MPC862PCVR66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP
部品番号: MPC862PCVR66B ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $34.75 | $3,475.00 |
| 500 | $31.1 | $15,550.00 |
| 1,000 | $28.4 | $28,400.00 |
MPC862PCVR66B 概要
A PowerQUICC microprocessor (MPU) is a member of the integrated communications processor family that combines a high-performance CPU core with optimized peripheral subsystems. Within the broader taxonomy, MPC862 sits under microprocessor -> MPU -> embedded processor -> integrated circuit. These devices historically targeted WAN access, LAN switching, and protocol conversion by offloading communications tasks from the main CPU. The PowerQUICC line later evolved into PowerQUICC II and PowerQUICC III, but the original MPC860/862/866 family remains in service for legacy designs.
Key features of the MPC862PCVR66B include 1 core at 32-bit, 66MHz operation, a 357-pin PBGA package (25 x 25 mm), and the MPC8xx instruction set. The 'PCV' designator indicates the part is the consumer/extended-temperature variant without the CPM (Communications Processor Module) HDLC license fee; the 'R66' suffix denotes the 66MHz speed grade; the trailing 'B' indicates the BGA package. The integrated peripheral set typically includes UARTs, SCCs, SMCs, an SPI, an I2C controller, timers, and memory control for DRAM, SRAM, and Flash.
Typical applications for the MPC862 include telecom line cards, ISDN modem banks, xDSL access concentrators, industrial control routers, and legacy networking appliances. Engineers often pair it with external 10/100 Ethernet PHYs, TDM framers, and SRAM/Flash memory. The 66MHz speed grade is well suited for protocols that do not require gigabit throughput.
When designing with the MPC862, the 357-ball PBGA requires careful PCB layout with controlled-impedance traces and a minimum 6-layer stack-up for signal integrity. Decoupling capacitors must be placed as close to the power balls as possible, and the unused balls per the datasheet must remain unconnected. Thermal management at the 3.3V rail typically requires a copper pour under the exposed die area.
ドロップイン代替品: MPC862PCVR66B — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC862PCVR66B （同一形状・フットプリント） — 相違点: RoHS Status, Mounting Type, Core Architecture, Lead Free Status, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
MPC862PCVR50B
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC862PVR66B
✅ ドロップイン✓ 在庫あり
$28.9 / 個
データシートを見る →MPC860TVR66D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860TZQ66D4
✅ ドロップイン✓ 在庫あり
$81.28 / 個
データシートを見る →MPC866PCVR100A
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC862PCVR66B 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx |
| Core Architecture | Power Architecture, 32-bit |
| Core Count | 1 |
| Core Speed | 66 MHz |
| Operating Voltage | 3.3 V |
| パッケージ | 357-PBGA (25 x 25 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +105C |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC |
| Process Technology | 0.32 um |
| Lead Free Status | Lead Free |
| RoHS ステータス | RoHS Compliant |
| Packaging | Tray |
| Lifecycle | No Longer Manufactured (last-time-buy per NXP discontinuance notice) |
MPC862PCVR66B 357-pbga (25 x 25 mm) ピン配置ガイド
MPC862PCVR66B (357-pbga (25 x 25 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC862PCVR66B.
詳細は データシート をご参照ください。
主な用途
MPC862PCVR66B の用途: 6 件s: Telecom Line Cards and Access Concentrators, Industrial Routers and Protocol Gateways, Legacy LAN Switch Control Plane, ISDN Terminal Adapters and Modem Banks, Embedded Industrial Control Systems, VoIP Gateway and Media Server Platforms.
Telecom Line Cards and Access Concentrators
The MPC862PCVR66B is well suited for telecom line cards and DSL access concentrators where its integrated Communications Processor Module (CPM) handles multiple HDLC channels and TDM streams in hardware, offloading the 32-bit Power Architecture core. At 66MHz the part sustains typical E1/T1 framing and ATM SAR processing without bottlenecks, and the 357-ball PBGA delivers the high I/O count required for parallel bus interfaces to framers and PHYs. Compared with a discrete CPU + ASIC approach, the MPC862 reduces BOM cost and board area while keeping firmware in a familiar Power Architecture toolchain (CodeWarrior, GCC).
おすすめ
Industrial Routers and Protocol Gateways
Industrial routers and protocol-conversion gateways benefit from the MPC862PCVR66B's combination of 66MHz 32-bit processing and integrated peripherals (UARTs, SCCs, SMCs, SPI, I2C). The -40C to +105C temperature rating covers factory-floor and outdoor cabinet deployments without derating. The 3.3V single-rail supply simplifies the power tree when paired with a modern buck regulator, and the 357-ball PBGA exposes the full external memory bus for SRAM/Flash expansion needed for routing-table storage. Drop-in migration paths exist within the MPC8xx family for cost reduction.
おすすめ
Legacy LAN Switch Control Plane
Legacy Layer-2/Layer-3 LAN switches often use the MPC862PCVR66B as a control-plane processor because it provides a 32-bit Power Architecture core plus a CPM that handles Ethernet MAC and serial management interfaces. At 66MHz the part manages SNMP, routing tables, and switch fabric configuration without taxing the data plane. The 357-ball PBGA delivers the bus width needed to attach large SDRAM for forwarding tables while keeping power dissipation manageable at 3.3V single supply.
おすすめ
ISDN Terminal Adapters and Modem Banks
ISDN terminal adapters and central-office modem banks rely on the MPC862PCVR66B's integrated HDLC controllers and TDM channels to terminate multiple D-channel and B-channel streams in parallel. The 66MHz core runs the upper-layer protocol stack (PPP, MLPPP, IP) while the CPM offloads channelised framing, keeping CPU headroom available. The 357-ball PBGA exposes PCM and serial interfaces for direct connection to codec/framer ICs, and the 3.3V single supply keeps the analog/digital power tree simple.
おすすめ
Embedded Industrial Control Systems
Embedded industrial control systems use the MPC862PCVR66B as a deterministic control processor where its integrated timers, interrupt controller, and dual-CPM peripherals provide deterministic response to field-bus events. The 66MHz speed is adequate for PID loops, SCADA protocol handling, and HMI refresh, while the 357-ball PBGA accommodates wide data buses and parallel I/O expansion. The -40C to +105C rating supports cabinet-mounted installations, and the legacy Power Architecture toolchain (CodeWarrior, Green Hills) is well supported in industrial software stacks.
おすすめ
VoIP Gateway and Media Server Platforms
VoIP gateways and small-form-factor media servers can use the MPC862PCVR66B as the system controller where its Power Architecture core runs the SIP/RTP stack while the integrated CPM handles TDM-to-IP conversion. The 66MHz clock provides sufficient headroom for 4-8 simultaneous G.711/G.729 voice channels and management-plane traffic. The 357-ball PBGA simplifies PCB routing of PCM buses, Ethernet MII, and external SDRAM/Flash, and the 3.3V supply pairs cleanly with codec and PHY ICs on the same rail.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC862PCVR66B — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC862PCVR50B | MPC862PVR66B | MPC860TVR66D4 | MPC860TZQ66D4 | MPC866PCVR100A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same family | 357-PBGA (25x25 mm) - same family | 357-PBGA (25x25 mm) - same family |
| Core Speed | 66 MHz | 50 MHz (-24%) | 66 MHz (same) | 66 MHz (same) | 66 MHz (same) | 100 MHz (+52%) |
| Core Architecture | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C (industrial) | -40C to +105C | -40C to +105C | -40C to +105C |
| CPM (Communications Processor Module) | Single CPM, HDLC | Single CPM, HDLC | Single CPM, HDLC | Single CPM, HDLC | Dual CPM, HDLC | Single CPM, HDLC |
| Lifecycle Status | Last-time-buy (NXP discontinued) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| RoHS Compliance | RoHS Compliant, Lead-free | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
主な差別化要因
- Single-CPM lower-cost variant vs MPC860T dual-CPM parts （vs MPC860TZQ66D4)
- 66MHz speed grade balances performance and cost vs 100MHz MPC866 （vs MPC866PCVR100A)
- Extended -40C to +105C temperature grade vs industrial MPC862PVR66B （vs MPC862PVR66B)
設計ノート
The 357-ball PBGA package at 1.27 mm ball pitch requires a minimum 6-layer PCB stack-up with continuous ground planes beneath the device for signal integrity and controlled-impedance routing of the external memory bus. Vias-in-pad are recommended for the inner-row balls to fan out the BGA escape routing, and the central power/ground balls must connect to internal planes with low-inductance paths. Follow the NXP application note on BGA land-pattern geometry for solder-mask-defined vs non-solder-mask-defined pads.
The MPC862PCVR66B requires a stable 3.3V supply with decoupling placed within 5 mm of each power-ball cluster. Place 100 nF X7R ceramic capacitors per power pin group, plus bulk 10 uF tantalum or polymer capacitors near the regulator output. The internal PLL requires a quiet analog 3.3VAVDD rail - isolate it with a ferrite bead from the digital 3.3V supply. Power sequencing should hold the core in reset until VCC is stable per the datasheet timing diagram.
At full 66MHz operation with sustained CPM activity, the MPC862PCVR66B can dissipate up to approximately 1.5-2 W depending on peripheral utilization. The 357-ball PBGA junction-to-ambient thermal resistance (theta_JA) is around 15-20 C/W with proper PCB copper pouring under the die. For industrial -40C to +105C environments, ensure the PCB bottom layer under the BGA has at least 4 square inches of continuous copper tied to the ground plane to spread heat. Forced-air cooling is recommended in enclosed cabinets.
Do not assume the MPC862PCVR66B is pin-compatible with newer NXP QorIQ devices (P1020, P2020) - the BGA ball maps differ completely and a drop-in replacement is impossible. Software written for the MPC8xx CPM must be re-validated when migrating to MPC866 or MPC885 because the peripheral register maps and interrupt priorities differ. Also note that 'PCV' vs 'PCE' suffixes denote temperature grade (-40C to +105C vs -40C to +125C), so substituting one for the other in automotive designs is invalid.
コンプライアンス情報
RoHS compliant and lead-free per DigiKey and Mouser listings. REACH and conflict-mineral status not explicitly stated in available data. AEC-Q100 not applicable - this is a communications MPU, not an automotive-qualified IC.
