MCIMX257DJM4 - i.MX25 ARM9 400MHz MPU 400-LFBGA | NXP
部品番号: MCIMX257DJM4 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.95 | $289.50 |
| 100 | $25.4 | $2,540.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $19.85 | $19,850.00 |
MCIMX257DJM4 概要
Key specifications include a 400 MHz ARM926EJ-S core, 400-LFBGA (17x17) package, 128 I/O lines, and external program memory support with on-chip RAM. The processor combines a small die-area ARM9 core with DDR2/LPDDR memory controllers and an integrated LCD controller, suitable for cost-sensitive HMI designs.
The MCIMX257DJM4 belongs to the i.MX25 family of ARM9 microprocessors (MPUs), a category of 32-bit microprocessors in NXP's broader i.MX applications processor portfolio. As an MPU (microprocessor), it relies on external SDRAM/NOR/NAND flash for program storage, distinguishing it from MCUs which typically integrate non-volatile memory internally. MPUs of this class typically address systems requiring higher clock speeds, larger external memory address spaces, and richer peripheral integration than 8/16/16-bit MCUs offer, making them a mid-tier solution between basic microcontrollers and higher-end Cortex-A application processors.
Architecturally, the device implements the ARM926EJ-S core with a 16 KB instruction cache and a 16 KB data cache, plus an MMU for full operating system support. An integrated image processing unit (IPU), enhanced audio and security blocks, and a 10/100 Ethernet MAC accelerate multimedia and connected industrial products.
Typical applications include factory automation HMI panels, industrial control terminals, medical patient monitoring displays, point-of-sale terminals, and connected consumer devices. The wide peripheral set (USB, Ethernet, CAN, UART, SPI, I2C, I2S, LCD) means most system requirements are satisfied without companion controller ICs.
When designing with this part, pay close attention to PCB power decoupling because the 400-LFBGA package concentrates high-frequency switching currents in a small area. Maintain a 4-layer PCB with a continuous ground plane beneath the BGA; thermal performance depends primarily on inner copper layers, since the package has limited top-side heat dissipation.
ドロップイン代替品: MCIMX257DJM4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX257DJM4 （同一形状・フットプリント） — 相違点: Operating Temperature, Core Architecture, Package, Program Memory Type.
クイック比較ツール — 並列比較する代替部品を選択:
MCIMX257DJM4A
✅ ドロップイン✓ 在庫あり
$16.54 / 個
データシートを見る →MCIMX253DJM4A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX253CJM4A
✅ ドロップイン✓ 在庫あり
$22.8 / 個
データシートを見る →MCIMX255DJM4A
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCIMX257DJM4 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | i.MX25 |
| Core Processor | ARM926EJ-S |
| Core Count | 1 |
| データバス幅 | 32-bit |
| 最大クロック周波数 | 400 MHz |
| Program Memory Type | External (NOR/NAND) |
| RAM Size | 144 KB on-chip |
| Number of I/O | 128 |
| パッケージ | 400-LFBGA (17x17 mm) |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
| RoHS ステータス | Compliant |
| Silicon Version | 1.2 |
MCIMX257DJM4 400-lfbga (17x17 mm) ピン配置ガイド
MCIMX257DJM4 (400-lfbga (17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX257DJM4.
詳細は データシート をご参照ください。
主な用途
MCIMX257DJM4 の用途: 6 件s: Industrial Human-Machine Interface (HMI) Panels, Patient Monitoring and Medical Displays, Point-of-Sale (POS) Terminals, Connected Industrial Gateways, Building Automation and Energy Controllers, Industrial Printer and Label Controllers.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX257DJM4 is well-suited to industrial HMI terminals because its integrated IPU (Image Processing Unit) drives TFT panels up to SVGA without an external graphics controller. Combined with the 10/100 Ethernet MAC, CAN bus, and up to 128 user I/Os, it provides everything needed for a connected factory-floor operator panel in a single 400-LFBGA device. The 400 MHz ARM926EJ-S core runs typical HMI applications (Qt/Embedded, lvgl, or WinCE) with margin for protocol stacks such as Modbus TCP and EtherNet/IP, while the -40C to +85C industrial temperature range meets IEC 61131-2 environments.
おすすめ
Patient Monitoring and Medical Displays
The MCIMX257DJM4 fits medical bedside monitors and clinical displays because its long-life ARM926EJ-S core gives a proven 32-bit platform with deterministic interrupt latency for data acquisition. The integrated IPU interfaces directly to medical-grade TFT displays, while the on-chip 144 KB SRAM keeps time-critical waveform buffers local to the CPU, avoiding DDR access during sampling. Industrial temperature grade and NXP's controlled-bill-of-materials support the long product lifetimes IEC 60601-1 medical device designs require.
おすすめ
Point-of-Sale (POS) Terminals
Point-of-sale terminals rely on the MCIMX257DJM4's combination of LCD controller, USB host/device ports, Ethernet MAC, and secure boot. The 32-bit ARM9 core runs Linux or Windows Embedded CE POS application stacks including payment terminal libraries and encryption middleware, while external NOR/NAND flash boots trusted firmware from authenticated ROM. The 400-LFBGA package keeps the overall POS motherboard compact yet provides sufficient I/O for mag-stripe readers, thermal printers, and customer-facing displays.
おすすめ
Connected Industrial Gateways
Industrial IoT gateways use the MCIMX257DJM4 because it integrates Ethernet MAC, USB, multiple UARTs, and CAN interfaces needed for protocol conversion between fieldbuses and Ethernet. The 400 MHz ARM9 runs Linux with full networking stack plus MQTT or OPC-UA clients, while the external memory interface supports DDR2 for buffering aggregated sensor data. Industrial temperature rating plus NXP's extended-product longevity program target factory gateways with 10+ year operational lifetimes.
おすすめ
Building Automation and Energy Controllers
Building automation controllers use the MCIMX257DJM4 to drive touch-screen thermostats, lighting controllers, and BACnet/Modbus supervisory nodes. The integrated LCD controller, capacitive touch I/O via I2C, and Ethernet connectivity satisfy modern touchscreen building controls without companion ICs, while the -40C to +85C range covers outdoor electrical enclosures and rooftop HVAC controls. The IPU handles text-and-icon HVAC graphics directly, freeing the ARM9 core for control loop code.
おすすめ
Industrial Printer and Label Controllers
Label and industrial printers benefit from the MCIMX257DJM4's combination of high-speed USB 2.0 device port for PC host connection, Ethernet for network printing, and the IPU driving operator displays and status panels. The 400 MHz ARM9 core runs PostScript/PDF interpreters and ARM9-optimized raster image processors (RIPs) for thermal-transfer printers, while the DDR2 controller handles large print-buffer memories required for 300/600 dpi output. The mature ARM9 toolchain supports long-life embedded printer code bases.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX257DJM4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX257DJM4A | MCIMX253DJM4A | MCIMX253CJM4A | MCIMX255DJM4A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Max Clock Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Program Memory | External (NOR/NAND) | External (NOR/NAND) | External (NOR/NAND) | External (NOR/NAND) | External (NOR/NAND) |
| Silicon Version | 1.2 (legacy) | 1.2 (updated) | 1.2 | 1.2 industrial | 1.2 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C (industrial optimized) | -40C to +85C |
主な差別化要因
- ARM926EJ-S core with 144 KB on-chip SRAM （vs Lower-tier Cortex-M microcontrollers)
- Integrated Image Processing Unit (IPU) with LCD controller （vs External LCD controller companions)
- Mature ARM9 ecosystem with long-life production （vs Newer Cortex-A application processors)
設計ノート
The 400-LFBGA package with 0.8 mm ball pitch requires a 4-layer (or more) PCB with laser-drilled or 0.2 mm micro-vias to fan out signals. Use a continuous ground plane on layer 2 and a power plane on layer 3 to deliver low-impedance returns for DDR2 clocks operating at 133 MHz, and follow NXP's reference escape pattern for the LFBGA-400 array to avoid signal integrity issues.
The LFBGA-400 package dissipates heat primarily through inner PCB copper layers rather than top-side convection; design at least 4 thermal vias-in-pad under the center power balls, each plated with 1 oz copper. For continuous operating junction temperatures above 95C, add thermal copper pours on outer layers directly under the BGA exposed paddle area to keep Tj below the 105C industrial limit.
Do not assume MCIMX257DJM4 alternatives with the same 400-LFBGA footprint are drop-in. i.MX25 variants differ in pin multiplexing for USB, Ethernet, and display interfaces - always re-validate the BSDL/IBAT file and Pin-Mux tool configuration when substituting even between same-package parts. Also confirm boot mode strapping because i.MX25 variants sample boot pins on different balls.
コンプライアンス情報
RoHS compliant per NXP/Freescale product page. AEC-Q100 not applicable - industrial temperature grade only. Halogen-free status not explicitly stated in fetched web data; request NXP environmental certification letter if needed.
