MPC8572LVJAULE - 1.333GHz Dual-Core PowerQUICC III MPU | NXP
部品番号: MPC8572LVJAULE ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $281.93 | $281.93 |
| 10 | $267.83 | $2,678.30 |
| 100 | $253.74 | $25,374.00 |
| 500 | $239.64 | $119,820.00 |
| 1,000 | $225.55 | $225,550.00 |
MPC8572LVJAULE 概要
A microprocessor unit (MPU) is the central processing unit of an embedded computing system, integrating CPU cores, caches, memory controllers, and high-speed peripherals on a single die. The PowerQUICC III family sits at the top of NXP's communications-processor hierarchy, descended from the original PowerQUICC, PowerQUICC II, and PowerQUICC II Pro families, and is designed for wired and wireless infrastructure equipment where deterministic multi-protocol packet processing is required.
Key features of the MPC8572LVJAULE include 1.333 GHz core clock on each of the two e500 cores, integrated DDR2/DDR3 memory controllers, four Gigabit Ethernet controllers, two PCIe interfaces, two Serial RapidIO ports, dual I2C, SPI, DUART, and USB 2.0, plus an integrated security engine. The device supports industrial-temperature operation from 0°C to 105°C (junction) and is manufactured on a 90 nm process with 1.8V/2.5V/3.3V I/O supply rails.
Architecturally, the MPC8572LVJAULE uses a 32-bit superscalar e500 core with dual integer and dual double-precision floating-point units, a 32 KB I-cache and 32 KB D-cache per core, and a shared 1 MB L2 cache with ECC. The memory subsystem supports up to 32 GB of addressable DDR2/DDR3 with ECC. High-bandwidth I/O is delivered through dedicated SerDes lanes routed to PCIe, SRIO, and GbE PHYs without external glue logic.
Typical applications include multi-service routers, LTE/UMTS baseband line cards, industrial control gateways, secure network appliances, and embedded computing platforms requiring hardware-accelerated packet processing and deterministic multi-protocol bridging. The dual-core configuration enables separation of control-plane and data-plane workloads.
When designing with the MPC8572LVJAULE, allocate generous copper area under the FCBGA land pattern for thermal dissipation, follow NXP's reference PCB stack-up recommendations for high-speed SerDes, and verify DDR3 write leveling/calibration with the actual memory devices. Use NXP's CodeWarrior development suite for bring-up.
This page synthesizes distributor pricing, drop-in PowerQUICC III alternatives, and practical design notes not consolidated on the NXP product page or the manufacturer datasheet.
ドロップイン代替品: MPC8572LVJAULE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MPC8572EVJAULE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8572CLVJAULE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8572LVJAULD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8572ELVJAULE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8572VJAULE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8572LVJAULE 最大定格＆電気的特性
| Core Architecture | PowerPC e500 |
| Number of Cores | 2 |
| データバス幅 | 32-bit |
| Core Clock Speed | 1.333 GHz |
| Co-Processors / DSP | Signal Processing; SPE |
| Memory Controller | DDR2 / DDR3 |
| Ethernet | Gigabit Ethernet (4x) |
| High-Speed Serial I/O | PCIe, Serial RapidIO (SRIO) |
| Graphics Acceleration | No |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| パッケージ | 1023-FCBGA (33x33 mm) |
| 実装タイプ | Surface Mount (BGA) |
| 動作温度 | 0 °C to 105 °C |
| Process Technology | 90 nm CMOS |
| MSL (Moisture Sensitivity Level) | 3 |
| Peak Reflow Temperature | 245 °C (max 30 s) |
| Terminal Finish | Tin-Silver (SnAg) |
| Series | MPC85xx / PowerQUICC III |
| JEDEC JESD-609 Code | e2 |
| RoHS ステータス | Compliant (per Heisener listing) |
MPC8572LVJAULE 1023-fcbga (33x33 mm) ピン配置ガイド
MPC8572LVJAULE (1023-fcbga (33x33 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8572LVJAULE.
詳細は データシート をご参照ください。
主な用途
MPC8572LVJAULE の用途: 7 件s: Multi-Service Router Line Card, LTE / UMTS Baseband Processing, Industrial Control Gateway, Secure Network Appliance, Embedded Computing Platform, Wireless Backhaul Aggregation, Storage Controller / NAS Bridge.
Multi-Service Router Line Card
The MPC8572LVJAULE's dual PowerPC e500 cores at 1.333 GHz run separate data-plane (packet forwarding via SRIO/GbE) and control-plane (routing protocols, OAM, CLI) tasks in parallel. The integrated four-port Gigabit Ethernet and two SRIO lanes enable direct attach to switch fabrics without external PHYs. Compared to a single-core design, the dual-core topology doubles control-plane throughput while leaving headroom for QoS shaping, ACL lookups, and traffic management on the data-plane core. DDR3 with ECC ensures reliable memory operations at line-rate forwarding loads.
おすすめ
LTE / UMTS Baseband Processing
The MPC8572LVJAULE's dual-core e500 architecture with on-chip SPE signal-processing extensions is well-suited to LTE Layer-1 baseband, channel coding, and HARQ control. PCIe links attach directly to a baseband FPGA or radio card, while four GbE ports backhaul to the baseband pool. The DDR2/DDR3 controller with ECC sustains the high memory bandwidth required by turbo decoding and FFT operations. The 1023-FCBGA package provides sufficient I/O for multi-RAT radio heads and the 0-105 °C temperature range suits outdoor base-station enclosures.
おすすめ
Industrial Control Gateway
The MPC8572LVJAULE's deterministic e500 cores and PCIe/SRIO/GbE mix make it an ideal control gateway between industrial Ethernet fieldbuses and enterprise backhaul. The dual cores isolate time-critical industrial protocols (PROFINET, EtherCAT) from non-real-time SCADA/management traffic. DDR3 with ECC provides robust memory operation in noisy factory environments, while the FCBGA package's industrial temperature rating (0-105 °C) handles the wide thermal range of control cabinets. NXP's CodeWarrior IDE streamlines deterministic real-time software development.
おすすめ
Secure Network Appliance
For VPN gateways, firewalls, and IPS/IDS appliances, the MPC8572EVJAULE (or MPC8572ELVJAULE with security engine) provides hardware-accelerated encryption that the plain MPC8572LVJAULE does not. Even without the E variant, the dual e500 cores can run software cryptography plus full packet inspection in parallel. The four GbE ports support WAN/LAN/DMZ segmentation, while PCIe provides a path to external crypto accelerators or 10 GbE uplinks. DDR3 ECC ensures memory integrity under sustained deep-packet-inspection workloads.
おすすめ
Embedded Computing Platform
In VME or VPX-based embedded computing systems, the MPC8572LVJAULE serves as a CPU payload board controller with dual e500 cores handling real-time operating-system tasks (VxWorks, INTEGRITY) plus housekeeping I/O via DUART, I2C, and SPI. The PCIe and SRIO links connect to neighbouring payload cards on the backplane with deterministic latency. The 1023-FCBGA package's high I/O count exposes all peripherals while the 1.333 GHz clock provides ample headroom for high-rate data acquisition flows on the same payload.
おすすめ
Wireless Backhaul Aggregation
The MPC8572LVJAULE aggregates traffic from multiple microwave/PtP backhaul links via its four GbE ports and routes them upstream over SRIO or PCIe. Dual e500 cores let one core run link-aggregation protocols (LACP, MLAG) while the other handles QoS policing and shaping. The DDR3 controller sustains high-bandwidth buffering during peak aggregation. Compared to discrete CPU + switch designs, the integrated architecture reduces BOM cost and PCB area in compact street-cabinet backhaul units.
おすすめ
Storage Controller / NAS Bridge
The MPC8572LVJAULE can serve as a NAS bridge controller, using PCIe to attach to a RAID/HBA card, GbE for host connectivity, and the dual e500 cores to run a storage OS (Linux with iSCSI or NFS targets). DDR3 ECC protects against silent data corruption in write-back cache operations. SRIO enables direct attach to a high-availability peer controller for clustering. The industrial temperature grade suits unattended edge-storage deployments in factory floors or remote sites.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8572LVJAULE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8572EVJAULE | MPC8572CLVJAULE | MPC8572LVJAULD | MPC8572ELVJAULE | MPC8572VJAULE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Architecture | 2x PowerPC e500 | 2x PowerPC e500 + security engine | 2x PowerPC e500 (lower speed grade) | 2x PowerPC e500 | 2x PowerPC e500 + security engine | 2x PowerPC e500 |
| Core Clock | 1.333 GHz | 1.333 GHz | 1.0 GHz (lower grade) | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| Memory Controller | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 | DDR2 / DDR3 |
| Gigabit Ethernet | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports |
| PCIe / SRIO Lanes | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO | 2x PCIe + 2x SRIO |
| Security Engine | No | Yes | No | No | Yes | No |
| Series | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III | MPC85xx / PowerQUICC III |
主な差別化要因
- Dual-core e500 at 1.333 GHz in 1023-FCBGA with DDR2/DDR3 + 4 GbE + PCIe + SRIO integrated （vs MPC8548EVJAUJD)
- Optional security engine without package change （vs MPC8572CLVJAULE)
- Higher I/O integration vs competing QorIQ entry parts （vs P1020)
- Long-lifecycle PowerQUICC III silicon （vs Generic ARM SoC)
設計ノート
Estimated: the 1023-FCBGA package has limited exposed die area for top-side cooling. For typical 1.333 GHz dual-core operation at 1.8V/2.5V/3.3V, expect 6-8W package dissipation. Provide a thermal pad connection to an inner copper plane with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) under the die shadow, and consider a low-profile heatsink for fan-less enclosure designs above 4-5W total power. Maintain junction temperature below 105 °C.
Use a high-layer-count stack-up (minimum 8 layers) with dedicated ground and power planes adjacent to the outer signal layers. Route SerDes differential pairs (PCIe, SRIO) with 85 ohm differential impedance and length matching within 5 mils per NXP layout guidelines. Place the DDR3 memory devices on the same side as the FCBGA, within 5 cm of the package, with matched routing for byte-lane signals.
Do not rely on the default DDR3 calibration; perform write-leveling at production thermal corners. The SerDes reference clock must be within +/- 100 ppm of the NXP-referenced frequency for PCIe/SRIO link-up. Boot configuration resistors on the cfg pins must match the chosen boot source (NOR flash, NAND flash, I2C EEPROM) - a common bring-up failure is incorrect cfg pull-up/pull-down values.
Keep noisy digital signals (DDR, SerDes) at least 3 mm from analog signals on the same PCB layer. Decoupling must include 0.1 uF X7R caps within 2 mm of each power pin plus bulk 10 uF X5R near the package. Use split analog/digital power domains with ferrite-bead isolation if mixing sensitive analog with the FCBGA's digital switching noise.
Series SRIO links are particularly sensitive to inter-symbol interference; validate eye-mask compliance at the receiver with the actual board stack-up and SerDes pre-emphasis/de-emphasis settings. PCIe Gen1/Gen2 endpoints may require CTLE adaptation; use NXP's SerDes configuration tool rather than generic PHY defaults.
コンプライアンス情報
RoHS compliance inferred from Tin-Silver (SnAg) finish and JESD-609 Code e2 per Heisener and Vyrian listings reviewed 2026-10-17. AEC-Q100 not applicable (industrial communications MPU, not automotive). Halogen-free status not stated in Verified Web Data.