MPC8313CZQADDC - PowerQUICC II Pro MPU 267MHz | TI
部品番号: MPC8313CZQADDC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $18.4 | $18,400.00 |
MPC8313CZQADDC 概要
A PowerQUICC communications processor is a category of integrated Power Architecture SoCs originally developed by Motorola (later Freescale, now NXP) that consolidate a PowerPC CPU core with communication peripherals such as Ethernet MACs, PCI interfaces, and memory controllers. The MPC8313 sits in the lower-power tier of the PowerQUICC II Pro family and is commonly used in wired networking and embedded control applications where deterministic performance and integrated connectivity outweigh raw MHz.
Key features include up to 267 MHz e300c3 core frequency, 16 KB I-cache and 16 KB D-cache, integrated DDR1/DDR2 SDRAM controller with ECC support, dual 10/100/1000 Ethernet MACs (one with GMII/TBI/RGMII, one with GMII/MII/RGMII), two PCI/PCI-X controllers, USB 2.0 (Host + Device), local bus, DMA, and a security engine. The integrated peripherals allow a complete line-card or small-router BOM with only the MPC8313, PHY, memory, and magnetics.
The architecture leverages a unified 32-bit peripheral bus plus separate DMA channels for I/O, offloading memory transfers from the CPU and improving sustained throughput. The e300c3 core is a low-power variant of the e500 family, providing predictable integer performance with low heat dissipation suitable for fanless industrial enclosures. The 516-TEPBGA package provides the high-density interconnect needed for the 32-bit memory and 16-bit local-bus interfaces.
Typical applications include SOHO and SMB routers, integrated access devices, DSLAM line cards, industrial gateways, secure point-of-sale terminals, and PowerPC-based embedded control. The DDR1/DDR2 controller and dual GbE MACs make the device well suited to small-office networking appliances requiring line-rate packet processing without an external switch.
When designing with this part, allocate a 4-layer or 6-layer PCB to route the 32-bit DDR memory bus with proper impedance control and length matching. The TEPBGA package requires 0.8 mm or 1.0 mm ball pitch PCB land pattern and precise reflow profile to avoid head-in-pillow defects; NXP's hardware specification document is the authoritative reference for layout rules. Designers should also verify boot ROM configuration and pin strapping resistors at design bring-up.
This page synthesizes NXP datasheet parameters, current distributor pricing, and drop-in same-family alternatives not found in the manufacturer literature, providing context for sourcing and PCB reuse decisions.
ドロップイン代替品: MPC8313CZQADDC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8313CZQADDC （同一形状・フットプリント） — 相違点: Series, Mounting Type, Manufacturer, Operating Temperature Range, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8313EZQADDC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8313ECVRAFFC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8313CZQADDCA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8309CVMAGDCA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX357DJQ5C
✅ ドロップイン✓ 在庫あり
$23.4 / 個
データシートを見る →MPC8313CZQADDC 最大定格＆電気的特性
| Series | PowerQUICC II Pro, MPC83xx |
| Core Architecture | PowerPC e300c3 |
| Core Count | 1 |
| データバス幅 | 32-Bit |
| Maximum Core Frequency | 267 MHz |
| Package Type | 516-TEPBGA (27x27 mm) |
| 動作温度範囲 | -40C to +105C |
| 電源電圧 | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | DDR1/DDR2 SDRAM with ECC |
| Ethernet MACs | 2x 10/100/1000 Mbps (GMII/TBI/RGMII, GMII/MII/RGMII) |
| PCI Controllers | 2x PCI / PCI-X |
| USB Interface | USB 2.0 Host + Device |
| Local Bus | 16-bit, up to 133 MHz |
| Security Engine | Integrated (IPsec / bulk crypto) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant (Lead-Free) |
MPC8313CZQADDC 516-tepbga (27x27 mm) ピン配置ガイド
MPC8313CZQADDC (516-tepbga (27x27 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8313CZQADDC.
詳細は データシート をご参照ください。
主な用途
MPC8313CZQADDC の用途: 6 件s: SOHO and SMB Routers, Industrial Gateways and Protocol Converters, DSLAM Line Cards and Access Equipment, Secure Point-of-Sale Terminals, Embedded Industrial Control, Network-Attached Storage Entry-Level.
SOHO and SMB Routers
The MPC8313CZQADDC's 267 MHz e300c3 core and dual integrated Gigabit Ethernet MACs make it well suited for SOHO and SMB router designs where deterministic packet processing and line-rate throughput matter more than raw CPU MHz. The integrated DDR1/DDR2 memory controller with ECC simplifies the BOM by combining CPU and memory interface in one IC, while the security engine accelerates IPsec for VPN termination without external crypto ASICs. Typical SOHO router designs run Linux or VxWorks on the MPC8313 with 128-256 MB DDR2, a GbE PHY, and a magnetics module, achieving wire-speed NAT for typical broadband connections.
おすすめ
Industrial Gateways and Protocol Converters
The MPC8313CZQADDC integrates dual GbE MACs, dual PCI controllers, and a 16-bit local bus, which provides the I/O density needed for industrial gateway designs that aggregate fieldbus (Modbus, Profibus, CAN) traffic onto Ethernet. The -40C to +105C industrial temperature range allows deployment in factory floor enclosures without active cooling. A typical industrial gateway uses the local bus to interface a fieldbus controller ASIC, the PCI bus for a wireless modem, and the dual Ethernet ports for redundant uplink connections, with the security engine encrypting site-to-site traffic.
おすすめ
DSLAM Line Cards and Access Equipment
The MPC8313CZQADDC's combination of DDR1/DDR2 controller with ECC, PCI/PCI-X for line-card interfacing, and integrated security engine suits DSLAM and central-office line card designs. The e300c3 core can run uClinux or a real-time RTOS to manage DSL PHY control and traffic shaping. ECC memory is essential for telecom-grade MTBF targets, and the 516-TEPBGA package provides the I/O density required for 32-bit memory plus PCI plus Ethernet. Line card designers typically pair the MPC8313 with a discrete DSL PHY and a TDM bus controller on the local bus.
おすすめ
Secure Point-of-Sale Terminals
The MPC8313CZQADDC's integrated security engine, which accelerates AES, DES, 3DES, SHA, and RSA, makes it suitable for PCI PTS-compliant point-of-sale terminals where on-chip crypto reduces BOM cost. The 267 MHz core runs the payment application stack while the security engine handles PIN block encryption and key management. Designers typically connect a smart card reader via USB, a thermal printer via the local bus, and a wired Ethernet or dial-up modem for transaction authorization. Industrial temperature operation is important for outdoor kiosk deployments.
おすすめ
Embedded Industrial Control
The MPC8313CZQADDC's e300c3 core, deterministic interrupt latency, and rich peripheral mix make it suitable for embedded industrial control applications such as CNC controllers, machine vision pre-processors, and building automation controllers. The PCI bus allows connection to frame grabbers or motion controller cards, while the dual Ethernet ports enable redundant industrial Ethernet (PROFINET, EtherNet/IP) connectivity. The 1.8V/2.5V/3.3V supply rails simplify integration with industrial ASICs and FPGAs on the same board, and the 516-TEPBGA package supports high-density routing required by industrial PC-like form factors.
おすすめ
Network-Attached Storage Entry-Level
The MPC8313CZQADDC's DDR2 controller with ECC, SATA support via PCI-hosted controller, and Gigabit Ethernet MACs make it suitable for entry-level NAS appliances targeting small office and home office backup markets. The security engine provides hardware-accelerated encryption for at-rest data protection, while the 267 MHz performance is sufficient for gigabit wire-speed file serving. A typical NAS design pairs the MPC8313 with two SATA disks on PCI, a DDR2 SODIMM slot, and a GbE PHY, running Linux with SMB/NFS/iSCSI stacks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8313CZQADDC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8313EZQADDC | MPC8313ECVRAFFC | MPC8309CVMAGDCA | MCIMX357DJQ5C |
|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | ARM1136JF-S |
| Maximum Core Frequency | 267 MHz | 266 MHz | 266 MHz | 200 MHz | 532 MHz |
| Operating Temperature Range | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Ethernet MACs | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 1x 10/100 + 1x 10/100/1000 |
| USB Interface | USB 2.0 Host + Device | USB 2.0 Host + Device | USB 2.0 Host + Device | USB 2.0 Host only | USB 2.0 OTG |
主な差別化要因
- Rev 3 silicon with full errata fixes （vs MPC8313ZQADDC)
- Lower power consumption for fanless designs （vs MPC8313EZQADDC)
- Integrated security engine eliminates external crypto ASIC （vs MPC8309CVMAGDCA)
設計ノート
The 516-TEPBGA package uses a 1.0 mm ball pitch and requires a 4-layer or 6-layer PCB stackup with controlled-impedance routing for the DDR memory bus. Use microvia-in-pad PCB technology to fan out the dense BGA ball array; standard through-via fanout is not feasible at this density. Maintain 50 ohm single-ended and 100 ohm differential impedance for the Ethernet GMII/RGMII signals, and follow NXP's hardware specification layout rules exactly to avoid signal integrity issues on the DDR bus.
Estimated: At 267 MHz full CPU load with both Ethernet ports active and DDR2 traffic, the MPC8313CZQADDC dissipates approximately 1.5-2.0 W typical power. The 516-TEPBGA package has theta_JA around 25-30 C/W on a 4-layer JEDEC test board, resulting in 50-60 C temperature rise above ambient. For enclosed industrial designs without airflow, provide thermal vias under the BGA die and at least 4 square cm of copper pour to keep junction temperature below 105 C at 70 C ambient.
Do not assume the local bus pin mapping is compatible between MPC8313 and MPC8313E revisions without checking the errata document - some local bus pins have silicon revision-dependent functions. Verify boot ROM configuration strapping resistors at design bring-up; the MPC8313 reads CFG pins via the reset sequence and an incorrect strapping can lock the part in JTAG-only mode. Always use ECC-enabled DDR2 memory in production designs even if your application does not currently need ECC, to ensure compliance with NXP's reference firmware.
コンプライアンス情報
RoHS compliant per NXP product page. AEC-Q100 not applicable (this is an MPU, not an automotive-grade IC). Halogen-free status not explicitly stated in retrieved data; refer to NXP environmental compliance documentation for confirmation.