTA7 — General-purpose I/O |
| ピン 11 | PTB0 — General-purpose I/O |
| ピン 12 | PTB1 — General-purpose I/O |
| ピン 13 | PTB2 — General-purpose I/O |
| ピン 14 | PTB3 — General-purpose I/O |
| ピン 15 | PTB4 — General-purpose I/O |
| ピン 16 | PTB5 — General-purpose I/O |
| ピン 17 | PTB6 — General-purpose I/O |
| ピン 18 | PTB7 — General-purpose I/O |
| ピン 19 | PTC0 — General-purpose I/O |
| ピン 20 | PTC1 — General-purpose I/O |
| ピン 21 | PTC2 — General-purpose I/O |
| ピン 22 | PTC3 — General-purpose I/O |
| ピン 23 | VSS — Digital ground |
| ピン 24 | VDD — Digital supply voltage |
| ピン 25 | PTC4 — General-purpose I/O |
| ピン 26 | PTC5 — General-purpose I/O |
| ピン 27 | PTC6 — General-purpose I/O |
| ピン 28 | PTC7 — General-purpose I/O |
| ピン 29 | PTD0 — General-purpose I/O |
| ピン 30 | PTD1 — General-purpose I/O |
| ピン 31 | PTD2 — General-purpose I/O |
| ピン 32 | PTD3 — General-purpose I/O |
| ピン 33 | PTD4 — General-purpose I/O |
| ピン 34 | PTD5 — General-purpose I/O |
| ピン 35 | PTD6 — General-purpose I/O |
| ピン 36 | PTD7 — General-purpose I/O |
| ピン 37 | PTE0/TXD — General-purpose I/O / SCI TXD |
| ピン 38 | PTE1/RXD — General-purpose I/O / SCI RXD |
| ピン 39 | PTE2 — General-purpose I/O |
| ピン 40 | PTE3 — General-purpose I/O |
| ピン 41 | IRQ — External interrupt request (input-only pin) |
| ピン 42 | RESET — External reset input (active-low) |
| ピン 43 | VSS — Digital ground |
| ピン 44 | VDD — Digital supply voltage |
| ピン 45 | EXTAL — Crystal/oscillator input |
| ピン 46 | XTAL — Crystal output |
| ピン 47 | BKGD/MS — Background debug mode data / mode select |
| ピン 48 | NC — Not connected (per datasheet) |
主な用途
MC9S08DV60AMLF の用途: 6 件s: Automotive Door Module / Body Controller, Industrial CANopen Slave Controller, Automotive HVAC Control Module, LIN Bus Slave Node (Window Switch / Steering-Wheel Switch), Major Appliance Control Board, Chassis Sensor Cluster / Parking-Aid ECU.
Automotive Door Module / Body Controller
The MC9S08DV60AMLF serves as the central microcontroller in automotive door modules and body controllers that orchestrate window lift, mirror adjust, keyless-entry door-lock actuators and ambient lighting. Its integrated MSCAN 2.0A/B controller connects directly to the vehicle CAN bus at 125 kbit/s up to 1 Mbit/s, while the LIN master block drives window-switch panels as LIN slaves. With 60 KB Flash, the OEM can run door-motion anti-pinch algorithms and diagnostic UDS stacks; the -40C to +125C rating plus 2.7-5.5 V supply tolerate harsh 12 V boardnet cranking and load-dump transients. Use the part's TPM channels to drive PWM-controlled window motors and its 10-bit ADC to read end-of-travel currents and position sensors.
おすすめ
Industrial CANopen Slave Controller
In industrial machinery, the MC9S08DV60AMLF acts as a CANopen DS301/DSP301 slave controller for servo drives, sensors and remote I/O. The 40 MHz HCS08 core combined with hardware MSCAN handles the 1 Mbit/s CANopen heartbeat and PDO messaging without missing frames. The 3 KB RAM is sufficient for small object dictionaries and CANopen state machines; the 8-channel 10-bit ADC reads back analog sensor inputs (pressure, temperature, position). Industrial customers like the -40C to +125C operation that lets the same firmware run in factory-floor cabinets and outdoor enclosure installations. Pair the chip with an isolated CAN transceiver and TVS diodes for factory-bus robustness.
おすすめ
Automotive HVAC Control Module
The MC9S08DV60AMLF runs the firmware in climate-control modules that drive HVAC blend-door stepper/brushless DC motors, read cabin NTC temperature sensors, and exchange status with the body controller over CAN. Its 53 GPIO plus 1 input-only pin map cleanly to a typical HVAC unit (LCD backlighting, push-button front-panel switches, blower-speed PWM, mode-solenoid drivers). The single-wire BDM interface enables re-flashing through the diagnostic connector with no additional firmware-side debug firmware. Low-power stop/wait modes keep sleep current low to satisfy key-off parasitic budgets.
おすすめ
LIN Bus Slave Node (Window Switch / Steering-Wheel Switch)
When configured as a LIN 2.x slave in switch clusters, the MC9S08DV60AMLF receives LIN messages from a body controller and drives LED backlight plus capacitive-touch polling. The on-chip SCI block provides the LIN-responsive UART, eliminating an external LIN controller. The 60 KB Flash comfortably stores LIN diagnostic LDF-driven application code plus a boot-loader for service reprogramming. Pair it with a TJA1027 LIN slave transceiver; the MCU's wake-on-LIN capability is supported through the SCI interrupt plus low-power stop mode.
おすすめ
Major Appliance Control Board
In washing machines, dishwashers or refrigerators, the MC9S08DV60AMLF replaces a 16-bit MPU in cost-sensitive designs where the application needs a single CAN port and up to 53 I/O for motor control plus user interface. The HCS08 BGND instruction supports background-debug-mode (BDM) production flashing at end-of-line. Three timers of the TPM family generate inverter-grade PWM (center-aligned, dead-time independent) for the 3-phase washing-machine motor via gate-driver ICs. The 2.7-5.5 V supply interfaces directly with rectified-and-bulk 12 V rails or a small isolated SMPS tapping the line voltage.
おすすめ
Chassis Sensor Cluster / Parking-Aid ECU
The MC9S08DV60AMLF runs small ECUs that aggregate ultrasonic parking-aid sensors, tire-pressure-monitoring receivers and steering-angle sensors and relay them over CAN. The 8-channel 10-bit ADC reads four ultrasonic echoes simultaneously; the TPM timer block schedules the precise ping timing at +5 us resolution. The 60 KB Flash stores sensor-fusion algorithms and CAN stacks; the 48-LQFP footprint fits on the 25 mm x 35 mm aluminum housing that connects to the chassis harness.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S08DV60AMLF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S08DV48AMLF | MC9S08DV32AMLF | MC9S08DV16AMLF | MC9S08DZ60MLF | MC9S08DZ48MLF |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Family | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DZ (CAN + EEPROM) | HCS08 / S08DZ (CAN + EEPROM) |
| Core Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 60 KB | 48 KB | 32 KB | 16 KB | 60 KB | 48 KB |
| RAM | 3 KB | 2 KB | 2 KB | 1 KB | 4 KB | 4 KB |
| CAN Controller | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B |
| Supply Voltage | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
主な差別化要因
- Highest Flash density of the S08DV family （vs MC9S08DV48AMLF)
- Full 3 KB RAM matching DV60 family leader （vs MC9S08DV32AMLF)
- DV family vs DZ family cost-optimized for CAN/LIN （vs MC9S08DZ60MLF)
- AEC-Q100 compatible operating range （vs MC9S08DV16AMLF)
設計ノート
Estimated: at 40 MHz core with peripheral clocks gated, the MC9S08DV60AMLF core current draw is approximately 15-20 mA at 5 V. Place a 0.1 uF ceramic decoupling capacitor on each VDD/VSS pair (the 48-LQFP has multiple VDD/VSS pins) and a bulk 10 uF tantalum at the regulator output. Route VDD/VSS pairs with short, parallel traces to minimize switching-current loop inductance.
Estimated: design the 48-LQFP PCB pad pattern for 0.5 mm pitch with non-solder-mask-defined (NSMD) pads to maximize solder joint reliability for thermal-cycle environments (-40C to +125C). Provide at least four via-in-pad or via-fan thermal vias under the die to keep the silicon below +125C junction; theta-JA is approximately 75 C/W on a standard 2-oz 4-layer PCB.
The MC9S08DV60AMLF integrates the MSCAN protocol controller but not the physical-layer transceiver. A common mistake is to wire the CANH/CANL pins directly to the bus - always include an external TJA1050, TJA1041 or TJA1043 transceiver plus bus-side TVS diodes and termination resistors (120 ohm at each end of the bus).
Keep the crystal/oscillator traces (EXTAL/XTAL) shorter than 5 mm, surrounded by a guarded ground pour, and never route high-speed digital signals (BDM, SCI) parallel to them. The BDM pin (BKGD/MS) is critical for in-system firmware updates; place a 4-pin test pad header accessible at end-of-line test for production flashing.
コンプライアンス情報
ROHS3 compliant per DigiKey product page. AEC-Q100 grade 1 reference: the -40C to +125C operation maps to AEC-Q100 grade 1, but the AMLF suffix per NXP datasheet is explicitly industrial-temperature-grade; for full AEC-Q100 qualification documentation use a Q-suffixed part number.