MCIMX6L3EVN10AA - i.MX6SoloLite 1GHz Cortex-A9 MPU | NXP | 432-MAPBGA
部品番号: MCIMX6L3EVN10AA ✓ 生産中MCIMX6L3EVN10AA 概要
A microprocessor (MPU) is a system-on-chip (SoC) that integrates one or more CPU cores, memory controllers, peripheral interfaces, and graphics subsystems on a single die. The i.MX6 family belongs to NXP's EdgeVerse platform and sits in the hierarchy: Cortex-A9 CPU -> ARM Cortex family -> 32-bit RISC processor -> microprocessor -> SoC -> integrated circuit. The SoloLite sub-family is optimized for low-power, display-centric applications where rich graphics and aggressive power management outweigh peak compute.
Key features include the ARM Cortex-A9 single core with Neon SIMD and VFPv3 floating-point hardware, an integrated EPD controller for direct electrophoretic panel drive, hardware-accelerated video and 2D graphics, and an advanced power-management unit supporting deep-sleep, sleep, and standby modes. The device integrates LPDDR2/DDR3/LPDDR3 memory controllers and a rich set of peripherals including USB, Ethernet, UART, SPI, I2C, and I2S audio interfaces.
Architecturally, the i.MX6SoloLite uses a 40 nm process and pairs the Cortex-A9 with the Vivante GC320 2D graphics engine plus an EPDC that supports up to 2048x1536 at 5-bit grayscale or 16-level grayscale electrophoretic panels. Multi-stream display pipelines enable concurrent LCD and EPD operation - a key differentiator vs single-display controllers.
Typical applications include e-readers (Kindle-class), industrial HMI panels with e-paper secondary display, portable medical tablets, point-of-sale terminals, and rugged handhelds requiring long battery life. The integrated EPD controller eliminates the need for an external display timing ASIC, reducing BOM and PCB area.
When designing with this MPU, allocate at least 6 PCB layers for the 432-ball BGA breakout, follow NXP's DDR3/LPDDR2 routing guidelines for the memory interface, and ensure the PMIC sequencing matches NXP's PF3000/PF0100 reference designs for proper power-up.
This page synthesizes distributor pricing, application notes, and same-family i.MX6 drop-in alternatives not consolidated in the manufacturer datasheet.
ドロップイン代替品: MCIMX6L3EVN10AA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX6L3EVN10AA （同一形状・フットプリント）.
MCIMX6L3EVN10AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L3EVN10AC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L3DVN10AA
✅ ドロップイン価格はお問い合わせください
データシートを見る →MCIMX6L3EVN10AB-R
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L3EVN10AA 最大定格＆電気的特性
| Manufacturer | NXP USA Inc. |
| Series | i.MX6 SoloLite |
| Core Processor | ARM Cortex-A9 |
| Number of Cores / Bus Width | 1 Core / 32-Bit |
| Speed | 1.0 GHz |
| Co-processors / DSP | Multimedia; NEON SIMD, VFPv3 |
| パッケージ / ケース | 432-MAPBGA, 13 mm x 13 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (industrial) |
| 電源電圧 | 0.95 V to 1.5 V core, 1.8 V / 2.8 V / 3.3 V I/O |
| Memory Interface | LPDDR2, DDR3, DDR3L, LPDDR3 |
| Display Controller | EPDC up to 2048x1536 + parallel LCD |
| Graphics Accelerator | Vivante GC320 2D |
| USB | USB 2.0 OTG + USB 2.0 Host |
| Ethernet | 10/100 Mbps MAC |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MCIMX6L3EVN10AA ピン構成
| ピン A1 | VSS — Ground reference |
| ピン B12 | DRAM_DQM0 — DDR3 data mask 0 |
| ピン G6 | NVCC_EPD — EPD interface I/O supply |
| ピン K11 | EPDC_DATA00 — EPD data line 0 |
| ピン M18 | LCD_DATA00 — LCD data line 0 |
| ピン AC15 | USB_OTG_DP — USB OTG D+ line |
| ピン AE2 | VDD_ARM — ARM core supply (0.95 V to 1.25 V) |
| ピン AB24 | POR_B — Power-on reset (active low) |
主な用途
MCIMX6L3EVN10AA の用途: 6 件s: E-Reader / E-Paper Tablet, Industrial HMI with E-Paper Secondary Display, Portable Medical Tablet, Point-of-Sale Terminal, Rugged Handheld / Field Service Device, Smart Home Control Panel with E-Paper.
E-Reader / E-Paper Tablet
The MCIMX6L3EVN10AA is purpose-built for Kindle-class e-readers, with an integrated EPDC supporting 2048x1536 at 5-bit grayscale plus concurrent LCD output. The SoloLite sub-family's deep-sleep power mode (<100 uA) enables weeks of battery standby. Pair with a 6-inch e-paper panel and LPDDR2 for a sub-$80 BOM.
おすすめ
Industrial HMI with E-Paper Secondary Display
Industrial HMIs use the MCIMX6L3EVN10AA's dual-display capability to drive an LCD for active interaction and an EPD panel for always-on status pages that retain image during power loss. The -40C to +85C operating range supports factory floor deployment. Concurrent display pipelines are unique to the SoloLite variant.
おすすめ
Portable Medical Tablet
Medical tablets leverage the MCIMX6L3EVN10AA's 1 GHz Cortex-A9 performance for real-time vitals display on LCD while the EPDC shows patient ID and medication records with zero backlight power. Hardware AES and secure boot via the i.MX6 HAB module support FDA 21 CFR Part 11 data integrity requirements.
おすすめ
Point-of-Sale Terminal
POS terminals benefit from the MCIMX6L3EVN10AA's Ethernet MAC, USB 2.0 host, and hardware cryptographic accelerators. The SoloLite variant draws less than 1W active, enabling fanless POS designs. Customer-facing displays can be e-paper for static pricing while the main LCD handles transaction flow.
おすすめ
Rugged Handheld / Field Service Device
Field service devices use the MCIMX6L3EVN10AA's wide operating temperature range and low standby power for multi-day battery operation. The integrated EPDC displays work orders and schematics on e-paper for sunlight readability. Hardware crypto and HAB secure boot protect firmware in field conditions.
おすすめ
Smart Home Control Panel with E-Paper
Smart home hubs combine the MCIMX6L3EVN10AA's Cortex-A9 performance with EPDC to provide an always-on secondary display showing temperature, security status, and weather without backlight power. The 1 GHz core runs Linux-based automation stacks like Home Assistant comfortably. Ethernet and Wi-Fi via SDIO enable gateway functions.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX6L3EVN10AA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX6L3EVN10AB | MCIMX6L3EVN10AC | MCIMX6L3DVN10AA | MCIMX6L3EVN10AB-R |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13) | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same |
| Core Speed | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Operating Temperature | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +105C (extended) | -40C to +85C (industrial) | 0C to +70C (commercial) |
| Architecture | ARM Cortex-A9 1-core | ARM Cortex-A9 1-core | ARM Cortex-A9 1-core | ARM Cortex-A9 1-core | ARM Cortex-A9 1-core |
| Packaging Form | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
| EPD Controller | Integrated (2048x1536) | Integrated (2048x1536) | Integrated (2048x1536) | Integrated (2048x1536) | Integrated (2048x1536) |
| Lifecycle Status | Active | Active | Active | Active | Active |
主な差別化要因
- Integrated EPD controller on-die （vs MCIMX6S6AVM08AC)
- Wide industrial temperature range （vs MCIMX6L3EVN10AB)
- Mature software ecosystem （vs i.MX7D)
設計ノート
Route the 432-ball MAP-BGA breakout on a minimum 6-layer PCB stack-up with the reference planes immediately adjacent to the outer signal layers. Use 0.5 mm pitch micro-vias (laser-drilled, filled and plated) for inner-row fanout. Per NXP's i.MX6 hardware design guidelines, keep the DDR3/LPDDR2 byte lanes matched within 25 mils to preserve signal integrity. Decouple each VDD_ARM/VVDD_SOC ball with a 100 nF X7R 0201 ceramic plus a 10 uF 0402 bulk capacitor placed within 1 mm of the pin.
The i.MX6 SoloLite requires 13 separate voltage rails with specific sequencing: VDD_ARM (1.0-1.25 V) must precede VDD_SOC (1.0-1.15 V) by at least 1 ms. NXP's PF3000 PMIC implements this sequencing natively and provides the POR_B reset signal. Avoid discrete regulator solutions for production designs - the PMIC integrates DVFS support that scales VDD_ARM with CPU load, reducing active power by up to 40% in typical workloads.
The 13x13 mm MAP-BGA has a junction-to-ambient thermal resistance of approximately 15 C/W with a 4-layer JEDEC test PCB. At 1 GHz full Cortex-A9 load, expect 1.5-2 W dissipation. For fanless handheld designs, spread thermal vias under the package center and use a 2 oz copper inner plane connected to the thermal pad. At ambient temperatures above 60 C, derate CPU clock to 800 MHz to maintain junction below 105 C.
Do not apply power to the EPDC interface (NVCC_EPD) before VDD_SOC is stable - this can latch the EPD controller. Always reset the device via POR_B after power-up. The boot mode pins (BOOT_CFG) must be pulled to valid logic levels before POR_B deasserts; floating boot pins cause unpredictable boot behavior. For eMMC boot, ensure the eMMC device is reset after POR_B to avoid bus contention.
コンプライアンス情報
RoHS and REACH compliant per NXP product declaration. Not AEC-Q100 qualified - this is a consumer/industrial MPU, not an automotive part. Lead-free reflow profile per JEDEC J-STD-020.
