ラストタイムバイのお知らせ: MPC870CZT133 は生産終了が近づいています。最終注文日: お問い合わせ. 利用可能な代替部品を見る →
NXP Semiconductors

MPC870CZT133 - MPC8xx 133MHz 32-Bit MPU | NXP | 256-PBGA

部品番号: MPC870CZT133 ⚠ ラストタイムバイ
在庫あり 1〜3営業日以内に発送
256-PBGA (23x23 mm) Package 133 MHz Speed
開始価格 $71 USD / 個
MOQ: 1 |
価格更新日: 2026-10-16
ボリューム価格
数量 単価 小計
1 $95 $95.00
10 $88.5 $885.00
100 $82 $8,200.00
250 $76.5 $19,125.00
500 $71 $35,500.00
ℹ️ すべての価格はUSDです

MPC870CZT133 概要

The NXP MPC870CZT133 is a 32-bit RISC microprocessor from the MPC8xx PowerQUICC family, operating at 133 MHz with a single core and housed in a 256-ball PBGA (23x23 mm) package. It integrates the PowerPC architecture with on-chip peripherals including communications processor module (CPM), making it a system-on-chip solution for embedded networking and industrial control. The part is offered in a tray packaging format and targets legacy embedded designs.

An MPU (Microprocessor Unit) is a CPU-centric integrated circuit that contains the central processing unit, control logic, and on-chip peripheral interfaces but typically relies on external memory for program and data storage. MPUs sit higher in the computing hierarchy than MCUs (which integrate flash/RAM), and are commonly used when large external memory footprints, DMA engines, or specialized peripheral modules are required. The MPC8xx family extends the PowerPC core with dedicated communications hardware for telecom and industrial applications, occupying a distinct niche between general-purpose microprocessors and dedicated communication ASICs.

Key features of the MPC870CZT133 include a 32-bit PowerPC core at 133 MHz, integrated CPM for HDLC/USB/UART support, 256-ball PBGA package, and extended operating temperature range suitable for industrial environments. The device supports up to 32-bit external memory bus and offers multiple serial interface controllers, reducing external component count in networking equipment.

The architecture combines a PowerPC integer unit with a RISC-based CPM, allowing simultaneous execution of communications protocol handling and general-purpose processing. The 133 MHz clock speed delivers approximately 133 MIPS of integer performance, adequate for legacy router, bridge, and serial concentrator designs. Memory management is handled by a hardware MMU supporting virtual memory and protection.

Typical applications include industrial serial concentrators, low-end routers and bridges, telecom control boards, factory automation controllers, and legacy embedded systems requiring PowerPC instruction-set compatibility. The integrated CPM eliminates the need for an external protocol controller in most designs.

Designers should verify long-term supply before committing to new designs, as the MPC8xx family is approaching end-of-life. Existing designs should plan for migration to the MPC85xx or QorIQ families for new production. The 256-ball PBGA requires careful PCB layout with controlled-impedance traces and adequate thermal relief for reliable operation.

This page synthesizes distributor availability, drop-in MPC8xx alternatives, lifecycle status, and practical design notes that go beyond the manufacturer hardware specifications document, helping engineers assess sourcing options and modernization paths.

ドロップイン代替品: MPC870CZT133 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MPC870CZT133 (同一形状・フットプリント) — 相違点: Core Architecture, Package, Operating Temperature, Package Code, RoHS Status.

NXP Semiconductors
Core Architecture: Power Architecture (32-bit RISC)
Package: 256-BGA (PBGA, 23x23 mm)
比較対象 MPC870CZT133 →
NXP Semiconductors
Core Architecture: Power Architecture (G2_LE)
Operating Temperature: 0C to +95C (commercial)
Package Code: HBGA
比較対象 MPC870CZT133 →
NXP Semiconductors
Core Architecture: Power Architecture (PowerPC) 32-bit
Package: 256-Pin BGA (23x23 mm)
Operating Temperature: -40 C to +100 C
比較対象 MPC870CZT133 →
NXP Semiconductors
Core Architecture: Power Architecture (PowerPC) 32-bit
Package: 256-ball PBGA (23x23 mm)
Operating Temperature: 0C to +95C
比較対象 MPC870CZT133 →

クイック比較ツール — 並列比較する代替部品を選択:

MPC870ZT133

✅ ドロップイン
NXP Semiconductors
📦 256-PBGA (23x23)
NXP USA Inc. (formerly Freescale) · PowerQUICC MPC8xx · MPC8xx PowerQUICC, 32-Bit · Power Architecture (G2_LE) · 133 MHz · 1 · 32-bit · 3.3 V I/O, 1.8 V core

✓ 在庫あり

$28.75 / 個

データシートを見る →

MPC875ZT133

✅ ドロップイン
NXP Semiconductors
📦 256-PBGA (23x23)
Power Architecture (PowerPC) 32-bit · 1 · 133 MHz · MPC8xx / PowerQUICC · 256-ball PBGA (23x23 mm) · HBGA, Grid Array with Heat Sink/Slug · 0C to +95C · 1.9 V

✓ 在庫あり

$19.85 / 個

データシートを見る →

MPC870CVR133

✅ ドロップイン ⚠️ 仕様未検証
NXP Semiconductors
📦 256-PBGA (23x23)
NXP Semiconductors (formerly Freescale Semiconductor) · PowerQUICC MPC8xx · MPC8xx · Power Architecture (32-bit RISC) · 133 MHz · 176 MIPS · 32-bit · 1

✓ 在庫あり

$18.4 / 個

データシートを見る →

MPC860DTZQ133D4

✅ ドロップイン ⚠️ 仕様未検証
📦 256-PBGA (23x23)
Same 256-PBGA footprint, 133 MHz, MPC860 family ancestor with overlapping CPM peripheral set, similar instruction set

📋 参考代替品(カタログ未掲載)

MPC870CZT133 最大定格&電気的特性

Part Number MPC870CZT133
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor)
Series MPC8xx (PowerQUICC)
Core Architecture PowerPC 32-bit RISC
Number of Cores 1
Core Speed 133 MHz
データバス幅 32-bit
パッケージ 256-PBGA (23x23 mm)
Package Code HBGA, BGA-256
Terminal Form Ball
Number of Terminals 256
On-chip Peripherals Communications Processor Module (CPM), UART, HDLC, USB
実装タイプ Surface Mount
RoHS ステータス unknown
Lead-Free unknown
ハロゲンフリー unknown
AEC-Q100 Qualified not_applicable

MPC870CZT133 hbga, bga-256 ピン配置ガイド

MPC870CZT133 (hbga, bga-256 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

MPC870CZT133 の hbga, bga-256 パッケージピン配置図

詳細なピン配置データはありません: MPC870CZT133.

詳細は データシート をご参照ください。

主な用途

MPC870CZT133 の用途: 6 件s: Legacy Telecom Control Boards, Industrial Serial Concentrators, Low-End Routers and Bridges, Factory Automation Controllers, Embedded Networking Equipment, Legacy System Maintenance and Repair.

🌐

Legacy Telecom Control Boards

The MPC870CZT133's integrated Communications Processor Module (CPM) with native HDLC, UART, and USB support makes it well suited for legacy telecom line cards and control boards requiring PowerPC instruction-set compatibility. At 133 MHz the core delivers adequate throughput for T1/E1 aggregation, signaling protocol termination, and supervisory control tasks common in legacy central-office equipment. The 32-bit PowerPC architecture simplifies migration of existing firmware from older MPC860 designs.

🏭

Industrial Serial Concentrators

Multi-port serial concentrators in industrial automation frequently use the MPC870CZT133 to aggregate UART-based fieldbus traffic from RS-232, RS-422, or RS-485 links. The CPM's multiple SCC (Serial Communication Controller) channels handle the protocol framing in hardware, freeing the PowerPC core for higher-level routing and management functions. The 256-PBGA package's robust thermal characteristics and 133 MHz performance are well matched to DIN-rail mounted industrial gateways.

🌐

Low-End Routers and Bridges

Small-office router and bridge designs from the early 2000s frequently used the MPC870CZT133, leveraging its integrated CPM for WAN serial interface termination alongside the PowerPC core running routing protocols. The 133 MHz clock provides adequate packet processing for sub-100 Mbps aggregate throughput. While the part is now legacy, fielded router installations continue to require replacement units for maintenance windows.

🏭

Factory Automation Controllers

Programmable Logic Controller (PLC) and distributed control system (DCS) modules deployed in factory automation historically used the MPC870CZT133 for deterministic real-time processing of sensor and actuator data. The PowerPC core's deterministic interrupt latency and the CPM's hardware-protocol-offload capabilities simplify real-time control loop implementation. The industrial temperature variants of the MPC870 family support deployment in harsh factory-floor environments.

🌐

Embedded Networking Equipment

Small-footprint embedded networking appliances such as protocol converters, print servers, and embedded web servers leveraged the MPC870CZT133's combination of PowerPC processing throughput and CPM peripheral integration. The integrated USB controller simplifies connection to external storage or peripheral devices. The 256-PBGA package and 133 MHz core provide a balance of capability and power consumption suitable for fanless embedded designs.

🔧

Legacy System Maintenance and Repair

Fielded systems using the MPC870CZT133 continue to require spare parts for repair and maintenance throughout their operational lifetime. With the part now in last-time-buy status, identifying verified pin-compatible alternatives is essential for sustaining production of repair components. The MPC870ZT133 and MPC875ZT133 serve as drop-in replacements in many legacy applications, allowing continued support without redesign.

What is the MPC870CZT133?
The MPC870CZT133 is a 32-bit PowerPC microprocessor from NXP's MPC8xx (PowerQUICC) family, operating at 133 MHz in a 256-ball PBGA package. It integrates a PowerPC core with a Communications Processor Module (CPM) supporting HDLC, UART, and USB interfaces. According to the NXP product page, the part is in the last-time-buy lifecycle phase, indicating limited remaining supply for legacy designs.
What is the core speed of the MPC870CZT133?
The MPC870CZT133 runs at 133 MHz core clock frequency, delivering approximately 133 MIPS of integer performance. This speed is appropriate for legacy networking and industrial control applications. The clock is supplied externally; designers must provide a stable oscillator and configure the PLL inside the device for proper operation.
What package does the MPC870CZT133 use?
The MPC870CZT133 is housed in a 256-ball Plastic Ball Grid Array (PBGA) measuring 23x23 mm. The BGA pitch and ball layout are documented in the NXP hardware specifications document. This surface-mount package requires reflow soldering and careful PCB layout with multiple GND/VCC balls for power integrity.
What is the lifecycle status of the MPC870CZT133?
According to the NXP product page, the MPC870CZT133 has reached End of Life and is in the last-time-buy phase. The product page explicitly lists "End of Life Overview" and "Discontinuance and Replacement" documentation. New designs should not use this part; existing designs should secure remaining inventory or migrate to the MPC85xx or QorIQ families.
What is the best drop-in replacement for the MPC870CZT133?
The closest drop-in replacements within the MPC8xx family are the MPC870ZT133 (solder-ball-revised variant) and the MPC875ZT133 (higher-integration sibling with additional peripherals). Both share the same 256-PBGA package footprint. For modern designs, the MPC8309 or QorIQ P1010 are recommended upgrades, though they require PCB layout changes.
Where can I buy the MPC870CZT133 online?
The MPC870CZT133 is available from distributors including DigiKey (stocking both NXP and Rochester Electronics inventory) and Mouser. As of 2026-10-16, both NXP USA Inc. and Rochester Electronics LLC are listed as authorized sources. Pricing fluctuates due to last-time-buy status; request quotes from multiple distributors for the best available stock and lead time.
What is the price of the MPC870CZT133?
As of 2026-10-16, the MPC870CZT133 single-unit price is approximately USD 95.00 based on Octopart distributor listings. Bulk pricing drops to around USD 71.00 at 500-piece quantities. Pricing is highly volatile due to last-time-buy status; confirm current pricing directly with distributors before procurement.
What is the lead time for the MPC870CZT133?
Lead time for the MPC870CZT133 varies significantly due to last-time-buy status. DigiKey and Mouser may have limited stock for immediate shipment, but larger orders may require manufacturer allocation. As of 2026-10-16, Rochester Electronics stocks the part for ongoing legacy support. Confirm lead time directly with each distributor before placing orders.
Is the MPC870CZT133 in stock?
As of 2026-10-16, the MPC870CZT133 is listed as in stock at DigiKey and Mouser in limited quantities. Rochester Electronics also stocks the part for long-term legacy support. Due to last-time-buy status, stock levels are declining. Engineers should verify availability at the time of order and consider placing safety stock for production continuity.
MPC870CZT133 vs MPC875ZT133 - which should I use?
Choose the MPC870CZT133 if your existing design is validated against the MPC870 peripheral set. Choose the MPC875ZT133 if you need additional integrated peripherals (Fast Ethernet, additional SCC channels) in the same package. Both share the 256-PBGA footprint, enabling direct migration. The MPC875 is a feature superset at the same 133 MHz clock speed.
MPC870CZT133 vs MPC870ZT133 - what is the difference?
The MPC870CZT133 and MPC870ZT133 are both 133 MHz MPC8xx MPUs in 256-PBGA. The 'C' suffix typically denotes a specific silicon revision or feature subset. Both share the same 256-PBGA package footprint and are functionally interchangeable for most applications. Confirm exact register-level compatibility against the hardware specifications document before substituting.
When should I choose the MPC870CZT133 over a modern alternative?
Choose the MPC870CZT133 only when maintaining exact PowerPC instruction-set compatibility for existing software, or when repair/replacement of legacy fielded systems requires identical form-fit-function. For new designs, modern alternatives like the QorIQ P1010 or i.MX RT series offer better performance, lower power, and active lifecycle. The MPC870CZT133 is best suited for maintenance of legacy telecom and industrial equipment.
Where can I download the MPC870CZT133 datasheet PDF?
The MPC870CZT133 hardware specifications document (84 pages) is available on AllDataSheet and DigChip archives. The official NXP product page at https://www.nxp.com/part/MPC870CZT133 links to the current hardware specifications document. Designers should obtain the document directly from NXP for the latest revision, including any errata documents.
What is the pinout of the MPC870CZT133?
The MPC870CZT133 uses a 256-ball PBGA with specific ball assignments for address bus, data bus, CPM interfaces, and power/ground. The full pin-by-pin assignment is documented in the NXP hardware specifications document. Critical balls include the external memory interface (data/address/control), CPM serial channels, USB, JTAG, and multiple VCC/GND balls for power integrity.
Is the MPC870CZT133 RoHS compliant?
RoHS compliance status for the MPC870CZT133 is marked as "unknown" because the part is in last-time-buy phase and the original datasheet may not specify current compliance status. The 256-PBGA package was historically available in lead-free finishes. Engineers should request the latest material declaration directly from NXP or Rochester Electronics for regulatory compliance verification.
What is a good alternative MPN for the MPC870CZT133?
Within the NXP/Freescale family, the MPC875ZT133 is a good pin-compatible alternative offering additional integrated peripherals in the same 256-PBGA package. Cross-brand drop-in equivalents are not widely available due to the PowerPC architecture. For functional equivalents from other vendors, consider the Microchip AT91 series or Renesas RZ family as modern architectural substitutes, noting these require PCB redesign.

エンジニアリング参考データ: MPC870CZT133 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MPC870CZT133 only when maintaining PowerPC instruction-set compatibility for existing validated firmware in legacy telecom, industrial, or networking equipment. The part is in last-time-buy status, so limit new designs and instead select the MPC870ZT133 (silicon revision variant) or MPC875ZT133 (feature superset) as alternatives. For new product designs, prefer modern architectures: NXP's QorIQ P1010 or i.MX RT1060 offer better performance and active lifecycle, though they require PCB redesign. Within the MPC8xx family, choose the MPC875ZT133 if additional Fast Ethernet MAC and SCC channels are needed; otherwise the MPC870ZT133 provides identical functionality at similar cost.

代替品との比較

パラメータ この製品 MPC870ZT133 MPC875ZT133 MPC870CVR133 MPC860DTZQ133D4
Package 256-PBGA (23x23) 256-PBGA (23x23) - same 256-PBGA (23x23) - same 256-PBGA (23x23) - same 256-PBGA (23x23) - same
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Core Architecture PowerPC 32-bit PowerPC 32-bit PowerPC 32-bit PowerPC 32-bit PowerPC 32-bit
Core Speed 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Integrated Ethernet MAC No (external required) No Yes (Fast Ethernet) No No
Number of SCC Channels 2 2 4 2 4
USB Controller Yes (USB 1.1) Yes Yes Yes No
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy Obsolete

主な差別化要因

  • Integrated Communications Processor Module (vs MPC860DTZQ133D4)
  • Compact 256-PBGA footprint (vs MPC875ZT133)
  • Last-time-buy availability for legacy support (vs Modern alternatives like QorIQ P1010)

設計ノート

The 256-PBGA package has thermal resistance theta_JA that depends heavily on PCB layout. For continuous 133 MHz operation, ensure at least four thermal vias under the central ground balls and a ground plane on the opposite PCB layer. Estimated: with theta_JA of approximately 15 C/W on a standard 4-layer PCB, the junction temperature rise at 2W typical dissipation is about 30C above ambient. Add thermal relief copper pours if operating near maximum ambient temperature.

The 256-PBGA requires a PCB with BGA-compatible land pattern and reflow soldering profile. Use non-solder-mask-defined (NSMD) pads with a diameter approximately 80% of the ball diameter for optimal joint reliability. Place multiple GND and VCC balls with direct via connections to inner planes. The high-speed external memory bus traces must be length-matched within timing specifications documented in the hardware specifications document.

Do not design new products with the MPC870CZT133 - the part is in last-time-buy status per the NXP product page. Existing designs must plan for last-time-buy procurement: place orders for full lifetime requirements before the part reaches end-of-life. Verify silicon revision and errata against the latest hardware specifications document before substitution with the MPC870ZT133 or MPC875ZT133.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
鉛フリー
Unknown
ハロゲンフリー
Unknown
紛争鉱物
Unknown

Compliance status unknown because the part is in last-time-buy phase and the manufacturer may not have updated compliance documentation. Request the latest material declaration directly from NXP or Rochester Electronics for regulatory compliance verification.

データ検証日: 2026-10-16 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MPC870CZT133 MPC870CZT133 datasheet NXP MPC870CZT133 MPC870 PowerQUICC 133 MHz 256-PBGA PowerPC MPU MPC870CZT133 industrial serial concentrator MPC870CZT133 vs MPC875ZT133 MPC870CZT133 drop-in replacement MPC870CZT133 buy price MPC8xx last time buy replacement MPC870CZT133 pinout PBGA-256 legacy PowerPC MPU telecommunications

関連部品&用語

NXP Semiconductors Freescale Semiconductor MPC870CZT133 MPC870ZT133 MPC875ZT133 MPC870CVR133 MPC860DTZQ133D4 MPC8xx PowerQUICC PowerPC 32-bit RISC microprocessor Communications Processor Module CPM HDLC controller SCC 256-PBGA PBGA BGA Surface Mount QorIQ USB 1.1 UART Rochester Electronics legacy embedded last-time-buy End of Life
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