MPC8572ECVTARLE - 1.067GHz Dual-Core e500 MPU | NXP
部品番号: MPC8572ECVTARLE ✗ 生産終了MPC8572ECVTARLE 概要
A multiprocessor unit (MPU) like the MPC8572ECVTARLE combines one or more processor cores, cache, memory controllers and I/O peripherals on a single die. The PowerQUICC III family sits in NXP's Power Architecture (PowerPC e500) lineage, and within the MPU hierarchy it belongs to the communications-processor segment (broadly: MPU -> embedded processor -> SoC -> communications processor). The SoC category targets routers, switches, base stations, and storage controllers where deterministic packet handling, hardware acceleration, and multi-protocol I/O are required.
Key features include dual PowerPC e500 cores at 1.067 GHz with 32-bit ISA, DDR2/DDR3 memory controller with ECC, integrated PCI Express, Gigabit Ethernet, Serial RapidIO, security accelerator (SEC), and signal-processing engine (SPE). Industrial temperature grade (-40C to +105C) and a 1023-ball FCBGA (33x33 mm) package support high-density PCB designs. The 90 nm process delivers a balance of performance and leakage suitable for embedded applications.
The MPC8572ECVTARLE uses a symmetric dual-core PowerPC e500 architecture with a shared platform coherency fabric, enabling symmetric multiprocessing (SMP) across both cores. Hardware acceleration offloads packet processing, encryption, and signal processing from the cores, freeing CPU cycles for control-plane and exception-path handling. The integrated DDR2/DDR3 controller with ECC supports memory bandwidth appropriate for line-rate gigabit networking.
Typical applications include enterprise routers and switches, wireless base stations, network security appliances, industrial control with networking, and storage controllers. The integrated SERDES lanes (PCIe, SRIO, GbE) reduce external PHY count and BOM in these systems.
For the 1023-FCBGA, full thermal and power integrity requires a high-layer-count PCB with continuous ground and power planes; signal integrity demands controlled-impedance routing for all high-speed serial links and matched-length DDR traces.
This page synthesizes distributor pricing, drop-in NXP QorIQ alternatives, and design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MPC8572ECVTARLE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MPC8572ELVTARLE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8572EVTARLE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8572ECVTARLE 最大定格＆電気的特性
| Processor Type | MPU PowerQUICC III MPC85xx |
| Core Architecture | PowerPC e500 |
| Number of Cores | 2 |
| Bus Width | 32-bit |
| Core Frequency | 1.067 GHz |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.1 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Co-Processors / DSP | Signal Processing Engine (SPE); Security Engine (SEC) |
| RAM Controllers | DDR2, DDR3 (with ECC) |
| Graphics Acceleration | No |
| Display & Interface Controllers | Not specified |
| Ethernet | Gigabit Ethernet (integrated MAC) |
| PCI Express | Integrated |
| Serial RapidIO (SRIO) | Integrated |
| パッケージ / ケース | 1023-BBGA, FCBGA 33x33 mm |
| 動作温度 | -40 C to +105 C |
| 実装タイプ | Surface Mount |
| Part Status | Obsolete (End of Life) |
MPC8572ECVTARLE 1023-bbga, fcbga 33x33 mm ピン配置ガイド
MPC8572ECVTARLE (1023-bbga, fcbga 33x33 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8572ECVTARLE.
詳細は データシート をご参照ください。
主な用途
MPC8572ECVTARLE の用途: 6 件s: Enterprise Routers and Switches, Wireless Base Station (BTS) Baseband, Network Security Appliances (Firewall/VPN), Industrial Control and Networking Gateways, RAID and Storage Controllers, Aerospace and Defense Embedded Computing.
Enterprise Routers and Switches
The MPC8572ECVTARLE is well matched to enterprise routers and switches where deterministic packet handling is critical. The dual PowerPC e500 cores at 1.067 GHz run control-plane and routing daemons (Quagga/FRR) with headroom for OS overhead, while integrated Gigabit Ethernet MACs and PCI Express reduce external PHY count. Hardware SERDES lanes support line-rate forwarding with hardware queuing and DMA on a single chip. Industrial temperature grade (-40C to +105C) supports outdoor enclosures and central office deployments.
おすすめ
Wireless Base Station (BTS) Baseband
The MPC8572ECVTARLE's dual e500 cores with the integrated Signal Processing Engine (SPE) and Security Engine (SEC) provide baseband PHY primitives, encryption (IPsec/SEC) and protocol processing on a single chip. Serial RapidIO links to DSP arrays (TI TMS320 or Freescale StarCore) for real-time baseband processing while the e500 cores handle Layer 2/3 and O&M stacks. The 1023-FCBGA allows compact BBP designs and the industrial temperature grade meets outdoor BTS thermal budgets.
おすすめ
Network Security Appliances (Firewall/VPN)
The MPC8572ECVTARLE integrates a dedicated Security Engine (SEC) that offloads AES, 3DES, SHA, public-key algorithms and IPsec encapsulation/decapsulation at line rate, freeing CPU cycles for policy and inspection. Dual e500 cores at 1.067 GHz run mainstream firewall suites (Linux + iptables/nftables) and PKI infrastructure with predictable throughput. DDR2/DDR3 with ECC supports policy tables and large connection tracking without system memory errors.
おすすめ
Industrial Control and Networking Gateways
The MPC8572ECVTARLE's industrial temperature grade (-40C to +105C), 90 nm low-leakage process, and integrated field-bus support (Gigabit Ethernet, PCIe, SRIO) make it well suited to factory-automation gateways where deterministic cycles and uptime are required. The integrated DDR2/DDR3 controller with ECC ensures reliable operation in electrically noisy industrial environments. Classic embedded stacks (VxWorks, Linux) are mature on this part, simplifying long-life industrial deployments.
おすすめ
RAID and Storage Controllers
The MPC8572ECVTARLE drives enterprise RAID controllers with two e500 cores handling host-side I/O translation (SAS/SATA via external bridge) and metadata RAID processing in parallel. PCI Express high-bandwidth lanes connect to host systems at PCIe Gen1/Gen2 rates and Serial RapidIO extends to backplane JBOD shelves. Hardware SEC accelerates self-encryption drives (SED) with AES-256 at full throughput. The 1023-FCBGA accommodates fat firmware plus DRAM buffers in a compact footprint.
おすすめ
Aerospace and Defense Embedded Computing
The MPC8572ECVTARLE is widely deployed in aerospace/defense embedded systems including mission computers, line-replaceable units (LRUs) and avionics data concentrators, where its industrial temperature grade, mature software ecosystem, and long-life-cycle support meet certification needs. The dual-core e500 design supports multi-channel ARINC-429/MIL-STD-1553 bridging via external transports connected over PCI Express or SRIO. For new flight programs, NXP's P-series QorIQ parts (with extended aerospace support) are recommended.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8572ECVTARLE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8572ELVTARLE | MPC8572EVTARLE |
|---|---|---|---|
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.067 GHz | 1.067 GHz - same | 1.067 GHz - same |
| Number of Cores | 2 (e500) | 2 (e500) - same | 2 (e500) - same |
| Temperature Grade | -40C to +105C | -40C to +105C - same | -40C to +85C (commercial) |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same |
| RAM Controllers | DDR2, DDR3 | DDR2, DDR3 - same | DDR2, DDR3 - same |
| Co-Processors / DSP | SPE, SEC | SPE, SEC - same | SPE, SEC - same |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
主な差別化要因
- Industrial temperature grade for harsh deployments （vs MPC8572EVTARLE (commercial grade))
- Dual-core symmetric multiprocessing （vs single-core MPC8572E variants)
- Integrated Security Engine (SEC) and Signal Processing Engine (SPE) （vs MPC8544 (non-E parts))
設計ノート
Estimated: The 1023-FCBGA package typically yields a theta_JA of approximately 10-15 C/W with proper 12+ layer PCB thermal vias under the ball grid. At full dual-core workload, total power can approach 15-20 W, so a continuous top-layer copper land and bottom-side thermal pad are required. For chassis-mounted designs, an aluminum cold plate pressed against the package top with thermal interface material (TIM) is recommended. Designers should validate junction temperature in system-level thermal simulation since the manufacturer datasheet does not publish theta_JC explicitly for this FCBGA.
Recommended: Use 12 or more PCB layers for the MPC8572ECVTARLE to provide continuous GND and PWR planes between high-speed SERDES and DDR3 routing. All DDR3 traces must be length-matched within 50 mil and routed with controlled impedance (50 ohm single-ended, 100 ohm differential). ESL and bypass: place 0402 0.1 uF X7R capacitors within 100 mil of each power pin and add bulk 10 uF tantalum/ceramic bypass per supply rail. The exposed-die flip-chip BGA requires a full-ball land pattern with non-solder-mask-defined (NSMD) pads.
Critical: This is an EOL/obsolete part - do not use the MPC8572ECVTARLE for new designs. For new designs, contact NXP for QorIQ recommendations. When sourcing stock, beware of counterfeit parts on the open market: insist on Rochester Electronics or other authorized distributors, validate date codes and packaging, and run incoming-inspection checks including decapsulation on lot samples. Power-sequencing must follow the datasheet sequence (1.1 V core before 1.8 V/2.5 V/3.3 V I/O) to avoid latch-up in the FCBGA.
Recommended: PCI Express and Serial RapidIO SERDES lanes must be routed with 85 ohm differential impedance and 100 ohm on-chip termination; maintain length matching to within 5 mil across each lane. Reset, JTAG, and clock signals (SYSCLK, PCI_REF_CLK) must be guarded from switching noise with guard rings or GND shielding. Place the 25 MHz or 66 MHz reference oscillator within 0.5 inch of the SYSCLK pin with a stable local bypass.
コンプライアンス情報
RoHS, REACH and lead-free status are not stated in the verified web data for this obsolete part. The 90 nm process and 1023-FCBGA suggest pre-RoHS-6 manufacturing era; check the manufacturer datasheet packaging label for RoHS compliance. AEC-Q100 is not applicable (industrial/aerospace, not automotive).
