MPC8272VRTMFA - PowerQUICC II 400MHz SoC MPU | NXP | Networking
部品番号: MPC8272VRTMFA ⚠ ラストタイムバイMPC8272VRTMFA 概要
A PowerQUICC II processor belongs to the microprocessor (MPU) category within embedded processors; it integrates a CPU core with on-chip peripherals traditionally found in separate ASICs. By collapsing multi-chip designs into one BGA package, PowerQUICC II reduces BOM count, board area, and power consumption for routers, DSLAMs, and wireless base stations that previously required a CPU plus a network ASIC.
Key features of the MPC8272VRTMFA include an integrated hardware security engine (SEC) for encryption offload, an FCC (Fast Communications Controller) supporting UTOPIA, ATM, and POS interfaces, dual 10/100 Mbps Ethernet MACs with MII/RMII interfaces, a USB 1.1 host/device controller, a 32-bit PCI 2.2 interface, and memory controllers for DDR and SDRAM. The device is designed for 0 to 105C operation in industrial-grade networking environments.
The PowerPC G2_LE core executes the Power Architecture instruction set with a hardware MMU supporting 32-bit virtual addressing and configurable small (16K) and large (256K) instruction and data caches. The CPM operates independently from the core, offloading DMA, HDLC, Ethernet, and ATM processing, which lets the CPU focus on routing, signaling, and management tasks.
Typical applications include small-to-medium enterprise (SME) routers, integrated access devices (IAD), digital subscriber line access multiplexers (DSLAM), wireless local loop base stations, VPN/firewall appliances, and industrial control networking platforms requiring IPsec/TLS acceleration via the SEC engine.
When designing with this device, allow generous PCB real estate for the 516-BGA footprint; the 27x27 mm package requires 0.8 mm pitch vias and multi-layer escape routing. Provide a stable 1.5V core and 3.3V I/O supply with bulk decoupling at each regulator, and use a JTAG header for boundary-scan bring-up.
This page synthesizes real-time distributor pricing, replacement alternatives from the MPC82xx family, and design considerations not consolidated in the manufacturer datasheet.
ドロップイン代替品: MPC8272VRTMFA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MPC8272CVRMFA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8272VRMFA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8272CVRMFA-400
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8272VRTMFA 最大定格＆電気的特性
| MPN | MPC8272VRTMFA |
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II |
| Core Architecture | PowerPC G2_LE (Power Architecture) |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Maximum CPU Clock | 400 MHz |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| パッケージ | 516-PBGA (27x27 mm) |
| 実装タイプ | Surface Mount (BGA) |
| 動作温度 | 0C to +105C |
| Integrated Peripherals | CPM, SEC, PCI, USB, UTOPIA, 2x 10/100 Ethernet MAC |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Ethernet | 2x 10/100 Mbps MAC with MII/RMII |
| PCI | PCI 2.2, 32-bit |
| USB | USB 1.1 host/device |
| Memory Controller | DDR/SDRAM |
MPC8272VRTMFA 516-pbga (27x27 mm) ピン配置ガイド
MPC8272VRTMFA (516-pbga (27x27 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8272VRTMFA.
詳細は データシート をご参照ください。
主な用途
MPC8272VRTMFA の用途: 6 件s: Small-to-Medium Enterprise (SME) Routers, Integrated Access Devices (IAD) and DSLAMs, VPN / Firewall / IPsec Appliances, Wireless Local Loop (WLL) Base Stations, Industrial Control Networking Gateways, VoIP Media Gateways and PBXs.
Small-to-Medium Enterprise (SME) Routers
The MPC8272VRTMFA is a system-on-chip processor tailored for SME routers, integrating a 400 MHz PowerPC G2_LE core, dual 10/100 Ethernet MACs, a PCI 2.2 interface for WAN PHY / crypto co-processors, and the SEC engine for IPsec/3DES/AES/TLS acceleration at line rate. Its CPM offloads DMA, HDLC, and ATM from the core so the CPU spends cycles on routing, NAT, and management tasks instead of packet shuffling. The 516-PBGA 27x27 mm footprint concentrates CPU plus network plus crypto into a single BGA, letting router ODMs hit aggressive BOM and PCB area budgets while still delivering IPsec throughput in the 100 Mbps range, which is the typical WAN side of an SME router. Designers value the deterministic CPM performance because it keeps routing latency bounded even under DDoS scenarios where the core is saturated.
おすすめ
Integrated Access Devices (IAD) and DSLAMs
Integrated access devices and low-density DSLAM line cards rely on the MPC8272VRTMFA for its UTOPIA interface, which bridges to upstream DSL PHY chips, and its FCC ports that handle multiple PPPoA/PPPoE sessions per subscriber. The CPM's multi-channel HDLC controller terminates up to 256 HDLC frames without core intervention, eliminating the need for an external ASIC and shrinking the BOM for cost-sensitive IADs. The SEC engine accelerates CHAP/PAP authentication inside RADIUS-controlled subscriber sessions, while the dual 10/100 Ethernet MACs backhaul aggregated traffic to the access router. Industrial-grade 0C to +105C operation lets designers deploy these IADs in outdoor cabinets without a thermal redesign, which is a key reason carriers still specify the MPC8272 series for legacy DSL deployments.
おすすめ
VPN / Firewall / IPsec Appliances
VPN concentrators and SMB firewall appliances benefit from the MPC8272VRTMFA's integrated SEC engine, which performs AES, 3DES, SHA-1, MD5, and RSA operations in hardware at speeds sufficient for 100 Mbps-class IPsec tunnels. The CPM handles the IPsec ESP/AH packet transform and SPD/SAD lookup independently, keeping the CPU available for IKE negotiation, routing policy, and management plane tasks like SNMP and CLI. Dual 10/100 Ethernet MACs provide WAN and LAN ports in a single chip, removing the need for an external PHY-switch combo. Engineers pair the MPC8272 with external DDR SDRAM (16-256 MB) and a serial boot flash, then run a hardened Linux or VxWorks image from onboard NAND. The 516-PBGA footprint is well supported by mainstream 6-layer PCB stack-ups, which keeps NRE cost low for security appliance ODMs.
おすすめ
Wireless Local Loop (WLL) Base Stations
Fixed-wireless and WiMAX base stations deploy the MPC8272VRTMFA as the baseband processor because its CPM offers FCC, SCC, and SMC serial channels that connect to RF front ends via SPI or UTOPIA-like interfaces. The PowerPC G2_LE core handles the MAC scheduler, QoS classification, and OAM messaging, while the SEC engine secures backhaul links to the operator's core network. Operating temperature up to 105C lets the part sit inside environmentally hardened outdoor enclosures alongside PA and filter stages. The DDR/SDRAM memory controller supports the burst-heavy traffic patterns of TDD/TDMA wireless protocols, and the PCI 2.2 bus attaches to co-processor FPGAs for PHY acceleration. Expect deterministic latency for TDD frame timing because the CPM runs at a separate clock from the CPU core.
おすすめ
Industrial Control Networking Gateways
Industrial gateway designs leverage the MPC8272VRTMFA's combination of dual Ethernet MACs, USB host controller, PCI bus, and serial SCC channels to bridge PLCs, drives, and HMIs with plant-floor Ethernet protocols like EtherNet/IP, Modbus TCP, and PROFINET. The SEC engine is useful for OPC-UA-over-TLS links to the SCADA tier, which is becoming standard in critical infrastructure. The 0C to +105C industrial temperature grade and the long-life NXP PowerQUICC architecture make the part attractive to industrial OEMs that need 10+ years of availability. Designers typically boot from a parallel NOR flash and run a real-time OS like VxWorks or INTEGRITY to meet deterministic industrial control deadlines. The 516-BGA package, while larger than QFP alternatives, lets the PCB carry short controlled-impedance traces for the 10/100 Ethernet MII signals.
おすすめ
VoIP Media Gateways and PBXs
VoIP media gateways and SMB PBXs build on the MPC8272VRTMFA's HDLC/TDM support, using the FCC ports to connect directly to T1/E1 framers and the SCC channels for ISDN BRI/UART links to endpoint devices. The SEC engine secures SIP/TLS and SRTP media streams, while the PowerPC G2_LE core runs the SIP stack and PBX feature server. Booting from compact flash and running Linux or VxWorks keeps the firmware cost low for high-volume SMB PBX products. PCI 2.2 expansion lets OEMs add DSP daughter cards for higher-density transcoding when 256+ channels are required. The 400 MHz core is well balanced for typical 64-128 channel systems without requiring additional DSP offload, which simplifies BOM and accelerates time-to-market.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8272VRTMFA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8272CVRMFA | MPC8272VRMFA | MPC8272CVRMFA-400 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Maximum CPU Clock | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Operating Temperature | 0C to +105C (industrial) | -40C to +105C (extended) | 0C to +70C (commercial) | -40C to +105C (extended) |
| SEC Engine | Yes (AES, 3DES, SHA, RSA) | Yes | Yes | Yes |
| Ethernet MACs | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps |
| Core / I/O Voltage | 1.5 V / 3.3 V | 1.5 V / 3.3 V | 1.5 V / 3.3 V | 1.5 V / 3.3 V |
主な差別化要因
- Industrial temperature grade for outdoor enclosures （vs MPC8272VRMFA (commercial))
- SEC hardware encryption engine included （vs MPC8247CVRTIEA)
- Extended temperature headroom for rugged designs （vs MPC8272CVRMFA (extended temp))
設計ノート
The MPC8272VRTMFA requires a 1.5V core rail and 3.3V I/O rail; design these as point-of-load supplies downstream of a 5V intermediate bus. Use a multiphase buck regulator (e.g., MAX1978EUI+T) to source at least 2.5A on the 1.5V rail. Bulk-decouple each supply with a 22 uF ceramic + 100 uF polymer at the regulator output and a 0.1 uF + 10 uF ceramic pair within 5 mm of every BGA supply ball. Power sequencing must assert 1.5V before 3.3V or use a tracking regulator to avoid latch-up.
Estimated: at 1.5V/3A core draw plus 3.3V/0.5A I/O draw at 400 MHz under full CPM load, the device dissipates approximately 4.5-5 W. The 516-PBGA 27x27 mm package has a typical theta_JA of around 12 C/W on an 8-layer JEDEC test board, which yields a 60 C rise. For 0C to +105C operation, the maximum ambient must stay below 45 C under full load, so use a 4-6 layer PCB with a continuous ground plane and thermal via array under the BGA. Add a top-side copper lid or stiffener if the chassis is enclosed.
The 516-PBGA 27x27 mm package uses 1.0 mm ball pitch; escape routing requires microvias or 0.4 mm-pitch traces on at least the top two layers. Maintain 50 ohm controlled impedance on the MII/RMII traces and 90 ohm differential impedance on USB DP/DM. Place a single 0.1 uF decoupling cap between each power ball pair and route a continuous 3.3V and 1.5V island in the third layer. Add 4 ground thermal-via clusters (9-via array) directly under the die shadow to drop theta_JA by 20%.
Do not boot the MPC8272VRTMFA from a NAND flash on the local bus without configuring the BPM (Bus Port Mode) - the device defaults to a 60x bus and will hang. Always program the BCSR (Bus Configuration Registers) in the reset configuration words from a parallel NOR flash before relinquishing the reset. Reference the MPC8272EC datasheet's Power-On Reset and Boot section before laying out boot strapping resistors on the hardReset config pins.
コンプライアンス情報
RoHS/REACH status for this EOL part is not confirmed in the verified web data; lead-free is implied by the BGA-package series and the NXP Pb-free transition. AEC-Q100 is not applicable for a PowerPC microprocessor. Refer to the official NXP PCN for full compliance certificates.