MK30DX256ZVMD10 - 32-Bit 100MHz Cortex-M4 MCU | NXP
部品番号: MK30DX256ZVMD10 ✓ 生産中MK30DX256ZVMD10 概要
A microcontroller is a semiconductor device that executes embedded-control code and manages connected inputs and outputs. Within the product hierarchy, an MCU is a type of integrated circuit and embedded processor. The Kinetis K30 family is designed for industrial, consumer, communications, and human-machine-interface applications that require efficient 32-bit control alongside display and connectivity functions.
The MK30DX256ZVMD10 provides 256 KB of Flash program memory and 64 KB of SRAM according to the verified product listings. Its listed peripheral set includes ADC and DAC channels, DMA controllers, PWM, CAN, I2C, IrDA, SD, SPI, UART and USART, I2S, LCD, low-voltage detection, power-on reset, and watchdog timer functions. These resources support mixed-signal measurement, motor and power control, communications, data acquisition, and graphical user-interface systems.
The Cortex-M4 core supports a maximum clock frequency of 100 MHz, giving the device substantially more processing headroom than lower-frequency 8-bit or 32-bit MCUs. The K30 architecture combines deterministic embedded control with flexible serial connectivity and LCD-oriented features. This balance makes the part useful where a system needs more than basic GPIO control but does not require a higher-end application processor.
Typical designs include industrial operator panels, medical-instrument control modules, communication equipment, data-acquisition systems, and compact consumer products with LCD displays. The listed 144-MAPBGA package reduces board area but requires careful escape routing and inspection because its fine-pitch balls are difficult to rework with conventional soldering methods.
For a new PCB, use the manufacturer package drawing and pin-assignment documentation rather than inferring the 144-ball connectivity from a generic BGA layout. Confirm voltage rails, decoupling, exposed thermal requirements, clock implementation, programming interfaces, and LCD routing against the official K30 documentation before release.
This product record combines verified distributor specifications, package information, source links, and engineering guidance to support component selection and PCB planning. Because the supplied search results do not expose a complete manufacturer price matrix or a verified pin-by-pin map, missing values are explicitly identified rather than guessed.
ドロップイン代替品: MK30DX256ZVMD10 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MK30DX256ZVLQ10
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK20DX256VMD10
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK30DX256VMD10
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK20DX256VMD10
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MK30DX256ZVMD10
✅ ドロップイン価格はお問い合わせください
データシートを見る →MK30DX256ZVMD10 最大定格＆電気的特性
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Series | Kinetis K30 |
| Maximum Core Frequency | 100 MHz |
| Flash Memory | 256 KB |
| SRAM | 64 KB |
| Architecture | 32-bit RISC |
| 動作電源電圧 | 1.8 V, 2.5 V, or 3.3 V |
| パッケージ | 144-ball MAPBGA, 13 mm x 13 mm |
| Terminal Count | 144 balls |
| 実装タイプ | Surface mount |
| Core | ARM Cortex-M4 |
| Data Conversion | ADC and DAC channels |
| Connectivity | CAN, I2C, IrDA, SD, SPI, UART/USART, and I2S |
| Display Support | LCD |
| System Functions | DMA, PWM, LVD, POR, and WDT |
| Maximum Ambient Temperature | 105 degrees C |
| Lifecycle Stage | Active |
MK30DX256ZVMD10 144-ball mapbga, 13 mm x 13 mm ピン配置ガイド
MK30DX256ZVMD10 (144-ball mapbga, 13 mm x 13 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MK30DX256ZVMD10.
詳細は データシート をご参照ください。
主な用途
MK30DX256ZVMD10 の用途: 8 件s: Industrial LCD Operator Panel, CAN-Based Equipment Controller, Data-Acquisition and Control Module, Medical-Instrument Control Board, Communications Gateway, Compact Consumer Control Product, Motor and Power-Control Subsystem, Educational and Embedded-Control Platform.
Industrial LCD Operator Panel
The MK30DX256ZVMD10 fits an industrial operator panel that combines display control, sensor input, and field communications. Its 100 MHz ARM Cortex-M4 core provides processing capacity for UI state handling, while 64 KB of SRAM supports display buffers and control data. LCD support reduces the need for a separate display controller, and UART/USART, CAN, and SPI interfaces can connect local sensors, expansion boards, and supervisory equipment. The verified 144-ball MAPBGA also permits a compact controller board, although production assembly requires a fine-pitch BGA process and careful review of the official ball map.
おすすめ
CAN-Based Equipment Controller
The MK30DX256ZVMD10 is appropriate for a compact CAN equipment controller because the verified feature list includes CAN, PWM, ADC, DMA, and watchdog support. The Cortex-M4 core at 100 MHz can manage protocol processing alongside real-time control tasks, while 256 KB of Flash provides room for application and communications code. A CAN transceiver remains an external component because the MCU does not replace the physical-layer interface. Design engineers should confirm pin multiplexing, transceiver levels, termination, isolation, and EMC requirements against the controlled device documentation.
おすすめ
Data-Acquisition and Control Module
The MK30DX256ZVMD10 can serve as the processing center of a data-acquisition module that combines analog measurement with digital control. Its verified ADC and DAC resources support sensor conditioning and controlled outputs, while DMA can reduce processor involvement in transfers between memory and peripherals. The 100 MHz Cortex-M4 core leaves headroom for filtering, calibration, logging, and communication tasks. A practical implementation should verify the selected ADC channels, reference voltage, sampling behavior, DAC output limits, and analog pin routing rather than assuming that every peripheral function is simultaneously available on every ball.
おすすめ
Medical-Instrument Control Board
The MK30DX256ZVMD10 is a candidate for a medical-instrument control board that needs deterministic embedded processing, communications, and mixed-signal functions. The Cortex-M4 core, 256 KB of Flash, and 64 KB of SRAM support application firmware, while ADC, DAC, DMA, PWM, and serial interfaces support sensing, control, and external equipment. The verified maximum ambient temperature of 105 degrees C can be useful in compact industrial-style enclosures, but medical use requires system-level validation, isolation review, electrical-safety analysis, and regulatory assessment. The MCU listing alone does not establish medical certification or compliance.
おすすめ
Communications Gateway
The MK30DX256ZVMD10 can be used in a communications gateway that bridges serial, memory-card, or local-network interfaces. The verified peripheral set includes CAN, I2C, IrDA, SD, SPI, UART/USART, I2S, and DMA, creating several practical paths for protocol conversion and data buffering. The 100 MHz core provides enough instruction throughput for gateway supervision and firmware updates, while 64 KB of SRAM can hold protocol state and transfer buffers. Engineers should budget external transceivers, connectors, level shifting, and memory where required, and validate protocol timing against the actual peripheral specifications.
おすすめ
Compact Consumer Control Product
The MK30DX256ZVMD10 fits a compact consumer product that requires a capable 32-bit controller without the complexity of an application processor. LCD support can drive a local display, PWM can control indicators or actuators, and UART/USART, I2C, SPI, and IrDA support configuration and accessory connections. The 13 mm by 13 mm MAPBGA helps reduce board area, but its fine-pitch construction can increase assembly and inspection requirements. For consumer programs, confirm lifecycle continuity, software support, component availability, and enclosure thermal conditions before approving the MCU for high-volume production.
おすすめ
Motor and Power-Control Subsystem
The MK30DX256ZVMD10 is suitable for a supervisory motor or power-control subsystem where a high-performance MCU coordinates measurements, PWM outputs, communications, and protection logic. The verified ADC and DAC resources support monitoring and control, while PWM, DMA, watchdog, and low-voltage detection support deterministic system behavior. The MCU does not directly replace power transistors, gate drivers, current sensors, or protection hardware; those components must be selected for the voltage and current range of the actual power stage. Firmware should include safe-state behavior and watchdog recovery strategies.
おすすめ
Educational and Embedded-Control Platform
The MK30DX256ZVMD10 can support an embedded-control development platform because it combines a familiar ARM Cortex-M4 core with broad peripheral connectivity. Students or engineers can use the 256 KB of Flash and 64 KB of SRAM for experiments involving GPIO, timers, PWM, ADC, DAC, DMA, UART/USART, SPI, I2C, CAN, SD, and LCD functions. The 144-ball MAPBGA limits accessibility for a simple breadboard, so the device is better suited to a controlled carrier board than to a basic through-hole educational kit. A development board should expose power, debug, reset, clocks, and required communication interfaces.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MK30DX256ZVMD10 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MK30DX256ZVLQ10 | MK20DX256VMD10 | MK30DX256VMD10 | MK20DX256VMD10 | MK30DX256ZVMD10 |
|---|---|---|---|---|---|---|
| Package | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
主な差別化要因
- 100 MHz ARM Cortex-M4 processing within a Kinetis K30 family device （vs MK20DX256VMD10)
- Broad verified connectivity for embedded gateways and control panels （vs MK30DX256ZVLQ10)
- Compact 13 mm by 13 mm 144-ball MAPBGA implementation （vs MK20DX256VMD10)
設計ノート
Use the controlled 144-ball MAPBGA package drawing and ball table as the layout authority. The verified package is 13 mm by 13 mm, and no complete pin map was supplied, so do not infer connections from a generic BGA symbol. Plan power and ground distribution, decoupling, clock routing, debug access, and peripheral escape routes before routing signal classes. Validate the land pattern with the assembler and perform X-ray or equivalent inspection after first builds.
The verified supply options are 1.8 V, 2.5 V, and 3.3 V, but the exact rail sequence, current limits, internal regulators, and decoupling values require the official device documentation. Confirm every power ball and exposed thermal or ground connection in the controlled package data. Place required bypass capacitors close to their associated supply pins and verify startup, reset, brownout, and low-voltage behavior in hardware rather than relying on generic MCU assumptions.
Do not treat related Kinetis MPNs as automatic replacements. A candidate must match the exact 144-ball footprint, ball functions, voltage requirements, peripheral mapping, programming method, and thermal assumptions. The supplied evidence does not verify a drop-in substitute, so firmware and PCB validation are required for any proposed alternative. Also, the zero values in the tier array represent unavailable pricing, not free components.
Separate analog inputs, communication lines, and high-speed or high-current external interfaces as appropriate. ADC and DAC-capable pins should be routed away from switching nodes and noisy power inductors, while CAN, SPI, UART/USART, and clock signals require controlled return paths and impedance review where applicable. The integrated peripherals do not eliminate the need for external transceivers, protection components, filtering, or proper grounding.
The supplied data states an ambient maximum of 105 degrees C, but it does not provide a verified junction-temperature curve or package thermal-resistance value for this exact MPN. Determine actual dissipation from clock activity, I/O loading, internal peripherals, and ambient conditions using the manufacturer thermal data. Keep exposed thermal or ground structures properly connected and provide copper area where the package design permits. Do not use the 105 degrees C figure as a substitute for a complete thermal design.
コンプライアンス情報
The supplied verified data does not include RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Lifecycle is reported as active by a retrieved technical listing, but compliance status remains unknown.
