MCIMX351AJQ5C - i.MX35 ARM1136 MPU, 532MHz, 400-LFBGA | NXP
部品番号: MCIMX351AJQ5C ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $44.04 | $44.04 |
| 10 | $40.2 | $402.00 |
| 100 | $36.5 | $3,650.00 |
| 250 | $33.9 | $8,475.00 |
| 500 | $31.75 | $15,875.00 |
MCIMX351AJQ5C 概要
An applications processor in the i.MX class is a system-on-chip combining a high-performance CPU, memory controllers, display and camera interfaces, and a wide peripheral set into a single BGA package, sitting at the top of the embedded hierarchy below the system level: SoC -> applications processor -> microprocessing unit (MPU) -> semiconductor. The i.MX35 generation provides more compute headroom than earlier i.MX31 designs and offers richer multimedia and connectivity than the lower-tier i.MX25 (ARM926EJ-S) devices.
Key features include a 532 MHz ARM1136JF-S core with Java acceleration, a 128 KB unified L2 cache reported as 128K x 8 in distributor listings, an external memory controller supporting DDR1/DDR2 and NAND flash, and up to 96 general-purpose I/O lines. Integrated peripherals include a 10/100 Ethernet MAC, USB 2.0 OTG host/device, 3.3 V I/O, MMC/SD card interfaces, and an LCD controller. The 400-LFBGA 17 mm package supports the high-pin-out needed for multiplexed address/data and the wide variety of peripheral interfaces.
Typical applications include automotive instrument clusters, in-vehicle telematics units, point-of-sale terminals, industrial control panels, and consumer multimedia devices. The ARM1136 architecture's deterministic interrupt response and the i.MX35 peripheral mix make the MCIMX351AJQ5C suitable for real-time multimedia plus connectivity workloads that earlier i.MX31 and i.MX27 designs would struggle to sustain.
Engineers laying out the 400-ball BGA should reserve a full ground plane under the package and provide thermal vias on the center balls to keep junction temperature within the automotive-grade range. Per NXP's i.MX35 hardware guidelines, all power rails require bulk plus bypass ceramic capacitors placed as close as possible to the balls to mitigate switching noise on the DDR interface.
ドロップイン代替品: MCIMX351AJQ5C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX351AJQ5C （同一形状・フットプリント） — 相違点: Mounting Type, Package, Program Memory Type.
クイック比較ツール — 並列比較する代替部品を選択:
MCIMX353DJQ5C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX353CJQ5C
✅ ドロップイン✓ 在庫あり
$23.1 / 個
データシートを見る →MCIMX357DJQ5C
✅ ドロップイン✓ 在庫あり
$23.4 / 個
データシートを見る →MCIMX351AJQ5CR2
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCIMX356AJQ5C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX351AJQ5C 最大定格＆電気的特性
| Product Family | i.MX35 |
| Core Architecture | ARM1136JF-S (ARM11) |
| Number of Cores | 1 |
| データバス幅 | 32-bit |
| Maximum Core Frequency | 532 MHz |
| L2 Cache Size | 128 KB (128K x 8 per distributor listing) |
| Number of I/O Lines | 96 |
| Program Memory Type | ROMless (external) |
| パッケージ / ケース | 400-LFBGA (17 mm x 17 mm, 0.8 mm pitch) |
| 実装タイプ | Surface Mount, MAPBGA |
| Oscillator Type | External |
| Process Technology | 90 nm CMOS |
| Packaging | Tray |
| Market | Automotive |
| Lifecycle | End of Life / Last Time Buy (per NXP product page) |
MCIMX351AJQ5C 400-lfbga (17 mm x 17 mm, 0.8 mm pitch) ピン配置ガイド
MCIMX351AJQ5C (400-lfbga (17 mm x 17 mm, 0.8 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX351AJQ5C.
詳細は データシート をご参照ください。
主な用途
MCIMX351AJQ5C の用途: 6 件s: Automotive Instrument Cluster, In-Vehicle Telematics Unit, Industrial HMI Panel, Point-of-Sale Terminal, Medical Patient-Monitoring Display, Consumer Multimedia Streaming Device.
Automotive Instrument Cluster
The MCIMX351AJQ5C drives graphical automotive instrument clusters where its ARM1136JF-S 532 MHz core renders gauges, indicators, and warning icons in real time. The chip's integrated LCD controller can drive medium-resolution TFT panels directly, while the 128 KB L2 cache keeps framebuffer access responsive under CAN-FD and LIN traffic. Engineers typically pair this MPU with a TPS65350 power management IC for sequencing core, IO, and ADC rails. The 400-MAPBGA footprint simplifies thermal via placement under the die for cluster heads-up applications across the automotive temperature grade.
おすすめ
In-Vehicle Telematics Unit
For telematics control units the MCIMX351AJQ5C delivers ARM11-class throughput and integrated 10/100 Ethernet, USB 2.0 OTG, and MMC/SD peripherals required for cellular modem management and GNSS data parsing. The 90 nm process supports up to 532 MHz sustained operation, sufficient for TCP/IP stacks and LTE/3G modem handshakes. The 400-MAPBGA 17 mm package allows the MPU, modem, and power management devices to be placed on a compact mainboard designed for in-cabin thermal envelopes. NXP recommends this family for telematics head units requiring deterministic ARM1136 interrupt response.
おすすめ
Industrial HMI Panel
The MCIMX351AJQ5C fits factory HMI panels where its ARM1136JF-S core resolves Qt/Embedded GUIs and the integrated LCD controller drives RGB TFT displays at production-line operator stations. With up to 96 GPIO plus Ethernet, USB, and CAN, the chip handles panel-to-PLC communication and touch-screen I/O without external bridges. The 400-MAPBGA 0.8 mm pitch requires 4-layer PCB stack-ups with a full ground plane and a power plane pair for the DDR reference; a TDK-Lambda DC-DC converter typically supplies the 1.2 V / 1.8 V / 3.3 V rails. Lifecycle is favorable: last-time-buy stock remains available for service continuity of installed automation lines.
おすすめ
Point-of-Sale Terminal
POS terminals benefit from the MCIMX351AJQ5C's ARM1136 throughput for payment-processing stacks, Ethernet for back-office sync, and USB 2.0 OTG for PIN pads and barcode scanners. The ROMless architecture lets OEMs ship encrypted boot loaders in external NAND and locks down the firmware supply chain via on-chip secure boot. The 400-MAPBGA is laid out on a 6-layer PCB with controlled-impedance routing for the DDR2 interface running at 133 MHz. Multimedia peripherals support customer-facing receipt printers and signature-pad displays at retail counters.
おすすめ
Medical Patient-Monitoring Display
The MCIMX351AJQ5C is suited to medical patient-monitoring displays where its ARM1136JF-S 532 MHz core renders multi-trace waveforms, the integrated LCD controller drives SVGA TFT panels, and the 96 GPIO bit-bangs sensor front ends. Deterministic interrupt response supports real-time heart-rate / SpO2 sampling at sub-second intervals. The 17x17 mm 400-MAPBGA package integrates into compact bedside monitors with a TPS3823 supervisor monitoring the 1.2 V core rail. NXP's i.MX35 medical references include BSPs for use-cases that fall under IEC 60601 compliance paths.
おすすめ
Consumer Multimedia Streaming Device
Consumer multimedia streamers use the MCIMX351AJQ5C for its ARM1136 throughput, hardware image-processing unit (IPU), and display controller that drive 720p media playback from NAND or networked streams. The integrated Ethernet MAC plus USB 2.0 OTG provide the network and storage interfaces needed for set-top streaming products. The 400-MAPBGA allows the part to share a small mainboard with DDR2 memory and an HDMI bridge for TV output. Designers evaluating newer designs should consult NXP's i.MX8 recommended replacement list, as the i.MX35 generation is in its last-time-buy phase.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX351AJQ5C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX353DJQ5C | MCIMX353CJQ5C | MCIMX357DJQ5C | MCIMX351AJQ5CR2 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA (17x17) | 400-MAPBGA (17x17) - same | 400-MAPBGA (17x17) - same | 400-MAPBGA (17x17) - same | 400-MAPBGA (17x17) - same |
| Core | ARM1136JF-S (ARM11) | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Core Frequency | 532 MHz | 532 MHz | 532 MHz | 532 MHz | 532 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| L2 Cache | 128 KB (128K x 8) | 128 KB | 128 KB | 128 KB | 128 KB |
| GPIO Count | 96 | 96 | 96 | 96 | 96 |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
主な差別化要因
- Same-family i.MX35 variant with different feature code （vs MCIMX353DJQ5C)
- Drop-in to other i.MX35 family parts on the same socket （vs MCIMX357DJQ5C)
- Long supply chain via Rochester Electronics （vs MCIMX351AJQ5C raw distributor stock)
設計ノート
Estimated: with the 90 nm ARM1136JF-S core at 532 MHz dissipating approximately 0.8-1.2 W typical, the 17x17 mm 400-MAPBGA part requires thermal vias under the center BGA balls and at least 4 oz copper on inner/outer power layers to keep the junction rise bounded in sealed automotive enclosures. Reference NXP's i.MX35 hardware guidelines for the canonical thermal relief pattern.
BGA escape routing must dedicate at least two PCB layers to the DDR2 address/command/data/DQS lanes; NXP's reference design uses microstrip + stripline pairs with length-matching within +/-25 mils. Maintain a continuous reference ground plane under all DDR lanes; do not route any signal across a plane split. Decoupling: place 1x 1uF 0402 (or smaller) and 1x 0.1uF 0402 ceramic within 50 mils of every power-ball cluster on the 400-LFBGA.
The MCIMX351AJQ5C is ROMless - the design MUST boot from external NAND/NOR flash and configure the DDR controller before any application code runs. Engineers often forget the boot mode strap pins (BOOT_CFG0/1/2/3) and see no boot activity: ensure correct pull-up/down settings before debugging power sequences. Because the device is in last-time-buy, freeze firmware BSPs against fixed silicon revisions and stock sufficient inventory for the product lifecycle before designing in.
Estimated: rail sequencing per NXP's i.MX35 reference uses a TPS65350 PMIC to gate core (1.2 V typical) before IO (1.8 V / 3.3 V) and analog supplies. Budget at least 4 bulk capacitors (22 uF / 10 uF / 4.7 uF / 1 uF ceramic) per rail cluster on the BGA perimeter, with their grounds returning to a single star ground near the regulator outputs.
コンプライアンス情報
AEC-Q100 automotive qualified per NXP i.MX35 family datasheet. Lead-free / Pb-free confirmed via legacy Freescale ordering information on the NXP product page (Tray packing, plastic package 17x17 mm 0.8 mm pitch). RoHS / REACH / halogen / conflict-mineral statuses were not explicitly stated in the verified data and are marked unknown - consult the manufacturer's material declaration before production.
