MPC860TZQ50D4-FR - 50MHz PowerQUICC MPU 357-PBGA | NXP
部品番号: MPC860TZQ50D4-FR ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $112.98 | $112.98 |
| 10 | $105.5 | $1,055.00 |
| 100 | $92.3 | $9,230.00 |
| 250 | $85.1 | $21,275.00 |
| 500 | $78.75 | $39,375.00 |
MPC860TZQ50D4-FR 概要
A PowerQUICC device is a category of communications-oriented MPU that integrates a general-purpose processor core with dedicated communications hardware, DMA engines, and serial protocol controllers. Within the broader taxonomy, the PowerQUICC sits between a microcontroller (MCU) and a high-end microprocessor, occupying the integrated communications processor niche. The MPC860 family is one of the foundational PowerQUICC implementations, widely deployed in legacy routers, WAN interfaces, ISDN adapters, and industrial control systems.
Key features of the MPC860TZQ50D4-FR include a 50 MHz PowerPC core, 4 Kbytes of instruction cache and 4 Kbytes of data cache, an integrated CPM supporting multiple serial channels, a 32-bit external data bus, and a 3.3 V I/O supply with a separate core voltage rail. The device integrates Ethernet, HDLC/UART, SCC, SMC, SPI, and I2C controllers, plus timers and a memory controller for DRAM, SRAM, and Flash. The 357-PBGA package provides the necessary I/O count and thermal performance for sustained 50 MHz operation in networking hardware.
Architecturally, the MPC860 uses a Harvard-style core with separate instruction and data paths feeding the CPM via dual DMA channels. The CPM offloads serial and protocol processing from the core, allowing deterministic handling of multiple TDM streams, HDLC links, and Ethernet frames without CPU intervention. This partitioning lets the MPC860 achieve wire-speed handling of multiple WAN interfaces at modest clock rates.
Typical applications include ISDN routers, T1/E1 multiplexers, xDSL modems, set-top box controllers, industrial serial protocol bridges, and legacy embedded networking equipment. The wide supply tolerance and integrated peripherals make the device attractive for telecom-grade designs. When designing with this device, ensure proper decoupling on both core and I/O supply rails, follow Freescale/NXP PBGA layout guidelines for ball-to-trace fan-out, and confirm JTAG access for boundary-scan and debug. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet alone.
ドロップイン代替品: MPC860TZQ50D4-FR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC860TZQ50D4-FR （同一形状・フットプリント） — 相違点: Core Architecture, Mounting Type, Package, RoHS Status, Series.
クイック比較ツール — 並列比較する代替部品を選択:
MPC860TVR50D4
✅ ドロップイン✓ 在庫あり
$58 / 個
データシートを見る →MPC860DEZQ50D4
✅ ドロップイン✓ 在庫あり
$24.95 / 個
データシートを見る →MPC860PZQ80D4
✅ ドロップイン✓ 在庫あり
$30.95 / 個
データシートを見る →MPC860DPVR66D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC855TVR50D4
✅ ドロップイン✓ 在庫あり
$48.1 / 個
データシートを見る →MPC860DTCZQ50D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860TZQ50D4-FR 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | MPC860 PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Core Count | 1 |
| Operating Frequency | 50 MHz |
| パッケージ | 357-PBGA (25 mm x 25 mm) |
| 実装タイプ | Surface Mount |
| Supply Voltage (I/O) | 3.3 V |
| Instruction Cache | 4 Kbytes |
| Data Cache | 4 Kbytes |
| External Data Bus | 32-bit |
| Integrated Module | CPM (Communications Processor Module) |
| Serial Controllers | SCC, SMC, SPI, I2C, HDLC, UART, Ethernet |
| Lead Free Status | Contains Lead |
| RoHS ステータス | Non-Compliant |
| Packaging | Tray |
| ライフサイクル状態 | Obsolete (End of Life per NXP product page) |
MPC860TZQ50D4-FR 357-pbga (25 mm x 25 mm) ピン配置ガイド
MPC860TZQ50D4-FR (357-pbga (25 mm x 25 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC860TZQ50D4-FR.
詳細は データシート をご参照ください。
主な用途
MPC860TZQ50D4-FR の用途: 6 件s: ISDN Router and Terminal Adapter, T1/E1 Multiplexer and WAN Access Device, xDSL Modem and CPE Platform, Industrial Serial Protocol Bridge, Legacy Set-Top Box Controller, Embedded Networking Reference Platform.
ISDN Router and Terminal Adapter
The MPC860TZQ50D4-FR's integrated Communications Processor Module (CPM) with multiple SCCs and SMCs makes it ideal for ISDN router designs where a single device must handle both the BRI/U interface and the Ethernet LAN side. The 50 MHz PowerPC core runs routing protocols while the CPM offloads HDLC framing and DMA for wire-speed packet handling. Placed at the heart of an ISDN terminal adapter, it manages the ISDN data link and presents Ethernet/IP to the customer-side LAN, all from one BGA footprint. Compared to discrete MCU plus protocol-ASIC designs, the integrated CPM eliminates external bridges and reduces BOM cost.
おすすめ
T1/E1 Multiplexer and WAN Access Device
The MPC860TZQ50D4-FR's multiple TDM-ready SCC channels and integrated HDLC controllers suit T1/E1 multiplexer and WAN access equipment. The CPM drives the T1/E1 framer interface directly via its serial channels and the dedicated RISC engine inside the CPM handles bit-level protocol processing without CPU loading. At 50 MHz, the device can manage several full-duplex T1/E1 lines plus an uplink Ethernet port in a single BGA. Compared to a discrete framer plus CPU approach, the MPC860 collapses two chips into one, which simplifies PCB layout and reduces power budget for telecom edge equipment.
おすすめ
xDSL Modem and CPE Platform
The MPC860TZQ50D4-FR is used as the host processor and Ethernet bridge in xDSL customer-premises equipment (CPE), where a discrete DSL chipset handles the analog line interface and the MPC860 provides the packet processing and routing stack. Its 32-bit external data bus accommodates a fast SDRAM/Flash memory subsystem for PPPoE, NAT, and firewall workloads. The integrated Ethernet MAC connects to the DSL PHY or to an external Ethernet PHY for the LAN side. Compared to a microcontroller-only approach, the 50 MHz PowerPC core plus DMA delivers the throughput needed for ADSL2+ line rates without bottlenecks.
おすすめ
Industrial Serial Protocol Bridge
The MPC860TZQ50D4-FR's combination of SCCs, SMCs, SPI, and I2C controllers makes it well suited for industrial protocol bridging between legacy serial field devices and Ethernet-based SCADA networks. Each SCC can be configured for HDLC, UART, or transparent mode, allowing the same hardware to bridge Profibus, Modbus, and proprietary serial protocols. The 50 MHz core plus CPM offload ensures deterministic latency for time-critical industrial traffic. Compared to a discrete UART-expander plus MCU design, the MPC860 integrates the bridging logic in a single chip, reducing board area and improving reliability for plant-floor deployments.
おすすめ
Legacy Set-Top Box Controller
The MPC860TZQ50D4-FR was deployed in early-generation set-top box controllers where the PowerPC core handled the application stack and the CPM managed the transport stream interface to the MPEG decoder. The integrated peripherals (I2C for the tuner, SPI for the flash, UART for the smart-card interface, and SCCs for the modem return channel) covered all set-top box interfaces without external glue logic. Compared to a discrete MCU plus ASIC design, the MPC860 reduced BOM and simplified firmware development by keeping the application CPU and transport processing on one device.
おすすめ
Embedded Networking Reference Platform
The MPC860TZQ50D4-FR serves as the reference MPU in many university and engineering training platforms for embedded networking and PowerPC firmware development. Its 357-PBGA package, well-documented peripherals, and extensive toolchain (including BDM/JTAG debug, GCC, and proprietary IDEs) make it a learning vehicle for Power Architecture programming. Compared to modern Cortex-M dev boards, the MPC860 provides a richer peripheral set and more representative real-world networking hardware. The 50 MHz speed grade offers sufficient headroom for laboratory workloads while keeping power dissipation manageable on standard dev-board supplies.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC860TZQ50D4-FR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC860TVR50D4 | MPC860DEZQ50D4 | MPC860PZQ80D4 | MPC860DPVR66D4 | MPC855TVR50D4 | MPC860DTCZQ50D4 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 80 MHz | 66 MHz | 50 MHz | 50 MHz |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Instruction Cache | 4 Kbytes | 4 Kbytes | 4 Kbytes | 4 Kbytes | 4 Kbytes | 4 Kbytes | 4 Kbytes |
| External Data Bus | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| CPM Module | Yes (SCC, SMC, Ethernet, HDLC) | Yes | Yes (DE peripheral mix) | Yes | Yes | Yes (MPC855 peripheral mix) | Yes (DTC peripheral mix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Status | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
主な差別化要因
- Integrated Communications Processor Module with multi-protocol support （vs MPC860TVR50D4)
- 50 MHz speed grade offers balanced performance and power （vs MPC860PZQ80D4)
- PowerPC core with Harvard-style caches for deterministic performance （vs MPC855TVR50D4)
設計ノート
Estimated: The MPC860TZQ50D4-FR uses a separate core and I/O voltage supply. The I/O rail is typically 3.3 V while the core rail is generated by an external regulator (often around 2.0 V). Provide bulk decoupling (10 uF tantalum or ceramic) near each supply ball group, with 0.1 uF high-frequency ceramics within 5 mm of each supply pin. Power sequencing should bring up the core rail before or simultaneously with the I/O rail to prevent latch-up. Estimated input values: core voltage ~2.0 V, I/O voltage 3.3 V, core current ~250 mA typical at 50 MHz.
The 357-PBGA package uses a 1.27 mm or 1.0 mm ball pitch and requires 4 or 6 PCB layers with microvia or via-in-pad construction for reliable fan-out. Follow Freescale/NXP AN-2914 layout guidelines: use a solid ground plane on layer 2 directly beneath the BGA, route signals on outer layers, and place power planes on inner layers. The thermal pad array (if present) must be soldered to a thermal pad on the PCB for adequate heat spreading. Avoid routing high-speed signals under the BGA unless they are on an isolated ground island.
Common pitfalls when designing with the MPC860 include: (1) failing to initialize the SIU (System Interface Unit) before accessing external memory, causing bus hangs; (2) misconfiguring the CPM BRG (Baud Rate Generator) which leads to serial framing errors; (3) omitting the proper reset configuration word from the boot ROM, which prevents the part from booting correctly; (4) using the wrong memory controller timing for the chosen SDRAM, which causes intermittent data corruption. Always reference the MPC860 family reference manual and validate with a logic analyzer on the external bus during bring-up.
The MPC860's 32-bit external bus operates at half the core frequency (typically 25 MHz at 50 MHz core) and is sensitive to signal integrity on address, data, and control lines. Series-terminate the address and control lines with 22 to 33 ohm resistors placed near the driver; data lines typically do not require termination due to bidirectional drive. Keep bus trace lengths matched within 25 mm to prevent skew, and isolate the bus from analog sections (such as the Ethernet PHY MII interface) with a ground moat. Estimated bus frequency: 25 MHz at 50 MHz core, with 32-bit data bus.
コンプライアンス情報
RoHS status non-compliant per verified distributor data (contains lead). AEC-Q100 not applicable for this legacy MPU category. REACH, halogen-free, and conflict-minerals status not explicitly documented in the verified web data and noted in _validation_note.
