MC9S08QA4CFQE - 8-bit S08 MCU, 4KB Flash, 20MHz | NXP Semiconductors
部品番号: MC9S08QA4CFQE ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.5 | $1.50 |
| 10 | $1.35 | $13.50 |
| 100 | $1.2 | $120.00 |
| 500 | $1.05 | $525.00 |
| 1,000 | $0.9 | $900.00 |
MC9S08QA4CFQE 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and peripherals such as timers, ADCs, and communication interfaces. The MC9S08QA4 belongs to the cost-effective, high-performance S08 family of 8-bit microcontrollers from NXP (formerly Freescale). Within the broader semiconductor taxonomy, it sits under 8-bit MCU -> microcontroller -> embedded processor -> semiconductor device. The S08 architecture uses the HC08 instruction set (backward-compatible) with the added BGND instruction for background debug, enabling non-intrusive in-circuit programming and breakpoint-based debugging.
Key features include an internal clock source, on-chip memory, two very low-power stop modes for battery conservation, and low-voltage detection with reset or interrupt capability. The 8-pin DFN-EP package minimizes board area while providing a thermal pad for improved heat dissipation. Single-wire background debug mode (BDM) allows in-circuit programming and debug without consuming I/O pins.
The HCS08 CPU executes most instructions in 1-2 bus cycles, achieving throughput close to 1 MIPS/MHz. The 4 KB program memory supports C-language firmware development for typical small embedded tasks. The integrated low-voltage detect (LVD) circuit protects against brown-out conditions by asserting reset or generating an interrupt when VDD drops below a programmed threshold.
Typical applications include low-cost consumer electronics, battery-powered sensors, home appliances, and simple motor/relay control where a small footprint and low power are essential. The wide 1.8 V to 3.3 V range supports both single-cell Li-ion and 2xAA battery-powered designs.
When designing with this part, ensure the exposed pad is soldered to a sufficiently large copper pour to meet thermal and electrical ground requirements. Programming requires a BDM tool compatible with the HCS08 family; the integrated stop modes require careful peripheral state management on wake-up to minimize current consumption.
This page synthesizes distributor pricing, drop-in alternatives within the same 8-DFN-EP footprint, and practical design notes not consolidated in the manufacturer datasheet alone.
ドロップイン代替品: MC9S08QA4CFQE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S08QA4CFQE （同一形状・フットプリント） — 相違点: Mounting Type, Package, RAM.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S08QA4CDWE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S08QA4CFNE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S08QA4CWNE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S08QA2CFQE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S08QA4CFQE 最大定格＆電気的特性
| Core | HCS08 (8-bit) |
| Instruction Set | HC08 with BGND extension |
| CPU Clock (Max) | 20 MHz |
| Program Memory (Flash) | 4 KB (4K x 8) |
| RAM | 256 B |
| Operating Voltage (VDD) | 1.8 V to 3.3 V |
| パッケージ | 8-DFN-EP (4x4 mm) with Exposed Pad |
| 実装タイプ | Surface Mount |
| Low-Power Stop Modes | Two (very low power) |
| Low-Voltage Detect (LVD) | Yes, with reset or interrupt |
| Debug Interface | Background Debug Mode (BDM), single-wire |
| Breakpoints | 1 in-circuit + 2 additional (on-chip) |
| RoHS ステータス | Compliant |
MC9S08QA4CFQE ピン構成
| ピン 1 | VSS — Ground (also exposed pad) |
| ピン 2 | BKGD/MS — Background Debug Mode / Mode Select |
| ピン 3 | RESET — External reset input, active low |
| ピン 4 | PTA2/TCLK — General I/O / Timer clock input |
| ピン 5 | PTA3 — General I/O |
| ピン 6 | PTA4 — General I/O |
| ピン 7 | PTA5/IRQ — General I/O / External interrupt |
| ピン 8 | VDD — Supply voltage (1.8 V to 3.3 V) |
主な用途
MC9S08QA4CFQE の用途: 6 件s: Battery-Powered Wireless Sensor Nodes, Home Appliance Control (Small Motors, Relays), Low-Cost Consumer Electronics, Industrial Sensor Aggregation Modules, LED Lighting and Signage Controllers, Simple Security and Access-Control Panels.
Battery-Powered Wireless Sensor Nodes
The MC9S08QA4CFQE is well suited for battery-powered wireless sensor nodes thanks to its 1.8 V to 3.3 V supply range and two very low-power stop modes per the manufacturer datasheet. With the CPU halted in Stop1 or Stop2, quiescent current drops low enough to support multi-year battery life on a single 2xAA cell. The 4 KB Flash fits typical sensor firmware (sampling, threshold checking, low-power RF wake-up). The exposed thermal pad keeps self-heating minimal in sealed enclosures.
おすすめ
Home Appliance Control (Small Motors, Relays)
In small home appliances such as coffee makers, fans, or simple washing-machine control boards, the MC9S08QA4CFQE drives relays, triacs, and small DC motors via its GPIO pins. The HCS08 core's deterministic interrupt response ensures clean zero-crossing switching, and the 20 MHz CPU bandwidth is more than adequate for state-machine control loops. The 8-DFN-EP 4x4 mm package fits compact consumer appliance PCBs where every square millimeter matters.
おすすめ
Low-Cost Consumer Electronics
The MC9S08QA4CFQE targets cost-sensitive consumer electronics where its sub-$1.50 unit price (as of 2026-10-18) and minimal BOM (no external crystal required, on-chip LVD and BDM) minimize total system expense. The integrated background debug mode enables factory firmware updates without removing I/O pins. Per the manufacturer datasheet, the device operates from 1.8 V to 3.3 V, fitting directly into 3.3 V digital subsystems such as remote controls, toys, and simple user interfaces.
おすすめ
Industrial Sensor Aggregation Modules
For industrial sensor aggregation hubs reading multiple digital or analog sensors and forwarding data over UART or I2C, the MC9S08QA4CFQE provides the right balance of memory, peripherals, and ruggedness. The integrated low-voltage detect with reset or interrupt protects against brown-out events common on long industrial cabling runs. Per the verified manufacturer description, the on-chip memory and two stop modes allow duty-cycled sampling that extends service intervals in remote installations.
おすすめ
LED Lighting and Signage Controllers
Architectural LED controllers and small digital signage benefit from the MC9S08QA4CFQE's small footprint and deterministic timing. The 8-pin DFN-EP package fits inside LED fixture housings, and the 20 MHz HCS08 core smoothly drives WS2812B or APA102 addressable LED strings via bit-banged GPIO. The 1.8 V to 3.3 V supply range accommodates direct Li-ion or 3.3 V regulated supplies common in lighting applications.
おすすめ
Simple Security and Access-Control Panels
Keypad-based access control panels, RFID tag readers, and basic alarm keypads use the MC9S08QA4CFQE for matrix keypad scanning, LED indicator control, and low-speed communication with a host controller. The 4 KB Flash stores keypad debounce, authentication, and indicator logic; the 256 B RAM handles the active key buffer. The integrated BDM enables field firmware updates during installation or service calls.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S08QA4CFQE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S08QA4CDWE | MC9S08QA4CFNE | MC9S08QA4CWNE | MC9S08QA2CFQE |
|---|---|---|---|---|---|
| Package | 8-DFN-EP (4x4) | 8-DFN-EP (4x4) - same | 8-DFN-EP (4x4) - same | 8-DFN-EP (4x4) - same | 8-DFN-EP (4x4) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| CPU Clock (Max) | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Flash Memory | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB (-50%) |
| RAM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V |
| Low-Power Stop Modes | 2 (Stop1, Stop2) | 2 (Stop1, Stop2) | 2 (Stop1, Stop2) | 2 (Stop1, Stop2) | 2 (Stop1, Stop2) |
| Debug Interface | BDM (single-wire) | BDM (single-wire) | BDM (single-wire) | BDM (single-wire) | BDM (single-wire) |
主な差別化要因
- Smallest-footprint NXP S08 MCU with exposed-pad thermal management （vs MC9S08QA2CFQE)
- Integrated single-wire BDM debug without sacrificing I/O pins （vs PIC16F series (Microchip))
- Wide 1.8 V to 3.3 V supply supports direct battery operation （vs STM8S003F3 (STMicroelectronics))
設計ノート
The 8-DFN-EP package has an exposed thermal pad on the underside that MUST be soldered to a sufficiently large copper ground pour for both thermal dissipation and electrical grounding. Per the manufacturer datasheet, use at least 4 to 6 thermal vias connecting the exposed pad to inner ground planes. Without proper pad soldering, the device may overheat or exhibit unreliable reset behavior due to floating ground reference.
Place a 0.1 uF decoupling capacitor as close as possible to the VDD pin (pin 8) with a short, wide trace. For designs with noisy digital rails, add a 1 uF to 10 uF bulk capacitor near the MCU. The integrated low-voltage detect (LVD) should be configured via the system reset and status registers before relying on brown-out protection; failure to enable LVD leaves the MCU vulnerable to undefined execution at low VDD.
Do not leave the RESET pin floating - either tie it to VDD via a 10 kohm pull-up or drive it with an external supervisor. The BKGD/MS pin must also be pulled up to VDD through a recommended value resistor for normal operation; only the BDM tool drives this pin during debugging. Per the manufacturer datasheet, attempting to debug without proper BKGD pull-up may result in unexpected reset or mode entry on power-up.
コンプライアンス情報
RoHS and lead-free compliance per DigiKey product listing. AEC-Q100 not applicable for general-purpose consumer/industrial 8-bit MCU family.
