MCIMX6L7DVN10AB - i.MX 6SoloLite ARM Cortex-A9 1GHz MPU | NXP Semiconductors
部品番号: MCIMX6L7DVN10AB ✓ 生産中MCIMX6L7DVN10AB 概要
An applications processor is a system-on-chip that integrates a CPU core, memory controllers, graphics/display pipelines, and a rich peripheral set into a single device, displacing discrete microcontrollers plus external glue logic. Within the broader taxonomy, the i.MX 6SoloLite sits below the i.MX 6 family, which is itself part of the NXP i.MX applications processor portfolio, spanning Cortex-A class devices used in industrial HMI, automotive infotainment, and consumer multimedia. The "Solo" naming indicates single-core operation, distinguishing it from Dual/Quad siblings in the same family while preserving software and pin compatibility across the line.
Key differentiating features include a hardware-accelerated LCD interface with LVDS bridge support, integrated power management with multiple LDOs and DCDC controllers for energy-aware operation, and an enhanced multimedia subsystem including a GPU (GC320 composition) and VFPv3 floating-point unit. The device supports external DDR3/LPDDR2 memory, multiple connectivity options (USB, Ethernet, CAN, PCIe), and hardware cryptography accelerators, all on a low-power process.
Typical applications span industrial HMI panels, e-readers, portable medical displays, point-of-sale terminals, and IoT gateways. The combination of 1 GHz Cortex-A9 throughput and the integrated display pipeline makes this part well suited to driving LVDS panels while running a Linux-based UI stack.
When designing with this part, allocate PCB area for the 432-ball MAPBGA (0.5 mm or 0.4 mm pitch, per device variant) and provide a multi-layer PCB with controlled-impedance routing for DDR3 traces. The integrated power management IC requires proper decoupling sequencing during boot. Drop-in compatible siblings (L2/L3/L5) allow memory or peripheral scaling without PCB rework.
ドロップイン代替品: MCIMX6L7DVN10AB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX6L7DVN10AB （同一形状・フットプリント） — 相違点: Mounting Type, Package, Series.
MCIMX6L5DVN10AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L3DVN10AB
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MCIMX6L2DVN10AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L7DVN10AA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L3EVN10AB
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MCIMX6L7DVN10AB 最大定格＆電気的特性
| Core Architecture | ARM Cortex-A9 (32-bit) |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.0 GHz |
| Series | i.MX 6SoloLite |
| Graphics Processor | GC320 (2D composition) |
| Floating Point Unit | VFPv3 + NEON SIMD |
| Memory Interface | DDR3 / LPDDR2 (external) |
| Display Interface | LCD controller + LVDS bridge |
| パッケージ | MAPBGA-432 (13x13 mm) |
| Ball Pitch | 0.5 mm (per datasheet mechanical drawing) |
| 動作温度 | -40C to +105C (industrial) |
| Supply Voltage (Core) | 1.375 V to 1.5 V |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
MCIMX6L7DVN10AB ピン構成
| ピン A1 | VDD_ARM — ARM core supply |
| ピン B5 | GND — Common ground |
| ピン C9 | LVDS_DATA_P — LVDS data positive |
| ピン D12 | BOOT_MODE0 — Boot mode selection bit 0 |
主な用途
MCIMX6L7DVN10AB の用途: 6 件s: Industrial HMI Terminals, Medical Diagnostic Displays, E-Reader and Consumer Multimedia, Point-of-Sale (POS) Terminals, IoT Edge Gateways, Industrial Control Panels.
Industrial HMI Terminals
The MCIMX6L7DVN10AB drives industrial HMI terminals requiring responsive touch-screen graphics. Its ARM Cortex-A9 at 1 GHz executes the Qt/GTK UI stack smoothly while the integrated LVDS bridge connects directly to 1080p industrial panels without external hardware. The GC320 2D GPU accelerates GUI composition; -40 to +105C operating range suits factory-floor enclosures. NXP's Yocto BSP support shortens time-to-market for Linux-based HMI projects.
おすすめ
Medical Diagnostic Displays
The MCIMX6L7DVN10AB integrates an LVDS bridge and parallel display controller suitable for medical imaging panels. Its VFPv3 + NEON SIMD accelerates DICOM image preprocessing at the edge. Industrial temperature grade and long-term NXP product longevity support a 10+ year service life required by medical OEMs. Hardware crypto accelerators secure patient data at rest, and the Cortex-A9 core runs medical-grade Linux stacks including FDA-recognized distributions.
おすすめ
E-Reader and Consumer Multimedia
Consumer e-readers and portable multimedia devices benefit from the MCIMX6L7DVN10AB's low-power Cortex-A9 + LVDS display drive. The integrated display pipeline simplifies E-ink or LCD panel interface with no external bridge chip required. Power management features include DVFS for dynamic voltage/frequency scaling to extend battery life on typical 8-10 hour sessions. NXP's BSP supports Android AOSP builds targeting consumer devices.
おすすめ
Point-of-Sale (POS) Terminals
The MCIMX6L7DVN10AB's 1 GHz Cortex-A9 + integrated crypto accelerators are well matched to payment-terminal encryption (PCI PTS) workloads in POS terminals. The LVDS bridge connects to bright retail display panels while USB + Ethernet + CAN peripherals cover printer, scanner, and cash-drawer integration. Industrial temperature grade supports kitchen or outdoor retail environments, and NXP's secure-boot support assists PCI-PTS 5/6 certification processes.
おすすめ
IoT Edge Gateways
IoT edge gateways use the MCIMX6L7DVN10AB as a Linux processing node aggregating sensor data via Ethernet/CAN/USB. Its Cortex-A9 + 1 GHz capability runs MQTT brokers, local database, and protocol bridges on the gateway side. Hardware crypto supports TLS termination. The wide peripheral mix (PCIe, USB, multiple UART, SPI, I2C) connects to industrial sensor busses typical in building automation or smart-factory gateways.
おすすめ
Industrial Control Panels
The MCIMX6L7DVN10AB drives industrial control panels where LVDS-to-LCD bridge integration reduces BOM and PCB real estate. The Cortex-A9 runs CODESYS or PLC-style soft-logic while exposing CAN, RS-232, RS-485, and Ethernet for industrial field-busses. NXP's longevity program and -40 to +105C industrial temperature grade align with 10+ year factory-automation service life, while the LVDS display enables capacitive touch-panel integration.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX6L7DVN10AB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX6L5DVN10AB | MCIMX6L3DVN10AB | MCIMX6L2DVN10AB | MCIMX6L7DVN10AA | MCIMX6L3EVN10AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-432 (13x13 mm) | MAPBGA-432 (13x13 mm) - same | MAPBGA-432 (13x13 mm) - same | MAPBGA-432 (13x13 mm) - same | MAPBGA-432 (13x13 mm) - same | MAPBGA-432 (13x13 mm) - same |
| Core Architecture | ARM Cortex-A9 (1 core) | ARM Cortex-A9 (1 core) | ARM Cortex-A9 (1 core) | ARM Cortex-A9 (1 core) | ARM Cortex-A9 (1 core) | ARM Cortex-A9 (1 core) |
| Maximum Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| LVDS Bridge | Yes | Yes | No | No | Yes | No |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
主な差別化要因
- Integrated LVDS display bridge vs no-LVDS siblings （vs MCIMX6L3DVN10AB)
- Higher multimedia performance variant within same package （vs MCIMX6L5DVN10AB)
- Mass production version vs engineering sample （vs MCIMX6L7DVN10AA)
設計ノート
The MAPBGA-432 (13x13 mm) package at 0.5 mm ball pitch requires 6-layer or 8-layer PCB with 0.4 mm laser-drilled micro vias, per the NXP hardware reference manual. Use 100 um dielectric between top and ground/power planes. Match DDR3 trace lengths within 25 mil to maintain signal integrity at 800 MHz. Place decoupling capacitors directly under the BGA balls using land-side array capacitors (LSCs) where the inner pitch allows.
The integrated PMU requires proper supply ramp sequencing during boot (VDD_ARM, VDD_SOC, VDD_HIGH) per the NXP reference manual. Use NXP-recommended discrete buck/boost regulators (e.g., PF0100) with sequencing logic. Add bulk decoupling on each rail plus local 100 nF + 10 uF ceramic at the SoC supply pins. Thermal monitoring requires a dedicated ADC channel for on-die temperature sensor; reference schematic and voltage sequencing in the i.MX 6SoloLite BSP documentation.
At 1 GHz continuous load, the MCIMX6L7DVN10AB's junction temperature must be kept under 105C TJ. Use 4-layer thermal vias (0.3 mm drill, 1.0 mm pitch) under the central ball grid to sink heat to inner copper planes. The MAPBGA-432 dissipates up to 3 W in typical workloads with DVFS. Provide chassis airflow or copper spreading in industrial enclosures to maintain margin under heavy GUI load.
Do not exceed the 1.5 V maximum VDD_ARM supply. Use only NXP-qualified DDR3/LPDDR2 grades and follow reference schematic exactly. Boot configuration pins (BOOT_MODE0/1, BT_CFG) must be stable at POR; floating boot pins can cause boot loop. The LVDS bridge requires the LVDS_2P5 supply rail - do not ground unused LVDS balls without consulting NXP errata. Reference manual errata must be checked for known silicon revisions.
コンプライアンス情報
RoHS and REACH compliant per NXP product environmental compliance. AEC-Q100 not applicable (industrial-grade processor, not automotive-specific). Halogen-free per NXP declaration.
