MCIMX355AVM4B - i.MX35 ARM11 400MHz Auto MPU | NXP
部品番号: MCIMX355AVM4B ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.85 | $3,185.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.1 | $25,100.00 |
MCIMX355AVM4B 概要
A microprocessor (MPU) is an integrated circuit that contains the CPU core, memory controllers, and a rich set of on-chip peripherals, sitting at the top of an embedded system's compute hierarchy: MPU -> applications processor -> SoC -> semiconductor. The i.MX35 family extends this hierarchy with hardware accelerators for image, video, and audio processing, freeing the ARM core from media-intensive workloads.
Key features of the MCIMX355AVM4B include an integrated Image Processing Unit (IPU), an Enhanced Serial Audio Interface (ESAI) supporting 5.1-channel audio, an SPDIF transceiver for compressed digital audio, an advanced sample rate converter (ASRC) for mixing streams of different sampling rates, and an external memory interface. The ROMless architecture allows the OEM to pair the processor with the appropriate density of external DDR2/DDR/NOR/NAND memory for the target application. With 96 user I/Os and a 1-core 32-bit CPU, the device balances compute density against power and PCB footprint constraints.
Typical applications include automotive infotainment head units, in-vehicle navigation systems, telematics control units, and industrial HMI panels. The 400-LFBGA package requires careful PCB layout with microvia stack-ups to route the 0.8 mm-pitch ball array and to maintain reference-plane continuity beneath the package.
When designing with this device, allocate a 4-layer (minimum) PCB with continuous power and ground planes under the BGA. Provide bulk decoupling within 25 mm of the BGA and high-frequency ceramics at the ball side. Thermal management must include a copper flood of at least 1 square inch on the top layer connected through the center balls for heat spreading.
This page synthesizes distributor availability, AEC-Q100 grade information, and package-level design notes not found in the bare datasheet summary, giving engineers a single reference for i.MX35 sourcing decisions.
ドロップイン代替品: MCIMX355AVM4B — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX355AVM4B （同一形状・フットプリント） — 相違点: Core Architecture, Package, Mounting Type, Automotive Qualification, Program Memory Type.
クイック比較ツール — 並列比較する代替部品を選択:
MCIMX355AVM4BR2
✅ ドロップイン✓ 在庫あり
$19.85 / 個
データシートを見る →MCIMX356AVM4B
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX357AVM4B
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX353AVM4B
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX351AJQ5CR2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX355AVM4B 最大定格＆電気的特性
| Core Architecture | ARM1136JF-S |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Maximum CPU Clock | 400 MHz |
| 動作温度範囲 | -40 C to +85 C (ambient, AEC-Q100 Grade 3) |
| パッケージ | 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch) |
| 実装タイプ | Surface Mount |
| Program Memory Type | ROMless (external memory required) |
| On-chip RAM | 128 KB |
| Number of User I/O | 96 |
| Oscillator Type | External |
| Automotive Qualification | AEC-Q100 Grade 3 |
| Audio Interfaces | ESAI (5.1), SPDIF I/O, ASRC |
| Image Processing Unit | Yes (integrated IPU) |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
MCIMX355AVM4B ピン構成
| ピン A1 | VDD — Core supply voltage (refer to datasheet for exact rail) |
| ピン B5 | GND — Ground reference (multiple GND balls) |
| ピン C10 | DRAM_DQ0 — DDR data lane 0 (external memory interface) |
| ピン D15 | ESAI_TXD — Enhanced Serial Audio Interface transmit data |
| ピン E18 | SPDIF_OUT — Sony/Philips Digital Interface audio output |
| ピン AB1 | RESET_B — Active-low system reset |
| ピン T20 | GPIO1_IO00 — General-purpose I/O ball 0 of bank 1 |
主な用途
MCIMX355AVM4B の用途: 6 件s: Automotive Infotainment Head Unit, In-Vehicle Navigation System, Telematics Control Unit (TCU), Industrial HMI Panel, Rear-Seat Entertainment (RSE) Module, Automotive Instrument Cluster Companion.
Automotive Infotainment Head Unit
The MCIMX355AVM4B drives mainstream automotive infotainment head units where a 400 MHz ARM1136 core plus the integrated Image Processing Unit is sufficient for a 7-9 inch WVGA display. AEC-Q100 Grade 3 qualification supports continuous operation at +85 C ambient inside a center stack. The IPU handles LCD panel timing and color-space conversion while the ESAI/SPDIF/ASRC route 5.1 audio to the external amplifier. Pair with an external DDR2 and a power management IC from the same NXP PF family.
おすすめ
In-Vehicle Navigation System
The 400 MHz ARM1136 plus external DDR2/NAND delivers enough throughput to run automotive-grade navigation stacks (NNG, Elektrobit) with 3D landmarks and map panning. The MCIMX355AVM4B's 96 user I/Os allow direct connection to GPS receivers, CAN transceivers, and resistive touch controllers without an external expander. The 400-LFBGA 17x17 mm package fits the navigation mainboard behind the dashboard display. AEC-Q100 Grade 3 and +85 C ambient cover the parked-to-driving thermal envelope.
おすすめ
Telematics Control Unit (TCU)
The MCIMX355AVM4B anchors a telematics control unit by running the LTE/5G modem host stack, GPS fusion, and vehicle data logging concurrently. AEC-Q100 Grade 3 plus +85 C ambient lets the TCU survive under-dash deployment. The ROMless architecture lets OEMs pick exact-density NAND to balance cost against OTA image size. External DDR2 holds the modem AT-command buffers and TLS session state without spilling to flash. The IPU is unused in headless TCUs but adds headroom for HMI variants.
おすすめ
Industrial HMI Panel
Industrial human-machine interface panels reuse the MCIMX355AVM4B's display pipeline outside the automotive cabin, accepting the +85 C ambient as headroom for sealed enclosures. The IPU drives TFT panels up to WVGA without an external graphics controller, lowering BOM cost. The ARM1136JF-S core runs Qt/Embedded and web-based HMI stacks with adequate headroom for 30 fps animations. External NOR/NAND holds the application image; DDR2 acts as the frame buffer.
おすすめ
Rear-Seat Entertainment (RSE) Module
The MCIMX355AVM4B powers a rear-seat entertainment module that streams audio/video to headrest displays. The ESAI 5.1 and SPDIF outputs feed external audio DACs and headphone amplifiers, while the IPU drives a local LCD for menu navigation. The 400-LFBGA footprint fits a compact module housing behind a seat back. AEC-Q100 Grade 3 covers cabin thermal conditions during summer. External NAND stores media files; DDR2 buffers video decode.
おすすめ
Automotive Instrument Cluster Companion
Used as a graphics companion to a microcontroller-based instrument cluster, the MCIMX355AVM4B renders 3D gauge animations and turn-by-turn arrows on a TFT display. The IPU performs frame composition and gamma correction, while the ARM1136 core runs the cluster HMI stack. The 96 user I/Os connect to the body controller via CAN and to the cluster's local display/touch. AEC-Q100 Grade 3 and +85 C ambient cover the behind-cluster thermal envelope.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX355AVM4B — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX355AVM4BR2 | MCIMX356AVM4B | MCIMX357AVM4B | MCIMX353AVM4B | MCIMX351AJQ5CR2 |
|---|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm, 0.8 mm pitch) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-MAPBGA (different pinout) - family migration |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Maximum CPU Clock | 400 MHz | 400 MHz | 532 MHz | 532 MHz | 200 MHz | 400 MHz |
| Automotive Grade | AEC-Q100 Grade 3 | AEC-Q100 Grade 3 | AEC-Q100 Grade 3 | AEC-Q100 Grade 3 | AEC-Q100 Grade 3 | AEC-Q100 |
| Image Processing Unit | Yes | Yes | Yes | Yes | Yes | Yes |
| Program Memory Type | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) |
主な差別化要因
- AEC-Q100 Grade 3 qualified for in-cabin automotive deployment （vs Industrial-grade ARM MPUs without automotive qualification)
- Integrated Image Processing Unit (IPU) on-chip （vs ARM MPUs requiring an external display controller)
- 5.1-channel ESAI plus SPDIF I/O plus ASRC on-chip （vs Processors requiring an external audio hub)
- 96 user I/Os supporting direct sensor and bus connection （vs Lower-I/O MPUs requiring I/O expanders)
設計ノート
The MCIMX355AVM4B uses a 400-LFBGA at 0.8 mm pitch. Use a 4-layer stack-up minimum with continuous GND and PWR planes directly under the BGA. Microvias-in-pad on the top layer simplify fan-out from the 0.8 mm ball array. Stitch the package perimeter with a GND via ring to suppress edge EMI, and place bulk decoupling capacitors within 25 mm of the package to keep the DDR2 reference plane quiet.
Estimated: at 400 MHz with full IPU + ESAI activity, typical power dissipation is around 1.0-1.4 W. With theta_JA in the 30-40 C/W range for a 4-layer JEDEC board, junction temperature rises 30-55 C above ambient. At +85 C cabin ambient, junction can reach +115-140 C, so a top-layer copper flood of at least 1 square inch connected through the center balls is recommended for thermal spreading.
Use the NXP MC34713EP or MC13892JVK PMIC to generate the multiple voltage rails required by the i.MX35 (core, I/O, DDR, PLL, etc.). Sequence the rails per the datasheet power-on sequence; failure to do so can latch the device. Place 10 uF bulk + 0.1 uF high-frequency ceramic pairs at every rail pin. Keep the PMIC feedback traces short and away from switching nodes.
Do not assume the 400-LFBGA and other i.MX35 family BGAs (e.g. MCIMX351AJQ5CR2) are pin-compatible; the ball maps differ. Always verify the exact ordering code before laying out the PCB. Also note that ROMless variants require external boot memory on a specific NAND/NOR interface; missing boot media will leave the part silent on reset.
The DDR2 interface is the highest-speed bus on this MPU. Maintain 50-ohm single-ended controlled impedance on the DDR traces, match trace lengths within the DDR byte-lane tolerances (typically +/- 25 mil), and place series-stubs near the die. Place the DDR VTT termination voltage decoupling close to the memory devices and reference the VTT plane to GND.
コンプライアンス情報
AEC-Q100 Grade 3 qualified per NXP product page. RoHS and lead-free per NXP packaging materials declaration. Reach compliance per EU SVHC list.
