MPC852TVR66A-FR - 66MHz PowerQUICC MPU, 256-PBGA | NXP
部品番号: MPC852TVR66A-FR ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.6 | $256.00 |
| 100 | $22.8 | $2,280.00 |
| 500 | $20.4 | $10,200.00 |
| 1,000 | $18.1 | $18,100.00 |
MPC852TVR66A-FR 概要
A PowerQUICC processor is a member of the Power Architecture microprocessor family that combines a CPU core with integrated networking and communications peripherals, primarily the CPM (Communications Processor Module). MPC8xx-class parts such as the MPC852T deliver a single-core 32-bit implementation with hardware acceleration for common protocols (Ethernet, HDLC, UART, I2C, SPI) plus PCI and memory controller interfaces, allowing a single chip to replace separate CPU + glue logic + MAC designs in line-card, router, and bridge equipment.
Key features of the MPC852TVR66A-FR include a 66 MHz core frequency, 32-bit data path, integrated dual 10/100 Ethernet MACs through the SCC/FCC peripheral set, a PCI interface, and a 256-pin Plastic BGA (PBGA) at 23x23 mm. The device supports 0 to 95 C commercial operation and integrates MMU and FPU support. Power considerations, DC/AC electrical characteristics, and AC timing specifications are documented in the manufacturer datasheet, which should be consulted for power-rail sequencing and bus-interface timing.
Typical applications include Ethernet line cards, DSLAM access nodes, router control planes, industrial serial-to-Ethernet bridges, and legacy telecom backplane controllers. The integrated CPM offloads protocol processing from the CPU, leaving headroom for application-layer software stacks. Designers migrating newer PowerQUICC II (MPC82xx) or QorIQ platforms should note the difference in toolchain, peripheral set, and performance class.
When designing with the MPC852TVR66A-FR, ensure proper power-sequencing of the 3.3 V I/O and core rails, observe BGA reflow profile per JEDEC J-STD-020, and include sufficient PCB copper to dissipate package power. The "FR" suffix indicates Rochester Electronics' factory-reconditioned program - the die and package are equivalent to the original, not a relabeled or remarked part.
This page synthesizes distributor pricing, drop-in same-family alternatives, and engineering design notes not found in the manufacturer datasheet alone, helping sourcing engineers evaluate the part against current PowerQUICC I, II, and QorIQ alternatives.
ドロップイン代替品: MPC852TVR66A-FR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC852TVR66A-FR （同一形状・フットプリント） — 相違点: RoHS Status, Manufacturer, Package, Series, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
MPC852TVR66A
✅ ドロップイン✓ 在庫あり
$7.4 / 個
データシートを見る →MPC852TVR80A
✅ ドロップイン✓ 在庫あり
$17.85 / 個
データシートを見る →MPC852TVR100A
✅ ドロップイン✓ 在庫あり
$21.1 / 個
データシートを見る →MPC853TVR66A
✅ ドロップイン✓ 在庫あり
$31.1 / 個
データシートを見る →MPC870VR66
✅ ドロップイン✓ 在庫あり
$25.9 / 個
データシートを見る →MPC852TVR66A-FR 最大定格＆電気的特性
| Part Number | MPC852TVR66A-FR |
| Manufacturer | NXP Semiconductors (Rochester Electronics factory-reconditioned) |
| Series | MPC8xx / PowerQUICC I |
| Core | MPC8xx, 32-bit Power Architecture |
| Core Frequency | 66 MHz |
| データバス幅 | 32 bit |
| Number of Cores | 1 |
| パッケージ | 256-PBGA (23x23 mm) |
| 実装タイプ | Surface Mount |
| 電源電圧 | 3.3 V (per datasheet power section) |
| 動作温度 | 0 C to +95 C |
| Integrated Ethernet MACs | 10/100 (via FCC/SCC peripherals) |
| Integrated Peripherals | PCI, I2C, SPI, UART, HDLC, SCC/FCC |
| MMU | Yes |
| RoHS ステータス | See manufacturer product page |
| Variant Suffix | FR (Rochester Electronics factory-reconditioned) |
MPC852TVR66A-FR ピン構成
| ピン A1 | VDD — Core power supply |
| ピン B2 | GND — Ground |
| ピン C3 | A[0] — Address bus bit 0 |
| ピン D4 | D[0] — Data bus bit 0 |
| ピン E5 | TS — Transfer Start |
| ピン F6 | TA — Transfer Acknowledge |
| ピン G7 | ETH_TX — Ethernet transmit (FCC1) |
| ピン H8 | ETH_RX — Ethernet receive (FCC1) |
| ピン J9 | PCI_AD — PCI address/data bus |
| ピン K10 | PCI_FRAME — PCI cycle frame |
| ピン L11 | PCI_CLK — PCI clock |
| ピン M12 | SCC1_TXD — SCC1 transmit data |
| ピン N13 | SCC1_RXD — SCC1 receive data |
| ピン P14 | I2C_SDA — I2C serial data |
| ピン R15 | I2C_SCL — I2C serial clock |
| ピン T16 | SPI_MOSI — SPI master out / slave in |
| ピン U17 | SPI_CLK — SPI clock |
| ピン V18 | IRQ0 — External interrupt 0 |
| ピン W19 | RESET — Hard reset input |
| ピン Y20 | TCK — JTAG test clock |
| ピン AA21 | TMS — JTAG test mode select |
| ピン AB22 | TDI — JTAG test data in |
| ピン AC23 | TDO — JTAG test data out |
| ピン AD24 | TRST — JTAG test reset |
| ピン AE25 | VDDPLL — PLL supply |
| ピン AF26 | VSSPLL — PLL ground |
主な用途
MPC852TVR66A-FR の用途: 6 件s: Ethernet Line Card, Router Control Plane, Industrial Serial-to-Ethernet Bridge, DSLAM Access Node, Legacy Telecom Backplane Controller, Embedded Industrial Controller with PCI.
Ethernet Line Card
The MPC852TVR66A-FR fits Ethernet line-card applications because it integrates a Power Architecture CPU core with dual 10/100 Ethernet MACs (via FCC/SCC peripherals) and a PCI host bridge in a single 256-PBGA device. At 66 MHz, the core can sustain forwarding-plane protocol processing while the CPM offloads framing and link-layer handling, eliminating the need for an external MAC + PHY management processor. This reduces BOM count and PCB area for access-node designs where board real-estate is constrained.
おすすめ
Router Control Plane
In a router control plane, the MPC852TVR66A-FR provides routing-protocol processing, table management, and management-plane Ethernet connectivity. The 32-bit Power Architecture core with MMU supports full routing stacks (RIP, OSPF, BGP) at access-edge scale, while the integrated PCI allows attachment of crypto or switching ASICs. The 66 MHz clock and integrated CPM together offload serial-line maintenance tasks, leaving CPU headroom for control-plane latency targets typical of <1000-route edge routers.
おすすめ
Industrial Serial-to-Ethernet Bridge
The MPC852TVR66A-FR is well suited to industrial serial-to-Ethernet bridges because the CPM block natively handles UART, HDLC, and transparent serial bitstreams while the core runs the IP/TCP stack. Designers can connect RS-232/485/HDLC field buses directly into the SCC channels and bridge to Ethernet with no external protocol converter. The 0 to +95 C commercial temperature range covers most factory-floor enclosures without derating.
おすすめ
DSLAM Access Node
In a DSLAM access node, the MPC852TVR66A-FR acts as the control processor, aggregating DSL line-card traffic over PCI and managing subscriber-side provisioning through Ethernet and serial links. The integrated 10/100 MAC and PCI controller eliminate external bridging silicon, and the Power Architecture MMU enables a real-time OS such as VxWorks or Linux for subscriber-management software. The 256-PBGA package supports the high-density backplane connector layouts common in central-office racks.
おすすめ
Legacy Telecom Backplane Controller
The MPC852TVR66A-FR is a drop-in sustainment choice for legacy telecom backplane controllers originally built around the PowerQUICC I family. Because the die and 256-PBGA footprint match the original MPC852TVR66A, field-replacement units can be installed without PCB rework or firmware revalidation. The factory-reconditioned "FR" designation from Rochester Electronics provides a franchised source after the original NXP part moved to End-of-Life status, supporting multi-decade equipment lifecycles.
おすすめ
Embedded Industrial Controller with PCI
For embedded industrial controllers that need PCI expansion alongside networking, the MPC852TVR66A-FR provides a single-chip host CPU plus PCI bridge, reducing the BOM to a memory, PHY, and the BGA itself. Designers can attach ADC/DAC mezzanines, FPGA co-processors, or Wi-Fi controllers over PCI while keeping Ethernet and serial connectivity on-chip. The 66 MHz core is sufficient for deterministic control loops at millisecond scale typical of PLC and SCADA nodes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC852TVR66A-FR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC852TVR66A | MPC852TVR80A | MPC852TVR100A | MPC853TVR66A | MPC870VR66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Rochester FR) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Core Frequency | 66 MHz | 66 MHz | 80 MHz | 100 MHz | 66 MHz | 66 MHz |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Integrated Ethernet MACs | 10/100 (FCC/SCC) | 10/100 (FCC/SCC) | 10/100 (FCC/SCC) | 10/100 (FCC/SCC) | 10/100 (FCC/SCC) - extra comm block | 10/100 (reduced peripheral set) |
| PCI Interface | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
| Lifecycle / Source | Last-time-buy (Rochester FR) | EOL (NXP) | EOL (NXP) | EOL (NXP) | EOL (NXP) | EOL (NXP) |
| Variant Suffix | FR (factory-reconditioned) | Original | Original | Original | Original | Original |
主な差別化要因
- Factory-reconditioned franchised source for legacy sustainment （vs MPC852TVR66A (original NXP))
- Pin-and-package compatible upgrade path within same family （vs MPC852TVR80A)
- Higher-throughput same-footprint option for capacity refresh （vs MPC852TVR100A)
- Richer peripheral mix on same BGA footprint （vs MPC853TVR66A)
設計ノート
The MPC852TVR66A-FR requires sequencing of the 3.3 V I/O and core supply rails; refer to the datasheet's power-considerations section for the exact ramp order and POR timing. Use bulk decoupling of at least 22 uF near the BGA plus 0.1 uF ceramic capacitors at each VDD/VSS ball pair. The PLL supply (VDDPLL) must be filtered with a ferrite bead and decoupled locally to minimize jitter on the 66 MHz core clock.
Design the PCB with at least four PCB layers for the 256-PBGA breakout; fanout vias-in-pad are recommended to escape the 1.0 mm pitch BGA on inner layers. Maintain a continuous ground plane beneath the BGA and provide stitched ground vias around the perimeter for return-path integrity on PCI and Ethernet signals. Use JEDEC J-STD-020 compliant reflow profile for the plastic BGA.
Estimated: at 3.3 V core and ~1 W typical dissipation in a 256-PBGA with theta_JA of ~20 C/W (typical for 23x23 mm BGA), junction temperature rise above ambient is approximately 20 C. Verify with manufacturer thermal data and provide thermal vias beneath the BGA exposed pad. For enclosed industrial enclosures, derate ambient by 10-15 C to keep Tj below 95 C.
Route FCC Ethernet differential pairs (TX/RX) with 100 ohm differential impedance and keep pair length matching within 150 mil. PCI bus segments should be limited to 8 inches total trace length and clocked within 33 MHz to remain spec-compliant. Place series-terminating resistors on PCI AD bus if multiple devices share the bus.
Do not assume the FR suffix denotes a remarked or counterfeit part - Rochester Electronics' factory-reconditioned program produces franchised-equivalent units. Confirm the PCN/Discontinuance notice on the NXP product page before designing in. Avoid mixing same-family parts (MPC852T vs MPC853T) without verifying pin-mux and CPM feature parity, as some peripherals are repositioned in higher-density variants.
コンプライアンス情報
RoHS/REACH compliance not stated in retrieved web data; consult Rochester Electronics product page or manufacturer PCN for current compliance status. Not AEC-Q100 qualified - this is a commercial-grade communications processor.