MMG3004NT1 - 400-2200 MHz, 27 dBm InGaP HBT GPA | NXP Semiconductors
部品番号: MMG3004NT1 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.12 | $4.12 |
| 10 | $3.71 | $37.10 |
| 100 | $3.21 | $321.00 |
| 500 | $2.78 | $1,390.00 |
| 1,000 | $2.45 | $2,450.00 |
MMG3004NT1 概要
A General Purpose Amplifier (GPA) is a broadband, internally matched RF transistor block used as a gain stage or driver stage between a transceiver's mixer/filter section and the power amplifier chain. InGaP HBT technology provides superior linearity, gain flatness, and thermal stability compared to GaAs MESFET alternatives, making it the dominant technology for sub-3 GHz driver and small-signal amplifier ICs.
Key features of the MMG3004NT1 include broadband operation from 400 MHz to 2200 MHz without external matching, 50-ohm input/output matching built into the IC, +27 dBm output IP3 (OIP3) typical, and a single positive supply rail typically at 5 V or 8 V. The 50-ohm internal prematch eliminates the need for off-chip LC components at the RF ports, simplifying PCB layout and reducing bill-of-materials cost in multi-band radios.
The MMG3004NT1 uses NXP's InGaP HBT process on a GaAs substrate, integrated with passive matching networks and bias circuitry inside the PQFN-16 (5x5) laminate package. The exposed paddle provides both the ground reference and the primary thermal path; careful PCB thermal via design under the paddle is required to maintain junction temperature within datasheet limits at sustained +27 dBm output.
Typical applications include driver amplifiers for cellular/PCS base-station transmitter chains, UMTS/WCDMA small-signal driver stages, broadband industrial RF amplifier modules, VHF/UHF general-purpose gain blocks, and driver stages for higher-power PAs in fixed wireless and WLL infrastructure. The broadband nature makes it well suited to multi-band radios where one stage covers several bands.
When designing with this part, observe the absolute maximum input RF level (typically +15 dBm CW) to avoid overdrive damage. Place decoupling capacitors directly at the supply pin and provide a low-inductance ground path through the exposed paddle with multiple filled thermal vias to inner ground planes. Bias sequencing should ensure the negative gate-like bias is removed before RF is applied to prevent transistor damage.
This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical PCB/layout design notes not duplicated from the manufacturer datasheet.
ドロップイン代替品: MMG3004NT1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MMG3004NT1 （同一形状・フットプリント） — 相違点: Package, Small-Signal Gain.
クイック比較ツール — 並列比較する代替部品を選択:
MMG3005NT1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MMG3004NT1G
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
AGB3301RS24Q1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SKY65162-70LF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MMG3004NT1 最大定格＆電気的特性
| Technology | InGaP HBT (Heterojunction Bipolar Transistor) |
| 機能 | General Purpose Amplifier (GPA), Class A, small-signal, broadband |
| Frequency Range | 400 MHz to 2200 MHz |
| Small-Signal Gain | 17 dB (typical) |
| Output Power (P1dB) | +27 dBm (typical) |
| Input/Output Matching | Internally prematched to 50 ohm |
| パッケージ | 16-PQFN (5x5 mm) |
| Package Type | PQFN-16 with exposed thermal paddle |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MMG3004NT1 ピン構成
| ピン 1 | RF_IN — RF input, internally matched to 50 ohm |
| ピン 2 | GND — DC/RF ground |
| ピン 3 | GND — DC/RF ground |
| ピン 4 | VBIAS — Bias reference input |
| ピン 5 | GND — DC/RF ground |
| ピン 6 | GND — DC/RF ground |
| ピン 7 | GND — DC/RF ground |
| ピン 8 | GND — DC/RF ground |
| ピン 9 | GND — DC/RF ground |
| ピン 10 | GND — DC/RF ground |
| ピン 11 | GND — DC/RF ground |
| ピン 12 | GND — DC/RF ground |
| ピン 13 | VCC — DC supply voltage |
| ピン 14 | GND — DC/RF ground |
| ピン 15 | GND — DC/RF ground |
| ピン 16 | RF_OUT — RF output, internally matched to 50 ohm |
| ピン PADDLE | GND — Exposed thermal paddle - solder to ground plane with filled thermal vias |
主な用途
MMG3004NT1 の用途: 6 件s: Cellular Base-Station Driver Amplifier, UMTS / WCDMA Driver Stage, WLL and Fixed Wireless Infrastructure, General-Purpose Broadband RF Gain Block, VHF/UHF Industrial Amplifier Modules, PCS / PHS Transmitter Driver.
Cellular Base-Station Driver Amplifier
The MMG3004NT1's 400-2200 MHz bandwidth covers all major cellular uplink/downlink bands including GSM 900, DCS 1800, PCS 1900, and UMTS 2100, making it an ideal broadband driver stage in base-station transmit chains. Its +27 dBm P1dB and 17 dB small-signal gain provide sufficient drive level for downstream high-power PAs while preserving linearity for multi-carrier 3G/4G signals. Unlike discrete BJT designs, the internal 50-ohm prematch eliminates custom LC matching, reducing BOM cost and tuning time across multiple bands. In typical cellular-driver use the part operates Class A from a single +5 V or +8 V rail and the exposed paddle must be soldered to a multi-via ground pour for thermal stability.
おすすめ
UMTS / WCDMA Driver Stage
For UMTS/WCDMA driver stages where linearity dominates the design budget, the MMG3004NT1's InGaP HBT process delivers the OIP3 figure required to handle multi-carrier WCDMA signals without distortion-induced ACPR degradation. The 17 dB gain across 1900-2200 MHz provides uniform drive level for downstream PAs, while the internally matched 50-ohm I/O simplifies integration into UMTS RF front-end modules. The exposed paddle thermal path supports continuous UMTS downlink signal levels within the +27 dBm output range. Compared to GaAs MESFET alternatives, InGaP HBT offers superior thermal stability under sustained UMTS carrier loads.
おすすめ
WLL and Fixed Wireless Infrastructure
In WLL (Wireless Local Loop) and fixed wireless infrastructure equipment, the MMG3004NT1 serves as a small-signal gain block between the transceiver and the high-power transmit PA. Its broadband 400-2200 MHz response covers both licensed WLL bands and unlicensed UHF telemetry bands, allowing a single design to serve multi-band customer-premises equipment. The +27 dBm P1dB enables the part to drive the PA chain into saturation without itself adding meaningful IM3 distortion. The PQFN-16 (5x5) package supports automated SMT assembly in volume production environments typical of WLL infrastructure OEMs.
おすすめ
General-Purpose Broadband RF Gain Block
The MMG3004NT1 functions as a broadband 50-ohm-in/50-ohm-out gain block for laboratory test equipment, evaluation boards, and prototyping of RF subsystems. The internally prematched RF ports allow the part to be dropped into a 50-ohm transmission line without external matching, simplifying bench characterization. Its 400-2200 MHz coverage spans all common ISM, cellular, and telemetry bands used in test instrumentation. Engineers commonly use the MMG3004NT1 as a reference gain stage when characterizing filters, mixers, or other two-port RF components under small-signal conditions.
おすすめ
VHF/UHF Industrial Amplifier Modules
Industrial VHF/UHF amplifier modules benefit from the MMG3004NT1's broad 400-2200 MHz response combined with InGaP HBT's inherent ruggedness under mismatched load conditions. The +27 dBm output capability supports industrial telemetry, RFID reader pre-drivers, and process-control RF links. The exposed paddle provides thermal grounding suitable for sealed industrial enclosures where ambient temperatures reach +85 C. The PQFN-16 (5x5) form factor enables compact module design and supports reflow soldering compatible with standard lead-free SMT processes.
おすすめ
PCS / PHS Transmitter Driver
The MMG3004NT1's bandwidth covers PCS (Personal Communications Service) at 1850-1910 MHz / 1930-1990 MHz and PHS (Personal Handy-phone System) at 1880-1930 MHz, allowing a single driver stage to serve multiple personal-communication standards. Its 17 dB gain provides ample drive for downstream PA stages while the broadband response eliminates band-switching filters at the driver output. InGaP HBT linearity preserves the low ACPR required for PCS/PHS regulatory compliance. The PQFN-16 package's small 5x5 mm footprint supports the compact PCB area typical of PCS/PHS handsets and small-cell infrastructure.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MMG3004NT1 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MMG3005NT1 | MMG3004NT1G | AGB3301RS24Q1 | SKY65162-70LF |
|---|---|---|---|---|---|
| Package | 16-PQFN (5x5 mm) | 16-PQFN (5x5 mm) - same | 16-PQFN (5x5 mm) - same | 16-PQFN (5x5 mm) - same | 16-PQFN (5x5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Skyworks Solutions |
| Technology | InGaP HBT | InGaP HBT | InGaP HBT | InGaP HBT | InGaP HBT |
| Internal Matching | 50 ohm prematch (input/output) | 50 ohm prematch | 50 ohm prematch - same | 50 ohm prematch | 50 ohm prematch |
| Source | NXP primary | web_data | llm_knowledge | web_data | web_data |
主な差別化要因
- Broadest single-stage 400-2200 MHz coverage in NXP's PQFN-16 GPA family （vs MMG3005NT1)
- Drop-in footprint compatible with higher-linearity family members （vs AGB3301RS24Q1)
- Internally prematched 50 ohm I/O simplifies BOM （vs SKY65162-70LF)
設計ノート
The MMG3004NT1's exposed thermal paddle is the primary heat-dissipation path. Estimated: at +27 dBm output in Class A bias, the die dissipates several hundred mW, and the theta_JA of the PQFN-16 (5x5) package without a ground-plane heat spreader is approximately 35-45 C/W. Solder the paddle to a continuous ground pour on the top layer and stitch at least 9 to 16 filled thermal vias (0.3 mm drill, 0.6 mm pad) under the paddle to inner ground planes for reliable operation at +27 dBm continuous output.
Maintain 50-ohm microstrip or coplanar-waveguide transmission lines at both RF_IN (pin 1) and RF_OUT (pin 16) with reference to the ground paddle. Place DC-blocking capacitors directly at these RF pins to prevent DC offset from bias networks coupling into the RF path. Keep the VCC supply trace short and place a 100 nF bypass capacitor immediately at the VCC pin (pin 13), with a larger 10 uF tantalum or ceramic bulk capacitor nearby for low-frequency supply decoupling.
Keep the VBIAS line (pin 4) well-isolated from the RF traces to prevent bias noise from modulating the RF output. Use a pi-network (series resistor plus bypass caps) on the VBIAS pin to filter out supply noise, especially in switching-power-supply environments. The exposed paddle should be soldered to a low-impedance ground with multiple filled thermal vias - a single via or sparse via pattern will compromise both RF grounding and thermal performance.
Do not exceed the absolute maximum input RF level (typically +15 dBm CW); higher input levels can permanently damage the HBT die. Always sequence bias: apply VCC/VBIAS before applying RF input, and remove RF before removing bias. Avoid routing the RF output near the supply trace or bias trace - coupling from these lines can cause spurious outputs and degrade OIP3 by 3-5 dB. The internal 50-ohm prematch eliminates LC matching but does NOT eliminate the need for proper PCB ground-plane design.
For multi-band radios sharing this amplifier, ensure the band-switching filters downstream of RF_OUT have at least 30 dB stopband attenuation to prevent out-of-band signals from re-entering the amplifier's output and generating IM3 products. In OIP3-sensitive applications, sweep two-tone RF inputs centered in each band of interest and verify OIP3 exceeds the linearity budget by 3 dB minimum across temperature.
コンプライアンス情報
RoHS-compliant per NXP product page; AEC-Q100 grade not qualified (industrial/commercial target). REACH and halogen-free status not explicitly stated in verified web data and marked unknown. Choose AGB3301RS24Q1 if AEC-Q100 qualification is required.
