MPC8323ECVRADDC - 266MHz PowerQUICC II Pro SoC | NXP
部品番号: MPC8323ECVRADDC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.1 | $821.00 |
| 100 | $74.25 | $7,425.00 |
| 500 | $67.8 | $33,900.00 |
| 1,000 | $62.4 | $62,400.00 |
MPC8323ECVRADDC 概要
A PowerQUICC II Pro is a cost-effective, highly integrated system-on-chip (SoC) targeting wired and wireless communications infrastructure, including SOHO routers, DSLAM line cards, media gateways, and industrial control. Within the NXP processor taxonomy it sits below the PowerQUICC III modules - MPC83xx family -> PowerPC e300 core -> 32-bit communications processor -> communications SoC -> embedded processor. The e300c2 core is a 32-bit Power Architecture core with MMU, on-chip debug (COP/JTAG), and dual-issue pipelining for embedded-class throughput.
Key features of the MPC8323ECVRADDC include the integrated security engine (SEC 2.0) supporting DES, 3DES, AES, SHA-1/MD5 hashing, and public-key acceleration; a DDR/DDR2 memory controller with ECC; a USB 2.0 high-speed host/device/OTG controller; two PCI 2.3 interfaces; a UTOPIA-L2 interface for ATM/PHY connectivity; two fast Ethernet controllers (FCCs) supporting 10/100 Mbps; and a QUICC Engine sub-system for TDM, HDLC, and SS7 protocol termination.
Typical applications are SOHO/SMB routers and integrated access devices, xDSL line cards in central-office DSLAMs, 2.5G/3G base-station baseband, industrial serial-control gateways, secure VPN appliances, and PCI-based embedded computing boards. The wide -40C to +105C temperature range also supports outdoor industrial enclosures and telecom line-card environments where commercial-grade parts would fail.
For design-in, route DDR address/command traces with controlled impedance and length-matching, and place 100 ohm differential termination resistors close to the UTOPIA/PCI signals. The 27x27 mm PBGA requires a multilayer PCB with at least 4 layers for power/ground integrity. Use the JTAG/COP debug port for bring-up; the COP header should be brought out for production test.
ドロップイン代替品: MPC8323ECVRADDC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8323ECVRADDC （同一形状・フットプリント） — 相違点: Memory Controller, PCI, Operating Temperature, Ethernet, Package.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8323EVRADDC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8323ECVRAGDC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8323EVRAGDC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8323EZQADDC
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$14.06 / 個
データシートを見る →MPC8321ECVRADDC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8321EVRADDC
✅ ドロップイン✓ 在庫あり
$38.4 / 個
データシートを見る →MPC8323ECVRADDC 最大定格＆電気的特性
| Part Status | Active |
| Core Processor | PowerPC e300c2 |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Core Speed | 266 MHz |
| Series | MPC83xx |
| Family | PowerQUICC II Pro |
| Security Engine (SEC) | Yes (SEC 2.0) |
| USB | USB 2.0 (Host/Device/OTG) |
| PCI | 2x PCI 2.3 |
| Memory Controller | DDR/DDR2 with ECC |
| UTOPIA Interface | UTOPIA-L2 (ATM/PHY) |
| Ethernet | 2x 10/100 Mbps FCC |
| 動作温度 | -40C to +105C |
| パッケージ | 516-PBGA, 27x27 mm |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
MPC8323ECVRADDC 516-pbga, 27x27 mm ピン配置ガイド
MPC8323ECVRADDC (516-pbga, 27x27 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8323ECVRADDC.
詳細は データシート をご参照ください。
主な用途
MPC8323ECVRADDC の用途: 7 件s: SOHO/SMB Router Platform, DSLAM Line Card, Industrial Serial Gateway, Secure VPN Appliance, Wireless Base Station Controller, PCI Embedded Computing Board, Media Gateway Controller.
SOHO/SMB Router Platform
The MPC8323ECVRADDC's 266 MHz e300c2 core with integrated 10/100 Ethernet, USB 2.0, PCI, and security engine make it ideal for SOHO and SMB router platforms. The hardware SEC 2.0 block accelerates IPsec/SSL VPNs at wire speed, eliminating the need for a separate crypto chip and reducing BOM cost. With DDR2 memory controller supporting up to 1 GB, the SoC can handle NAT, firewall, and routing table workloads. The integrated USB 2.0 OTG port enables 3G/4G modem tethering for backup WAN links. Compared to discrete router designs, this integration cuts PCB area by 40% and power consumption by ~30%.
おすすめ
DSLAM Line Card
The MPC8323ECVRADDC's UTOPIA-L2 interface and QUICC Engine sub-system enable direct connection to ADSL2+/VDSL PHY chipsets for DSLAM line cards. The QUICC Engine terminates ATM AAL2/AAL5 traffic in hardware, freeing the e300c2 core for higher-layer routing and QoS processing. The two PCI 2.3 interfaces can connect to upstream switch fabric ASICs, supporting multi-line-card backplane designs. The extended -40C to +105C temperature range suits central-office environments where commercial-grade parts would fail reliability specifications.
おすすめ
Industrial Serial Gateway
The MPC8323ECVRADDC's PCI interfaces, Ethernet controllers, and wide -40C to +105C temperature range support ruggedized industrial serial-to-Ethernet gateways. The QUICC Engine handles HDLC framing for legacy serial protocols (Modbus, Profibus, RS-485), while the integrated security engine enables secure TLS/DTLS tunnels for remote SCADA monitoring. The 516-PBGA package provides excellent thermal dissipation for fanless enclosures. Industrial deployments benefit from the SoC's 10+ year product longevity commitment from NXP, ensuring long-term supply for factory-floor infrastructure.
おすすめ
Secure VPN Appliance
The MPC8323ECVRADDC's hardware SEC 2.0 engine supports DES/3DES/AES/SHA-1/MD5 at multi-Gbps rates, making it well-suited for branch-office VPN appliances. The e300c2 core at 266 MHz can manage IPsec tunnel setup and IKE negotiation, while the SEC block handles bulk encryption/decryption offload. With DDR2 supporting up to 1 GB RAM, the appliance can maintain thousands of simultaneous VPN tunnels with full IPsec state tables. The integrated Ethernet and USB ports enable direct LAN/WAN connectivity without external MAC chips.
おすすめ
Wireless Base Station Controller
The MPC8323ECVRADDC's combination of Ethernet, PCI, and QUICC Engine makes it suitable for 2.5G/3G wireless base station controllers and picocell baseband processing. The QUICC Engine handles HDLC framing for Abis/Iub interfaces, while the e300c2 core runs the L2/L3 protocol stack. The extended temperature grade supports outdoor radio unit deployment. Multiple PCI endpoints enable connection to FPGA-based baseband accelerators or DSP arrays for capacity upgrades.
おすすめ
PCI Embedded Computing Board
The MPC8323ECVRADDC's two PCI 2.3 interfaces and PCI Host/Agent mode support make it suitable for CompactPCI/PICMG embedded computing boards used in defense, aerospace, and industrial automation. The e300c2 core runs VxWorks or Linux for real-time control, while the PCI bus connects to FPGA Mezzanine Card (FMC) sites for I/O expansion. The 516-PBGA package enables single-board computer designs in 3U/6U Eurocard form factors. The hardware security engine supports encrypted communications for defense and secure-industrial applications.
おすすめ
Media Gateway Controller
The MPC8323ECVRADDC's TDM/HDLC capabilities via QUICC Engine and integrated Ethernet enable VoIP media gateway designs for SMB and carrier edge. The SoC can terminate T1/E1 circuits on the QUICC Engine side while bridging to Ethernet VoIP on the FCC side, supporting 30+ simultaneous voice channels. The hardware security engine handles SRTP/TLS encryption for secure voice. The wide temperature range and PCI expansion enable deployment in both carrier CO environments and customer premises.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8323ECVRADDC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8323EVRADDC | MPC8323ECVRAGDC | MPC8323EVRAGDC | MPC8323EZQADDC | MPC8321ECVRADDC | MPC8321EVRADDC |
|---|---|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 266 MHz | 266 MHz | 400 MHz (+50%) | 400 MHz (+50%) | 266 MHz | 266 MHz | 266 MHz |
| Operating Temperature | -40C to +105C | 0C to +70C (commercial) | -40C to +105C | 0C to +70C (commercial) | -40C to +105C | -40C to +105C | 0C to +70C (commercial) |
| Security Engine (SEC) | Yes (SEC 2.0) | Yes (SEC 2.0) | Yes (SEC 2.0) | Yes (SEC 2.0) | Yes (SEC 2.0) | No (MPC8321 variant) | No (MPC8321 variant) |
| Family Variant | MPC8323E | MPC8323E | MPC8323E | MPC8323E | MPC8323E | MPC8321E (no SEC) | MPC8321E (no SEC) |
| DDR Memory Controller | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC |
| PCI Interfaces | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 |
| USB 2.0 | Yes (Host/Device/OTG) | Yes (Host/Device/OTG) | Yes (Host/Device/OTG) | Yes (Host/Device/OTG) | Yes (Host/Device/OTG) | Yes (Host/Device/OTG) | Yes (Host/Device/OTG) |
| Approximate Unit Price (USD) | $89.50 | ~$85 (commercial temp lower cost) | ~$110 (higher speed) | ~$105 (higher speed) | ~$92 (lead-free finish) | ~$75 (no SEC, lower cost) | ~$72 (no SEC, commercial) |
主な差別化要因
- Extended temperature range for harsh environments （vs MPC8323EVRADDC)
- Integrated hardware security engine （vs MPC8321ECVRADDC)
- Balanced cost-performance in the PowerQUICC II Pro family （vs MPC8323ECVRAGDC)
- UTOPIA-L2 interface for legacy xDSL infrastructure （vs MPC8308 (newer generation))
- QUICC Engine for hardware protocol termination （vs MPC8321ECVRADDC)
設計ノート
Estimated: the 516-PBGA package at 27x27 mm with 1.0 mm ball pitch requires a multilayer PCB (minimum 4 layers, 6 layers recommended) with controlled-impedance routing for DDR traces (50 ohm single-ended, 100 ohm differential). Microvia or via-in-pad technology is recommended for BGA breakout. Power plane and ground plane must be solid below the BGA to provide low-impedance power delivery and thermal dissipation. Estimated using standard BGA design rules for 1.0 mm pitch packages.
The 516-PBGA with thermal balls requires thermal via arrays under the package to dissipate heat to internal copper planes. Estimated: at 266 MHz core speed and typical 1.5W power dissipation, the junction-to-ambient thermal resistance is approximately 15-20 C/W with proper thermal via design. Without thermal vias, junction temperature can exceed 105C maximum in enclosed industrial environments. Always include at least 25 thermal vias (0.3 mm drill, 0.5 mm pad) under the thermal ball grid.
Common design pitfalls for the MPC8323ECVRADDC: (1) Failing to length-match DDR address/command and clock signals within 25 mils results in memory errors at higher bus speeds. (2) Not connecting the JTAG/COP debug port headers prevents in-system debug, leaving no way to recover from boot failures. (3) Using commercial-grade 0C-70C parts in industrial -40C to +105C environments causes field failures - verify the C-suffix in the ordering code for extended temp. (4) Forgetting pull-up resistors on I2C/SMI management interfaces locks the management bus. (5) Not providing bypass capacitors within 5 mm of each power pin causes noise-induced resets.
The MPC8323ECVRADDC requires multiple voltage rails: core voltage (~1.2V typical for 266 MHz speed grade), DDR I/O voltage (1.8V or 2.5V depending on DDR1 vs DDR2), and standard I/O voltage (3.3V). Estimated: total board power consumption at 266 MHz with active Ethernet and USB is approximately 3-5W. Use a multi-rail PMIC or discrete LDOs with proper sequencing - the core voltage must ramp before I/O voltages to prevent latch-up. Decoupling requires 100nF ceramic caps within 5 mm of each power pin plus bulk 10uF tantalum caps on each rail.
For the DDR/DDR2 memory interface, route address/command signals in a controlled-impedance strip-line layer with 50 ohm single-ended impedance and length-match within 50 mils. Data strobes (DQS) and data lines must be length-matched within 25 mils and routed on the same layer to minimize skew. Use 100 ohm differential termination on clock pairs. Estimated based on standard DDR2 layout practices; consult the Freescale/NXP hardware specifications document (approximately 80 pages) for detailed routing requirements.
コンプライアンス情報
RoHS compliant per NXP ordering code VR suffix. Lead-free finish per ECVRADDC ordering code. Not AEC-Q100 qualified (industrial/telecom grade, not automotive). REACH and conflict minerals declarations available from NXP product compliance portal.
