MCIMX6Y2DVK09AB - i.MX6ULL 900MHz Cortex-A7 MPU | NXP
部品番号: MCIMX6Y2DVK09AB ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.86 | $11.86 |
| 10 | $10.95 | $109.50 |
| 100 | $9.4 | $940.00 |
| 500 | $8.2 | $4,100.00 |
| 1,000 | $7.1 | $7,100.00 |
MCIMX6Y2DVK09AB 概要
An applications processor is a system-on-chip (SoC) that integrates a CPU core, memory controller, peripherals, and often graphics and multimedia accelerators onto a single die, replacing what would otherwise require multiple discrete ICs. The i.MX 6ULL belongs to the i.MX family of multimedia applications processors — sitting within the broader taxonomy of microprocessor unit (MPU) > applications processor > ARM Cortex-A system-on-chip. The Cortex-A7 core implements the ARMv7-A architecture with Neon SIMD and VFPv4, supporting symmetric multiprocessing concepts even in this single-core configuration for future scalability within the family.
Key features of the MCIMX6Y2DVK09AB include 900 MHz maximum CPU clock, integrated LPDDR2/DDR3/LPDDR3 memory controller, dual Ethernet/Can-bond 10/100 Mbps MAC, USB 2.0 OTG plus USB 2.0 host with PHY, LCD controller up to WXGA, and a wide peripheral set including UART, SPI, I2C, I2S, PWM, and SD/MMC. The integrated PMIC companion interface reduces BOM and PCB area compared with discrete power designs. The ROM Performance Enhanced variant is pre-programmed with NXP ROM firmware that enables fast boot, secure boot, and HAB (High Assurance Boot) on this specific die revision.
This part targets cost-sensitive and power-efficient applications: human-machine interface (HMI) panels, IoT edge gateways, e-readers, portable medical, industrial control, and connected consumer devices. The 272 MAPBGA package is optimized for high-density 4-layer PCB designs with thermal performance suitable for fan-less industrial enclosures.
When designing with this part, plan power rail sequencing carefully — even with the integrated PMIC companion logic, an external PMIC (such as the NXP PF3000 or PF8100 family) is required for full SoC operation. Decoupling and bulk capacitor selection around the 272-ball BGA is critical; refer to the NXP hardware design guide for the validated stack-up and via pattern.
ドロップイン代替品: MCIMX6Y2DVK09AB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX6Y2DVK09AB （同一形状・フットプリント） — 相違点: Core Architecture, Ethernet, Package.
クイック比較ツール — 並列比較する代替部品を選択:
MCIMX6Y2CVM08AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6Y2DVM09AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6Y1CVK05AB
✅ ドロップイン✓ 在庫あり
$13.9 / 個
データシートを見る →MCIMX6Z0DVM09AB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6Y2DVK09AB 最大定格＆電気的特性
| Core Architecture | ARM Cortex-A7 |
| Core Count | 1 |
| データバス幅 | 32-Bit |
| Maximum CPU Clock | 900 MHz |
| パッケージ | 272-MAPBGA (9x9 mm) |
| Firmware Variant | ROM Performance Enhanced |
| Memory Controller | 16-bit LPDDR2/DDR3/LPDDR3 |
| Ethernet | 2x 10/100 Mbps MAC |
| USB | 1x USB 2.0 OTG + 1x USB 2.0 Host with PHY |
| Display | LCD controller up to WXGA resolution |
| 動作温度 | -40C to +105C (industrial) |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MCIMX6Y2DVK09AB 272-mapbga (9x9 mm) ピン配置ガイド
MCIMX6Y2DVK09AB (272-mapbga (9x9 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX6Y2DVK09AB.
詳細は データシート をご参照ください。
主な用途
MCIMX6Y2DVK09AB の用途: 6 件s: Industrial HMI Panels, IoT Edge Gateways, Portable Medical Devices, E-Reader and Smart Display, Connected Consumer Devices, Automotive Infotainment (Non-Safety).
Industrial HMI Panels
The MCIMX6Y2DVK09AB drives industrial human-machine interface panels thanks to its WXGA-resolution LCD controller, dual 10/100 Ethernet MACs for networked control, and 900 MHz Cortex-A7 headroom for Qt/Embedded GUI rendering. The 272-MAPBGA's thermal envelope supports fanless operation, and the ROM Performance Enhanced firmware enables <500 ms secure boot for fast power-on response.
おすすめ
IoT Edge Gateways
Edge gateways aggregating sensor data benefit from the 6ULL's Linux support, dual Ethernet for LAN + WAN segmentation, and USB OTG host for cellular modem tethering. The 900 MHz Cortex-A7 runs containerized workloads at sub-watt power, while the integrated PMIC companion interface keeps the power tree compact enough for DIN-rail enclosures. Industrial temperature grade (VK suffix) supports outdoor or factory-floor installation.
おすすめ
Portable Medical Devices
Patient monitors and handheld diagnostics use the MCIMX6Y2DVK09AB for low-power Linux processing of vital signs with TFT-LCD display, USB device charging, and secure Wi-Fi/BT tethering via companion modules. The Cortex-A7's NEON SIMD accelerates FFT-based ECG signal processing, and the 6ULL's <1 W typical power extends battery life. Industrial temperature tolerance supports emergency-vehicle and clinical environments.
おすすめ
E-Reader and Smart Display
E-readers and smart retail signage use the MCIMX6Y2DVK09AB's LCD controller to drive up to WXGA TFT or ePaper panels at low refresh rates, with the Cortex-A7 handling PDF rendering and EPUB parsing under Linux. USB OTG enables on-the-go content transfer, and the industrial temperature grade supports outdoor kiosks. Power dissipation under 1 W preserves all-day battery life on e-reader form factors.
おすすめ
Connected Consumer Devices
Smart speakers, networked appliances, and home automation hubs leverage the MCIMX6Y2DVK09AB's Cortex-A7 for cloud-agent processing, the dual Ethernet plus Wi-Fi/BT companion for mesh connectivity, and the USB host for peripheral expansion. The ROM Performance Enhanced firmware delivers fast-boot responsiveness consumers expect, while the 900 MHz performance handles local voice-trigger pre-processing before cloud handoff.
おすすめ
Automotive Infotainment (Non-Safety)
Non-safety automotive displays such as rear-seat entertainment and instrument-cluster companions use the MCIMX6Y2DVK09AB's WXGA LCD controller, CAN/Ethernet interfaces, and -40C to +105C temperature grade. For safety-critical ECUs requiring AEC-Q100, designers should migrate to the NXP i.MX 8 series with full automotive qualification; this 6ULL variant targets non-safety body-electronics and aftermarket accessories.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX6Y2DVK09AB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX6Y2CVM08AB | MCIMX6Y2DVM09AB | MCIMX6Y1CVK05AB | MCIMX6Z0DVM09AB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-MAPBGA (9x9 mm) | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same |
| Maximum CPU Clock | 900 MHz | 528 MHz (-41%) | 900 MHz (same) | 528 MHz (-41%) | 900 MHz (same) |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C | 0C to +95C (commercial) | -40C to +105C | 0C to +95C |
| Firmware Variant | ROM Performance Enhanced | ROM Performance Enhanced | ROM Performance Enhanced | ROM Basic | ROM Performance Enhanced |
| Core Architecture | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 (6ULZ cost-down) |
| Ethernet MACs | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps |
| USB | OTG + Host with PHY | OTG + Host with PHY | OTG + Host with PHY | OTG + Host with PHY | OTG only (reduced) |
主な差別化要因
- Highest speed grade in i.MX 6ULL family with industrial temperature （vs MCIMX6Y2CVM08AB)
- Industrial temperature range with full 900 MHz speed （vs MCIMX6Y2DVM09AB)
- ROM Performance Enhanced firmware with secure boot （vs MCIMX6Y1CVK05AB)
設計ノート
The 272-MAPBGA package at 0.5 mm pitch requires a 4-layer minimum PCB stack-up with laser-drilled micro-vias or via-in-pad (VIP) for the BGA escape. NXP's hardware design guide recommends a 1.6 mm total board thickness with the top layer dedicated to SoC escape, layer 2 as GND pour, layer 3 for power, and bottom for signal routing. Maintain a continuous GND pour directly under the BGA with thermal vias connecting to the inner GND plane for heat dissipation.
At 900 MHz, the MCIMX6Y2DVK09AB dissipates approximately 0.8-1.0 W typical, requiring the thermal pad on the BGA to be soldered to a 4x4 thermal via array connecting to inner planes. Estimated junction temperature at 25C ambient with a 4x4 via array: Tj ~55-65C, well within industrial limits. For fanless enclosures, provide at least 20x20 mm of inner copper pour connected to the thermal pad to keep Tj below 105C in worst-case 70C ambient.
The MCIMX6Y2DVK09AB requires the NXP PF3000, PF8100, or compatible companion PMIC for sequencing the multiple SoC voltage rails (VDD_ARM, VDD_SOC, VDD_DDR, etc.). The integrated power management module reduces sequencing complexity but does not replace external regulators. Place bulk decoupling (22 uF X5R) within 5 mm of each SoC power pin and add 100 nF high-frequency decoupling at every power pin per the i.MX 6ULL hardware design guide.
Avoid using boot mode pins in floating state during reset - configure BOOT_CFG pins with explicit pull-ups or pull-downs to set the desired boot source (SD, eMMC, QSPI, NAND). Failing to do so results in non-deterministic boot on some PCB layouts. Also, the USB OTG VBUS pin requires a 50 uF bulk capacitor per USB 2.0 spec; reducing this capacitance can cause enumeration failures on attached USB devices.
コンプライアンス情報
RoHS compliant per NXP product page (MCIMX6Y2DVK09AB marked lead-free / RoHS Compliant). Not AEC-Q100 qualified - for safety-critical automotive, choose i.MX 8 with full automotive qualification. Halogen-free status not explicitly stated in verified data - left unknown per data authenticity rules.
