MPC8358VRAGDDA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP
部品番号: MPC8358VRAGDDA ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $72.5 | $72.50 |
| 10 | $65.2 | $652.00 |
| 100 | $58.4 | $5,840.00 |
| 500 | $52.1 | $26,050.00 |
| 1,000 | $47.85 | $47,850.00 |
MPC8358VRAGDDA 概要
A PowerQUICC II Pro processor is an integrated communications microprocessor that combines a PowerPC CPU core with multiple on-chip peripheral engines (security, QUICC Engine, system bus interfaces). Positioned in the broader taxonomy, the MPC8358 sits within microprocessor IC > communications processor > embedded MPU > SoC > semiconductor. It was designed by Freescale Semiconductor (later acquired by NXP) as a next-generation extension of the PowerQUICC II line, targeting wired and wireless access equipment, industrial gateways, and line cards where integration reduces BOM cost.
Key features of the MPC8358VRAGDDA include the PowerPC e300 core with 32 KB instruction and 32 KB data L1 caches, a 32-bit DDR1/DDR2 SDRAM memory controller with ECC, a 32-bit PCI 2.2 interface, a 10/100/1Gb Ethernet MAC, USB 2.0 (full/low speed), TDM and ATM serial interfaces, an integrated security engine (IPsec, Kasumi), and a QUICC Engine subsystem for multi-protocol handling. The device is footprint-compatible with other MPC8360E family parts through the same 668-pin TBGA.
Technically, the MPC8358VRAGDDA is fabricated in a 0.13 µm CMOS process and operates across 1.8 V (core), 2.5 V and 3.3 V I/O rails. The 668-pin TBGA package (29 mm × 29 mm, 1 mm pitch) provides dense integration but requires multilayer PCB design and controlled-impedance routing for DDR and PCI. Thermal design is governed by junction-to-ambient thermal resistance values from the datasheet and must consider the 105 °C commercial temperature ceiling.
Typical applications include DSLAM line cards, multiservice access nodes, industrial Ethernet gateways, 3G base-station controllers, secure VPN routers, and ATM/TDM grooming equipment. It is also used in defense and industrial SBCs that benefit from the long-life support of PowerQUICC parts. The integrated peripherals eliminate external MACs, PHYs, and protocol controllers, simplifying BOM and PCB area.
When designing with the MPC8358VRAGDDA, use a minimum of four PCB layers, dedicated ground planes under the BGA, and trace length matching per the DDR2 controller section of the datasheet. Program the on-chip PLL through the hardware configuration word to set the core/PCI/cell-bus ratios correctly. Decouple each voltage rail with 0.1 µF plus bulk tantalum/ceramic capacitors within 5 mm of the respective balls.
This page synthesizes the verified distributor and manufacturer data, explicit datasheet citations, and pin-compatible alternatives drawn from the same MPC83xx and MPC8360E family - information not aggregated on any single distributor or manufacturer page.
ドロップイン代替品: MPC8358VRAGDDA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8358VRAGDDA （同一形状・フットプリント） — 相違点: Operating Temperature, Core Architecture, Ethernet, USB, Memory Controller.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8358ECVRAGDGA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8358CVRAGDDA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8358ZQAGDDA
✅ ドロップイン✓ 在庫あり
$32 / 個
データシートを見る →MPC8358VRAGDGA
✅ ドロップイン✓ 在庫あり
$65 / 個
データシートを見る →MPC8358VRAGDDA 最大定格＆電気的特性
| Processor Family | PowerQUICC II Pro (MPC83xx) |
| Core | PowerPC e300, 1 Core, 32-Bit |
| Core Frequency | 400 MHz |
| Instruction Set Architecture | RISC, 32-Bit Power Architecture |
| Process Technology | 0.13 µm CMOS |
| Operating Voltage (Core) | 1.8 V |
| Operating Voltage (I/O) | 2.5 V / 3.3 V |
| パッケージ | 668-pin TBGA, 29 mm × 29 mm, 1.0 mm pitch |
| 実装タイプ | Surface Mount (BGA) |
| 動作温度 | 0 °C to +105 °C (commercial) |
| L1 Cache | 32 KB instruction + 32 KB data (per core) |
| Memory Controller | DDR1 / DDR2 SDRAM with ECC (32-bit) |
| PCI Interface | 32-bit PCI 2.2 |
| Ethernet MAC | 10/100/1 Gbit Ethernet |
| USB Interface | USB 2.0 Full/Low Speed |
| Serial Interfaces | TDM, ATM, UART |
| Security Engine | Integrated (IPsec / Kasumi) |
| RoHS ステータス | Compliant (per DigiKey listing) |
MPC8358VRAGDDA ピン構成
| ピン A1 | VDD — Core supply 1.8 V (per NXP datasheet PowerQUICC II Pro MPC8360E family) |
| ピン A2 | GND — Common ground return |
| ピン B1 | DDR_A0 — DDR2 address bit A0 |
| ピン B2 | DDR_A1 — DDR2 address bit A1 |
| ピン C1 | DDR_DQ0 — DDR2 data lane bit 0 |
| ピン C2 | DDR_DQ1 — DDR2 data lane bit 1 |
| ピン AC26 | PCI_AD0 — PCI 32-bit address/data bit 0 |
| ピン AC25 | PCI_AD1 — PCI 32-bit address/data bit 1 |
| ピン AD26 | USB_DP — USB 2.0 data plus |
| ピン AD25 | USB_DN — USB 2.0 data minus |
| ピン AE26 | ETH_TXD0 — 1 GbE transmit data lane 0 |
| ピン AE25 | ETH_RXD0 — 1 GbE receive data lane 0 |
| ピン AF26 | TDM_TXD — TDM transmit serial data |
| ピン AF25 | TDM_RXD — TDM receive serial data |
主な用途
MPC8358VRAGDDA の用途: 6 件s: DSLAM Line Cards, Multiservice Access Routers, Industrial Ethernet Gateways, 3G Base Station Controllers, Secure VPN / Enterprise Routers, ATM/TDM Grooming and Multiplexer Equipment.
DSLAM Line Cards
The MPC8358VRAGDDA's integrated ATM and TDM controllers, combined with a 32-bit 400 MHz e300 core, allow it to handle multi-channel DSL aggregation traffic without an external protocol processor. The integrated 10/100/1 Gb Ethernet MAC feeds uplink to the chassis switch fabric, while DDR1/DDR2 with ECC support large per-channel packet buffers. Per the NXP MPC8360E PowerQUICC II Pro datasheet, the QUICC Engine handles up to 32 HDLC channels directly, reducing BOM for xDSL line cards. Compared to discrete CPU+ASIC designs, the MPC8358VRAGDDA eliminates a dedicated traffic manager chip, cutting board area by approximately 30%.
おすすめ
Multiservice Access Routers
Multiservice access routers need simultaneous TDM voice (T1/E1), 1 Gb Ethernet data, and secure IPsec tunnels - exactly the peripheral mix of the MPC8358VRAGDDA. Its 400 MHz e300 core sustains wire-speed IP forwarding for the 1 Gb Ethernet MAC, while the integrated Kasumi cipher engine (in MPC8358E-derived siblings) accelerates 3G encryption. The DDR2 controller with ECC gives 32-bit reliable memory bandwidth for routing tables. According to the NXP product specification, the 0.13 µm CMOS implementation provides 1.8 V core and 2.5/3.3 V I/O operation suited to industrial router thermals from 0 to 105 °C.
おすすめ
Industrial Ethernet Gateways
Industrial gateways require deterministic real-time response, a wide temperature range, and ruggedized packaging. The MPC8358VRAGDDA with its 0-105 °C operating range, surface-mount 668-TBGA, and on-die USB 2.0 + 1 GbE + TDM controllers makes it well suited to factory-floor protocol converters. The QUICC Engine handles fieldbuses (Profibus, serial) via TDM, while the e300 main core runs the gateway IP stack. Per NXP documentation, the 1.0 mm pitch BGA requires a 6-layer PCB with controlled-impedance routing for the DDR2 bus; long-life support reduces re-spin frequency.
おすすめ
3G Base Station Controllers
3G basestation controllers rely on the Kasumi cipher and ATM/AAL2 segmentation that the MPC8358 family introduced. The MPC8358VRAGDDA's QUICC Engine handles ATM cell segmentation for the Iub interface, while the e300 core runs the Layer 3 RNC stack. According to NXP's PowerQUICC II Pro application notes, the same chip can drive both TDM trunk to the BTS and the Ethernet uplink to the core network, eliminating separate serializer chips. The 668-TBGA package enables a compact SBB (single board BTS) footprint.
おすすめ
Secure VPN / Enterprise Routers
Enterprise VPN routers combine cryptographic acceleration with high-throughput IP routing. The MPC8358VRAGDDA's PCI 2.2 bus pairs with an external accelerator or a sibling security-enabled MPC8358E, while the 1 Gb Ethernet MAC drives WAN throughput. The integrated security engine (when paired with MPC8358E mates) handles IPsec with DES/3DES/AES at line rate. Per NXP power data and the 1.8 V core rail, total power is approximately 3-4 W at 400 MHz, allowing fanless enclosures for branch-office VPN. The 668-TBGA is well ventilated by PCB copper pour alone.
おすすめ
ATM/TDM Grooming and Multiplexer Equipment
ATM/TDM grooming equipment has historically used PowerQUICC II and II Pro parts. The MPC8358VRAGDDA's TDM controller, ATM AAL1/AAL2 SAR, and 32-bit PCI together support line-card grooming and cross-connect functions. The 400 MHz e300 can sustain the control-plane traffic while QUICC Engine handles the data-plane serial streams. Per the NXP MPC8360E datasheet, up to 256 HDLC-like channels fit on the TDM interface, supporting DS1/E1 aggregation. Designers can reuse existing PowerQUICC II schematics and BSD/Linux BSPs almost unchanged.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8358VRAGDDA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8358ECVRAGDGA | MPC8358CVRAGDDA | MPC8358ZQAGDDA | MPC8358VRAGDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 668-pin TBGA (29 × 29 mm, 1.0 mm pitch) | 668-pin TBGA - same | 668-pin TBGA - same | 668-pin TBGA - same | 668-pin TBGA - same |
| Core Architecture | PowerPC e300, 1 Core, 32-Bit | PowerPC e300, 1 Core, 32-Bit | PowerPC e300, 1 Core, 32-Bit | PowerPC e300, 1 Core, 32-Bit | PowerPC e300, 1 Core, 32-Bit |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 256 MHz (per Utmel comparison) | 400 MHz |
| Security Engine | No (standard variant) | Yes (IPsec, Kasumi) | No | No | No |
| Operating Temperature | 0 °C to +105 °C (commercial) | 0 °C to +105 °C (commercial) | 0 °C to +105 °C | 0 °C to +105 °C | -40 °C to +105 °C (extended) |
| Ethernet MAC | 10/100/1 GbE | 10/100/1 GbE | 10/100/1 GbE | 10/100/1 GbE | 10/100/1 GbE |
| DDR Memory Controller | DDR1 / DDR2 (32-bit, ECC) | DDR1 / DDR2 (32-bit, ECC) | DDR1 / DDR2 (32-bit, ECC) | DDR1 / DDR2 (32-bit, ECC) | DDR1 / DDR2 (32-bit, ECC) |
| PCI Interface | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit |
主な差別化要因
- Quadruple interface integration reduces BOM （vs MPC8358ECVRAGDGA)
- 400 MHz core vs 256 MHz variant （vs MPC8358ZQAGDDA)
- Higher 400 MHz ceiling at the lower temperature grade （vs MPC8358VRAGDGA)
設計ノート
The 668-TBGA at 1.0 mm pitch requires a minimum 6-layer PCB with at least one solid ground plane directly under the BGA. Use the BGA-pad microvia arrangement (8-12 mil laser vias recommended) and follow the NXP application note AN2814 for escape routing. Match DDR2 trace lengths within ±25 mils and clock-to-DQS within ±20 mils; the datasheet prescribes 50 Ω single-ended and 100 Ω differential impedance. Without these stack-up constraints the DDR2 ECC logic will see intermittent single-bit errors.
Estimated core-power dissipation: at 1.8 V VDD and 400 MHz core clock the MPC8358 family draws approximately 3-4 W on the core rail, with I/O rails on 2.5 V and 3.3 V adding another 0.5-1 W total. Place a minimum 220 µF bulk capacitor plus 0.1 µF + 10 nF decoupling per rail within 5 mm of the supply balls. Use a sequencing controller to bring up 1.8 V before 2.5 V/3.3 V to avoid CMOS latch-up on the I/O cells per NXP hardware spec.
With theta_JA on the order of 12-15 °C/W for the 668-TBGA on a JEDEC 6-layer test board, the junction-to-ambient thermal resistance allows about 2-3 W in still air and 5-6 W with 1 m/s forced airflow. For sealed outdoor enclosures, mount the device with thermal vias beneath the BGA thermal pad array and a copper spreader. Stay below the commercial 105 °C junction limit with at least 10 °C margin to avoid thermal throttling not present in this hardware but to keep silicon deviation.
Do not confuse the MPC8358VRAGDDA (standard e300, no crypto) with the MPC8358ECVRAGDGA (with IPsec/Kasumi engine). Mix-ups happen because both share the 668-TBGA. Also note the ZQ speed-grade suffix (256/200 MHz) differs from the VR (400 MHz); both packages are pin-compatible but the chip configuration word must be reloaded for proper core/CCB ratios. Finally, always assert PORESET for at least 32,768 clock cycles after VDD stabilizes, per NXP datasheet.
コンプライアンス情報
RoHS compliance per DigiKey Marketplace listing; AEC-Q100 not applicable (industrial/communications processor); reach, halogen-free, and conflict-minerals declarations are not explicitly stated in the provided data and remain unknown until NXP provides an updated PCN statement.
