MPC853TVR100A-FR - PowerQUICC MPC8xx MPU, 100MHz, 256-BGA | NXP
部品番号: MPC853TVR100A-FR ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $65.4 | $6,540.00 |
| 500 | $58.95 | $29,475.00 |
| 1,000 | $54.2 | $54,200.00 |
MPC853TVR100A-FR 概要
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, registers, and memory interfaces needed to execute operating systems, protocol stacks, and user applications. The MPC8xx class of microprocessors belongs to the broader embedded-MPU hierarchy (microprocessor > processor > integrated circuit > semiconductor) and was widely adopted in 1990s and early 2000s networking infrastructure. The MPC853T is positioned as an ethernet-only variant of the MPC866, retaining the CPM (Communications Processor Module) while omitting certain HDLC/serial channels, which reduces silicon cost for Ethernet-centric designs.
Key specifications include a 100 MHz CPU core, 66 MHz external bus, 256 PBGA package with 1 mm ball pitch, integrated 10/100 Ethernet MAC, dual UART, I2C, SPI, and a memory controller supporting SDRAM, SRAM, and Flash. The device also features a 16-bit or 32-bit general-purpose timer, an interrupt controller, and on-chip debug/JTAG boundary scan. Power management supports low-power stop, doze, and sleep modes typical of the MPC8xx family.
The architecture pairs a PowerPC core with a RISC-based CPM (Communications Processor Module) that offloads DMA, Ethernet, and serial-channel handling. This dual-engine topology lets the PowerPC core focus on control-plane code (routing tables, management stacks) while the CPM moves packets autonomously, an early example of heterogeneous multiprocessing on a single die.
Typical applications include SOHO routers, 10/100 Ethernet switches, ADSL/cable modem gateways, industrial serial-to-Ethernet bridges, and embedded telematics units. Its 5 V tolerant I/O makes it a drop-in upgrade for legacy 5 V systems that are transitioning to 32-bit processing but cannot redesign the backplane. Modern designs often pair it with PHYs like the Intel LXT972A or Micrel KSZ8041 and with SDRAM such as Micron MT48LC16M16A2.
When selecting this part, verify that the firmware and toolchain (e.g., Embedded Linux MPC8xx BSP, U-Boot, or Green Hills INTEGRITY) are still maintained, as NXP has marked the broader MPC8xx line as mature and is steering new designs toward PowerQUICC II/III and QorIQ families. Designers of long-lifecycle equipment (industrial controllers, telematics, defense) frequently use Rochester Electronics authorized stock to extend availability.
This page consolidates distributor pricing, datasheet references, and verified drop-in alternatives for engineers maintaining legacy PowerQUICC designs.
ドロップイン代替品: MPC853TVR100A-FR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC853TVR100A-FR （同一形状・フットプリント） — 相違点: Memory Controller, Operating Temperature, Package.
クイック比較ツール — 並列比較する代替部品を選択:
MPC853TVR100A
✅ ドロップイン✓ 在庫あり
$18.9 / 個
データシートを見る →MPC853TVR80A-FR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC866TVR100A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC875VR80
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC853TVR100A-FR 最大定格＆電気的特性
| Core Architecture | PowerPC 32-bit (MPC8xx) |
| Core Frequency | 100 MHz |
| External Bus Frequency | 66 MHz max |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V (5 V TTL tolerant) |
| パッケージ | 256-PBGA (23x23 mm, 1.0 mm pitch) |
| Process Technology | 0.18 micron CMOS |
| Family | PowerQUICC MPC866 Family (ethernet-only) |
| Integrated Peripherals | 10/100 Ethernet MAC, 2x UART, I2C, SPI |
| Memory Controller | SDRAM, SRAM, Flash |
| DMA Engine | CPM (Communications Processor Module) |
| JTAG / Debug | Yes (IEEE 1149.1 boundary scan) |
| Power Modes | Run, Doze, Sleep, Deep Sleep |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 (168 hours) |
MPC853TVR100A-FR 256-pbga (23x23 mm, 1.0 mm pitch) ピン配置ガイド
MPC853TVR100A-FR (256-pbga (23x23 mm, 1.0 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC853TVR100A-FR.
詳細は データシート をご参照ください。
主な用途
MPC853TVR100A-FR の用途: 6 件s: SOHO Ethernet Router, Industrial Serial-to-Ethernet Bridge, ADSL/Cable Modem Gateway, Embedded Telematics and Fleet Management, Industrial Print Server and Networked MFP, Defense and Avionics Legacy Replacement.
SOHO Ethernet Router
The MPC853TVR100A-FR fits SOHO routers thanks to its integrated 10/100 Ethernet MAC, on-chip CPM that offloads packet DMA, and 100 MHz PowerPC core capable of running a lightweight IP routing stack. The CPM performs autonomous Ethernet framing, freeing the CPU for NAT, DHCP, and firewall processing. Power dissipation around 1.5-2 W at 100 MHz is acceptable for fanless plastic enclosures. The 256-PBGA footprint, while requiring 4-layer PCB, is the de facto standard for this class and is supported by reference designs from NXP.
おすすめ
Industrial Serial-to-Ethernet Bridge
The MPC853TVR100A-FR serves as the core of serial-to-Ethernet gateways used in factory automation and SCADA systems. Its dual UART, I2C, and SPI controllers handle legacy RS-232/485 sensor and PLC connectivity while the integrated MAC terminates the Ethernet side. The -40C to +85C industrial temperature rating covers most factory-floor deployments, and the 5 V TTL tolerant I/O simplifies interfaces to 5 V sensors without level shifters. The CPM offloads protocol framing (Modbus TCP, EtherNet/IP), and the 100 MHz core handles web/HMI tasks.
おすすめ
ADSL/Cable Modem Gateway
For xDSL and cable modem gateways, the MPC853TVR100A-FR provides the routing performance and peripheral mix needed for residential gateways. The PowerPC core runs the IP stack and NAT/firewall while the CPM handles Ethernet MAC and DMA, leaving headroom for QoS, VoIP DSP interfacing, and management interfaces. The 5 V tolerant I/O simplifies interface to legacy cable/ADSL front-end chips. The 256-PBGA (23x23 mm) package matches reference designs from leading DSLAM/cable-modem OEMs and supports standard 4-layer PCB stackups.
おすすめ
Embedded Telematics and Fleet Management
The MPC853TVR100A-FR suits telematics control units requiring deterministic Ethernet connectivity over CAN or serial buses. The CPM's DMA engine and integrated 10/100 MAC enable reliable data offload to back-office servers, while the 100 MHz PowerPC core handles GPS parsing, accelerometer fusion, and on-board diagnostics. The industrial -40C to +85C temperature range supports vehicle and rail environments. Long-lifecycle programs (defense, rail signaling) particularly benefit because Rochester Electronics stocks the part for 15+ year support.
おすすめ
Industrial Print Server and Networked MFP
The MPC853TVR100A-FR can act as the network processor in industrial print servers and networked multi-function peripherals. Its Ethernet MAC handles 10/100 connectivity, while UART/SPI ports interface to print engines and control boards. The 100 MHz core runs the print-job pipeline, image rendering buffers, and remote management stack. The integrated memory controller supports SDRAM for buffer queues and Flash for firmware. The 256-PBGA footprint is well documented in reference designs, easing rapid productization of networked office equipment.
おすすめ
Defense and Avionics Legacy Replacement
Long-lifecycle defense and avionics programs continue to use the MPC853TVR100A-FR because of its mature firmware ecosystem, established RTOS support (VxWorks, INTEGRITY, LynxOS), and ongoing authorized-stock availability through Rochester Electronics. Its deterministic CPM, 5 V tolerant I/O, and industrial temperature range simplify integration into legacy 5 V backplanes. The 100 MHz core is sufficient for instrument-panel controllers, MIL-STD-1553 bridges, and avionics data concentrators where certification cost dominates over raw speed.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC853TVR100A-FR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC853TVR100A | MPC853TVR80A-FR | MPC866TVR100A | MPC875VR80 |
|---|---|---|---|---|---|
| Package | 256-BGA (23x23 mm) | 256-BGA (23x23 mm) - same | 256-BGA (23x23 mm) - same | 256-BGA (23x23 mm) - same | 256-BGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 100 MHz | 100 MHz | 80 MHz | 100 MHz | 80 MHz |
| Integrated Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
| HDLC Channels | 0 (ethernet-only) | 0 | 0 | Multiple (HDLC/ATM) | 0 |
| USB Controller | No | No | No | No | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | Obsolete |
主な差別化要因
- 100 MHz core versus 80 MHz speed grade （vs MPC853TVR80A-FR)
- Lower BOM cost versus full PowerQUICC 866 （vs MPC866TVR100A)
- Industrial temperature range with 5 V tolerant I/O （vs MPC875VR80)
- Mature firmware ecosystem (U-Boot, VxWorks, Linux) （vs Newer NXP QorIQ P1010)
設計ノート
The MPC853TVR100A-FR requires two separate supply rails: 1.8 V for the PowerPC core and 3.3 V for I/O. Estimated: at 100 MHz full activity the part draws roughly 800 mA on the 1.8 V rail (1.4 W) plus 200 mA on the 3.3 V rail (0.66 W), totaling ~2 W. Use a low-dropout regulator with at least 1 A headroom on the 1.8 V rail. Decouple each VDD ball with a 100 nF X7R ceramic placed within 5 mm of the package; add bulk 10 uF tantalum at the regulator output. The 5 V TTL tolerant I/O means you can interface 5 V peripherals to the 3.3 V I/O bank without level shifters, but never back-drive 5 V into the 1.8 V core supply.
The 256-PBGA package has a relatively small thermal pad. Estimated: at 2 W total dissipation and a 256-PBGA with 31C/WR theta-JA (typical for this body style), junction temperature rises 62C above ambient. For an industrial -40C to +85C spec, ambient up to 70C is feasible with standard PCB thermal relief. For higher ambient temperatures, increase the PBGA thermal via array and use a 1-oz inner copper plane. Avoid placing the MPU next to high-dissipation components.
Use a minimum 4-layer PCB stackup with continuous ground and GND power planes under the BGA. Route all 256 balls on the 23x23 mm package with 1.0 mm pitch - this requires 0.15 mm trace width with 0.2 mm via pad diameters for inner-row escape routing. Microvia (laser-drilled) stackups are recommended for inner balls. Match trace lengths on the address/data bus within 50 mm to keep external bus skew within the 66 MHz spec. Place SDRAM as close as possible to the data bus balls to minimize stub lengths.
The 66 MHz external bus is the highest-speed interface. Use series damping resistors (22-33 ohm) on the address and data buses to control ringing. Reference the JTAG chain to a 10 kohm pull-up on TCK and TMS, and route TDI/TDO with ground guarding. The 10/100 Ethernet MII traces to the PHY must be length-matched within 2 mm to meet IEEE 802.3 timing. Refer to the NXP MPC853T Hardware Specifications section on AC timing for setup/hold margins derived from the datasheet.
Do not exceed the maximum core supply voltage (2.0 V) or I/O voltage (3.6 V). Confirm the FR suffix variant matches your RoHS/lead-free assembly requirements before ordering (RoHS status not specified in web data). The MPC853T is ethernet-only - do not use it in designs requiring HDLC/ATM channels (use the MPC866 instead). The BGA requires X-ray inspection or AOI to verify solder joint quality after reflow.
コンプライアンス情報
RoHS, REACH, and lead-free status for the FR suffix variant were not confirmed in the verified web data and are flagged [DATA_NEEDED]. Conflict Minerals compliance assumed compliant per NXP general policy.
