MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP
部品番号: MPC860SRVR50D4R2 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $124.97 | $124.97 |
| 10 | $118.5 | $1,185.00 |
| 100 | $108.2 | $10,820.00 |
| 500 | $96.4 | $48,200.00 |
| 1,000 | $85.75 | $85,750.00 |
MPC860SRVR50D4R2 概要
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, and registers required to execute software instructions. In the embedded hierarchy, the MPC8xx family sits between general-purpose microcontrollers and high-end application processors, optimized for deterministic real-time control with integrated peripheral bridges. Power Architecture (formerly PowerPC) is the underlying instruction set, providing a 32-bit RISC execution pipeline well suited to protocol processing. PowerQUICC is NXP's brand name for MPC8xx-family parts that combine a PowerPC core with a separate RISC-based Communications Processor Module for offloading serial protocol handling.
Key features of the MPC860SRVR50D4R2 include an integrated CPM supporting HDLC, Ethernet, UART, and other serial protocols, dual 10/100 Mbps Ethernet interfaces via the Fast Ethernet Controller, and on-chip peripheral subsystems such as timers, interrupt controllers, and memory control for DRAM and SRAM. The part provides 4-channel DMA, I2C, SPI, and parallel I/O, alongside a PCMCIA/PC Card controller. These features reduce external component count and BOM cost in routing, switching, and telecom equipment designs.
Typical applications include WAN routers and remote access concentrators, ISDN terminal adapters, ATM switches, T1/E1 framers, industrial control with serial networking, and set-top box controllers. The CPM offloads HDLC framing and serial bit processing from the CPU, freeing the core for higher-layer protocol stacks.
When designing with this part, note the 357-ball BGA requires X-ray inspection and controlled reflow profiles. Use the recommended boot configuration word settings from the reference manual. Ensure proper decoupling on all power pins per the hardware specifications section of the MPC860 family datasheet, and verify DDR/SDRAM interface timing with the supplied IBIS models before PCB fabrication.
ドロップイン代替品: MPC860SRVR50D4R2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC860SRVR50D4R2 （同一形状・フットプリント） — 相違点: Processor Type, RoHS Status, Package, Mounting Type, Packaging.
クイック比較ツール — 並列比較する代替部品を選択:
MPC860ENCVR50D4
✅ ドロップイン✓ 在庫あり
$52.4 / 個
データシートを見る →MPC860TCVR50D4
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MPC860PZQ50D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860DEZQ50D4
✅ ドロップイン✓ 在庫あり
$24.95 / 個
データシートを見る →MPC860SRVR50D4R2 最大定格＆電気的特性
| Processor Type | MPC8xx PowerQUICC, 32-Bit Power Architecture |
| Core Count | 1 |
| 最大クロック周波数 | 50 MHz |
| Operating Voltage | 3.3 V |
| 動作温度範囲 | 0 C to +95 C |
| パッケージ | 357-BGA (25 x 25 mm) |
| 実装タイプ | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Lead Free Status | Lead Free |
| Process Technology | 0.32 um CMOS |
| Communications Processor Module | Yes (RISC CPM with HDLC, Ethernet, UART) |
| Ethernet Interfaces | 10/100 Mbps Fast Ethernet (FCC) |
| DMA Channels | 4 |
| Series | MPC860 |
| RoHS ステータス | Compliant |
MPC860SRVR50D4R2 357-bga (25 x 25 mm) ピン配置ガイド
MPC860SRVR50D4R2 (357-bga (25 x 25 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC860SRVR50D4R2.
詳細は データシート をご参照ください。
主な用途
MPC860SRVR50D4R2 の用途: 6 件s: WAN Router and Remote Access Concentrator, ISDN Terminal Adapter, ATM Switch and Edge Controller, T1/E1 Framer Module, Industrial Serial Networking Controller, Set-Top Box and Embedded Media Controller.
WAN Router and Remote Access Concentrator
The MPC860SRVR50D4R2 is well suited to WAN router and remote access concentrator designs because its PowerQUICC architecture pairs a 50 MHz PowerPC core with a separate RISC-based Communications Processor Module that offloads HDLC framing and serial bit processing. The CPM's configurable serial channels and dual 10/100 Mbps Fast Ethernet controllers allow a single chip to terminate multiple T1/E1 lines and aggregate traffic onto a routed Ethernet backbone. Placing the CPM in the same silicon as the core removes the latency of an external framer, simplifying PCB layout. For new designs, the PowerQUICC II MPC8260 delivers higher CPM throughput; the original MPC860 remains the reference choice where verified stock and existing firmware are required.
おすすめ
ISDN Terminal Adapter
ISDN terminal adapters and BRI/PRI converter designs rely on the MPC860SRVR50D4R2's CPM to handle HDLC-based ISDN D-channel signaling while the PowerPC core runs higher-layer protocols. The integrated dual Fast Ethernet controllers enable a single device to bridge between an ISDN S/T interface and 10/100 Mbps Ethernet, reducing component count compared with a discrete framer plus microcontroller solution. At 50 MHz the part provides sufficient headroom for typical PPP/MLPPP stacks without thermal concerns in a small plastic BGA footprint. Engineers should note the part is in last-time-buy status, so legacy designs using this IC should plan for migration to the PowerQUICC II MPC8255 family.
おすすめ
ATM Switch and Edge Controller
ATM switch and edge controller designs use the MPC860SRVR50D4R2's CPM to terminate AAL5 segmentation and reassembly while the PowerPC core runs IP/ATM signalling and routing tables. The on-chip dual 10/100 Mbps Ethernet and configurable serial channels let a single MPC860 drive multiple ATM SAR ports in a compact edge concentrator. The 357-BGA package supports the multi-rail decoupling needed for clean AAL5 timing. Compared with newer MPC8255/MPC8260 devices the 50 MHz core can become a bottleneck at gigabit rates, so this part is best matched to T1/E1 or sub-100 Mbps ATM edge nodes.
おすすめ
T1/E1 Framer Module
T1/E1 framer and channel-bank modules integrate the MPC860SRVR50D4R2 to consolidate HDLC framing, bit error rate monitoring, and alarm detection in a single chip. The CPM's dedicated serial controllers execute HDLC bit-stuffing at line rate without CPU intervention, freeing the PowerPC core for higher-level OAM and SNMP handling. The 3.3V single-rail operation simplifies the power tree, while the 357-BGA keeps the design compact enough for a small daughter card that plugs into a central office shelf. Verified long-term availability is limited because the part is in last-time-buy, so design teams should verify remaining distributor stock before committing to new T1/E1 designs.
おすすめ
Industrial Serial Networking Controller
Industrial serial networking controllers use the MPC860SRVR50D4R2 to bridge RS-232/422/485 and HDLC fieldbus traffic onto Ethernet networks in factory automation cells. The on-chip I2C and SPI controllers let the same chip talk to EEPROM, real-time clocks, and ADC front ends, eliminating the need for a separate microcontroller. The 0 to 95 C operating range covers most factory-floor enclosures, and the integrated DMA engine moves fieldbus packets between the CPM and memory without CPU overhead. Newer industrial designs should evaluate the PowerQUICC II/III families for longer production lifetimes; the original MPC860 fits existing field installations where verified compatibility matters.
おすすめ
Set-Top Box and Embedded Media Controller
Set-top box and embedded media controller designs use the MPC860SRVR50D4R2 to host an RTOS, run a graphical UI, and process transport-stream and Ethernet traffic simultaneously. The dual Fast Ethernet controllers let the box share a MoCA or HomePlug bridge on one port and an IP return path on the other. The 50 MHz PowerPC core is adequate for legacy MPEG-2 transport-stream parsing and CAS descrambling, while the CPM offloads serial control-plane traffic from the tuner interface. Memory control supports both SDRAM and SRAM, allowing flexible PSRAM expansion. Designers should plan migration to MPC8255/MPC8260 for new set-top platforms to extend production lifecycle.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC860SRVR50D4R2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC860ENCVR50D4 | MPC860TCVR50D4 | MPC860PZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BGA (25 x 25 mm) | 357-BGA - same | 357-BGA - same | 357-BGA - same | 357-BGA - same |
| Maximum Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Architecture | PowerQUICC (PowerPC + RISC CPM) | PowerQUICC | PowerQUICC | PowerQUICC | PowerQUICC |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 to +95 C | 0 to +95 C | 0 to +95 C | 0 to +95 C | 0 to +95 C |
| Ethernet Controllers | Dual 10/100 Mbps Fast Ethernet | Dual 10/100 Mbps | Dual 10/100 Mbps | Dual 10/100 Mbps | Dual 10/100 Mbps |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- Lead-free RoHS-compliant variant （vs MPC860SRVR50D4 (non-RoHS predecessor))
- 50 MHz operation within the PowerQUICC family （vs MPC860PVR80D4 (80 MHz))
- 357-BGA package for high-density designs （vs MPC860DTCZQ50D4 (different BGA pinout))
設計ノート
Estimated: The MPC860SRVR50D4R2 in a 357-BGA (25 x 25 mm) package has a junction-to-ambient thermal resistance on the order of 20 to 25 C/W when soldered to a properly designed PCB with multiple thermal vias under the die. At 50 MHz and 3.3V the typical power dissipation is below 1 W, so most designs do not require an external heatsink. Provide at least 4 thermal vias under the central BGA pad and follow the NXP reference layout for supply decoupling.
The 357-ball BGA package requires controlled-impedance PCB traces for the SDRAM and Ethernet interfaces to meet the timing budgets in the MPC860 hardware specifications document. Use a 4-layer stack-up with continuous ground and power planes under the BGA, and place decoupling capacitors as close as possible to each power pin. Ball-grid arrays must be inspected with X-ray equipment post-reflow because solder joints are hidden beneath the package.
The MPC860SRVR50D4R2 is in last-time-buy status, so do not start new design wins on this exact MPN. Configure the boot word correctly during reset so the CPU can locate the reset vector and memory controller registers. Always sequence the 3.3V I/O supply before the core voltage according to the datasheet, otherwise the part can latch up. Validate IBIS models against the chosen SDRAM DIMM vendor before board fabrication to avoid timing violations.
コンプライアンス情報
RoHS compliant and lead free per R2 suffix. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. Conflict-mineral reporting compliant per NXP policy.
