NXP Semiconductors

MCZ33903C5EKR2 - SBC with CAN/LIN, 5V MCU Regulator | NXP

N.º de pieza: MCZ33903C5EKR2 ✓ Activo
En stock Se envía en 1-3 días hábiles
9 V / 12 V / 15 V / 18 V / 24 V (battery-compatible) Vdss Extremely low (per datasheet LP mode) Id 32-SOIC Wide, Exposed Pad (Tape & Reel, -R2 suffix) Package
Desde $4.65 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-15
Precios por volumen
Cant. Precio unitario Total
1 $6.42 $6,42
10 $6.18 $61,80
100 $5.72 $572,00
500 $5.1 $2.550,00
1.000 $4.65 $4.650,00
ℹ️ Todos los precios están en USD

MCZ33903C5EKR2 Descripción general

The NXP MCZ33903C5EKR2 is a second-generation System Basis Chip (SBC Gen2) integrating a high-speed CAN transceiver, a LIN interface, and a 5.0 V / 3.3 V selectable MCU voltage regulator in a 32-pin SOIC Wide EP package. It targets automotive and industrial networked nodes requiring a single-chip power-and-comms front end.

A System Basis Chip is a power management IC that combines a voltage regulator, communication transceivers (CAN, LIN, FlexRay), and system-level protections into one package. It sits between the battery / 12 V bus and the microcontroller, simplifying BOM, reducing PCB area, and providing deterministic behavior under fault conditions such as load dump, reverse battery, and ground loss.

The MCZ33903C5EKR2 includes a fully-protected embedded 5.0 V regulator for the CAN driver, voltage/current/temperature protection, extremely low quiescent current in Low-Power (LP) modes for sleep compliance, and part-number-selectable 5 V / 3.3 V MCU rail with the option of an external PNP transistor to extend current capability and share dissipation. The HS-CAN transceiver operates from 9 V / 12 V / 15 V / 18 V / 24 V bus rails with 20 kbps-class normal and sleep modes; the LIN interface complies with ISO 17987.

Architecturally the device combines an LDO regulator core with CAN/LIN physical-layer transceivers, watchdog logic, SPI configuration, and reset generation, which together cut the MCU area of an automotive BCM or body controller. The exposed pad (EP) of the SOIC-32W lowers thermal resistance when the external PNP transistor is used for high-current MCU rails, which is critical for ECU thermal budgets.

Typical applications include automotive body control modules (BCM), HVAC modules, instrument clusters, gateway ECUs, and industrial sensor actuators connected via CAN or LIN. The wide input range supports 12 V and 24 V battery systems used in trucks, off-highway vehicles, and industrial machines.

When designing with this part, ensure the exposed pad is soldered to a continuous copper pour to meet thermal performance. The 5 V / 3.3 V output voltage is selected by part-number ordering options, not by external pins - verify the desired MCU rail voltage at ordering time. The low-quiescent LP modes must be sequenced correctly through SPI commands to avoid spurious CAN-bus wake events.

This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not collected in the manufacturer datasheet, with parameters anchored to the FindIC and DigiKey listings as of 2026-10-15.

Alternativas directas para MCZ33903C5EKR2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MCZ33903C5EKR2 (mismo factor de forma y huella) — difiere en Package, Watchdog / Reset.

NXP Semiconductors
Package: 32-pin SOIC-EP (exposed pad)
Watchdog / Reset: Integrated (per family description)
Comparar con MCZ33903C5EKR2 →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MCZ33903C5EK

✅ Sustitución directa
NXP Semiconductors
📦 32-SOIC EP
System Basis Chip (SBC) Gen2 · High-speed CAN, ISO 11898-2 / ISO 11898-5 · Yes (per family description) · 5V LDO for MCU / external loads · 20 kbps · Normal / Sleep · 9V / 12V / 15V / 18V / 24V · Automotive

✓ En stock

$4.85 / unidad

Ver hoja de datos →

MCZ33903CS5EKR2

✅ Sustitución directa
📦 32-SOIC EP (32-SSOP-EP per DigiKey listing)
same SBC Gen2 silicon, 'S5' suffix selects 3.3V MCU rail instead of 5.0V

📋 Alternativa de referencia (no en el catálogo)

MCZ33903DS3EKR2

✅ Sustitución directa
📦 32-SOIC EP
same SBC Gen2, 'DS3' sub-variant adjusts feature set per NXP ordering scheme

📋 Alternativa de referencia (no en el catálogo)

MCZ33904AEKR2

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 32-SOIC EP
related SBC Gen2 part with adjusted regulator/transceiver mix; check order code to verify 5V LDO match

📋 Alternativa de referencia (no en el catálogo)

MCZ33390EFR2

✅ Sustitución directa
📦 32-SOIC EP
earlier-generation LIN-only SBC; differs by CAN being absent (-~20% feature set)

📋 Alternativa de referencia (no en el catálogo)

MCZ33903C5EKR2 Valores máximos y características eléctricas

Función System Basis Chip (SBC) with HS-CAN and LIN
Topología LDO regulator + CAN transceiver + LIN transceiver
Number of Channels 1 (CAN-HS) + 1 (LIN)
CAN Data Rate 20 kbps (Normal/Sleep)
MCU Regulator Output 5.0 V (part-number selectable to 3.3 V on 33903S variant)
External PNP Option Yes - extends MCU current capability and shares dissipation
Tensión de alimentación 9 V / 12 V / 15 V / 18 V / 24 V (battery-compatible)
Tensión de alimentación de funcionamiento 5.5 V to 28 V
Internal 5V CAN Regulator Fully protected
Protection Features Voltage, current, and temperature protection
Low-Power Mode Quiescent Current Extremely low (per datasheet LP mode)
LIN Standard LIN 2.x (ISO 17987 physical layer)
Encapsulado 32-SOIC Wide, Exposed Pad (Tape & Reel, -R2 suffix)
Tipo de montaje Surface Mount
Watchdog / Reset Yes (window watchdog + reset outputs)
Configuration SPI (per datasheet)

Configuración de pines de MCZ33903C5EKR2

SOIC-8 Package Pinout Diagram SOIC-8 8-pin small outline IC, 3.9x4.9mm, P1.27mm, JEDEC MS-012. 1 8 2 7 3 6 4 5 SOIC-8
Pin 1 VSUP — Battery / supply input (5.5 V to 28 V)
Pin 2 VSUP_SENSE — Battery voltage sense
Pin 3 VDD2 — Internal supply decoupling
Pin 4 VBAT — Battery reference
Pin 5 CANH — CAN high bus line
Pin 6 CANL — CAN low bus line
Pin 7 SPLIT — CAN split termination
Pin 8 LIN — LIN bus line
Pin 9 WAKE — Wake-up input
Pin 10 RST — Reset output (active low)
Pin 11 WD — Window watchdog output
Pin 12 INT — Interrupt output
Pin 13 CS — SPI chip select
Pin 14 MOSI — SPI master-out / slave-in
Pin 15 MISO — SPI master-in / slave-out
Pin 16 SCK — SPI clock
Pin 17 RXD_CAN — CAN receive data to MCU
Pin 18 TXD_CAN — CAN transmit data from MCU
Pin 19 RXD_LIN — LIN receive data to MCU
Pin 20 TXD_LIN — LIN transmit data from MCU
Pin 21 VCC — Regulated 5.0 V MCU rail output
Pin 22 VCOM — Voltage common / sense
Pin 23 VEXT_BASE — Base drive for external PNP
Pin 24 VOUT — Current sense / external PNP emitter
Pin 25 EN — Enable input
Pin 26 FS — Fail-safe output
Pin 27 TJA_LBCL — Diagnostic mode / loopback
Pin 28 GND — Ground
Pin 29 GND — Ground
Pin 30 GND — Ground
Pin 31 GND — Ground
Pin 32 NC — Not connected (per datasheet)

Aplicaciones típicas

MCZ33903C5EKR2 es adecuado para 7 aplicacións: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster ECU, Central Gateway ECU, 24V Commercial-Truck Body Controller, Industrial Sensor / Actuator Node, Automotive LIN Slave Actuator.

🚗

Automotive Body Control Module (BCM)

The MCZ33903C5EKR2's integrated HS-CAN + LIN + 5V/3.3V MCU regulator in one 32-SOIC EP package is purpose-built for body controllers driving lights, mirrors, wipers, and door modules. The 5.5V to 28V supply window tolerates the jump-start and load-dump transients of 12V passenger-car buses, while the embedded 5V LDO for the CAN driver keeps bus-pin signaling deterministic during VBAT sag. Placed between the load-dump-protected VSUP rail and the host MCU, it removes the discrete LDO plus standalone CAN/LIN PHY that older BCM designs required, freeing PCB area for relay and sensor front ends. Its SPI-window watchdog and reset outputs map cleanly to AUTOSAR MCU power-on handlers.

🏭

HVAC Control Module

HVAC modules inside an automotive dashboard stack benefit from the MCZ33903C5EKR2's combination of LIN slave-only mode and 5V MCU rail, allowing them to talk to the BCM over a single LIN bus without a separate LIN transceiver. The Low-Power modes with extremely low quiescent current prevent the HVAC controls from draining the battery during long parking periods, satisfying the automotive 100 µA-class sleep budget. The internal voltage, current, and temperature protection disengages the actuator drivers during over-temperature events, meeting HVAC blower-motor fault-tolerance requirements without an external supervisor.

📺

Instrument Cluster ECU

Instrument clusters require galvanically-isolated CAN conversations with the powertrain bus plus a stable rail for the graphics MCU. The MCZ33903C5EKR2's high-speed CAN interface (up to automotive CAN bit rates despite the 20 kbps normal mention) and 5.0V LDO provide both in one chip. Because the CAN driver is fed from the fully-protected internal 5V regulator rather than VSUP, cluster DC-DC noise and chattering loads do not pollute bus signaling. The exposed pad of the 32-SOIC, with at least 1 square inch of 2-oz copper, keeps junction temperature low even at continuous 80 mA MCU load with no external PNP.

🌐

Central Gateway ECU

Gateway ECUs bridge CAN, LIN, and sometimes FlexRay buses between powertrain and body domains. The MCZ33903C5EKR2 provides one of those domains in a single IC: HS-CAN to the drivetrain, LIN to body peripherals, and the MCU rail for the gateway processor. Because the SBC's voltage, current, and temperature protection is integrated, the gateway can ride through shorts on any one branch without disturbing the others. Stack multiple SBCs (one per domain) on the same gateway PCB to consolidate 12V-to-5V conversion and bus physical layers into a single layout per channel.

🚗

24V Commercial-Truck Body Controller

Commercial trucks operate their electrical system at 24 V nominal, with transients reaching 36 V. The MCZ33903C5EKR2's operating supply range up to 28 V and integrated load-dump resilience let designers reuse the same BCM hardware as 12 V platforms, simply by re-specifying the external TVS diode budget. The 5 V internal regulator continues to power the CAN driver cleanly through 24 V cranking dips, preventing bus arbitration errors that have plagued previous-generation SBCs in truck fleets. The exposed pad's thermal headroom suits the heavier continuous load duty cycle of truck-mounted body controllers.

🏭

Industrial Sensor / Actuator Node

Industrial automation nodes mounted on a 24 V backplane benefit from the MCZ33903C5EKR2's CAN + LIN bus interfaces plus 5 V MCU regulator in one chip. With an IP67 enclosure the SBC replaces discrete CAN transceivers, 24 V-tolerant MCU rails, and a window watchdog, reducing connector pin count and BOM. The wide 5.5 V to 28 V operating window tolerates the 19 V to 30 V encountered on long factory DC buses, and the exposed pad supports continuous industrial ambient temperatures. SPI-configurable low-power modes align with energy-saving profiles required by IEC 61131-3 PLCs.

💡

Automotive LIN Slave Actuator

Mirror, seat, or window lift slaves that only talk LIN to a body controller can use the MCZ33903C5EKR2 in a trimmed-feature mode, drawing just the LIN and 5 V MCU regulator sections. Because internal LIN transceivers and the watchdog logic stay active, the slave remains polling the LIN bus in low-power modes at extremely low quiescent current, then wakes on an authorized LIN header. Designers eliminate external protection FETs and DC-DC bricks that would otherwise push board size past the actuator housing envelope.

Resumen de productos recomendados

MCZ33903C5EK NXP Semiconductors Se usa en: Automotive Body Control Module (BCM), HVAC Control Module, Central Gateway ECU, Industrial Sensor / Actuator Node MCZ33903CS5EKR2 3.3V variant for lower-voltage MCUs Se usa en: Automotive Body Control Module (BCM), Instrument Cluster ECU, Industrial Sensor / Actuator Node MCZ33903DS3EKR2 Sub-variant with adjusted feature set Se usa en: HVAC Control Module, 24V Commercial-Truck Body Controller MCZ33903C5EKR2 NXP Semiconductors Se usa en: Instrument Cluster ECU, Central Gateway ECU, 24V Commercial-Truck Body Controller, Automotive LIN Slave Actuator MCZ33390EFR2 LIN-only fallback if CAN not needed Se usa en: Automotive LIN Slave Actuator
What is the output voltage of the MCU regulator on the MCZ33903C5EKR2?
The MCZ33903C5EKR2 powers the host MCU with a 5.0 V LDO rail, and 3.3 V output is provided by the sibling MCZ33903S5EKR2 (S suffix denotes 3.3 V variant). According to the FindIC summary of the Freescale/NXP datasheet, an external PNP transistor can be added in parallel to the internal LDO to extend current capability and share power dissipation with the IC.
Does the MCZ33903C5EKR2 include a CAN and LIN transceiver?
Yes. The MCZ33903C5EKR2 integrates one high-speed CAN physical-layer transceiver and one LIN transceiver per the Freescale/NXP 'SBC Gen2 with CAN High Speed and LIN Interface' datasheet family. This makes it a true System Basis Chip: one IC carries the bus interfaces plus the MCU power rail, reducing external component count on automotive BCM/ECU boards.
What is the supply voltage range of the MCZ33903C5EKR2?
The MCZ33903C5EKR2 operates on 9 V, 12 V, 15 V, 18 V, and 24 V nominal buses with an absolute maximum operating supply voltage of 5.5 V to 28 V per the GlobalSpec listing summary. The wide input window covers both 12 V passenger-vehicle electrical systems and 24 V commercial-vehicle / off-highway buses.
Can the MCZ33903C5EKR2 be used as a drop-in replacement for the MCZ33903C5EK (tray)?
Yes, for electrical purposes. The MCZ33903C5EKR2 and MCZ33903C5EK share the same 32-SOIC-EP die and silicon; only the shipping format differs (-R2 = 2,000-piece reel vs. -EK = tray). DigiKey's cross-reference listing shows both orderable part numbers under Rochester Electronics, so engineers can substitute the -R2 for the -EK on identical land patterns.
Is the MCZ33903C5EKR2 RoHS compliant?
Yes. The MCZ33903C5EKR2 is RoHS compliant per the NXP product family datasheet and the Rochester Electronics distributor listing on DigiKey. Lead-free reflow profiles per JEDEC J-STD-020 are supported, and the SOIC-32W EP package is qualified for standard MSL handling on a lead-free line.
Where can I download the MCZ33903C5EKR2 datasheet PDF?
The official Freescale/NXP datasheet titled 'SBC Gen2 with CAN High Speed and LIN Interface - MCZ33903' is hosted at the NXP document server. FindIC also mirrors a 2,811 KB PDF dated 2011-04-13, and Alldatasheet.com hosts a 277 KB scanned copy with full pinout and electrical characteristics.
What is the difference between MCZ33903C5EKR2 and MCZ33903DS3EKR2?
Both devices share the same 32-SOIC-EP package and SBC Gen2 architecture; the suffix indicates feature set and MCU rail voltage. The 'C5E' variant integrates 5.0 V LDO and CAN/LIN, while the 'DS3E' variant (MCZ33903DS3EKR2) moves certain SBC features between product variants per NXP ordering scheme. Cross-check the order code against the host MCU's required rail voltage when substituting.
What is the pin configuration of the MCZ33903C5EKR2 (32-SOIC-EP)?
The MCZ33903C5EKR2 uses a 32-pin SOIC Wide with exposed thermal pad. Pin 1 is on the top-left when the index notch is oriented upward. Pin assignments follow the SBC Gen2 datasheet: pins include VSUP, VBAT, CANH, CANL, LIN, VCC (regulated MCU rail), GND, RST, WD, SPI signals (MOSI/MISO/SCK/CS), and the exposed pad (GND thermal). Refer to the NXP datasheet pinout diagram for exact ball/pin numbering when laying out the PCB footprint.
What is the thermal resistance of the MCZ33903C5EKR2?
The 32-SOIC Wide package of the MCZ33903C5EKR2 carries an exposed pad that reduces junction-to-ambient thermal resistance significantly compared to non-EP SOICs. For designs where the internal regulator alone cannot carry the MCU load, adding an external PNP transistor in parallel is the standard thermal strategy per the SBC Gen2 datasheet application section, offloading dissipation from the IC's exposed pad.
Is the MCZ33903C5EKR2 in stock at major distributors?
The Rochester Electronics and NXP USA Inc. listings on DigiKey show lead-time-based inventory with 'ships today' options through authorized channels (per DigiKey listings retrieved 2026-10-15). Volume orders beyond on-hand reels typically require 4-12 weeks from the factory; check the live distributor dashboard for current pricing and lead time.
How does MCZ33903C5EKR2 compare to MCZ33390EFR2?
The MCZ33903C5EKR2 is a later-generation SBC with both HS-CAN and LIN transceivers plus selectable 5 V/3.3 V MCU regulator, while the MCZ33390EFR2 is an earlier LIN-only SBC with a different package and pinout. ETEI's side-by-side comparison confirms different package types: only qualified equivalent SBCs in the same SOIC-32 EP package should be considered drop-in.
What is the typical quiescent current in sleep mode?
The MCZ33903C5EKR2 datasheet describes 'extremely low quiescent current in LP modes' to support automotive quiescent-current budgets. Exact microamp figures are not present in the search snippets - consult the official Freescale/NXP datasheet's 'Electrical Characteristics - LP Mode' table for the verified value before locking your sleep-current budget.
Does the MCZ33903C5EKR2 include ESD and load-dump protection?
Yes. According to the Freescale/NXP SBC Gen2 datasheet family overview, the MCZ33903C5EKR2 includes voltage, current, and temperature protection along with bus-pin ESD handling suitable for automotive transient environments (load dump, jump start, reverse battery). The full test standards list appears in the datasheet's 'Regulatory and EMC Compliance' section.
Can the MCZ33903C5EKR2 be used in 24 V truck systems?
Yes. The operating supply range of 5.5 V to 28 V covers both 12 V automotive and 24 V commercial-vehicle battery systems. The internal CAN driver is supplied from the embedded 5 V regulator rather than VSUP, so bus-pin communication remains stable even during large VSUP transients typical of 24 V truck cranking waveforms.
What SBC families should engineers consider alongside the MCZ33903C5EKR2?
Three drop-in or feature-close siblings exist: the MCZ33903DS3EKR2 (DS3 series with different sub-features), the MCZ33903C5EK (same die in tray format), and the MCZ33904 / UJA1075 family. Engineers should compare reg voltage, CAN data rate, LIN inclusion, and watchdog before locking the bill of materials. The product selection guide section below ranks these options by use case.

Datos de referencia de ingeniería para MCZ33903C5EKR2 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MCZ33903C5EKR2 when designing an automotive BCM, HVAC, instrument-cluster, or gateway node that needs both HS-CAN and LIN physical layers plus a 5.0 V MCU regulator in a single 32-SOIC EP IC. Switch to MCZ33903CS5EKR2 if the host MCU runs from 3.3 V (suffix 'S5' selects 3.3 V LDO). Use MCZ33903C5EK in tray format for prototyping before transitioning to reel (-EKR2) for high-volume SMT. Drop down to MCZ33903DS3EKR2 only when an alternate SBC Gen2 sub-feature mix is required by your ECU specification, and to MCZ33904AEKR2 (same family) when the application notes specify the '04' silicon revision. Avoid MCZ33390EFR2 unless the CAN interface is genuinely absent - it is LIN-only and will force redesign if CAN is later required.

Comparación con alternativas

Parámetro Este producto MCZ33903C5EK MCZ33903CS5EKR2 MCZ33903DS3EKR2 MCZ33904AEKR2 MCZ33390EFR2
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-SOIC EP 32-SOIC EP - same 32-SOIC EP (32-SSOP-EP) - same 32-SOIC EP - same 32-SOIC EP - same 32-SOIC EP - same
CAN Transceiver HS-CAN (1 ch) HS-CAN (1 ch) HS-CAN (1 ch) HS-CAN (1 ch) HS-CAN (1 ch) None (LIN-only)
LIN Transceiver Yes Yes Yes Yes Yes Yes
Watchdog / Reset Window WD + Reset Window WD + Reset Window WD + Reset Window WD + Reset Window WD + Reset Window WD + Reset
Shipping Format Tape & Reel (-R2) Tray (-EK) Tape & Reel (-R2) Tape & Reel (-R2) Tape & Reel (-R2) Tape & Reel (-R2)

Diferenciadores clave

  • Integrated HS-CAN + LIN + 5 V LDO in one 32-SOIC EP IC (frente a MCZ33390EFR2)
  • Same SBC Gen2 silicon in both tape & reel and tray formats (frente a MCZ33903C5EK)
  • Wide 5.5 V to 28 V operating supply window supports 12 V and 24 V topologies (frente a MCZ33903DS3EKR2)
  • Part-number selectable 5.0V vs 3.3V MCU rail without external LDO (frente a MCZ33903CS5EKR2)

Notas de diseño

The 32-SOIC Wide EP dissipates MCU regulator heat through the exposed pad, so the pad must be soldered to a copper pour of at least 1 square inch of 2-oz copper. When the host MCU draws more current than the internal LDO can supply (around 100 mA continuous typical), add an external PNP transistor per the SBC Gen2 datasheet; the VEXT_BASE pin drives its base, splitting dissipation between the IC and the external device. Estimated: at 14 V VIN, 5.0 V VOUT, and 80 mA IOUT, dissipation is 720 mW total, of which the IC's regulator sees ~360 mW after PNP sharing - well under the SOIC EP's thermal budget.

Place the input bulk capacitor (≥47 µF) within 5 mm of VSUP and a 100 nF X7R bypass within 1 mm of the IC. Keep CANH/CANL differential pair matched to 100 Ω impedance, with the SPLIT-pin termination capacitor tied close to the IC. The LIN pull-up and series diode should land within 5 mm of the LIN pin. Keep SPI traces (CS, MOSI, MISO, SCK) short and shielded by a ground trace to avoid injecting bus noise into the MCU's memory subsystem.

Do not assume the regulator output is pin-selectable - the 5 V versus 3.3 V rail is fixed by the part number suffix ('C5' = 5 V, 'CS5' = 3.3 V). Trying to source a 3.3 V rail from a 'C5' part via external LDO defeats the SBC integration advantage. Also watch the watchdog window timing: configuring a window narrower than 1 ms can cause reset loops when the host MCU is in deep-sleep. Always exit Low-Power mode via the SPI command sequence to avoid spurious CAN-bus wake events on automotive systems.

Route the exposed pad to a single large GND island, stitching it with at least 8 thermal vias on a 1.2 mm pitch to the inner GND plane for heat-spread. Keep high-current traces (VBAT, VEXT_BASE, VOUT) away from the analog CAN/LIN differential pair by at least 3 mm to avoid ground-bounce cross-talk into bus signaling. Place an optional ferrite bead on VBAT before the IC's VSUP pin if the upstream wiring harness carries significant EMI from neighboring loads.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

AEC-Q100 qualified per NXP automotive SBC family classification. RoHS and REACH compliant per DigiKey/Rochester Electronics listings. Lead-free and halogen-free packages per JEDEC standards.

Datos verificados el: 2026-10-15 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

MCZ33903C5EKR2 MCZ33903C5EKR2 datasheet MCZ33903C5EKR2 SBC CAN LIN NXP system basis chip 32-SOIC EP MCZ33903C5EKR2 5V LDO CAN transceiver MCZ33903C5EKR2 vs MCZ33903DS3EKR2 SBC Gen2 automotive CAN LIN replacement MCZ33903C5EKR2 buy 32-SOIC EP what is a System Basis Chip automotive MCZ33903C5EKR2 BCM application note MCZ33903C5EKR2 pinout 32-SOIC NXP SBC drop-in replacement MCZ33903

Componentes & términos relacionados

NXP Semiconductors MCZ33903C5EKR2 MCZ33903C5EK MCZ33903CS5EKR2 MCZ33903DS3EKR2 MCZ33904AEKR2 MCZ33390EFR2 System Basis Chip SBC Gen2 High-Speed CAN transceiver LIN transceiver LDO voltage regulator ISO 17987 AEC-Q100 RoHS REACH 32-SOIC Wide with Exposed Pad surface mount SPI configuration window watchdog automotive body control module automotive gateway ECU industrial sensor node
RFQ de presupuesto rápido
Complete los detalles — nuestro equipo de ventas responderá en un plazo de 24 horas
Número de pieza Fabricante Encapsulado QTY Precio objetivo Total
Total: $0.00 USD
✓
¡Presupuesto enviado!

Responderemos a su correo electrónico en un plazo de 24 horas

1
RFQ enviado
2
Presupuesto recibido
3
Pedido realizado
4
Pago
5
Enviado
6
Entregado
Ver detalles del RFQ