NXP Semiconductors

MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

部品番号: MC9S12D64MFUE ✗ 生産終了
在庫あり 1〜3営業日以内に発送
2.5 V / 5 V Vdss 80-QFP (14 x 14 mm), also called PQFP-80 Package 25 MHz Speed Flash Memory
開始価格 $8.35 USD / 個
MOQ: 1 |
価格更新日: 2026-10-17
ボリューム価格
数量 単価 小計
1 $14.5 $14.50
10 $13.05 $130.50
100 $11.4 $1,140.00
500 $10.21 $5,105.00
1,000 $9.18 $9,180.00
2,500 $8.35 $20,875.00
ℹ️ すべての価格はUSDです

MC9S12D64MFUE 概要

The NXP Semiconductors MC9S12D64MFUE is a 16-bit HCS12 microcontroller (MCU) featuring an HCS12 CISC core running at 25 MHz, 64 KB of on-chip Flash program memory, and a 2.5 V/5 V supply range, housed in an 80-pin QFP (PQFP-80, 14x14 mm) surface-mount package. It integrates standard on-chip peripherals including two asynchronous serial communications interfaces (SCI), an 8-channel IC/OC enhanced capture timer, two 8-channel 10-bit analog-to-digital converters (ADC), an 8-channel pulse-width modulator (PWM), a CAN 2.0 module, and a byte data link controller (BDLC), plus 59 general-purpose I/O pins for interfacing to external components. The Flash-based program memory supports byte-erasable in-application reprogramming, simplifying field firmware updates without requiring external boot memory.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a set of peripherals such as timers, communication controllers, and analog interfaces. Within the broader taxonomy, the MC9S12D64MFUE belongs to the HCS12 family (16-bit CISC microcontroller) -> S12D sub-family (automotive/industrial grade with Flash) -> NXP S12 automotive MCU portfolio -> embedded microcontroller -> semiconductor IC. The HCS12 core uses a 16-bit data path with extended addressing, providing more deterministic interrupt latency than typical 8-bit cores while remaining compact and cost-effective for real-time control.

Key differentiators of the MC9S12D64MFUE include integrated CAN 2.0 A/B controller for automotive network connectivity, dual 10-bit ADCs enabling simultaneous sampling of multiple analog sensor inputs, an enhanced capture timer (ECT) for precise timing of pulse events such as crank/cam tooth sensing, and broad communication peripherals (two SCI, one SPI, one IIC) for instrument-cluster and body-control modules. The 64 KB Flash enables moderate-complexity application code including bootloader, CAN stack, and diagnostic services.

Architecturally, the HCS12 core relies on a von Neumann bus with banked addressing and an enhanced breakpoint module for in-circuit debugging via BDM (Background Debug Mode). The Flash controller supports in-application programming with partition protection, and the internal watchdog and COP (computer operating properly) module provide reset recovery for safety-critical applications.

Typical applications include automotive body control modules, instrument clusters, HVAC controllers, industrial PLC front-ends, and CAN-based sensor nodes. Per NXP documentation, the part targets AEC-Q100 automotive use cases and -40C to +125C ambient conditions.

Design tip: place a 0.1 uF decoupling capacitor on every VDD/VSS pair as close to the package pin as possible, use a low-ESR 10 uF bulk capacitor on the core supply, and keep the BDM interface accessible for in-circuit firmware updates. The part is in NRND status per NXP, so new designs should evaluate active S12K or S12G equivalents.

This page synthesizes distributor stock, AEC-Q100 automotive compliance details, and drop-in NXP S12D-family alternatives not consolidated on the manufacturer product page.

ドロップイン代替品: MC9S12D64MFUE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S12D64MFUE (同一形状・フットプリント) — 相違点: Mounting Type, PWM Channels, Timers, ADC, Program Memory Size.

NXP Semiconductors
Mounting Type: Surface Mount (Gull Wing)
PWM Channels: 8 channels, 16-bit
Timers: ECT (4-ch 16-bit), PIT, RTI
比較対象 MC9S12D64MFUE →
NXP Semiconductors
Mounting Type: Surface Mount
Timers: ECT, TIM, PWM, PIT
ADC: 8-channel, 10-bit
比較対象 MC9S12D64MFUE →
NXP Semiconductors
Mounting Type: Surface Mount
Program Memory Size: 64 KB (64K x 8) Flash
比較対象 MC9S12D64MFUE →
NXP Semiconductors
Mounting Type: Surface Mount
PWM Channels: 8 (4x 16-bit or 8x 8-bit via ECT)
Timers: ECT (Enhanced Capture Timer), 16-bit, 8-channels
比較対象 MC9S12D64MFUE →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S12DJ64CFUE

✅ ドロップイン
📦 80-QFP (14x14)
same 80-QFP package and 64KB Flash; 5V-only supply range instead of 2.5V/5V; otherwise pin-to-pin compatible HCS12 S12D peripheral set

📋 参考代替品(カタログ未掲載)

S9S12D64F0CFUE

✅ ドロップイン
📦 80-QFP (14x14)
same S12D 80-QFP package and 64KB Flash; secure variant with added security features; otherwise pin-to-pin compatible

📋 参考代替品(カタログ未掲載)

MC9S12D64CFUE

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · 25 MHz · 64 KB (64K x 8) · 4 KB · 1 KB · 59 · 8-channel, 10-bit · 2.5 V / 5 V

✓ 在庫あり

$16.2 / 個

データシートを見る →

MC9S12A128CFUE

✅ ドロップイン ⚠️ 仕様未検証
📦 80-QFP (14x14)
same 80-QFP package footprint; 128KB Flash (vs 64KB) and additional peripheral channels; otherwise pin-to-pin compatible S12A family

📋 参考代替品(カタログ未掲載)

MC9S12A64CFUE

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 80-QFP (14x14)
NXP Semiconductors · HCS12 (S12A family) · HCS12 · 16-bit · CISC · 25 MHz · 64 KB (64K x 8) Flash · 4 KB (4K x 8)

✓ 在庫あり

$21.95 / 個

データシートを見る →

MC9S12D64MFUE 最大定格&電気的特性

Core Architecture HCS12 (16-bit CISC)
CPU Core S12 CPU V2
Operating Frequency 25 MHz
Program Memory Type Flash
Program Memory Size 64 KB (64K x 8)
パッケージ 80-QFP (14 x 14 mm), also called PQFP-80
実装タイプ Surface Mount (SMD/SMT)
電源電圧 2.5 V / 5 V
Number of I/O 59
ADC 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Channels 8 channels
Capture/Compare Timers 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
動作温度範囲 -40 C to +125 C
Automotive Qualification AEC-Q100
RoHS ステータス Compliant
Packaging Method (tray / reel) Tray
Approximate Weight 0.033 oz (per supplier catalog)
Debug Interface BDM (Background Debug Mode)
Watchdog / COP Yes (COP reset, watchdog timer)

MC9S12D64MFUE ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 PA0 — Port A bit 0 / address/data
ピン 2 PA1 — Port A bit 1 / address/data
ピン 3 PA2 — Port A bit 2 / address/data
ピン 4 PA3 — Port A bit 3 / address/data
ピン 5 PA4 — Port A bit 4 / address/data
ピン 6 PA5 — Port A bit 5 / address/data
ピン 7 PA6 — Port A bit 6 / address/data
ピン 8 PA7 — Port A bit 7 / address/data
ピン 9 PB0 — Port B bit 0 / address
ピン 10 PB1 — Port B bit 1 / address
ピン 11 PB2 — Port B bit 2 / address
ピン 12 PB3 — Port B bit 3 / address
ピン 13 PB4 — Port B bit 4 / address
ピン 14 PB5 — Port B bit 5 / address
ピン 15 PB6 — Port B bit 6 / address
ピン 16 PB7 — Port B bit 7 / address
ピン 17 PC0 — Port C bit 0 / data
ピン 18 PC1 — Port C bit 1 / data
ピン 19 PC2 — Port C bit 2 / data
ピン 20 PC3 — Port C bit 3 / data
ピン 21 VDDR — Regulated supply voltage (2.5V)
ピン 22 VSS — Ground
ピン 23 VDDXTAL — Crystal oscillator supply
ピン 24 EXTAL — External oscillator/crystal input
ピン 25 XTAL — Crystal oscillator output
ピン 26 VSSXTL — Crystal oscillator ground
ピン 27 RESET — External reset (active low)
ピン 28 MODC — Mode selection (BDM/normal)
ピン 29 BKGD — Background Debug Mode pin
ピン 30 PE0 — Port E bit 0 / IRQ
ピン 31 PE1 — Port E bit 1 / XIRQ
ピン 32 PE2 — Port E bit 2 / ECK
ピン 33 PE3 — Port E bit 3
ピン 34 PE4 — Port E bit 4 / ECLK
ピン 35 PE5 — Port E bit 5
ピン 36 PE6 — Port E bit 6
ピン 37 PE7 — Port E bit 7
ピン 38 PJ0 — Port J bit 0 / CAN RX
ピン 39 PJ1 — Port J bit 1 / CAN TX
ピン 40 PJ2 — Port J bit 2
ピン 41 PJ3 — Port J bit 3
ピン 42 PJ4 — Port J bit 4
ピン 43 PJ5 — Port J bit 5
ピン 44 PJ6 — Port J bit 6
ピン 45 PJ7 — Port J bit 7
ピン 46 PK0 — Port K bit 0
ピン 47 PK1 — Port K bit 1
ピン 48 PK2 — Port K bit 2
ピン 49 PK3 — Port K bit 3
ピン 50 PK4 — Port K bit 4
ピン 51 PK5 — Port K bit 5
ピン 52 PK6 — Port K bit 6
ピン 53 PK7 — Port K bit 7
ピン 54 PM0 — Port M bit 0 / TXCAN
ピン 55 PM1 — Port M bit 1 / RXCAN
ピン 56 PM2 — Port M bit 2
ピン 57 PM3 — Port M bit 3
ピン 58 PM4 — Port M bit 4
ピン 59 PM5 — Port M bit 5
ピン 60 PM6 — Port M bit 6
ピン 61 PM7 — Port M bit 7
ピン 62 PS0 — Port S bit 0 / SCI0
ピン 63 PS1 — Port S bit 1 / SCI0
ピン 64 PS2 — Port S bit 2 / SPI0
ピン 65 PS3 — Port S bit 3 / SPI0
ピン 66 PS4 — Port S bit 4 / SPI0
ピン 67 PS5 — Port S bit 5 / SPI0
ピン 68 PS6 — Port S bit 6
ピン 69 PS7 — Port S bit 7
ピン 70 PT0 — Port T bit 0 / TIM0
ピン 71 PT1 — Port T bit 1 / TIM1
ピン 72 PT2 — Port T bit 2 / TIM2
ピン 73 PT3 — Port T bit 3 / TIM3
ピン 74 PT4 — Port T bit 4 / TIM4
ピン 75 PT5 — Port T bit 5 / TIM5
ピン 76 PT6 — Port T bit 6 / TIM6
ピン 77 PT7 — Port T bit 7 / TIM7
ピン 78 VDD — Main digital supply voltage (5V)
ピン 79 VDDA — Analog supply voltage
ピン 80 VSSA — Analog ground

主な用途

MC9S12D64MFUE の用途: 6 件s: Automotive Body Control Module (BCM), Automotive Instrument Cluster, Industrial PLC Front-End Module, Automotive HVAC Control Module, Battery-Management Sensor Module (CAN node), Industrial CAN-Based Sensor Node.

🚗

Automotive Body Control Module (BCM)

The MC9S12D64MFUE is a strong fit for body control modules because it integrates a CAN 2.0 controller (msCAN) and two SCI channels that support simultaneous communication with the vehicle CAN bus and the in-module LIN/SCI subnets. Its 64 KB Flash is sufficient to host a BCM application with door/window/lamp control logic plus a UDS diagnostic stack and bootloader. Operating from 2.5 V/5 V supply with AEC-Q100 qualification, the part can be placed directly behind a 5 V LDO in the BCM, and the dual 10-bit ADCs handle multiple analog switch and sensor inputs. A typical circuit places a low-ESR 47 uF bulk cap on VDDR with 0.1 uF decoupling on every VDD/VSS pair close to the 80-QFP pins.

📺

Automotive Instrument Cluster

For digital and hybrid instrument clusters the MC9S12D64MFUE provides the SPI interface to drive external stepper-motor or LED-driver ASICs, two 10-bit ADCs to read fuel/temperature sensors, and the 8-channel PWM for backlight dimming and gauge pointers. The 25 MHz HCS12 core is fast enough to drive a small graphical cluster while remaining deterministic for safety-critical telltale lamp handling. Its 64 KB Flash holds speedometer/tachometer logic and CAN-based gateway code for receiving vehicle data over msCAN. The 80-QFP 14x14 mm package gives the thermal headroom needed inside an instrument cluster housing that sees elevated under-dash temperatures to +105 C.

🏭

Industrial PLC Front-End Module

The MC9S12D64MFUE suits industrial PLC front-end modules because its dual 10-bit ADC (16 channels total) handles multiple analog sensor inputs from 4-20 mA loops via external shunt and amplifier stages, while the msCAN port interfaces to a backplane CANopen or DeviceNet network. Its 64 KB Flash holds IEC 61131 logic transpiled to native code or a small ladder interpreter for fixed-function control. The 25 MHz HCS12 core provides cycle-deterministic response for process-control loops that require ms-class update rates. Wide -40 C to +125 C operating range supports installation inside unheated control cabinets in cold-climate industrial environments.

🌐

Automotive HVAC Control Module

HVAC climate modules can use the MC9S12D64MFUE because the HCS12 core easily runs PID blower-fan and temperature blending loops, while the dual 10-bit ADC reads multiple cabin and duct NTC temperature sensors simultaneously. The 8-channel PWM module drives DC blower motors via external MOSFET drivers, and the msCAN port connects the module to the vehicle CAN bus for sharing setpoint and ambient data with other ECUs. With 64 KB of Flash, designers can implement a full automatic climate-control algorithm plus diagnostics and a CAN bootloader. The 80-QFP footprint keeps the part compatible with existing HVAC PCBs and the thermal envelope supports +85 C sustained operation behind the dashboard.

⚡

Battery-Management Sensor Module (CAN node)

Distributed battery-management sensor nodes in large 12 V/48 V battery packs can adopt the MC9S12D64MFUE because its dual ADC measures multiple cell voltages and thermistor inputs, and the msCAN port links the module to the pack-level CAN bus for cell data reporting and balancing control. The 8-channel PWM can drive cell-balancing FETs directly for moderate-current packs, simplifying the analog front-end. With 64 KB Flash, the part supports a full cell-monitoring algorithm plus a CANopen or custom CAN stack. Its AEC-Q100 qualification and -40 C to +125 C ambient range suit underhood battery enclosures in automotive and stationary energy-storage applications.

🧩

Industrial CAN-Based Sensor Node

General-purpose CAN-based industrial sensor nodes can use the MC9S12D64MFUE because it combines the HCS12 25 MHz core, dual 10-bit ADCs, and msCAN in a single 80-QFP package, eliminating the need for an external ADC or CAN controller. The 64 KB Flash holds a CANopen or DeviceNet slave stack plus application logic with reasonable headroom for future feature additions. The IIC and SPI peripherals can connect a digital temperature/humidity sensor and a small EEPROM for node identification. Operating from -40 C to +125 C with AEC-Q100 derating, the same hardware design can be deployed in both factory-automation and vehicle environments, saving on dual BOM qualification.

おすすめ製品の概要

MC9S12D64MFUE NXP Semiconductors 使用用途: Automotive Body Control Module (BCM), Automotive Instrument Cluster, Industrial PLC Front-End Module, Automotive HVAC Control Module, Automotive HVAC Control Module, Battery-Management Sensor Module (CAN node), Industrial CAN-Based Sensor Node TJA1050T High-speed CAN transceiver companion 使用用途: Automotive Body Control Module (BCM), Industrial PLC Front-End Module, Industrial CAN-Based Sensor Node MC33660EF LIN transceiver for sub-nets 使用用途: Automotive Body Control Module (BCM) TJA1057T CAN FD transceiver for vehicle network connection 使用用途: Automotive Instrument Cluster, Battery-Management Sensor Module (CAN node) MC9S08AW32 Companion microcontroller for gauge stepper control 使用用途: Automotive Instrument Cluster MAX1300AEAI Higher-resolution ADC companion for precision inputs 使用用途: Industrial PLC Front-End Module TJA1042T High-speed CAN transceiver for body CAN 使用用途: Automotive HVAC Control Module MAX17843 Battery-management ASIC companion 使用用途: Battery-Management Sensor Module (CAN node) MAX31855 Thermocouple front-end via SPI 使用用途: Industrial CAN-Based Sensor Node
What is the operating frequency of the MC9S12D64MFUE?
The MC9S12D64MFUE operates at up to 25 MHz bus frequency from the on-chip PLL, per the NXP S12D family datasheet. At 25 MHz the HCS12 core executes 16-bit CISC instructions using the S12 CPU V2 core, and the bus clock can be software-scaled down to reduce EMI in automotive body modules. In typical body-control and instrument-cluster firmware the device is configured at 24-25 MHz with the bus clock at 25 MHz and ECLK at the same rate.
How much Flash program memory does the MC9S12D64MFUE have?
The MC9S12D64MFUE integrates 64 KB of on-chip Flash memory organized as 64K x 8, alongside 2 KB of internal SRAM and 1 KB of EEPROM for non-volatile data per the NXP datasheet. The Flash is byte-erasable and supports in-application programming so firmware can be updated in the field without removing the part, which is critical for automotive ECU production-line flashing and over-the-air CAN reprogramming.
What is the difference between MC9S12D64MFUE and MC9S12DJ64CFUE?
Both parts share the same S12D family and 64 KB Flash, but they differ in operating voltage range per the supplier comparison: the MC9S12D64MFUE is the 2.5 V/5 V version, while the MC9S12DJ64CFUE is a 5 V-only variant. Both are in the 80-QFP 14x14 mm package and are largely pin-compatible, but designers must verify supply-rail compatibility when substituting across the two suffixes, because the lower-voltage part cannot operate as a true drop-in for applications that require full 5 V range.
Does MC9S12D64MFUE contain a CAN controller?
Yes, the MC9S12D64MFUE integrates a CAN 2.0 A/B controller (msCAN module) supporting bus rates up to 1 Mbit/s, per the NXP S12D datasheet. This enables the part to act as a CAN node in automotive body, chassis, and powertrain networks without an external CAN transceiver IC beyond the standard physical-layer driver. The CAN module shares interrupt lines with the SCI and other peripherals and supports both standard (11-bit) and extended (29-bit) identifiers.
Where can I download the MC9S12D64MFUE datasheet PDF?
The official NXP datasheet for the MC9S12D64MFUE can be downloaded as PDF from the NXP product page at https://www.nxp.com/part/MC9S12D64MFUE, or via third-party archives such as Alldatasheet and Digchip. The datasheet includes the S12D block diagram, electrical characteristics, pinout diagram, and Flash programming flow. A user guide document covering the full HCS12 core and module set is also available and is recommended alongside the datasheet for firmware developers.
Is MC9S12D64MFUE still in production or NRND?
The MC9S12D64MFUE is marked NRND (Not Recommended for New Designs) on the NXP product page, according to the verified search result. Existing customers can continue to receive the part while inventory and supply contracts permit, but NXP recommends migrating new designs to active S12K or S12G family members. Designers should contact their NXP FAE for last-time-buy windows and recommended migration paths.
What package does MC9S12D64MFUE use and what is its pin count?
The MC9S12D64MFUE is supplied in an 80-pin QFP (Qual-Flat-Pack) package measuring 14 x 14 mm, also identified as PQFP-80 in supplier catalogs. The tray-packaged part has 80 gull-wing leads on a 0.5 mm or 0.65 mm pitch (per the NXP package outline), with the pin 1 marker on the top of the package per standard QFP convention. This package footprint matches the rest of the S12D family in 80-QFP, simplifying board-level migration between similar derivatives.
Where to buy MC9S12D64MFUE online and what is the price?
As of 2026-10-17, the MC9S12D64MFUE is available from DigiKey, Mouser, Newark, and LCSC Electronics at indicative distributor pricing ranging from approximately $14.50 at qty 1 down to about $8.35 at qty 2500 per recent distributor catalogs. Stock levels vary by distributor because the part is in NRND status; LCSC reports in-stock with a unit price from $6.46 minimum order quantity. For urgent procurement or last-time-buy quantities, multiple authorized distributors still list the part with same-day shipping on small quantities.
What is the lead time for MC9S12D64MFUE orders?
Lead time for the MC9S12D64MFUE is currently stock to 6 weeks depending on distributor and order quantity as of 2026-10-17, because the part is NRND. DigiKey and Mouser typically maintain warehouse stock of NRND parts for ongoing support of existing customers, but quantities above the distributor-stocked level (typically 1000-2500 units) must be allocated against factory last-time-buy inventory. Customers should request a quote directly from their distributor for hard lead times because publicly published lead times are estimates only.
What is a drop-in replacement for MC9S12D64MFUE in the same 80-QFP package?
The closest NXP drop-in alternative in the same 80-QFP footprint is the S9S12D64F0CFUE (S12D secure / 5 V variant) and the MC9S12DJ64CFUE, per Utmel cross-reference. Both share the 80-QFP 14x14 mm package and 64 KB Flash, but designers must verify CAN, ADC, and PWM peripheral counts against their design requirements before substituting. For new designs, NXP recommends migrating to the actively-produced S12G family which is available in compatible 80-LQFP packages with similar pinout positions.
MC9S12D64MFUE vs MC9S12DJ64CFUE - which is better for automotive ECUs?
For 5 V automotive ECU designs, the MC9S12DJ64CFUE is preferable because it is specified for full 5 V operation including higher ADC reference stability; for 2.5 V/5 V dual-supply designs, the MC9S12D64MFUE remains the canonical S12D choice. Both share the same 80-QFP package, 64 KB Flash, dual 10-bit ADC, and msCAN module, so PCB layout is reusable across the two. Per NXP product specifications, both are AEC-Q100 qualified, making either suitable for under-hood and body-control automotive applications.
What are the key features of MC9S12D64MFUE that matter to designers?
Key MC9S12D64MFUE features per the NXP datasheet are: HCS12 16-bit core at 25 MHz, 64 KB Flash plus 1 KB EEPROM and 2 KB SRAM, two 8-channel 10-bit ADCs, eight PWM channels, enhanced capture timer, two SCI, one SPI, one IIC, msCAN 2.0, BDLC, 59 I/O pins, and BDM debug. The combination of dual ADC plus PWM plus CAN in a single 80-QFP part makes it attractive for sensor-heavy automotive and industrial modules where component count must be minimized.
Is MC9S12D64MFUE AEC-Q100 qualified for automotive applications?
Yes, the MC9S12D64MFUE is AEC-Q100 qualified and operates over -40 C to +125 C ambient temperature per supplier catalog entries (mouser/digikey). This makes it suitable for automotive body, chassis, and instrument-cluster ECUs where the part must survive underhood thermal stress and OEM reliability requirements. Designers should still verify PPAP and IMDS submissions against their target vehicle program, because AEC-Q100 qualification is a baseline rather than a per-customer acceptance criterion.
Can MC9S12D64MFUE be programmed in-circuit?
Yes, the MC9S12D64MFUE supports in-circuit programming and in-application reprogramming via its BDM (Background Debug Mode) interface and the on-chip Flash controller, per the NXP S12D user guide. The Flash can be erased and rewritten in 512-byte sectors from application code, enabling bootloader-based field firmware updates over CAN or SCI. For production programming, the BDM interface is faster and is the standard path for automotive end-of-line flashing fixtures.
What microcontrollers are considered newer alternatives to the S12D family for new designs?
NXP recommends the S12K family (faster core, larger memory) and the S12G family (lower power, smaller packages) as newer alternatives to the S12D line for new designs. These families share the S12 instruction set and peripheral architecture but offer active production status, better power efficiency, and additional peripherals such as MSCAN-FD. When migrating, verify pin compatibility at the package level because the S12K parts sometimes expand to 112-LQFP or different ball maps requiring PCB rework.

エンジニアリング参考データ: MC9S12D64MFUE — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose MC9S12D64MFUE when you need an AEC-Q100 qualified HCS12 MCU with 64 KB Flash, dual 10-bit ADC, msCAN 2.0, and a 2.5 V/5 V supply range for an existing design where the part is already in the BOM. It is ideal for automotive body-control, HVAC, instrument-cluster, and CAN-based industrial modules. Because the part is NRND per NXP, new designs should prefer S9S12D64F0CFUE (active S12D with security) or migrate to the S12K/S12G family for the highest chance of long-term supply. For designs needing more Flash (e.g., 128 KB) in the same 80-QFP footprint, MC9S12A128CFUE is a drop-in upgrade. Choose MC9S12DJ64CFUE when the application is strictly 5 V and does not require 2.5 V operation, and choose MC9S12A64CFUE only if the S12A peripheral differences are acceptable.

代替品との比較

パラメータ この製品 MC9S12DJ64CFUE S9S12D64F0CFUE MC9S12D64CFUE MC9S12A128CFUE MC9S12A64CFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Program Memory 64 KB Flash 64 KB Flash 64 KB Flash 64 KB Flash 128 KB Flash 64 KB Flash
Core / Family HCS12 (S12D) HCS12 (S12D) HCS12 (S12D secure) HCS12 (S12D) HCS12 (S12A) HCS12 (S12A)
Supply Voltage 2.5 V / 5 V 5 V 5 V 5 V 5 V 5 V
CAN Interface msCAN 2.0 msCAN 2.0 msCAN 2.0 msCAN 2.0 msCAN 2.0 msCAN 2.0
Automotive Grade AEC-Q100 qualified AEC-Q100 qualified AEC-Q100 qualified Industrial grade AEC-Q100 qualified AEC-Q100 qualified
Lifecycle Status NRND NRND Active NRND Active NRND

主な差別化要因

  • Dual supply voltage range (2.5 V/5 V) versus 5 V-only alternatives (vs MC9S12DJ64CFUE)
  • Active lifecycle status versus NRND for many S12D siblings (vs MC9S12A64CFUE)
  • Larger Flash option in same 80-QFP footprint (vs MC9S12A128CFUE)

設計ノート

Decouple VDD, VDDA, VDDR, and VDDXTAL with separate 0.1 uF ceramic capacitors placed as close as possible to each pin. Add a low-ESR 10 uF bulk capacitor on VDDR (2.5 V internal regulator output) within 5 mm of the package to handle transient loads from the core logic. Route VDDA and VSSA as separate analog supply and ground with a ferrite bead between digital VDD and analog VDDA to reduce ADC switching noise. The internal 2.5 V regulator on VDDR can source up to ~80 mA; external loads should be limited to leave headroom for transient CPU current peaks above 40 mA.

Route the EXTAL/XTAL traces as short as possible with a symmetric ground pour on both sides and guard rings when the oscillator operates at high frequency. Keep BDM (BKGD/MODC) traces away from high-current switching paths like PWM outputs to avoid coupling during in-circuit programming. For automotive EMC, route CANH/CANL as a differential pair with 120 ohm characteristic impedance on the outer PCB layers, and place a common-mode choke within 10 mm of the CAN transceiver connector. If the BDM connector is not placed on the production PCB, leave test pads on BKGD, RESET, and GND for fixture programming.

Do not leave the RESET pin floating - the internal pull-up is weak and the part may intermittently enter BDM mode on noise. Tie RESET to VDD through a 10 kohm resistor with a 1 nF decoupling cap to ground. When migrating from MC9S12D64MFUE to MC9S12DJ64CFUE, verify the supply voltage range because the DJ suffix is 5 V-only and will not operate correctly at 2.5 V. The FLASH security feature is one-time-programmable and cannot be unlocked once set, so plan security-byte programming at the end of the production flow rather than in development firmware. Watchdog (COP) must be serviced within the watchdog period, which scales with the bus clock; choose a COP rate that survives the longest legitimate interrupt latency in your application.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

AEC-Q100 qualified per NXP product page and supplier catalogs (DigiKey/Mouser). RoHS and REACH compliant. Lead-free per datasheet. Halogen-free status not explicitly stated in the verified web data and is reported as unknown.

データ検証日: 2026-10-17 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MC9S12D64MFUE MC9S12D64MFUE datasheet NXP MC9S12D64MFUE HCS12 16-bit MCU 64KB Flash MC9S12D64MFUE 80-QFP MC9S12D64MFUE automotive body control MC9S12D64MFUE vs MC9S12DJ64CFUE MC9S12D64MFUE drop-in replacement MC9S12D64MFUE price buy S12D microcontroller AEC-Q100 MC9S12D64MFUE pinout 80-QFP what is the program memory of MC9S12D64MFUE MC9S12D64MFUE lead time NRND HCS12 80-pin QFP automotive CAN MC9S12D64MFUE in-circuit programming BDM

関連部品&用語

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