MPC8572VTAVNE557 - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
部品番号: MPC8572VTAVNE557 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $372 | $372,000.00 |
MPC8572VTAVNE557 概要
A PowerQUICC III is a high-performance communications microprocessor that combines general-purpose processing cores with integrated networking and peripheral accelerators, primarily targeting wired and wireless infrastructure, telecom switching, and industrial control. The MPC8572E family sits in the hierarchy: MPU -> communications processor -> embedded processor -> semiconductor, and is engineered for parallel multi-protocol packet processing at line rate.
Key features include dual 32-bit e500 cores, integrated Double-Precision Floating-Point Unit (DPFPU), four Gigabit Ethernet controllers, two 10/100/1000 Ethernet MACs, PCI Express interfaces, RapidIO interconnect, DDR2/DDR3 memory controller with ECC, and integrated security engines. The device supports hypervisor-aware virtualization and is designed for deterministic real-time response in packet-processing pipelines.
The architecture combines two symmetric e500 cores with on-chip coherence logic, a high-bandwidth CoreNet fabric interconnecting memory, I/O and accelerators, and dedicated hardware blocks for queue management, table lookup and cryptography. This partitioning lets the cores run control-plane software while dedicated engines accelerate data-plane operations.
Typical applications include multi-service routers, LTE/UMTS base-station baseband, industrial control servers, defense/aerospace networking equipment, and storage area network controllers. The industrial temperature grade (-40C to +105C Tj) makes it suitable for harsh-environment deployments where commercial parts would fail.
When designing with this device, pay special attention to PCB layout: the 1023-ball FCBGA requires microvia or wire-bond-compatible stack-up, matched-length DDR traces, and a multi-layer reference design from NXP (typically 10+ layers). Power sequencing of the 1.0V core, 1.5V/1.8V DDR and 3.3V I/O rails must follow the datasheet sequence to prevent latch-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: MPC8572VTAVNE557 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8572VTAVNE557 （同一形状・フットプリント） — 相違点: Mounting Type, Package, Core Architecture, Ethernet, Memory Controller.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8572EVTAVNE
✅ ドロップイン✓ 在庫あり
$125 / 個
データシートを見る →MPC8572VTAVNE
✅ ドロップイン✓ 在庫あり
$308 / 個
データシートを見る →MPC8572CLPXARLD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8572CLPXATLD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
P2020NXE2KHC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8572VTAVNE557 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III |
| Processor Type | MPC85xx PowerPC e500 |
| Number of Cores | 2 |
| Core Architecture | 32-Bit Book E-enhanced Power Architecture |
| Core Frequency | 1.5 GHz |
| L1 Instruction Cache | 32 KByte per core (with parity) |
| L1 Data Cache | 32 KByte per core (with parity) |
| FPU | Double-Precision Floating-Point Unit (DPFPU) |
| 動作温度 | -40C to +105C (industrial) |
| パッケージ | 1023-FCBGA (33x33 mm) |
| 実装タイプ | Surface Mount (BGA) |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 4x Gigabit Ethernet + 2x 10/100/1000 MAC |
| Interconnect | PCI Express, RapidIO |
MPC8572VTAVNE557 1023-fcbga (33x33 mm) ピン配置ガイド
MPC8572VTAVNE557 (1023-fcbga (33x33 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8572VTAVNE557.
詳細は データシート をご参照ください。
主な用途
MPC8572VTAVNE557 の用途: 6 件s: Multi-Service Routers, LTE/UMTS Base Station Baseband, Industrial Control Servers, Defense and Aerospace Networking, Storage Area Network Controllers, Edge Compute and IoT Gateways.
Multi-Service Routers
The MPC8572VTAVNE557's dual 1.5 GHz e500 cores combined with integrated hardware accelerators make it a drop-in solution for multi-service router line cards. The four integrated Gigabit Ethernet controllers and 10/100/1000 MACs handle wire-speed forwarding on multiple ports simultaneously, while the dedicated queue manager and table-lookup engines accelerate routing-table lookups without burdening the cores. The industrial -40C to +105C temperature range allows deployment in outdoor telecom cabinets and central-office installations where commercial-grade processors would thermally throttle. Per the NXP PowerQUICC III reference designs, the DDR2/DDR3 memory controller with ECC ensures reliable high-bandwidth packet buffering at line rate.
おすすめ
LTE/UMTS Base Station Baseband
The MPC8572VTAVNE557's symmetric multiprocessing capability lets one e500 core handle Layer-2 MAC scheduling while the second runs Layer-3 RRC signaling - exactly matching 3GPP base-station partitioning. The Double-Precision Floating-Point Unit (DPFPU) accelerates turbo-decoding and channel-estimation DSP kernels, while the integrated RapidIO interconnect links to companion RFICs and DSP co-processors. With 1.5 GHz of dual-core compute plus hardware accelerators, this MPU delivers the deterministic latency required for LTE subframe timing. The industrial temperature range ensures reliability in outdoor macro-cell and harsh-environment small-cell deployments.
おすすめ
Industrial Control Servers
The MPC8572VTAVNE557's dual-core architecture and industrial temperature rating (-40C to +105C) make it suitable for rack-mounted industrial control servers running real-time Linux or VxWorks. The PCI Express and RapidIO interfaces connect to industrial I/O modules, motion controllers, and fieldbus gateways (PROFIBUS, EtherCAT). Its hardware virtualization support enables partitioning of the cores for separate control and safety functions in IEC 61508 SIL-2/3 systems. The DDR2/DDR3 memory controller with ECC provides the data integrity required in process-control and factory-automation environments where single-bit errors must be detected and corrected in real time.
おすすめ
Defense and Aerospace Networking
The MPC8572VTAVNE557's industrial temperature grade and long-term availability through Rochester Electronics make it a candidate for defense and aerospace networking equipment where component traceability and lifecycle extension are critical. The device's hardware security engines support IPsec, SSL/TLS, and SRTP acceleration required for tactical-radio and secure-router applications. Its PCI Express and Gigabit Ethernet interfaces connect to radio front ends and crypto modules, while the dual e500 cores run the control plane plus secure payload processing simultaneously. The 1023-FCBGA package withstands the shock and vibration profiles typical of military and avionics deployments.
おすすめ
Storage Area Network Controllers
The MPC8572VTAVNE557's high-bandwidth DDR2/DDR3 controller with ECC and quad Gigabit Ethernet ports provide the throughput required for iSCSI and Fibre Channel over Ethernet (FCoE) storage controllers. Its PCI Express interface links to SAS/SATA controllers or NVMe front ends, while the dual e500 cores run the storage stack (target driver, SCSI block layer, RAID engine) with hardware-accelerated crypto for encrypted volumes. Per the NXP PowerQUICC III reference designs, the device delivers deterministic IOPS performance for enterprise SAN deployments where consistent latency is critical for storage QoS.
おすすめ
Edge Compute and IoT Gateways
The MPC8572VTAVNE557 provides industrial-grade compute for edge gateways aggregating sensor data from industrial IoT deployments. Its dual e500 cores run container orchestration (Docker/Kubernetes-on-PowerPC) and edge analytics, while the integrated networking interfaces (Gigabit Ethernet, PCI Express) connect upstream to cloud platforms and downstream to field sensors. The industrial temperature range supports deployment in factory floors, oil-and-gas sites, and outdoor enclosures. Per NXP application notes, the device's hardware virtualization enables isolated tenant workloads on a single physical MPU, reducing per-gateway BOM cost in distributed edge deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8572VTAVNE557 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8572EVTAVNE | MPC8572VTAVNE | MPC8572CLPXARLD | MPC8572CLPXATLD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.0 GHz (-33%) | 1.2 GHz (-20%) |
| Number of Cores | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) |
| Security Engine | Standard | Enhanced (crypto accelerators) | Standard | Standard | Standard |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| DPFPU | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Dual-core 1.5 GHz e500 with hardware virtualization （vs MPC8572CLPXARLD (1.0 GHz))
- Same silicon with ordering-code flexibility （vs MPC8572VTAVNE (base code))
- Industrial temperature range with NXP/Freescale longevity （vs QorIQ P2020NXE2KHC)
設計ノート
The 1023-ball FCBGA at 33x33 mm requires a high-density PCB stack-up with microvia technology (typically 10+ layers, 1.0 mm pitch BGA). Per NXP MPC8572E reference designs, use 50-ohm controlled-impedance traces for DDR2/DDR3 signals with matched-length routing (within +/-25 mil) and dedicated ground-reference planes beneath the BGA. The exposed die pad (if present) must be soldered to a thermal pad with multiple thermal vias to the inner ground plane. Failure to follow these guidelines will result in signal-integrity issues and DDR memory errors.
Power sequencing must follow the NXP datasheet sequence: 1.0V VDD_CORE first, then 1.5V/1.8V DDR rail, then 3.3V I/O. Reverse sequencing risks latch-up. Estimated: at full load (1.5 GHz dual-core + accelerators), the VDD_CORE rail can draw 8-12A peak, requiring a 4-6 phase VRM with output accuracy better than +/-2%. Add bulk decoupling (220 uF polymer + 22 uF ceramic) at the BGA power balls plus 0.1 uF/1 nF pairs at every supply pin.
Estimated: at 1.5 GHz dual-core full utilization with 1.0V VDD_CORE, the device dissipates 12-18W. The 1023-FCBGA theta_JA is approximately 8-12 C/W with a properly designed 6-layer PCB and thermal vias, giving a junction temperature rise of 100-200C above ambient. A heatsink with thermal interface material is mandatory for industrial -40C to +105C operation. Without it, the device will thermal-throttle and degrade throughput.
Do not assume the '557' suffix indicates a different silicon - it is an NXP/Freescale ordering/binning code for the same MPC8572E die. Mixing MPC8572E with base MPC8572 parts in the same PCB is supported (pin-compatible), but check the security engine and DPFPU presence in software. JTAG boundary-scan is recommended for production testing. For new designs, prefer QorIQ Layerscape parts (LS1046A, LS1024A) as the PowerQUICC III family is NXP NRRND.
コンプライアンス情報
Compliance status not specified in the verified web data. The MPC8572VTAVNE557 is legacy Freescale/NXP silicon with the 1023-FCBGA package predating universal RoHS enforcement. Consult the NXP product declaration or manufacturer datasheet for current RoHS/REACH compliance before EU-market deployment.