MPC8313EVRADDB - PowerPC e300c3 MPU 267MHz 516-BGA | NXP
部品番号: MPC8313EVRADDB ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.1 | $341.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $23.4 | $11,700.00 |
| 1,000 | $19.95 | $19,950.00 |
MPC8313EVRADDB 概要
Background: An MPU (Microprocessor Unit, also called microprocessor IC) is a standalone processor IC, distinct from a microcontroller (MCU), which typically includes on-chip flash memory and peripherals. The MPC83xx line sits at the intersection of networking-grade processing and Power Architecture, originally developed by Freescale and now part of NXP's Power Architecture (e.Power) portfolio. The e300c3 core implements the Power Architecture Book-E instruction set with hardware cryptography acceleration, positioning the MPC8313 family as a secure platform for embedded routers, NAS systems, and industrial gateways.
Key differentiators include integrated encryption acceleration (SEC 2.3+), dual Gigabit Ethernet MACs, USB 2.0 high-speed (480 Mbps), and DDR1/DDR2 memory support up to 256 MB. The MPC8313EVRADDB operates from a 1.0 V core supply and 1.8/2.5 V for DDR, supporting industrial temperature ranges. The 27x27 mm 516-TEPBGA package features an exposed thermal pad enabling efficient heat dissipation in space-constrained designs.
Typical applications include secure routers, network attached storage (NAS), industrial automation controllers, secure point-of-sale terminals, and embedded gateways. The SGMII-capable Gigabit Ethernet ports and hardware encryption acceleration make it particularly suitable for managed switches and VPN appliances.
Design consideration: Power-rail sequencing (1.0 V core before 1.8/2.5 V I/O) is required during power-up to prevent latch-up. PCB designers must allocate at least 6 layers with dedicated power planes and follow the NXP layout guidelines for DDR trace matching within 50 ps.
This page synthesizes distributor pricing, same-family alternatives, and applied design considerations curated for embedded engineers evaluating the MPC8313 platform - context not available in a single distributor listing.
ドロップイン代替品: MPC8313EVRADDB — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8313EVRADDB （同一形状・フットプリント） — 相違点: Memory Controller, Core Architecture, Ethernet, PCI Express, USB.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8313EVRAGDB
✅ ドロップイン✓ 在庫あり
$17.9 / 個
データシートを見る →MPC8313ZQADDB
✅ ドロップイン✓ 在庫あり
$24.5 / 個
データシートを見る →MPC8313CVRADDB
✅ ドロップイン✓ 在庫あり
$24.6 / 個
データシートを見る →MPC8313CVRAGDB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8313EVRADDC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8313EVRADDB 最大定格＆電気的特性
| Core Architecture | PowerPC e300c3 (32-bit) |
| Series | MPC8313 (MPC83xx family) |
| Number of Cores | 1 |
| Maximum CPU Clock | 267 MHz |
| パッケージ | 516-TEPBGA (27x27 mm) |
| Memory Controller | DDR1/DDR2 (up to 266 MHz) |
| Ethernet | 2 x Gigabit Ethernet with SGMII |
| USB | USB 2.0 High-Speed (480 Mbps) |
| Security Engine | Integrated (SEC 2.3+, indicated by 'E' suffix) |
| Local Bus | Local bus controller |
| Core Voltage | 1.0 V |
| I/O Voltage | 1.8 V / 2.5 V |
| 動作温度 | -40C to +85C (industrial, extended) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Encryption Acceleration | Yes (AES, DES, 3DES, SHA, MD) |
MPC8313EVRADDB 516-tepbga (27x27 mm) ピン配置ガイド
MPC8313EVRADDB (516-tepbga (27x27 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8313EVRADDB.
詳細は データシート をご参照ください。
主な用途
MPC8313EVRADDB の用途: 8 件s: Secure Enterprise Router, Network Attached Storage (NAS), Industrial Automation Controller, Secure Point-of-Sale (POS) Terminal, IoT Edge Gateway, Cable / DSL Residential Gateway, Print / Imaging Controller, Vehicle Telematics and Fleet Tracking.
Secure Enterprise Router
The MPC8313EVRADDB fits secure enterprise routing platforms because its PowerPC e300c3 core at 267 MHz delivers the line-rate packet processing required for encrypted VPN and IPsec tunnels, while the integrated SEC 2.3+ engine handles AES/DES/SHA offload. The dual Gigabit Ethernet MACs with SGMII interface let designers connect directly to SFP cages and external PHYs without glue logic. Placed on a router line card with 256 MB DDR2 memory, it provides deterministic throughput for stateful firewalls.
おすすめ
Network Attached Storage (NAS)
The MPC8313EVRADDB suits entry-level NAS controllers because its USB 2.0 high-speed (480 Mbps) interface connects to external storage peripherals while the dual Gigabit Ethernet MACs provide SMB/NFS throughput for home and small business file servers. The hardware SEC engine accelerates encrypted disk volumes and secure file transfer protocols. Integrated DDR1/DDR2 memory controller (up to 256 MB) supports the in-memory filesystem and journal caching typical of Linux-based NAS distros.
おすすめ
Industrial Automation Controller
The MPC8313EVRADDB's industrial -40C to +85C temperature range and robust PowerPC architecture suit factory automation controllers, programmable logic controllers (PLCs), and SCADA gateways. The local bus controller connects to FPGA coprocessors and legacy industrial I/O, while the e300c3 core runs deterministic real-time Linux or VxWorks for hard-real-time motion control loops. The integrated security engine protects against network-borne attacks on OT infrastructure.
おすすめ
Secure Point-of-Sale (POS) Terminal
The MPC8313EVRADDB supports PCI PTS-compliant POS terminals because the SEC 2.3+ engine accelerates the AES, 3DES, and SHA primitives required for EMV chip card processing and PIN block encryption. The PowerPC e300c3 core runs a hardened payment kernel with the Gigabit Ethernet providing the IP-based payment gateway uplink. The industrial temperature grade and 27x27 mm 516-TEPBGA package fit the ruggedized housing of retail POS hardware.
おすすめ
IoT Edge Gateway
The MPC8313EVRADDB serves IoT edge gateways that aggregate multiple fieldbus interfaces and bridge them to the cloud: its USB 2.0 connects to Zigbee, LoRa, or cellular modems, the dual Gigabit Ethernet uplinks aggregate IP traffic, and the SEC engine authenticates TLS 1.2 / DTLS sessions with cloud providers. The local bus provides deterministic access to legacy industrial sensor buses (RS-485, CAN). Operating at 267 MHz, it consumes low power while sustaining edge analytics workloads.
おすすめ
Cable / DSL Residential Gateway
The MPC8313EVRADDB powers cable modem and DSL gateways because its PowerPC e300c3 core at 267 MHz can run a Linux networking stack with full QoS and IP routing offload, while the integrated SEC engine secures the residential firewall and parental-control features. The USB 2.0 port provides storage sharing and printer connectivity. The 27x27 mm 516-TEPBGA package is small enough for the slim residential gateway form factor favored by ISPs.
おすすめ
Print / Imaging Controller
The MPC8313EVRADDB suits office multifunction printer controllers where the PowerPC e300c3 core runs the page description language interpreter (PostScript, PCL, PDF), the local bus drives the scanner ASIC, and the Gigabit Ethernet uplinks provide high-speed job submission. The hardware SEC engine encrypts sensitive print jobs and SNMPv3 management traffic. At 267 MHz, it can sustain 60+ pages-per-minute throughput at engine speed.
おすすめ
Vehicle Telematics and Fleet Tracking
The MPC8313EVRADDB's industrial -40C to +85C temperature and automotive-rated supply partners make it suitable for vehicle telematics units and fleet trackers. Its USB 2.0 port interfaces with GPS modules and cellular modems, while the Gigabit Ethernet provides in-vehicle network access. The SEC engine secures over-the-air firmware updates. Note: for ISO 26262 compliance, designers should review automotive-specific NXP PowerPC variants.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8313EVRADDB — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8313EVRAGDB | MPC8313ZQADDB | MPC8313CVRADDB | MPC8313CVRAGDB | MPC8313EVRADDC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| CPU Core | PowerPC e300c3 (32-bit) | PowerPC e300c3 (32-bit) - same | PowerPC e300c3 (32-bit) - same | PowerPC e300c3 (32-bit) - same | PowerPC e300c3 (32-bit) - same | PowerPC e300c3 (32-bit) - same |
| Security Engine | Yes (SEC 2.3+) | Yes (SEC 2.3+) | Yes (SEC rev may differ) | Yes (SEC 2.3+) | Yes (SEC 2.3+) | Yes (SEC 2.3+) |
| Ethernet | 2 x GbE with SGMII | 2 x GbE with SGMII | 2 x GbE with SGMII | 2 x GbE with SGMII | 2 x GbE with SGMII | 2 x GbE with SGMII |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
| Memory Controller | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) |
主な差別化要因
- Integrated SEC 2.3+ hardware encryption engine (vs basic CPU offload) （vs MPC8313ZQADDB)
- D speed bin (267 MHz) with verified high-volume supply （vs MPC8313CVRADDB)
- Established security-engine ecosystem on PowerPC e300c3 （vs ARM Cortex-A SoC)
設計ノート
The MPC8313EVRADDB requires carefully sequenced power-rail ramp-up: the 1.0 V core supply must reach nominal before the 1.8 V or 2.5 V DDR I/O rail, otherwise latch-up can occur in the I/O buffers. Recommended approach uses a NXP UCOS-style power management IC (such as the PF0100) that drives the rails with programmed delay and provides 3 ms hold time. The core current at 267 MHz peaks near 1.2 A, so the 1.0 V rail requires at least a 4-layer PCB with a dedicated 2 oz copper pour on the BGA footprint.
The 516-TEPBGA 27x27 mm BGA package requires a 6-layer minimum stack-up with dedicated ground and power planes directly under the device. DDR2 trace matching must be within 50 ps for the byte-lane groups; use length-matched serpentine routing. Place decoupling capacitors on the BGA-side of the device at every 3rd pin for the core ring, reducing Ldi/dt ringing during heavy USB 2.0 or Ethernet transfers. X-ray solder inspection is mandatory since BGA joints are inaccessible to optical AOI.
Although the 516-TEPBGA package includes an exposed thermal pad, the Theta_JA is in the range of 12-18 C/W at typical 6-layer PCB thermal performance. At maximum throughput (267 MHz core + 2 GbE SGMII link-up + USB 2.0 active), worst-case dissipation is near 2.5 W. Estimated: with 25 C ambient, junction rises to ~50 C - safe for industrial -40C to +85C operation, but inadequate airflow derating is required when the device is used in sealed IP-rated industrial enclosures.
Do not use the SEC engine without first initializing the IIM (Internal Interface Module) and the e-fuses: an uninitialized SEC engine silently passes unencrypted traffic. When upgrading firmware, always verify the signature before flipping the boot bank, because a failed boot can leave the device in a bricked state requiring external JTAG recovery. The local bus must be configured with the correct hold time and wait-state values for the attached FPGA/ASIC to avoid bus timeouts.
コンプライアンス情報
RoHS compliant per NXP product page and distributor listings. AEC-Q100 not applicable since the MPC8313EVRADDB is industrial-grade, not automotive-grade qualified (for automotive telematics, designers should consult NXP's automotive-grade PowerPC product family).