MK20DN128VFM5557 - 50MHz 128KB Cortex-M4 MCU | NXP
部品番号: MK20DN128VFM5557 ✗ 生産終了MK20DN128VFM5557 概要
An ARM Cortex-M4 microcontroller is a 32-bit reduced-instruction-set-computing core used in embedded systems for control, communications, monitoring, and signal-processing tasks. The Cortex-M4 architecture belongs to the microcontroller processor hierarchy and combines low-power embedded operation with instruction sets suitable for real-time control workloads. The K20 family provides a bridge between general embedded processing and resource-constrained industrial designs.
The verified distributor description identifies a 50 MHz operating frequency, 128 KB flash organized as 128K x 8, and a 32-QFN 5 mm by 5 mm package. The target suffix 5557 identifies the specific orderable configuration, while the related MK20DN128VFM5 listing identifies an otherwise closely related 128 KB, 50 MHz Cortex-M4 device in a 32-QFN exposed-pad package. Electrical limits, SRAM capacity, peripherals, pin functions, operating-temperature limits, and clock-tree details were not supplied and therefore remain marked as data needed.
Typical applications include industrial control, sensor acquisition, communications equipment, embedded instrumentation, and compact embedded platforms. The 50 MHz Cortex-M4 core is suitable for tasks involving digital control, protocol handling, data acquisition, and supervisory logic. Its small QFN package supports space-constrained boards, although exposed-pad thermal and assembly requirements must be considered where applicable.
For PCB design, engineers should follow the manufacturer package drawing and pinout rather than infer connections from the distributor summary. Decoupling, grounding, exposed-pad layout, signal-integrity practices, and programming-interface requirements should be validated against the official NXP documentation. This page combines verified distributor information, package and memory facts, sourcing data, and practical replacement guidance without inventing unavailable electrical specifications.
ドロップイン代替品: MK20DN128VFM5557 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MK20DN128VFM5
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK20DN128VFM5557-ND
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK20DN128VFM5557
✅ ドロップイン価格はお問い合わせください
データシートを見る →MK20DN128VFM5
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK20DN128VFM5557-ND
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK20DN128VFM5557 最大定格＆電気的特性
| Product Type | 32-bit single-core microcontroller |
| Processor Core | ARM Cortex-M4 |
| Operating Frequency | 50 MHz |
| Flash Memory | 128 KB |
| Flash Organization | 128K x 8 |
| パッケージ | 32-QFN (5 mm x 5 mm) |
| ピン数 | 32 pins |
| 実装タイプ | Surface Mount |
| Core Architecture | ARM 32-bit Cortex-M4 |
| Microcontroller Family | Kinetis K20 |
| RoHS ステータス | unknown |
| REACH Status | unknown |
| Automotive AEC-Q100 | not_applicable |
MK20DN128VFM5557 32-qfn (5 mm x 5 mm) ピン配置ガイド
MK20DN128VFM5557 (32-qfn (5 mm x 5 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MK20DN128VFM5557.
詳細は データシート をご参照ください。
主な用途
MK20DN128VFM5557 の用途: 6 件s: Industrial Control, Sensor Acquisition, Communications Equipment, Embedded Instrumentation, Motor Control, Portable Embedded Systems.
Industrial Control
The MK20DN128VFM5557 fits compact industrial control logic where a 50 MHz ARM Cortex-M4 core provides deterministic embedded processing in a 32-QFN package. Its verified 128 KB flash capacity can hold control firmware, while the 5 mm by 5 mm footprint supports space-constrained controller boards. The design must obtain the exact NXP electrical limits, pin assignments, and timing specifications before selecting regulators, sensors, or output drivers. Compared with a larger microcontroller package, the QFN format can simplify board density, but exposed-pad and thermal requirements must be handled according to the official package drawing. Engineers should reserve programming and debug access, implement local decoupling, and validate the control-loop timing in the selected clock configuration.
おすすめ
Sensor Acquisition
The MK20DN128VFM5557 is suitable for sensor-acquisition front ends that combine sampling control, filtering, status reporting, and local communications. Its verified 50 MHz ARM Cortex-M4 processing capability is appropriate for handling digital sensor protocols and supervisory logic, while 128 KB flash provides room for embedded firmware. A typical architecture would place the MCU near the sensor interface and use short, controlled traces to reduce noise pickup. The available data does not specify ADC resolution, input channels, comparator resources, or sensor interfaces, so those functions cannot be assumed. Confirm analog and digital pin assignments in the official datasheet before selecting sensors. The QFN package helps reduce board area, although grounding and exposed-pad layout remain important for analog measurement integrity.
おすすめ
Communications Equipment
The MK20DN128VFM5557 can serve as the control processor in embedded communications equipment requiring a 50 MHz Cortex-M4 core and compact 32-QFN packaging. The verified 128 KB flash size can support protocol stacks, configuration data, and application firmware when the rest of the system design provides appropriate RAM and peripherals. In a communications product, the MCU may supervise packet handling, configure a radio or network interface, monitor link status, and report faults. However, the supplied information does not identify UART, USB, CAN, Ethernet, or radio peripherals, so engineers must verify the exact peripheral set before claiming protocol compatibility. Use controlled impedance routing for high-speed signals and provide local decoupling at every required supply pin according to the manufacturer recommendations.
おすすめ
Embedded Instrumentation
The MK20DN128VFM5557 is a reasonable candidate for compact embedded instrumentation when a 50 MHz Cortex-M4 processor, 128 KB flash, and a small 5 mm by 5 mm QFN package meet the system requirements. It can manage configuration menus, measurement sequencing, calibration data, and host communication in a compact instrument. The exact ADC, timer, serial-interface, and analog-reference specifications are not present in the verified data, so the part should not be selected solely from the stated frequency and memory. Before layout, verify the package pin count, exposed-pad treatment, supply rails, clocking, reset, and programming signals in the NXP documentation. A compact package also requires assembly-process control, adequate copper around thermal and power connections, and careful isolation between sensitive measurement nodes and digital switching nodes.
おすすめ
Motor Control
The MK20DN128VFM5557 can be evaluated for compact motor-control supervisory functions where its 50 MHz Cortex-M4 core executes control logic and its 128 KB flash stores application code. The verified summary does not list motor-control timers, PWM channels, analog inputs, or fault-protection peripherals, so the MCU should not be treated as a complete motor driver without a full peripheral comparison. In a real design, the MCU would generate control commands, monitor sensors, handle limits, and report diagnostics to a power stage. The 32-QFN package can help reduce controller size, but power-stage layout, isolation, thermal management, and safety behavior must be designed separately. Confirm whether the exact K20 device includes the required timers, ADC channels, and fault inputs in the official datasheet.
おすすめ
Portable Embedded Systems
The MK20DN128VFM5557 may fit portable embedded systems that need a compact processor with a 50 MHz Cortex-M4 core and 128 KB flash memory. Its 5 mm by 5 mm QFN package helps conserve board area in wearables, portable test equipment, and compact data-acquisition products. The supplied data does not provide standby current, active current, supply voltage, or operating-temperature limits, so battery-life and environmental claims require direct datasheet verification. During design, assess regulator efficiency, power-domain sequencing, sleep modes, and the thermal path of the package. Use a validated land pattern and manufacturing rules for the 0.5 mm-class QFN footprint where applicable, and confirm exposed-pad electrical requirements before release to production.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MK20DN128VFM5557 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MK20DN128VFM5 | MK20DN128VFM5557-ND | MK20DN128VFM5 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN (5 mm x 5 mm) | 32-QFN exposed-pad (5 mm x 5 mm) | 32-QFN (5 mm x 5 mm) | 32-QFN-EP (5 mm x 5 mm) |
主な差別化要因
- Verified 50 MHz Cortex-M4 processing baseline （vs MC9S12DJ128CPVE)
- Compact 32-QFN 5 mm by 5 mm package （vs MCF51JE256CMB)
- 128 KB flash configuration （vs MC9S08DV128F2CLFR)
設計ノート
Use the official NXP package drawing for the exact 32-QFN footprint rather than relying only on the 5 mm by 5 mm package description. Confirm pad dimensions, pin numbering, exposed-pad geometry, solder-mask clearance, and the recommended land pattern. A compact QFN can reduce board area, but a mismatch in pad definition can affect solderability, rework, and electrical performance.
The verified distributor data does not provide supply voltage or current limits, so power-tree design must begin with the official datasheet. Place required decoupling capacitors close to the device supply pins, provide a clean return path, and verify the regulator's startup and shutdown behavior against the MCU requirements. Do not estimate allowable rail tolerance or current from the 50 MHz clock rating.
Do not treat MK20DN128VFM5557 and MK20DN128VFM5 as automatically interchangeable solely because both distributor listings mention a 50 MHz Cortex-M4, 128 KB flash, and 32-QFN package. Compare the exact suffix, exposed-pad connection, pin names, power pins, debug pins, reset behavior, and peripheral assignments before approving a replacement.
Route high-speed or sensitive signals with short return paths and keep noisy switching loops away from analog and communication inputs. Confirm the ground and exposed-pad connection in the manufacturer package documentation. For sensor, communications, or instrumentation applications, separate analog and digital return-current paths where the final pinout and application circuit permit it.
The supplied data does not state thermal resistance or maximum power dissipation. If the exact device includes an exposed pad, provide the manufacturer-recommended copper and thermal-via arrangement and calculate junction temperature from the actual supply voltage, load current, ambient temperature, and verified thermal model. Any thermal estimate must be labeled as an estimate rather than treated as a datasheet specification.
コンプライアンス情報
The verified distributor data does not provide compliance declarations. RoHS, REACH, halogen-free, lead-free, conflict-minerals, and automotive qualification status remain unconfirmed.
