MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP
部品番号: MC9S12DJ64MFUE ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.95 | $159.50 |
| 100 | $12.4 | $1,240.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.2 | $8,200.00 |
MC9S12DJ64MFUE 概要
A microcontroller (MCU) in this category is a self-contained computing subsystem integrating a CPU core, program and data memory, peripherals, and I/O on a single silicon die. HCS12 belongs to the 16-bit CISC microcontroller family; it descends from the HC11 line and sits between 8-bit MCUs (such as the Freescale HC08) and higher-end 32-bit microcontrollers (such as Cortex-M or Power Architecture). The MC9S12D series specifically targets distributed body and chassis automotive networks requiring both deterministic CAN communication and real-time control.
Key features include 25 MHz bus speed at 5 V operation, two msCAN 2.0 A/B controllers, SCI, SPI, up to two 8-bit PWM channels plus a 16-bit pulse accumulator, an 8-channel 10-bit ADC with 7 µs conversion time, and an on-chip 1.0 V bandgap reference. The 80-QFP package offers generous I/O while remaining compatible with mid-density PCB assemblies. The HCS12 core is also fully upward-object-code compatible with the HC12 instruction set, allowing reuse of legacy firmware.
The architecture combines a 16-bit register-rich CISC CPU with a 25 ns minimum instruction cycle at 25 MHz. The internal PLL can synthesise higher bus rates from the standard 4 MHz external crystal, supporting accelerated peripheral operation. Two msCAN modules enable isolated high-speed CAN channels for powertrain and body domains, while the ADC's 8 channels support simultaneous analog sensing with hardware trigger from timers.
Typical applications include automotive body controllers (BCM), HVAC control panels, instrument clusters, industrial CAN nodes, OBD-II diagnostic interfaces, and seat/door/window modules. The dual-CAN architecture is also well-suited to vehicle gateway functions bridging powertrain and body networks.
When designing with this MCU, pay attention to the 5 V I/O voltage tolerance, place the 4 MHz crystal within 5 mm of the EXTAL/XTAL pins with short symmetrical traces, and add bulk decoupling at AVDD/VDDR. NRND status should be planned against: confirm ongoing last-time-buy windows with NXP via authorized distributors and pre-qualify a successor.
This page consolidates distributor pricing, life-cycle status, and drop-in alternatives not found in the manufacturer datasheet, giving engineers the actionable context needed for sourcing and migration decisions.
ドロップイン代替品: MC9S12DJ64MFUE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S12DJ64MFUE （同一形状・フットプリント） — 相違点: ADC, Package, PWM Channels, Supply Voltage, Debug Interface.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S12DJ128MFUE
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$10.75 / 個
データシートを見る →MC9S12A64MFUE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12D64MFUE
✅ ドロップイン✓ 在庫あり
$8.35 / 個
データシートを見る →MC9S12DG128MFUE
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$10.5 / 個
データシートを見る →MC9S12DP512MFUE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MC9S12DJ64MFUE 最大定格＆電気的特性
| Core Architecture | HCS12 (CISC, 16-bit) |
| CPU Frequency | 25 MHz |
| Program Memory | 64 KB Flash (64K x 8) |
| RAM Size | 4 KB |
| EEPROM Size | 1 KB |
| CAN Modules | 2x msCAN 2.0 A/B |
| SCI / SPI | 2x SCI, 1x SPI |
| ADC | 8-channel, 10-bit |
| Timers | ECT (Enhanced Capture Timer), 16-bit, 8-channels |
| PWM Channels | 8 (4x 16-bit or 8x 8-bit via ECT) |
| 動作温度 | -40C to +125C |
| Package Type | 80-QFP (14x14 mm) |
| 実装タイプ | Surface Mount |
| Debug Interface | Background Debug Mode (BDM), single-wire |
| RoHS ステータス | Compliant |
MC9S12DJ64MFUE 80-qfp (14x14 mm) ピン配置ガイド
MC9S12DJ64MFUE (80-qfp (14x14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MC9S12DJ64MFUE.
詳細は データシート をご参照ください。
主な用途
MC9S12DJ64MFUE の用途: 6 件s: Automotive Body Control Module (BCM), HVAC Control Panel and Climate Module, Instrument Cluster Controller, Industrial CAN Node / Field I/O, Seat, Door, and Window Module, OBD-II Diagnostic Interface / Scan Tool.
Automotive Body Control Module (BCM)
The MC9S12DJ64MFUE is well matched to body control modules because its two msCAN 2.0 A/B controllers operate concurrently at up to 1 Mbaud, allowing the part to bridge a high-speed powertrain CAN and a body-domain CAN off one MCU. The 64 KB Flash holds boot plus application plus diagnostic layers for seat/door/lighting controllers, while the 1 KB byte-erasable EEPROM supports last-state storage for trunk/door/window defaults across battery disconnect. The HCS12 core at 25 MHz executes CAN message filtering and the PWM routines for load drivers within tight task budgets, and AEC-Q100 plus -40C to +125C operation makes the part automotive-grade. Use NXP's BDM interface for in-circuit calibration on the assembly line. Trade-off: 64 KB Flash caps complex BLDC/PMSM control loops; consider the MC9S12DP512MFUE (512 KB) for vision or gateway duties.
おすすめ
HVAC Control Panel and Climate Module
Climate modules depend on accurate analog sensing plus PWM-driven blower motors, both of which the MC9S12DJ64MFUE delivers in one device. The 8-channel 10-bit ADC reads cabin temperature, outside temperature, humidity transducer, and blower current sense with 7 microsecond conversions, while the Enhanced Capture Timer supports up to 8 PWM channels (4x 16-bit or 8x 8-bit) to drive MOSFET bridges for the blower and mode doors. HCS12 CISC instructions handle bit-bang 7-segment display multiplexing and keypad scans at low cycle cost. The 5 V I/O of this part interoperates with mainstream automotive sensor signal conditioning. Designers should consider the 112-LQFP MC9S12A64CPVE variant in next-generation designs if more PWM channels are required.
おすすめ
Instrument Cluster Controller
Instrument clusters require deterministic CAN reception plus fast I/O for stepper motors or analog gauges, both natively supported by the MC9S12DJ64MFUE. The 25 MHz HCS12 core services msCAN mailbox interrupts to update telltale LEDs, fuel-level ADC, and odometer increments, while the SCI/SPI ports can talk to a companion graphics driver. Automotive-grade -40C to +125C operation is mandatory for under-dash temperature swings. The on-chip bandgap reference stabilizes ADC readings over the full supply range, important for accurate fuel and temperature gauges. For larger cluster displays, designers should evaluate the MC9S12DJ128MFUE variant for additional code headroom.
おすすめ
Industrial CAN Node / Field I/O
Outside the vehicle, the MC9S12DJ64MFUE serves as a robust industrial sensor and actuator node on factory CANopen or DeviceNet-style buses. Dual msCAN controllers support isolated sub-bus processing for mixed-traffic protocols, while the 10-bit ADC reads 4-20 mA current loops via external sense resistors. The HCS12 core's deterministic interrupt response aids deterministic closed-loop control, and 5 V I/O tolerance matches industrial 24 V-referenced sensors via standard isolators. AEC-Q100 qualification provides extra reassurance in industrial settings with wide temperature swings. Engineers needing deterministic Ethernet connectivity should migrate to the NXP S12K family or to Kinetis parts.
おすすめ
Seat, Door, and Window Module
Body-domain seat/door/window modules rely on multiple LIN or CAN channel inputs plus PWM-driven motor control, exactly the role of the MC9S12DJ64MFUE. The HCS12 core plus ECT timers deliver 8 PWM outputs for window lifters, mirror adjuster, and door-latch drivers, while the msCAN channels link to the BCM and powertrain networks for cross-domain messaging. 1 KB of byte-erasable EEPROM stores seat memory positions and anti-pinch calibration parameters across battery disconnects. The 80-QFP package exposes enough GPIO for hall-sensor feedback plus keypad row/column. Trade-off: the 64 KB Flash fills quickly in seat modules with comfort logic, so designers should budget for the MC9S12DJ128MFUE migration.
おすすめ
OBD-II Diagnostic Interface / Scan Tool
The MC9S12DJ64MFUE is a proven choice for OBD-II scan tools and diagnostic gateways because its dual msCAN ports enable simultaneous high-speed and low-speed CAN parameter access. The HCS12's BDM interface simplifies factory flash-load programming for differentiated country variant firmware. 64 KB Flash holds SAE J1979 PID plus manufacturer-specific PIDs, while the 1 KB EEPROM stores diagnostic trouble codes per ISO 15031. The 10-bit ADC and SCI ports allow integration of voltage probes and serial interface for development tooling. For ISO 14230 (KWP2000) legacy support, designers may layer the protocol on msCAN; if vehicle Ethernet is required in newer diagnostic bridges, migrate to the NXP S32K family.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S12DJ64MFUE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S12DJ128MFUE | MC9S12A64MFUE | MC9S12D64MFUE | MC9S12DG128MFUE | MC9S12DP512MFUE |
|---|---|---|---|---|---|---|
| Package | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB (same) | 64 KB (same) | 128 KB (+100%) | 512 KB (+700%) |
| CAN Modules | 2x msCAN 2.0 A/B | 2x msCAN 2.0 A/B | 1x msCAN 2.0 A/B (-50%) | 0x msCAN (-100%, none) | 2x msCAN 2.0 A/B | 5x msCAN 2.0 A/B (+150%) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Dual msCAN 2.0 A/B controllers （vs MC9S12D64MFUE)
- Identical 64 KB Flash with upgraded peripherals （vs MC9S12A64MFUE)
- Aggressive pin-for-pin upgrade path to 128 KB and 512 KB （vs MC9S12DJ128MFUE and MC9S12DP512MFUE)
設計ノート
Estimated: at 25 MHz CPU clock and all peripherals active, the MC9S12DJ64MFUE draws approximately 50-60 mA from the 5 V supply. Use a 1 µF ceramic bypass cap directly on every VDD/VDDR pin and a 47 µF tantalum or 100 µF aluminum bulk cap on the main 5 V rail. The internal 2.5 V regulator supplying the core requires a 4.7 µF low-ESR ceramic on the VDDC pin within 5 mm of the package; otherwise the core sees undervoltage during high-speed PLL bursts and may reset unpredictably.
The 4 MHz external crystal (or resonator) must be placed within 5 mm of the EXTAL/XTAL pins with short, symmetrical traces and a grounded guard ring around each. The BDM pin (BKGD) is sensitive to capacitive loading above 50 pF and should be guarded with a series resistor near the pin when long debug cable leads are used, since long cables exceeding 30 cm can introduce signal integrity issues at programming time. Place ADC analog power (VDDA) tracks with a star topology or ferrite filter from the digital 5 V rail to reduce switching noise on the analog reference voltage.
Do not assume the NRND status equates to immediate obsolescence: confirm with NXP or your authorized distributor the exact last-time-buy date before declaring the part EOL. The 1 KB byte-erasable EEPROM has a 100 K endurance rating per the family spec, so it should be used only for infrequently updated non-volatile parameters (seat memory, calibration values) - rapid cyclic data belongs in RAM/Flash-emulation region. The msCAN module requires configured bit timing per the crystal clock; running CAN before BDM-style tuning can lock up the bus controller.
The 80-QFP package has a theta-JA of approximately 50 C/W on a standard 2s2p 1-oz FR4 board. Estimated: at -40C ambient minimum, internal heating is negligible; at +125C ambient for under-hood applications, designers should aim to keep total power dissipation below 0.5 W or attach a small heat spreader. Automotive under-dash modules rarely exceed 0.2 W on this part in real-world conditions.
コンプライアンス情報
NRND lifecycle status applies. AEC-Q100 qualified per NXP MC9S12D family documentation; RoHS and REACH compliant. Halogen-free per package datasheet marking convention.