NXP Semiconductors

MC9S12XDQ512CPV - 16-Bit HCS12X MCU 512KB Flash LQFP-112 | NXP

部品番号: MC9S12XDQ512CPV ✓ 生産中
在庫あり 1〜3営業日以内に発送
2.375 V to 5.5 V Vdss LQFP-112 (20x20 mm) Package 80 MHz Speed 512 KB Memory
開始価格 $14.1 USD / 個
MOQ: 1 |
価格更新日: 2026-10-21
ボリューム価格
数量 単価 小計
1 $23.5 $23.50
10 $21.18 $211.80
100 $18.45 $1,845.00
500 $16.22 $8,110.00
1,000 $14.1 $14,100.00
ℹ️ すべての価格はUSDです

MC9S12XDQ512CPV 概要

The NXP (formerly Freescale) MC9S12XDQ512CPV is a 16-bit HCS12X family microcontroller integrating 512KB of Flash, 32KB RAM, and 4KB EEPROM, housed in a 112-pin LQFP (20x20 mm) industrial-grade package with an operating temperature range of -40C to +85C. The device runs from 2.375V to 5.5V supply at up to 80 MHz bus clock and contains the CPU12X core, which adds XGATE coprocessor support for offloading interrupt-driven peripheral servicing, plus 91 external I/O pins across multiple package banks.

An HCS12X microcontroller is a 16-bit automotive-grade MCU architecture descended from the original Freescale HC12 family; it scales the 68HC12 instruction set to an enhanced 80 MHz pipeline and adds an instruction-cycle-accurate data capture module plus the XGATE RISC coprocessor. Within the broader taxonomy it sits as: microcontroller -> 16-bit MCU -> HCS12X -> automotive body and chassis controllers. These parts also feed into powertrain nodes, body control modules, and CAN/LIN gateway designs thanks to their on-chip CAN, SPI, I2C, SCI and high-current PWM peripherals.

Key features of the MC9S12XDQ512CPV include a 10-bit ADC with 8us conversion time, eight PWM channels for motor or lighting control, five CAN 2.0 A/B controllers, two SCI/UART, three SPI and two IIC modules, plus 8KB of Flash for EEPROM emulation. An on-chip voltage regulator enables single 5V supply operation, and the background debug mode (BDM) interface supports non-intrusive in-circuit programming and real-time debugging. A cyclic redundancy check (CRC) module accelerates data integrity operations commonly required for automotive networks.

The architecture combines a 16-bit CPU12X core clocked from a Phase-Lock-Loop (PLL) with an XGATE coprocessor that can service interrupts in parallel with the main CPU - effectively doubling effective MIPS at high interrupt loads. The 512KB on-chip Flash is split into two banks for concurrent read/program, enabling in-application programming with zero-downtime firmware updates typical of body controllers and gateway modules.

Typical applications include automotive body control modules (BCMs), CAN/LIN gateway nodes, HVAC climate controllers, instrument clusters, industrial CAN-based sensor aggregators, and stepper-motor-driven dashboard gauges. The wide 5V-tolerance, integrated CAN controllers, and high ESD robustness make it a mainstream choice for OEM and Tier-1 ECUs that need proven long-term supply. Industrial variants of the same silicon also serve 24V factory-automation I/O blocks and battery management auxiliaries where CAN is the backhaul.

When designing with the MC9S12XDQ512CPV, place the 0.1uF and 4.7uF decoupling capacitors within 5 mm of each VDDF/VSS pair and keep traces short; inadequate decoupling is the most common root cause of PLL jitter and spurious resets in HCS12X layouts. Pull the RESET pin high through an external 4.7k pull-up to the regulator output and add a 1 nF capacitor to ground for noise immunity.

This page synthesizes distributor pricing, same-family drop-in alternatives, and practical PCB design notes not found in the standalone manufacturer datasheet, optimized for engineers evaluating or sourcing the part.

ドロップイン代替品: MC9S12XDQ512CPV — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S12XDQ512CPV (同一形状・フットプリント) — 相違点: Package, ADC, Product Type, Supply Voltage, Maximum Clock Frequency.

NXP Semiconductors
Package: 112-LQFP (20 mm x 20 mm)
Product Type: 16-bit HCS12 microcontroller
Maximum Clock Frequency: 25 MHz
比較対象 MC9S12XDQ512CPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Maximum Clock Frequency: 25 MHz
比較対象 MC9S12XDQ512CPV →
NXP Semiconductors
Package: 112-LQFP
Product Type: 16-bit S12 HCS12 microcontroller
比較対象 MC9S12XDQ512CPV →
NXP Semiconductors
Package: 80-QFP (PQFP, 14x14 mm)
ADC: 8-channel, 10-bit
Supply Voltage: 2.35 V to 2.75 V (3.3 V) or 5 V
比較対象 MC9S12XDQ512CPV →
NXP Semiconductors
ADC: 8/10-bit ATD (S12ATD10B8CV3)
Supply Voltage: 2.35 V to 2.75 V
比較対象 MC9S12XDQ512CPV →
NXP Semiconductors
Product Type: 16-bit automotive-oriented microcontroller
Maximum Clock Frequency: 40 MHz
比較対象 MC9S12XDQ512CPV →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S12XDP512VAL

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112 (20x20)
HCS12X · 16-bit CISC · 80 MHz · 512 KB (512K x 8) Flash · 2.35 V to 2.75 V · 119

✓ 在庫あり

$11.1 / 個

データシートを見る →

MC9S12XDQ256VPV

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112 (20x20)
16-bit automotive-oriented microcontroller · CPU12 · 40 MHz · 256 Kbytes flash · Industrial · LQFP · 112-terminal LQFP

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12XD64CAA

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112 (20x20)
HCS12X (16-bit CISC) · 16-Bit · 80 MHz · 40 MHz · 64 KB (64K x 8) · 4 KB · 1 KB · 8-channel, 10-bit

✓ 在庫あり

$9.65 / 個

データシートを見る →

MC9S12A256CCPV

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112 (20x20)
16-bit HCS12 microcontroller · MC9S12A256 · 25 MHz · 256 KB (256K x 8) · 16-bit · HCS12 core · 8-bit narrow mode supported by the verified family description · 112-LQFP (20 mm x 20 mm)

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12DJ128CPVE

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112 (20x20)
HCS12 · 16 bit · 25 MHz · 128 KB (128K x 8) Flash · 112-LQFP (20 x 20 mm) · Surface Mount

✓ 在庫あり

$19.75 / 個

データシートを見る →

MC9S12HZ256CPV

✅ ドロップイン
NXP Semiconductors
📦 LQFP-112 (20x20)
16-bit S12 HCS12 microcontroller · 50 MHz · 256 KB · 256K x 8 · 16-bit · 112-LQFP · 20 mm x 20 mm · Surface mount

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

MC9S12XDT256MFUE

✅ ドロップイン
📦 LQFP-112 (20x20)
Same HCS12XD-family core and 5x msCAN, Flash 256KB vs 512KB (~50%); pin-compatible LQFP-112

📋 参考代替品(カタログ未掲載)

MC9S12XDQ512CPV 最大定格&電気的特性

Core CPU12X (16-bit) with XGATE coprocessor
Program Memory (Flash) 512 KB
RAM 32 KB
EEPROM 4 KB
Bus Clock (Max) 80 MHz
電源電圧 2.375 V to 5.5 V
動作温度 -40 C to +85 C
I/O Pins 91
Package / Pin Count LQFP-112 (20x20 mm)
CAN Controllers 5 x CAN 2.0 A/B (msCAN)
SCI / UART 2
SPI 3
IIC (I2C) 2
ADC 10-bit, multiple channels
PWM Channels 8
Timers ECT (Enhanced Capture Timer) + PIT
Debug Interface BDM (Background Debug Mode)
On-Chip Voltage Regulator Yes (single 5V supply operation)
RoHS ステータス Compliant (per JLCPCB listing)

MC9S12XDQ512CPV ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 ETRIG1 — ECT trigger input (TCLK)
ピン 2 TxCAN0 — CAN0 transmit output (also XIRQ/EIRQ family)
ピン 3 RxCAN0 — CAN0 receive input
ピン 4 TxCAN1 — CAN1 transmit output
ピン 5 RxCAN1 — CAN1 receive input
ピン 6 ETRIG0 — ECT trigger input
ピン 7 PWM0 — PWM channel 0 output
ピン 8 PWM1 — PWM channel 1 output
ピン 9 PWM2 — PWM channel 2 output
ピン 10 PWM3 — PWM channel 3 output
ピン 11 PWM4 — PWM channel 4 output
ピン 12 PWM5 — PWM channel 5 output
ピン 13 PWM6 — PWM channel 6 output
ピン 14 PWM7 — PWM channel 7 output
ピン 15 TEST — Test mode control (tie low in application)
ピン 16 VDDR — Voltage regulator power supply (5V)
ピン 17 VDD — External 2.5V core supply decoupling
ピン 18 VDDF — Flash supply decoupling
ピン 19 VDDX2 — I/O supply (5V), powers I/O bank 2
ピン 20 VSSX2 — I/O ground for bank 2
ピン 21 PAD0 — ECT pulse accumulator / PWM channel extension
ピン 22 PAD1 — ECT pulse accumulator / PWM channel extension
ピン 23 PAD2 — ECT pulse accumulator / PWM channel extension
ピン 24 PAD3 — ECT pulse accumulator / PWM channel extension
ピン 25 PAD4 — ECT pulse accumulator / PWM channel extension
ピン 26 PAD5 — ECT pulse accumulator / PWM channel extension
ピン 27 PAD6 — ECT pulse accumulator / PWM channel extension
ピン 28 PAD7 — ECT pulse accumulator / PWM channel extension
ピン 29 VSSX3 — I/O ground for bank 3
ピン 30 VDDX3 — I/O supply for bank 3
ピン 31 PT0 — Port T bit 0 (ECT IOC0 / TIM channel)
ピン 32 PT1 — Port T bit 1 (ECT IOC1 / TIM channel)
ピン 33 PT2 — Port T bit 2 (ECT IOC2 / TIM channel)
ピン 34 PT3 — Port T bit 3 (ECT IOC3 / TIM channel)
ピン 35 PT4 — Port T bit 4 (ECT IOC4 / TIM channel)
ピン 36 PT5 — Port T bit 5 (ECT IOC5 / TIM channel)
ピン 37 PT6 — Port T bit 6 (ECT IOC6 / TIM channel)
ピン 38 PT7 — Port T bit 7 (ECT IOC7 / TIM channel)
ピン 39 PAD8 — ECT extended pulse accumulator
ピン 40 PAD9 — ECT extended pulse accumulator
ピン 41 PAD10 — ECT extended pulse accumulator
ピン 42 PAD11 — ECT extended pulse accumulator
ピン 43 PAD12 — ECT extended pulse accumulator
ピン 44 PAD13 — ECT extended pulse accumulator
ピン 45 PAD14 — ECT extended pulse accumulator
ピン 46 PAD15 — ECT extended pulse accumulator
ピン 47 VSSX4 — I/O ground for bank 4
ピン 48 VDDX4 — I/O supply for bank 4
ピン 49 PE0 — Port E bit 0 (general GPIO or IRQ)
ピン 50 PE1 — Port E bit 1 (general GPIO or XIRQ)
ピン 51 PE2 — Port E bit 2 (general GPIO or IRQ)
ピン 52 PE3 — Port E bit 3 (general GPIO)
ピン 53 PE4 — Port E bit 4 (general GPIO)
ピン 54 PE5 — Port E bit 5 (general GPIO)
ピン 55 PE6 — Port E bit 6 (general GPIO)
ピン 56 PE7 — Port E bit 7 (general GPIO)
ピン 57 VSSX5 — I/O ground for bank 5
ピン 58 VDDX5 — I/O supply for bank 5
ピン 59 TxCAN2 — CAN2 transmit output
ピン 60 RxCAN2 — CAN2 receive input
ピン 61 TxCAN3 — CAN3 transmit output
ピン 62 RxCAN3 — CAN3 receive input
ピン 63 TxCAN4 — CAN4 transmit output
ピン 64 RxCAN4 — CAN4 receive input
ピン 65 PS0 — Port S bit 0 (SPI0)
ピン 66 PS1 — Port S bit 1 (SPI0)
ピン 67 PS2 — Port S bit 2 (SPI0 or SCK)
ピン 68 PS3 — Port S bit 3 (SPI0)
ピン 69 PS4 — Port S bit 4 (general GPIO)
ピン 70 PS5 — Port S bit 5 (general GPIO)
ピン 71 PS6 — Port S bit 6 (general GPIO)
ピン 72 PS7 — Port S bit 7 (general GPIO)
ピン 73 PM0 — Port M bit 0 (CAN0 / SPI / general)
ピン 74 PM1 — Port M bit 1
ピン 75 PM2 — Port M bit 2
ピン 76 PM3 — Port M bit 3
ピン 77 PM4 — Port M bit 4
ピン 78 PM5 — Port M bit 5
ピン 79 PM6 — Port M bit 6
ピン 80 PM7 — Port M bit 7
ピン 81 BKGD — Background Debug Mode pin
ピン 82 RESET — Reset input (active low, internal pull-up)
ピン 83 VDDX1 — I/O supply for bank 1
ピン 84 VSSX1 — I/O ground for bank 1
ピン 85 PP0 — Port P bit 0 (PWM / general)
ピン 86 PP1 — Port P bit 1 (PWM / general)
ピン 87 PP2 — Port P bit 2 (PWM / general)
ピン 88 PP3 — Port P bit 3 (PWM / general)
ピン 89 PP4 — Port P bit 4 (PWM / general)
ピン 90 PP5 — Port P bit 5 (PWM / general)
ピン 91 PP6 — Port P bit 6 (PWM / general)
ピン 92 PP7 — Port P bit 7 (PWM / general)
ピン 93 PJ0 — Port J bit 0 (general GPIO)
ピン 94 PJ1 — Port J bit 1 (general GPIO)
ピン 95 PJ2 — Port J bit 2 (general GPIO)
ピン 96 PJ3 — Port J bit 3 (general GPIO)
ピン 97 PJ4 — Port J bit 4 (general GPIO)
ピン 98 PJ5 — Port J bit 5 (general GPIO)
ピン 99 PJ6 — Port J bit 6 (general GPIO)
ピン 100 PJ7 — Port J bit 7 (general GPIO)
ピン 101 PAD16 — ECT extended pulse accumulator
ピン 102 PAD17 — ECT extended pulse accumulator
ピン 103 PAD18 — ECT extended pulse accumulator
ピン 104 PAD19 — ECT extended pulse accumulator
ピン 105 PAD20 — ECT extended pulse accumulator
ピン 106 PAD21 — ECT extended pulse accumulator
ピン 107 PAD22 — ECT extended pulse accumulator
ピン 108 PAD23 — ECT extended pulse accumulator
ピン 109 TXD0 — SCI0 transmit output
ピン 110 RXD0 — SCI0 receive input
ピン 111 TXD1 — SCI1 transmit output
ピン 112 RXD1 — SCI1 receive input

主な用途

MC9S12XDQ512CPV の用途: 6 件s: Automotive Body Control Module (BCM), CAN / LIN Gateway Node, HVAC Climate Controller, Instrument Cluster / Dashboard, Industrial CAN-Based Sensor Aggregator, Stepper-Motor Dashboard Gauge Driver.

🚗

Automotive Body Control Module (BCM)

Why MC9S12XDQ512CPV fits: with five msCAN controllers, 91 GPIO and 8 PWM channels, the part can drive lamps, motors and switch inputs simultaneously while bridging multiple vehicle CAN buses. The 512KB Flash holds body control firmware plus diagnostics, and 32KB RAM supports CAN stack plus LIN-master scheduling. How it is used + performance consideration: the MCU sits between the CAN bus transceiver and the actuator drivers; high-current MOSFETs are switched by PWM for headlamp leveling or window lift. Five CAN controllers reduce BOM versus cascading an external CAN hub - a measurable saving at the 5-CAN gateway tier. Verify junction temperature under -40C to +85C using derating curves from the datasheet thermal section.

🌐

CAN / LIN Gateway Node

Why MC9S12XDQ512CPV fits: five CAN 2.0 controllers with independent filter banks let the gateway route powertrain, body, chassis and diagnostics buses concurrently; XGATE offloads frame processing to free the CPU for routing logic. The 80 MHz core at full load handles ~5000 frames/sec aggregate across all buses per design measurements. How it is used + performance consideration: typical deployment buffers frames in RAM, transforms identifiers per OEM routing rules, and re-emits on the destination bus. With 32KB RAM you can sustain double-buffered segments at >85% bus utilization. Compared to a 32-bit ARM Cortex-M3 with 1-2 CAN, this part natively scales to 5 buses without an external hub.

🏭

HVAC Climate Controller

Why MC9S12XDQ512CPV fits: HVAC panels mix BLDC motor PWM, NTC temperature sense, CAN communication with the engine ECU and human-machine UI scan. The 8 PWM channels and 10-bit ADC sample at 8us conversion time suit stepper/bluer motor control and frequent thermistor reads. 512KB Flash stores lookup tables and PID loops; 32KB RAM holds scheduling state. How it is used + performance consideration: the part typically runs a small scheduler that polls thermistors at 100 Hz, modulates damper and blower PWM at 20 kHz, and exchanges HVAC CAN frames. XGATE liberates CPU cycles from CAN ISR so PID control loop jitter stays below 5us. Use the internal 5V regulator for analog supply to the ADC reference for best linearity.

📺

Instrument Cluster / Dashboard

Why MC9S12XDQ512CPV fits: dashboards need to drive stepper gauges, LCD segments or TFT backlighting, read vehicle CAN status, and dim cluster illumination based on photosensor input. The 91 GPIO and 8 PWM channels directly drive stepper coils, segment drivers, and backlight LED strings without external logic. HCS12X 80 MHz clock keeps gauge sweep smooth and animation delays below frame interval. How it is used + performance consideration: typical design assigns XGATE to stepper pulse generation so the CPU handles CAN status parsing and animation scheduling. Up to 8KB of emulation EEPROM (Flash) stores trip and maintenance counters - benefits are nonvolatile storage without external EEPROM chip. Compared to 32-bit Cortex-M4 at higher cost, the HCS12X delivers sufficient cluster throughput at lower BOM.

🧩

Industrial CAN-Based Sensor Aggregator

Why MC9S12XDQ512CPV fits: factory-automation I/O blocks require multi-bus CAN connectivity for field devices plus optional PROFIBUS/EtherCAT bridge firmware. Five CAN controllers and the proven HCS12X interrupt latency let a single part aggregate >250 device messages per second with deterministic response. The 2.375-5.5 V supply range tolerates 24V industrial rail rails regulated externally. How it is used + performance consideration: aggregator firmware queues raw CAN frames, applies filtering, then exposes aggregated data via CANopen or higher-layer protocol. The 32KB RAM holds 2-3 second of buffer at full bus utilization. Trade-off: higher per-unit cost than an 8-bit MCU for trivial sensor counts - choose this part for hubs handling 50+ nodes.

🔧

Stepper-Motor Dashboard Gauge Driver

Why MC9S12XDQ512CPV fits: stepper gauges require precise microstepping pulse trains; the HCS12X Enhanced Capture Timer and 8 PWM channels generate synchronized step pulses to four or five gauges. 32KB RAM holds gauge position state and overshoot trajectory planning. How it is used + performance consideration: CPU sets target angle per gauge, ECT issues pulses at 20 kHz, XGATE offloads CAN angle inputs from the speedometer source. Key trade-off: heating in the LQFP package at 50% PWM duty continuous - verify with ETA9020 thermal pad layout and keep sustained per-coil currents below 200 mA.

What is the Flash memory size of MC9S12XDQ512CPV?
The MC9S12XDQ512CPV integrates 512 KB of on-chip Flash program memory, organized as two banks for concurrent read/program operations. This enables in-application firmware updates without blocking the CPU, which is critical for body control modules and CAN gateway nodes that must remain responsive during reflashing.
How much RAM and EEPROM does the MC9S12XDQ512CPV have?
The device includes 32 KB of SRAM and 4 KB of byte-erasable EEPROM, supplemented by 8 KB of Flash allocated for EEPROM emulation when extra write endurance is required. These resources support typical automotive stacks including CAN stacks, J1939, UDS diagnostics, and small RTOS kernels.
What is the operating voltage range of MC9S12XDQ512CPV?
According to the JLCPCB catalog entry, the MC9S12XDQ512CPV operates from 2.375 V to 5.5 V supply. Internal regulation derives the 2.5 V core voltage, so a single 5 V automotive rail is sufficient without an external LDO.
What is the maximum bus clock speed of the MC9S12XDQ512CPV?
The HCS12X core clocks up to 80 MHz, derived from an internal PLL referenced to a 0.5-40 MHz external crystal or resonator. At 80 MHz the core delivers roughly 80 MIPS, and the XGATE coprocessor adds another 80 MIPS of interrupt-driven throughput for peripheral handling.
How many CAN controllers are integrated in the MC9S12XDQ512CPV?
The MC9S12XDQ512CPV provides five independent msCAN (CAN 2.0 A/B) controllers, each with its own filter bank and message buffer. Five controllers support typical automotive gateway architectures with powertrain CAN, body CAN, chassis CAN, diagnostics CAN, and a redundant bus without an external transceiver cascade.
What package does the MC9S12XDQ512CPV use?
Per JLCPCB and Partstack listings the MC9S12XDQ512CPV ships in a 112-pin LQFP package with 20x20 mm body and 0.5 mm lead pitch, top-side gull-wing leads, and an exposed thermal pad tied to ground. The suffix 'PV' in the part number designates the LQFP-112 package per NXP ordering scheme.
Where can I buy the MC9S12XDQ512CPV online?
Per the LCSC listing dated 2026-10-21, the MC9S12XDQ512CPV is in stock at LCSC Electronics starting around $1.15 per unit. DigiKey, Mouser, Octopart and JLCPCB also list the part for purchase; lead time on authorized channels is typically 8-12 weeks as of 2026-10-21, with JLCPCB listing immediate-stock options.
What is the price of MC9S12XDQ512CPV in volume?
Pricing observed on 2026-10-21 ranges from about $1.15 each at LCSC in cut-tape/tube pack quantity to roughly $14 at 1,000-piece volume on distributor channels (Octopart aggregated listings). LCSC undercut authorized distributors for small prototype quantities as of 2026-10-21.
What is the lead time for the MC9S12XDQ512CPV?
Lead time as of 2026-10-21 is approximately 8 to 12 weeks on authorized distributors such as Mouser and DigiKey, with JLCPCB and LCSC showing immediate stock for low-volume buyers. Long lead time reflects continued strong automotive demand for HCS12X legacy platforms - request a quote for production volumes.
What is the difference between MC9S12XDQ512CPV and MC9S12XDP512VAL?
Both are HCS12X 512KB Flash parts but they differ in package: the MC9S12XDQ512CPV ships in the 112-pin LQFP (PV suffix), while the MC9S12XDP512VAL ships in the 112-pin LQFP (VAL, extended-temperature -40C to +105C). Electrical pinout is compatible; verify thermal and timing margins if swapping between them.
Can the MC9S12XDG512CPV replace the MC9S12XDQ512CPV?
Yes - within the S12XD family, variants differing only in the suffix letter (e.g. MAG vs CPV, or CAL vs VPV) share the same die and same pinout; the letter encodes package and temperature grade, not function. Confirm the target PCB land pattern matches the chosen suffix package before substituting.
When should I choose the MC9S12XDQ512CPV over the MC9S12XDT256MFUE?
Choose the MC9S12XDQ512CPV when your application needs the full 512 KB Flash and five msCAN controllers for multi-bus gateway nodes. Choose the MC9S12XDT256MFUE (smaller Flash 256 KB, fewer CAN) for cost-sensitive 8-16 bit body nodes - both share the HCS12X core and a similar 112-LQFP footprint.
Where to download the MC9S12XDQ512CPV datasheet PDF?
The MC9S12XDP512 reference manual (covers the entire MC9S12XD family including MC9S12XDQ512CPV) is published by NXP at the official URL https://www.nxp.com/docs/en/data-sheet/MC9S12XDP512RMV2.pdf, dated Rev 2.21. Always prefer the NXP-controlled host; distributor mirrors may lag revisions.
What is the difference between MC9S12XDQ512CPV and a 32-bit ARM Cortex-M MCU?
The MC9S12XDQ512CPV is a 16-bit HCS12X part with five CAN 2.0 controllers, XGATE coprocessor and 80 MHz CPU12X core. A 32-bit ARM Cortex-M3/M4 at 80-100 MHz has higher MIPS and richer toolchain support but typically only 1-2 CAN controllers - the HCS12X remains preferred for high-CAN-count body and gateway designs.
What are the key specifications engineers should know about MC9S12XDQ512CPV?
Five data points define the MC9S12XDQ512CPV: (1) 16-bit CPU12X core + XGATE coprocessor at 80 MHz; (2) 512 KB Flash + 32 KB RAM + 4 KB EEPROM; (3) five msCAN 2.0 A/B controllers with dedicated filters; (4) 112-LQFP 20x20 mm package, -40C to +85C industrial grade; (5) 2.375-5.5 V single-supply operation with internal regulator. These five parameters are the basis for component selection in automotive body and gateway ECUs.

エンジニアリング参考データ: MC9S12XDQ512CPV — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC9S12XDQ512CPV when you need 512 KB Flash, five msCAN controllers, and the XGATE coprocessor for parallel interrupt handling - typically in automotive body control modules, CAN gateway nodes, or instrumentation clusters. Choose MC9S12XDP512VAL when you need the same silicon at -40C to +105C extended-temp grade (chassis applications). Choose MC9S12XDQ256VPV for cost-sensitive nodes that fit in 256 KB Flash. Choose MC9S12A256CCPV only for legacy software running on the older HCS12A core without XGATE. All five options share the LQFP-112 footprint, allowing PCB reuse when only peripheral count or temperature grade varies. For new designs that benefit from higher MIPS and richer toolchains, consider evaluating a 32-bit ARM Cortex-M3 - but expect to add an external CAN hub since most Cortex-M3 parts offer only 1-2 CAN controllers.

代替品との比較

パラメータ この製品 MC9S12XDP512VAL MC9S12XDQ256VPV MC9S12XD64CAA MC9S12A256CCPV MC9S12DT256MFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-112 (20x20) LQFP-112 (20x20) - same LQFP-112 (20x20) - same LQFP-112 (20x20) - same LQFP-112 (20x20) - same LQFP-112 (20x20) - same
Flash Memory 512 KB 512 KB - same 256 KB 64 KB 256 KB 256 KB
RAM 32 KB 32 KB - same 16 KB 12 KB 12 KB 16 KB
EEPROM 4 KB 4 KB - same 4 KB - same 2 KB 4 KB - same 4 KB - same
Bus Clock (Max) 80 MHz 80 MHz - same 80 MHz - same 80 MHz - same 50 MHz 80 MHz - same
CAN Controllers 5 5 - same 5 - same 5 - same 3 3
Operating Temperature -40C to +85C (industrial) -40C to +105C (extended) -40C to +85C - same -40C to +85C - same -40C to +85C - same -40C to +125C (automotive grade)

主な差別化要因

  • Five msCAN 2.0 A/B controllers in a single MCU (vs MC9S12A256CCPV)
  • XGATE coprocessor for parallel interrupt-driven I/O (vs MC9S12DT256MFUE)
  • Largest Flash in the HCS12XD LQFP-112 family (vs MC9S12XDQ256VPV)

設計ノート

Place 0.1uF X7R ceramic decoupling capacitors within 5 mm of every VDDF and VDDX pin pair, and add a bulk 4.7-10uF tantalum or ceramic near the VDDR regulator input. Keep the capacitor ground return path short and on an unbroken ground pour that ties directly to the package exposed pad. Inadequate decoupling is the leading root cause of PLL jitter and spurious RESET events on HCS12X boards.

Always tie the TEST pin to GND via a 10k resistor; leaving TEST floating can put the device into factory test mode and prevent normal startup. Also, route the BKGD (background debug) pin away from high-current switching traces; noisy BKGD causes false BDM sync errors during in-circuit programming. Use a 4.7k pull-up and a 1nF capacitor to ground on RESET to ensure clean cold-boot behavior.

Differential CAN bus traces should be length-matched within 5 mm and routed over an unbroken ground plane to maintain 120-ohm impedance. Place the CAN transceiver within 50 mm of the TxCANx/RxCANx pins to minimize loop area. Add a common-mode choke and a TVS diode (e.g. PESD1CAN) on the bus for automotive EMC compliance per IEC 61000-4-2.

Estimated: in the LQFP-112 20x20 package, theta_JA is approximately 50 C/W on a 4-layer JEDEC test board. For continuous operation at +85C ambient with 200 mA core current at 5V, junction temperature rise is about 50 C, giving Tj around 135 C - within the -40C to +150C silicon limit but with limited margin. Add a thermal pad stitch to improve dissipation if operating near 200 mA.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

Industrial grade (-40C to +85C), not AEC-Q100 automotive qualified per JLCPCB listing; for AEC-Q100 qualified use the MC9S12XDQ512CAL or MC9S12XDT256MFUE variants. RoHS/REACH compliance verified by JLCPCB listing.

データ検証日: 2026-10-21 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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