MCIMX6G2CVM05AA-FR - i.MX 6UltraLite 528MHz Cortex-A7 MPU | NXP
部品番号: MCIMX6G2CVM05AA-FR ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.9 | $169.00 |
| 100 | $14.75 | $1,475.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $12.05 | $12,050.00 |
MCIMX6G2CVM05AA-FR 概要
An applications processor (AP) is a system-on-chip (SoC) class of integrated circuit that combines one or more CPU cores, a memory controller, graphics/display pipelines where present, and a wide selection of on-chip peripherals into a single BGA-packaged die. The i.MX 6UltraLite sits in the entry-level portion of the i.MX 6 product hierarchy - positioned below the i.MX 6SoloLite, i.MX 6Solo, i.MX 6DualLite, and i.MX 6Quad families but above simple Cortex-M microcontrollers, offering a Linux-capable MPU at minimal BOM cost for connected edge devices.
Key differentiating features of the MCIMX6G2CVM05AA-FR include 528 MHz Cortex-A7 compute, integrated 10/100 Ethernet MAC with deterministic performance for industrial protocols, USB 2.0 with integrated PHY, multiple UART/SPI/I2C/CAN controllers, a 12-bit ADC, and an external memory interface supporting DDR3/LPDDR2 memories. The industrial-grade variant (denoted by the C field) supports an extended -40C to +105C junction temperature range enabling deployment in factory automation, building controls, and other harsh environments.
Architecturally, the device leverages ARM's Cortex-A7 core in single-core configuration with NEON and FPU optional extensions, paired with NXP's Smart DMA (SDMA) engine for peripheral offload and a hardware cryptography block (DCP) for secure boot and on-the-fly data encryption. This combination enables deterministic real-time response together with rich OS support (Linux, Windows Embedded, Android), making the part suitable for hybrid real-time + application workloads.
Typical applications for the MCIMX6G2CVM05AA-FR include industrial HMI panels, IoT edge gateways, smart energy metering, building automation controllers, medical point-of-care devices, and connected white goods. The low-power design supports battery-backed or energy-harvesting scenarios where sleep-mode current directly impacts total cost of ownership.
When designing with this MPU, allocate PCB layer stack and via-in-pad geometry for the 0.8 mm pitch 289-BGA, place the DDR3/LPDDR2 memories within the package's strict trace-length budget, and budget thermal dissipation assuming the industrial -40C to +105C junction envelope. A four-layer board with a continuous ground plane beneath the BGA is the typical minimum starting point.
This page synthesizes distributor availability, Rochester Electronics franchise stock, drop-in same-package alternatives within the i.MX 6UL family, application circuits, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: MCIMX6G2CVM05AA-FR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX6G2CVM05AA-FR （同一形状・フットプリント） — 相違点: Core Architecture, CAN, Ethernet, Memory Interface, Package.
クイック比較ツール — 並列比較する代替部品を選択:
MCIMX6G2CVM05AA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6G1CVM05AA
✅ ドロップイン✓ 在庫あり
$14.2 / 個
データシートを見る →MCIMX6G3CVM05AA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6U5DVM10AA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6G2DVM05AA
✅ ドロップイン✓ 在庫あり
$11.75 / 個
データシートを見る →MCIMX6G2CVM05AA-FR 最大定格＆電気的特性
| Core Architecture | ARM Cortex-A7 (32-bit) |
| Core Count | 1 |
| Maximum CPU Frequency | 528 MHz |
| Series | i.MX 6UltraLite |
| パッケージ | 289-MAPBGA (14x14 mm, 0.8 mm pitch) |
| Operating Temperature (junction, industrial) | -40C to +105C |
| Memory Interface | DDR3 / LPDDR2 (16-bit) |
| Ethernet | 10/100 MAC (IEEE 1588) |
| USB | USB 2.0 with integrated PHY |
| CAN | 2x FlexCAN |
| UART / SPI / I2C | Multiple instances (peripherals) |
| ADC | 12-bit |
| Display / GPU | None (headless MPU variant) |
| Security | DCP (Data Co-Processor), secure boot |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (BGA) |
MCIMX6G2CVM05AA-FR 289-mapbga (14x14 mm, 0.8 mm pitch) ピン配置ガイド
MCIMX6G2CVM05AA-FR (289-mapbga (14x14 mm, 0.8 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX6G2CVM05AA-FR.
詳細は データシート をご参照ください。
主な用途
MCIMX6G2CVM05AA-FR の用途: 6 件s: Industrial IoT Edge Gateway, Building Automation Controller, Smart Energy Meter, Medical Point-of-Care Device, Connected White Goods / Home Appliance, Human-Machine Interface (HMI) Controller.
Industrial IoT Edge Gateway
The MCIMX6G2CVM05AA-FR fits industrial IoT edge gateways because its 528 MHz Cortex-A7 core, integrated 10/100 Ethernet MAC with IEEE 1588 timestamping, and dual FlexCAN controllers handle protocol conversion and edge analytics at low power. The 289-MAPBGA package with industrial -40C to +105C junction range allows deployment in factory-floor enclosures without active cooling. Placed as the central MPU between upstream sensors and upstream MQTT/OPC-UA brokers, it runs Linux with NXP's BSP and leaves thermal and BOM headroom for a Wi-Fi/BLE module. Designers should pair the part with 16-bit DDR3 or LPDDR2 memory and provision a 4-layer PCB with continuous ground beneath the BGA.
おすすめ
Building Automation Controller
Building automation controllers benefit from the MCIMX6G2CVM05AA-FR's blend of Cortex-A7 Linux capability and industrial peripherals including dual FlexCAN, multi-instance UART/SPI/I2C, and 12-bit ADC for sensor integration. The part's headless configuration suits controllers driving an external Cortex-M panel MCU rather than a graphics LCD, keeping system cost low. With -40C to +105C junction support, the MPU can be placed in unheated plant rooms. A typical design uses the part's 10/100 Ethernet for BACnet/IP or Modbus TCP uplink while running local control loops. Allow PCB space for an external watchdog supervisor and a discrete RTC companion.
おすすめ
Smart Energy Meter
Smart energy meter designs leverage the MCIMX6G2CVM05AA-FR's low-power Cortex-A7 plus its hardware DCP crypto block for secure metering data and tamper-resistant boot. The integrated 12-bit ADC handles voltage and current sensing channels while the FlexCAN ports connect to utility-grade communication buses. Its industrial temperature envelope supports outdoor meter enclosures in sun-loaded cabinets. Pair the part with a metrology AFE, a battery-backed RTC, and a cellular or PLC modem on UART or SPI. The MCIMX6G2CVM05AA-FR's small MAPBGA footprint and low BOM cost make it a strong fit for high-volume smart-meter production.
おすすめ
Medical Point-of-Care Device
Medical point-of-care devices such as bedside analyzers and portable diagnostic readers can use the MCIMX6G2CVM05AA-FR when deterministic connectivity and a Linux-capable CPU are required. The integrated Ethernet MAC, USB 2.0 with PHY, and multiple serial controllers link to barcode scanners, sample cartridges, and LIS/EHR uplinks. The Cortex-A7 at 528 MHz delivers responsive UI throughput without forcing the larger, hotter i.MX 6Solo/6Dual parts. Industrial-grade temperature support accommodates clinical environments. Designers must still add a separate IEC 60601 isolation barrier and verify the part's documented ESD/latch-up performance against the IEC 60601-1 system standard.
おすすめ
Connected White Goods / Home Appliance
Connected white-goods designs such as smart ovens, washers, and HVAC controllers find the MCIMX6G2CVM05AA-FR attractive because it bundles Cortex-A7 compute, Ethernet, Wi-Fi/BLE-ready serial interfaces, and ADC channels in one industrial-temp BGA. Its lower power versus the i.MX 6SoloLite fits energy-budgeted appliances. The 289-MAPBGA supports compact appliance mainboards; designers route motor-control PWM and inverter signals away from the MPU's analog and clock traces. Pair the part with an external Class-D amplifier CODEC if audio prompting is required and provision an SPI NOR flash for fast-boot UI rendering.
おすすめ
Human-Machine Interface (HMI) Controller
The MCIMX6G2CVM05AA-FR serves as the back-end controller for mid-resolution HMIs that pair the MPU with a separate graphics-capable MCU or small TFT panel via SPI/parallel RGB. Its Linux-capable Cortex-A7 runs HMI state machines, communicates with field-bus peripherals over CAN/UART, and brokers data with cloud services over Ethernet. The industrial temperature range supports control cabinet mounting. PCB layout should isolate the BGA's high-speed DDR3 traces from the analog ADC inputs and provide 4-layer stack with a solid ground plane to meet SI margins on the memory bus.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX6G2CVM05AA-FR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX6G2CVM05AA | MCIMX6G1CVM05AA | MCIMX6G3CVM05AA | MCIMX6U5DVM10AA | MCIMX6G2DVM05AA |
|---|---|---|---|---|---|---|
| Package | 289-MAPBGA (14x14 mm, 0.8 mm pitch) | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM Cortex-A7 (32-bit), 1 core | ARM Cortex-A7, 1 core | ARM Cortex-A7, 1 core | ARM Cortex-A7, 1 core | ARM Cortex-A7, 1 core | ARM Cortex-A7, 1 core |
| Maximum CPU Frequency | 528 MHz | 528 MHz | 528 MHz | 528 MHz | 900 MHz | 528 MHz |
| USB 2.0 with PHY | Yes | Yes | Yes | Yes | Yes | Yes |
| FlexCAN | 2x | 2x | 1x | 2x | 2x | 2x |
| 10/100 Ethernet MAC | Yes (IEEE 1588) | Yes (IEEE 1588) | Yes (IEEE 1588) | Yes (IEEE 1588) | Yes (IEEE 1588) | Yes (IEEE 1588) |
| Display / GPU | None (headless) | None (headless) | None (headless) | None (headless) | None (headless) | None (headless) |
主な差別化要因
- Industrial-grade temperature variant in the same 289-BGA footprint （vs MCIMX6G2DVM05AA)
- Drop-in pin compatibility with i.MX 6UltraLite speed-grade variants （vs MCIMX6G1CVM05AA)
- Higher CPU headroom available with the 6ULz refresh in same package （vs MCIMX6U5DVM10AA)
設計ノート
The 289-MAPBGA at 0.8 mm pitch demands via-in-pad (VIP) technology for the inner rows and a 4-layer stack-up minimum with a continuous reference ground plane under the BGA. Use micro-via (laser-drilled) stackups for inner-row breakout, and maintain the DDR3/LPDDR2 trace-length budgets (data-byte-to-clock skew under 25 ps typical) defined in the i.MX 6UL Hardware Developer's Guide. Power decoupling: 1x 22 uF bulk + 4x 100 nF + 2x 10 nF placed within 1 mm of the BGA supply pins.
Estimated: with theta_JA around 25 C/W on a 4-layer JEDEC board, full 528 MHz CPU load plus active Ethernet typically dissipates 0.8-1.2 W in the core region. Junction temperature rise at 25 C ambient sits at 20-30 C - within the -40C to +105C industrial envelope. For sealed enclosures with limited airflow, derate CPU clock or budget for a small top-side copper spreader. Measure theta_JA on your actual board before finalizing.
Do not assume the -FR suffix indicates a different speed grade - verify against the i.MX 6UL datasheet that electrical and pin parameters are identical to the base MPN. Boot-mode pins (BOOT_MODE[1:0]) are sampled at reset; wrong settings cause silent boot failures. Always provision an SD-card or eMMC boot path during development so you can recover eMMC-bricking mistakes via SD card boot. Use NXP's Manufacturing Tool (MfgTool) for first-time board bring-up.
コンプライアンス情報
RoHS and REACH compliance per NXP product page environmental information. AEC-Q100 not applicable - this is a consumer/industrial-grade MPU; for automotive designs see NXP's i.MX 6UL AEC-Q100 qualified variants.