MCZ33903C5EKR2 - SBC with CAN/LIN, 5V MCU Regulator | NXP
部品番号: MCZ33903C5EKR2 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $6.18 | $61.80 |
| 100 | $5.72 | $572.00 |
| 500 | $5.1 | $2,550.00 |
| 1,000 | $4.65 | $4,650.00 |
MCZ33903C5EKR2 概要
A System Basis Chip is a power management IC that combines a voltage regulator, communication transceivers (CAN, LIN, FlexRay), and system-level protections into one package. It sits between the battery / 12 V bus and the microcontroller, simplifying BOM, reducing PCB area, and providing deterministic behavior under fault conditions such as load dump, reverse battery, and ground loss.
The MCZ33903C5EKR2 includes a fully-protected embedded 5.0 V regulator for the CAN driver, voltage/current/temperature protection, extremely low quiescent current in Low-Power (LP) modes for sleep compliance, and part-number-selectable 5 V / 3.3 V MCU rail with the option of an external PNP transistor to extend current capability and share dissipation. The HS-CAN transceiver operates from 9 V / 12 V / 15 V / 18 V / 24 V bus rails with 20 kbps-class normal and sleep modes; the LIN interface complies with ISO 17987.
Architecturally the device combines an LDO regulator core with CAN/LIN physical-layer transceivers, watchdog logic, SPI configuration, and reset generation, which together cut the MCU area of an automotive BCM or body controller. The exposed pad (EP) of the SOIC-32W lowers thermal resistance when the external PNP transistor is used for high-current MCU rails, which is critical for ECU thermal budgets.
Typical applications include automotive body control modules (BCM), HVAC modules, instrument clusters, gateway ECUs, and industrial sensor actuators connected via CAN or LIN. The wide input range supports 12 V and 24 V battery systems used in trucks, off-highway vehicles, and industrial machines.
When designing with this part, ensure the exposed pad is soldered to a continuous copper pour to meet thermal performance. The 5 V / 3.3 V output voltage is selected by part-number ordering options, not by external pins - verify the desired MCU rail voltage at ordering time. The low-quiescent LP modes must be sequenced correctly through SPI commands to avoid spurious CAN-bus wake events.
This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not collected in the manufacturer datasheet, with parameters anchored to the FindIC and DigiKey listings as of 2026-10-15.
ドロップイン代替品: MCZ33903C5EKR2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCZ33903C5EKR2 （同一形状・フットプリント） — 相違点: Package, Watchdog / Reset.
クイック比較ツール — 並列比較する代替部品を選択:
MCZ33903C5EK
✅ ドロップイン✓ 在庫あり
$4.85 / 個
データシートを見る →MCZ33903CS5EKR2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCZ33903DS3EKR2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCZ33904AEKR2
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCZ33390EFR2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCZ33903C5EKR2 最大定格＆電気的特性
| 機能 | System Basis Chip (SBC) with HS-CAN and LIN |
| トポロジー | LDO regulator + CAN transceiver + LIN transceiver |
| Number of Channels | 1 (CAN-HS) + 1 (LIN) |
| CAN Data Rate | 20 kbps (Normal/Sleep) |
| MCU Regulator Output | 5.0 V (part-number selectable to 3.3 V on 33903S variant) |
| External PNP Option | Yes - extends MCU current capability and shares dissipation |
| 電源電圧 | 9 V / 12 V / 15 V / 18 V / 24 V (battery-compatible) |
| 動作電源電圧 | 5.5 V to 28 V |
| Internal 5V CAN Regulator | Fully protected |
| Protection Features | Voltage, current, and temperature protection |
| Low-Power Mode Quiescent Current | Extremely low (per datasheet LP mode) |
| LIN Standard | LIN 2.x (ISO 17987 physical layer) |
| パッケージ | 32-SOIC Wide, Exposed Pad (Tape & Reel, -R2 suffix) |
| 実装タイプ | Surface Mount |
| Watchdog / Reset | Yes (window watchdog + reset outputs) |
| Configuration | SPI (per datasheet) |
MCZ33903C5EKR2 ピン構成
| ピン 1 | VSUP — Battery / supply input (5.5 V to 28 V) |
| ピン 2 | VSUP_SENSE — Battery voltage sense |
| ピン 3 | VDD2 — Internal supply decoupling |
| ピン 4 | VBAT — Battery reference |
| ピン 5 | CANH — CAN high bus line |
| ピン 6 | CANL — CAN low bus line |
| ピン 7 | SPLIT — CAN split termination |
| ピン 8 | LIN — LIN bus line |
| ピン 9 | WAKE — Wake-up input |
| ピン 10 | RST — Reset output (active low) |
| ピン 11 | WD — Window watchdog output |
| ピン 12 | INT — Interrupt output |
| ピン 13 | CS — SPI chip select |
| ピン 14 | MOSI — SPI master-out / slave-in |
| ピン 15 | MISO — SPI master-in / slave-out |
| ピン 16 | SCK — SPI clock |
| ピン 17 | RXD_CAN — CAN receive data to MCU |
| ピン 18 | TXD_CAN — CAN transmit data from MCU |
| ピン 19 | RXD_LIN — LIN receive data to MCU |
| ピン 20 | TXD_LIN — LIN transmit data from MCU |
| ピン 21 | VCC — Regulated 5.0 V MCU rail output |
| ピン 22 | VCOM — Voltage common / sense |
| ピン 23 | VEXT_BASE — Base drive for external PNP |
| ピン 24 | VOUT — Current sense / external PNP emitter |
| ピン 25 | EN — Enable input |
| ピン 26 | FS — Fail-safe output |
| ピン 27 | TJA_LBCL — Diagnostic mode / loopback |
| ピン 28 | GND — Ground |
| ピン 29 | GND — Ground |
| ピン 30 | GND — Ground |
| ピン 31 | GND — Ground |
| ピン 32 | NC — Not connected (per datasheet) |
主な用途
MCZ33903C5EKR2 の用途: 7 件s: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster ECU, Central Gateway ECU, 24V Commercial-Truck Body Controller, Industrial Sensor / Actuator Node, Automotive LIN Slave Actuator.
Automotive Body Control Module (BCM)
The MCZ33903C5EKR2's integrated HS-CAN + LIN + 5V/3.3V MCU regulator in one 32-SOIC EP package is purpose-built for body controllers driving lights, mirrors, wipers, and door modules. The 5.5V to 28V supply window tolerates the jump-start and load-dump transients of 12V passenger-car buses, while the embedded 5V LDO for the CAN driver keeps bus-pin signaling deterministic during VBAT sag. Placed between the load-dump-protected VSUP rail and the host MCU, it removes the discrete LDO plus standalone CAN/LIN PHY that older BCM designs required, freeing PCB area for relay and sensor front ends. Its SPI-window watchdog and reset outputs map cleanly to AUTOSAR MCU power-on handlers.
おすすめ
HVAC Control Module
HVAC modules inside an automotive dashboard stack benefit from the MCZ33903C5EKR2's combination of LIN slave-only mode and 5V MCU rail, allowing them to talk to the BCM over a single LIN bus without a separate LIN transceiver. The Low-Power modes with extremely low quiescent current prevent the HVAC controls from draining the battery during long parking periods, satisfying the automotive 100 µA-class sleep budget. The internal voltage, current, and temperature protection disengages the actuator drivers during over-temperature events, meeting HVAC blower-motor fault-tolerance requirements without an external supervisor.
おすすめ
Instrument Cluster ECU
Instrument clusters require galvanically-isolated CAN conversations with the powertrain bus plus a stable rail for the graphics MCU. The MCZ33903C5EKR2's high-speed CAN interface (up to automotive CAN bit rates despite the 20 kbps normal mention) and 5.0V LDO provide both in one chip. Because the CAN driver is fed from the fully-protected internal 5V regulator rather than VSUP, cluster DC-DC noise and chattering loads do not pollute bus signaling. The exposed pad of the 32-SOIC, with at least 1 square inch of 2-oz copper, keeps junction temperature low even at continuous 80 mA MCU load with no external PNP.
おすすめ
Central Gateway ECU
Gateway ECUs bridge CAN, LIN, and sometimes FlexRay buses between powertrain and body domains. The MCZ33903C5EKR2 provides one of those domains in a single IC: HS-CAN to the drivetrain, LIN to body peripherals, and the MCU rail for the gateway processor. Because the SBC's voltage, current, and temperature protection is integrated, the gateway can ride through shorts on any one branch without disturbing the others. Stack multiple SBCs (one per domain) on the same gateway PCB to consolidate 12V-to-5V conversion and bus physical layers into a single layout per channel.
おすすめ
24V Commercial-Truck Body Controller
Commercial trucks operate their electrical system at 24 V nominal, with transients reaching 36 V. The MCZ33903C5EKR2's operating supply range up to 28 V and integrated load-dump resilience let designers reuse the same BCM hardware as 12 V platforms, simply by re-specifying the external TVS diode budget. The 5 V internal regulator continues to power the CAN driver cleanly through 24 V cranking dips, preventing bus arbitration errors that have plagued previous-generation SBCs in truck fleets. The exposed pad's thermal headroom suits the heavier continuous load duty cycle of truck-mounted body controllers.
おすすめ
Industrial Sensor / Actuator Node
Industrial automation nodes mounted on a 24 V backplane benefit from the MCZ33903C5EKR2's CAN + LIN bus interfaces plus 5 V MCU regulator in one chip. With an IP67 enclosure the SBC replaces discrete CAN transceivers, 24 V-tolerant MCU rails, and a window watchdog, reducing connector pin count and BOM. The wide 5.5 V to 28 V operating window tolerates the 19 V to 30 V encountered on long factory DC buses, and the exposed pad supports continuous industrial ambient temperatures. SPI-configurable low-power modes align with energy-saving profiles required by IEC 61131-3 PLCs.
おすすめ
Automotive LIN Slave Actuator
Mirror, seat, or window lift slaves that only talk LIN to a body controller can use the MCZ33903C5EKR2 in a trimmed-feature mode, drawing just the LIN and 5 V MCU regulator sections. Because internal LIN transceivers and the watchdog logic stay active, the slave remains polling the LIN bus in low-power modes at extremely low quiescent current, then wakes on an authorized LIN header. Designers eliminate external protection FETs and DC-DC bricks that would otherwise push board size past the actuator housing envelope.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCZ33903C5EKR2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCZ33903C5EK | MCZ33903CS5EKR2 | MCZ33903DS3EKR2 | MCZ33904AEKR2 | MCZ33390EFR2 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC EP | 32-SOIC EP - same | 32-SOIC EP (32-SSOP-EP) - same | 32-SOIC EP - same | 32-SOIC EP - same | 32-SOIC EP - same |
| CAN Transceiver | HS-CAN (1 ch) | HS-CAN (1 ch) | HS-CAN (1 ch) | HS-CAN (1 ch) | HS-CAN (1 ch) | None (LIN-only) |
| LIN Transceiver | Yes | Yes | Yes | Yes | Yes | Yes |
| Watchdog / Reset | Window WD + Reset | Window WD + Reset | Window WD + Reset | Window WD + Reset | Window WD + Reset | Window WD + Reset |
| Shipping Format | Tape & Reel (-R2) | Tray (-EK) | Tape & Reel (-R2) | Tape & Reel (-R2) | Tape & Reel (-R2) | Tape & Reel (-R2) |
主な差別化要因
- Integrated HS-CAN + LIN + 5 V LDO in one 32-SOIC EP IC （vs MCZ33390EFR2)
- Same SBC Gen2 silicon in both tape & reel and tray formats （vs MCZ33903C5EK)
- Wide 5.5 V to 28 V operating supply window supports 12 V and 24 V topologies （vs MCZ33903DS3EKR2)
- Part-number selectable 5.0V vs 3.3V MCU rail without external LDO （vs MCZ33903CS5EKR2)
設計ノート
The 32-SOIC Wide EP dissipates MCU regulator heat through the exposed pad, so the pad must be soldered to a copper pour of at least 1 square inch of 2-oz copper. When the host MCU draws more current than the internal LDO can supply (around 100 mA continuous typical), add an external PNP transistor per the SBC Gen2 datasheet; the VEXT_BASE pin drives its base, splitting dissipation between the IC and the external device. Estimated: at 14 V VIN, 5.0 V VOUT, and 80 mA IOUT, dissipation is 720 mW total, of which the IC's regulator sees ~360 mW after PNP sharing - well under the SOIC EP's thermal budget.
Place the input bulk capacitor (≥47 µF) within 5 mm of VSUP and a 100 nF X7R bypass within 1 mm of the IC. Keep CANH/CANL differential pair matched to 100 Ω impedance, with the SPLIT-pin termination capacitor tied close to the IC. The LIN pull-up and series diode should land within 5 mm of the LIN pin. Keep SPI traces (CS, MOSI, MISO, SCK) short and shielded by a ground trace to avoid injecting bus noise into the MCU's memory subsystem.
Do not assume the regulator output is pin-selectable - the 5 V versus 3.3 V rail is fixed by the part number suffix ('C5' = 5 V, 'CS5' = 3.3 V). Trying to source a 3.3 V rail from a 'C5' part via external LDO defeats the SBC integration advantage. Also watch the watchdog window timing: configuring a window narrower than 1 ms can cause reset loops when the host MCU is in deep-sleep. Always exit Low-Power mode via the SPI command sequence to avoid spurious CAN-bus wake events on automotive systems.
Route the exposed pad to a single large GND island, stitching it with at least 8 thermal vias on a 1.2 mm pitch to the inner GND plane for heat-spread. Keep high-current traces (VBAT, VEXT_BASE, VOUT) away from the analog CAN/LIN differential pair by at least 3 mm to avoid ground-bounce cross-talk into bus signaling. Place an optional ferrite bead on VBAT before the IC's VSUP pin if the upstream wiring harness carries significant EMI from neighboring loads.
コンプライアンス情報
AEC-Q100 qualified per NXP automotive SBC family classification. RoHS and REACH compliant per DigiKey/Rochester Electronics listings. Lead-free and halogen-free packages per JEDEC standards.
