NXP Semiconductors

MRF6V3090NR1 - 90W RF Power LDMOS 470-1215 MHz | NXP

部品番号: MRF6V3090NR1 ✓ 生産中
在庫あり 1〜3営業日以内に発送
50 V Vdss 350 mA Id TO-270 WB-4 (TO-272-4 family, ceramic air-cavity) Package 470 MHz to 1215 MHz Speed
開始価格 $59.9 USD / 個
MOQ: 1 |
価格更新日: 2026-10-15
ボリューム価格
数量 単価 小計
1 $87.5 $87.50
10 $81.2 $812.00
100 $73.8 $7,380.00
500 $66.4 $33,200.00
1,000 $59.9 $59,900.00
ℹ️ すべての価格はUSDです

MRF6V3090NR1 概要

The NXP MRF6V3090NR1 is a 90 W CW RF power N-channel enhancement-mode lateral MOSFET designed for broadband commercial and industrial broadcast applications across 470 to 1215 MHz, housed in the TO-270 WB-4 (TO-272-4 family) ceramic-air-cavity package. Per the NXP datasheet MRF6V3090N, the device is characterized for 50 V operation, delivers 22 dB typical gain at 860 MHz, and is rated for 90 W continuous-wave output power with 10:1 VSWR survivability across all phase angles. The MRF6V3090NR1 shares the same silicon and reference circuit family as MRF6V3090NR5 (tape-and-reel variant) and MRF6V3090NBR1 (narrower band tuning).

An RF power LDMOS (Laterally Diffused Metal-Oxide Semiconductor) transistor is a specialized high-power MOSFET optimized for RF amplification in the UHF band. Within the hierarchy LDMOS -> RF power MOSFET -> RF power transistor -> discrete semiconductor, LDMOS devices dominate broadcast, radar, and industrial-scientific-medical (ISM) RF power stages because they offer high gain, good efficiency, and ruggedness compared to older bipolar RF transistors. The MRF6V3090NR1's enhancement-mode gate structure simplifies biasing (no negative gate voltage needed to prevent conduction) while the lateral drain arrangement minimizes parasitic capacitance, enabling broadband operation.

Key features include 50 V drain-source breakdown, 90 W CW output at 860 MHz, 22 dB small-signal gain, integrated ESD protection, and gold metallization for high-temperature reliability. The ceramic TO-270 WB-4 air-cavity package provides very low lead inductance and excellent thermal transfer for high-duty-cycle broadcast service.

Architecturally, the MRF6V3090NR1 uses NXP's latest-generation LDMOS process, which places the drain contact laterally along the source to reduce hot-carrier injection and increase ruggedness under VSWR mismatch. The NXP datasheet MRF6V3090N provides series-equivalent large-signal impedance parameters for 470, 860, and 1215 MHz operation, enabling engineers to design the matching network around the device rather than reverse-engineering it on the bench.

Typical applications include UHF TV transmitter drivers, DVB-T/DVB-T2 broadband linear amplifiers, public-safety mobile-radio base stations, and ISM-band industrial heating. Its 10:1 VSWR tolerance makes it particularly suited to field installations where antenna mismatches are common.

When designing with this device, follow the reference circuit in the datasheet for impedance matching and bias sequencing. The TO-270 WB-4 package requires a bolted heatsink with proper torque, and the gate voltage must be sequenced before the drain voltage for safe hot-switching protection.

This page synthesizes distributor pricing, drop-in NXP-family alternatives, and broadcast RF design guidance not consolidated in the manufacturer datasheet.

ドロップイン代替品: MRF6V3090NR1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MRF6V3090NR1 (同一形状・フットプリント) — 相違点: Mounting Type, Transistor Type, Test Frequency, VSWR Tolerance.

NXP Semiconductors
Mounting Type: Surface Mount / Screw-Mount Chassis
VSWR Tolerance: 10:1 all phase angles, 50 V, 860 MHz, 90 W CW
比較対象 MRF6V3090NR1 →
NXP Semiconductors
Mounting Type: Surface Mount / Flange Mount with screws
Transistor Type: RF Power MOSFET, N-Channel Enhancement-Mode Lateral
Test Frequency: 450 MHz
比較対象 MRF6V3090NR1 →

クイック比較ツール — 並列比較する代替部品を選択:

MRF6V3090NR5

✅ ドロップイン
📦 TO-270 WB-4
Same die and package, differs only in reel quantity (R5 = 50-unit reel vs R1 = 500-unit reel)

📋 参考代替品(カタログ未掲載)

MRF6V3090NBR1

✅ ドロップイン
NXP Semiconductors
📦 TO-270 WB-4
N-Channel Enhancement-Mode Lateral MOSFET (LDMOS) · RF Power Amplifier · 470 MHz to 1215 MHz · 90 W at 860 MHz, 50 V · 22 dB at 860 MHz, 90 W CW · 50 V DC · 350 mA (test condition) · 10:1 all phase angles, 50 V, 860 MHz, 90 W CW

✓ 在庫あり

$44.5 / 個

データシートを見る →

MRF6V3090NBR5

✅ ドロップイン
📦 TO-270 WB-4
Same die as MRF6V3090NR1 (narrower-band tuning), differs in reel quantity (R5 = 50-unit reel)

📋 参考代替品(カタログ未掲載)

MRF6VP3091NR1

✅ ドロップイン
📦 TO-270 WB-4
Same TO-270 WB-4 family package, higher output power class (V P-series targeting ~100 W+ pulsed for avionics/DME), same 50 V LDMOS process

📋 参考代替品(カタログ未掲載)

MRF6V4300NBR5

✅ ドロップイン
NXP Semiconductors
📦 TO-270 WB-4 family
RF Power MOSFET, N-Channel Enhancement-Mode Lateral · NXP Semiconductors (formerly Freescale) · 110 V · 10 MHz to 600 MHz · 450 MHz · 300 W CW · 22 dB typical at 450 MHz, 50 V

✓ 在庫あり

$125 / 個

データシートを見る →

MRF6V3090NR1 最大定格&電気的特性

トランジスタタイプ N-Channel Enhancement-Mode Lateral MOSFET (LDMOS)
Technology LDMOS (Laterally Diffused MOSFET)
Drain-Source Voltage (VDS) 50 V
Continuous Drain Current (ID) 350 mA
Frequency Range 470 MHz to 1215 MHz
Test Frequency 860 MHz
Output Power (CW, Pout) 90 W
Power Gain (typical) 22 dB at 860 MHz
VSWR Tolerance 10:1, all phase angles @ 50 Vdc, 860 MHz, 90 W CW
Package Type TO-270 WB-4 (TO-272-4 family, ceramic air-cavity)
実装タイプ Surface Mount / Flange Mount with bolt-down heatsink
動作接合温度 -40C to +200C (max TJ)
Reel Quantity (R1 suffix) 500 per reel (R1 = 500 unit reel)

MRF6V3090NR1 ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 GATE1 — Gate input (parallel lead 1)
ピン 2 GATE2 — Gate input (parallel lead 2)
ピン 3 DRAIN1 — Drain output (parallel lead 1)
ピン 4 DRAIN2 — Drain output (parallel lead 2)
ピン FLANGE SOURCE — Source (flange / mounting bolts - electrical and thermal common)

安全動作領域 - DC

DC連続動作

主な用途

MRF6V3090NR1 の用途: 6 件s: UHF TV Transmitter Driver Stage, DVB-T/DVB-T2 Broadband Linear Amplifier, Public Safety / Mobile Radio Base Station PA, Industrial-Scientific-Medical (ISM) 915 MHz Power Amplifier, L-Band Avionics Transponder Driver (950-1215 MHz), UHF Digital TV Repeater / Gap-Filler Transmitter.

📺

UHF TV Transmitter Driver Stage

The MRF6V3090NR1 fits UHF TV transmitter driver stages in the 470-860 MHz DVB-T/DVB-T2 broadcast band where 90 W CW output at 22 dB gain and 50 V drain bias directly feeds the final power amplifier. Per the NXP datasheet MRF6V3090N, the device's 10:1 VSWR tolerance across all phase angles protects the driver stage when the final-stage output network is being tuned or when the antenna feed encounters mismatch. The ceramic TO-270 WB-4 air-cavity package supports the continuous 24/7 broadcast duty cycle required by regulated UHF TV transmitters. Pair with NXP MRF6V4300 series for the final amplifier when higher output power is needed.

📡

DVB-T/DVB-T2 Broadband Linear Amplifier

The MRF6V3090NR1's 470-1215 MHz frequency coverage and 22 dB gain make it a strong fit for broadband linear amplifiers in DVB-T and DVB-T2 OFDM transmitters, where the high PAPR of OFDM waveforms demands LDMOS linearity and ruggedness. Per the NXP datasheet MRF6V3090N, large-signal impedance parameters are characterized at 470, 860, and 1215 MHz reference points - giving design engineers a direct starting point for the output matching network that flattens gain across the UHF broadcast band. The 90 W CW rating supports both single-channel and multi-channel combining amplifier architectures.

🌐

Public Safety / Mobile Radio Base Station PA

The MRF6V3090NR1 delivers 90 W CW at 860 MHz with 22 dB gain, which fits public-safety and land-mobile-radio (LMR) base-station power amplifier stages operating in the 700/800 MHz bands (covered by the 470-1215 MHz device bandwidth). Per the NXP datasheet MRF6V3090N, the 10:1 VSWR tolerance ensures survival when the shared antenna system encounters tower-top mismatch, lightning-induced mismatch, or duplexer retune. The ceramic air-cavity package provides the thermal margin for continuous-duty base-station service. Engineers often pair this part with a small-signal pre-driver MRF9045 or similar LDMOS gain stage.

🏭

Industrial-Scientific-Medical (ISM) 915 MHz Power Amplifier

The MRF6V3090NR1 covers the 915 MHz ISM band within its 470-1215 MHz operating range, supporting 90 W CW output for industrial heating, drying, plastic welding, and RF plasma generation systems where the 902-928 MHz ISM allocation permits higher power than unlicensed Wi-Fi. Per the NXP datasheet MRF6V3090N, the 22 dB gain at 860 MHz extrapolates reasonably into the 915 MHz region with minor matching network adjustment. The TO-270 WB-4 flange mount simplifies integration into the heavy heatsinks typical of industrial RF generators. The 10:1 VSWR rating is essential in industrial environments where the work coil is a moving, mismatched load.

✈️

L-Band Avionics Transponder Driver (950-1215 MHz)

The MRF6V3090NR1 covers the 950-1215 MHz L-band used by Mode S transponders, DME interrogators, and ADS-B out transmitters in commercial aerospace applications. Per the NXP datasheet MRF6V3090N, large-signal impedance parameters are provided at 1215 MHz, giving avionics RF designers a known-good starting point for transponder final-stage matching. The 90 W CW rating supports pulsed-mode operation at higher instantaneous power for transponder interrogation pulses - a common use of CW-rated LDMOS in avionics. For pure-avionics variants see NXP's MRF6VP3091NR1 (P-suffix avionics grade).

📡

UHF Digital TV Repeater / Gap-Filler Transmitter

The MRF6V3090NR1 fits digital TV repeater and gap-filler transmitters that receive an off-air DVB-T signal and retransmit it on the same or adjacent channel to fill coverage holes in mountainous terrain or urban canyons. Per the NXP datasheet MRF6V3090N, the 90 W CW output and broadband 470-860 MHz response enable single-device PA stages for low-to-medium-power gap fillers, eliminating the need for combined amplifier chains. The flange-mount ceramic package allows field-replaceable assembly in outdoor repeater enclosures where maintenance access is limited. Use the NBR1 (narrower-band) variant when operating on a single fixed channel for better efficiency.

おすすめ製品の概要

MRF6V4300NBR5 NXP Semiconductors 使用用途: UHF TV Transmitter Driver Stage MRF6VP3091NR1 Avionics/DME-band companion part in same TO-270 WB-4 package 使用用途: UHF TV Transmitter Driver Stage, L-Band Avionics Transponder Driver (950-1215 MHz) MRF6V3090NBR1 NXP Semiconductors 使用用途: DVB-T/DVB-T2 Broadband Linear Amplifier, UHF Digital TV Repeater / Gap-Filler Transmitter MRF6V3090NR5 Identical device in 50-unit reel format for prototyping low-volume base stations 使用用途: Public Safety / Mobile Radio Base Station PA, UHF Digital TV Repeater / Gap-Filler Transmitter MRF6V3090NR1 NXP Semiconductors 使用用途: Industrial-Scientific-Medical (ISM) 915 MHz Power Amplifier
What is the output power of the MRF6V3090NR1 at 860 MHz?
The MRF6V3090NR1 delivers 90 W CW output power at 860 MHz when operated at 50 V drain bias with 22 dB typical gain. Per the NXP datasheet MRF6V3090N, the device is rated for 90 W continuous-wave output and survives 10:1 VSWR mismatches at all phase angles. This level targets UHF TV transmitter drivers, DVB-T broadband linear amplifiers, and industrial-scientific-medical (ISM) power stages.
What frequency range does the MRF6V3090NR1 cover?
The MRF6V3090NR1 covers 470 MHz to 1215 MHz, per the NXP datasheet MRF6V3090N. This includes the UHF TV broadcast band (470-860 MHz), the DVB-T/T2 mobile-broadcast band, and the lower L-band (950-1215 MHz) used in avionics transponders and DME. Large-signal impedance parameters are provided at 470, 860, and 1215 MHz reference points to simplify broadband matching network design.
What package does the MRF6V3090NR1 use and how is it mounted?
The MRF6V3090NR1 uses the TO-270 WB-4 ceramic air-cavity package (also referred to as TO-272-4 family). It is flange-mounted via two screw holes to a heatsink; the gate, drain, and source leads are flat ceramic-tab leads suitable for PCB launch. Per DigiKey, the full part designation is TO-270 WB-4. The ceramic-air-cavity construction minimizes lead inductance - critical for UHF stability - and provides excellent thermal transfer for continuous-wave broadcast duty.
Is the MRF6V3090NR1 RoHS compliant?
RoHS compliance status for the MRF6V3090NR1 was not explicitly stated in the Verified Web Data and is marked [DATA_NEEDED]. Ceramic-air-cavity RF power packages historically use lead-containing brazes for the ceramic-to-metal seal, which typically places them under RoHS exemption 7(a) for high-temperature solders in RF power devices. Engineers should request the RoHS declaration directly from NXP for binding documentation before qualifying the part for RoHS-restricted designs.
What is the difference between MRF6V3090NR1 and MRF6V3090NR5?
The MRF6V3090NR1 and MRF6V3090NR5 use identical silicon die and the same TO-270 WB-4 package, differing only in factory packaging format. The R1 suffix indicates a 500-unit reel while the R5 suffix indicates a 50-unit reel, per the NXP datasheet MRF6V3090N. Electrically and thermally they are drop-in equivalents - choose R1 for high-volume automated assembly and R5 for prototyping or low-volume builds.
What is the difference between MRF6V3090NR1 and MRF6V3090NBR1?
The MRF6V3090NR1 (NR1 suffix) targets broadband 470-860 MHz operation, while the MRF6V3090NBR1 (NBR1 suffix) is a narrower-band variant tuned for higher efficiency in a more limited frequency slice within the same 470-1215 MHz family. Per the NXP datasheet MRF6V3090N, both share the same 90 W, 22 dB, 50 V rating and the same TO-270 WB-4 package - they are drop-in pin compatible. Choose NR1 for broadband DVB-T/T2 and NBR1 when bandwidth is limited and you want maximum efficiency.
Where can I buy the MRF6V3090NR1 and what is the price?
The MRF6V3090NR1 is available at NXP authorized distributors including DigiKey (p/n 2508981, currently showing as NXP USA Inc. stock) and Mouser (currently in stock per their listing), with reference pricing starting around $87.50 USD at qty-1 as of 2026-10-16. Lead time for factory-direct orders from NXP typically runs 8-12 weeks for broadcast-grade parts. For small-quantity prototyping, Rochester Electronics also stocks obsolete/NXP-lifecycle parts.
What is the lead time for the MRF6V3090NR1?
The MRF6V3090NR1 lead time is typically 8-12 weeks when ordered factory-direct from NXP, because broadcast-grade LDMOS parts are often built to order rather than held in finished-goods inventory. Distributors such as DigiKey and Mouser typically hold small in-stock quantities (DigiKey shows current stock availability per their product page 2508981). For production volumes, place blanket orders with NXP six months ahead of build schedule.
Is the MRF6V3090NR1 in stock at distributors?
As of 2026-10-16, both DigiKey (product page 2508981) and Mouser list the MRF6V3090NR1 with current stock availability. NXP USA Inc. and Rochester Electronics LLC (Freescale legacy) both list the part. For production orders, verify stock first - broadcast RF power transistors can swing in and out of stock quickly as broadcast transmitter OEMs place large blanket orders.
How does the MRF6V3090NR1 compare to the MRF6V4300NBR5?
The MRF6V3090NR1 and MRF6V4300NBR5 differ in output power class: the MRF6V3090NR1 delivers 90 W CW at 860 MHz, while the MRF6V4300NBR5 is in NXP's higher-power MRF6V4300 family (4300 indicates a 430 W-class device family). Both share the same NXP LDMOS process generation and the same TO-270 WB-4-style ceramic flange package family but are not drop-in equivalents because internal matching networks differ. Choose MRF6V3090NR1 for sub-100 W applications and MRF6V4300NBR5 when you need 400 W class.
When should I choose MRF6V3090NR1 over the NBR1 variant?
Choose the MRF6V3090NR1 for broadband 470-860 MHz applications such as DVB-T/T2 transmitters, multi-channel UHF combining amplifiers, or any system requiring wide instantaneous bandwidth. Choose the MRF6V3090NBR1 when the operating bandwidth is narrower (typically a single UHF channel) and you want higher drain efficiency within that slice. Both share the TO-270 WB-4 package and 50 V / 22 dB / 90 W rating, making the choice a function of bandwidth-efficiency trade-off, not pin compatibility.
What is the best drop-in replacement for MRF6V3090NR1?
The best drop-in replacement for the MRF6V3090NR1 is the MRF6V3090NR5 - identical silicon die, identical TO-270 WB-4 package, identical 90 W / 22 dB / 50 V ratings, differing only in reel quantity (500 vs 50). For a cross-vendor option, no true drop-in exists in the same TO-270 WB-4 ceramic flange footprint from a different manufacturer; other broadcast LDMOS parts in this power class typically use different packages requiring PCB rework.
Where can I download the MRF6V3090NR1 datasheet PDF?
The official NXP datasheet for the MRF6V3090NR1 is available at https://www.nxp.com/docs/en/data-sheet/MRF6V3090N.pdf - it covers all four variants (MRF6V3090NR1, MRF6V3090NR5, MRF6V3090NBR1, MRF6V3090NBR5) including large-signal impedance tables at 470/860/1215 MHz, reference circuits, and bias sequencing recommendations. Mouser also hosts a copy at https://www.mouser.com/datasheet/2/161/MRF6V3090N-74821.pdf.
What is the MRF6V3090NR1 pinout?
The MRF6V3090NR1 pinout in the TO-270 WB-4 package assigns two leads each to gate, drain, and source for low-inductance parallel connection. Per the NXP datasheet MRF6V3090N, the gate leads are on one side of the ceramic body and the drain leads on the opposite side, with source leads on the flange. The two-bolt mounting pattern is symmetrical. Always verify against the datasheet mechanical drawing before PCB layout, as lead numbering conventions vary by manufacturer.
What are the key specifications of MRF6V3090NR1 that broadcast engineers should know?
The MRF6V3090NR1's key broadcast specifications are: 90 W CW output at 860 MHz, 22 dB power gain, 50 V drain bias, 350 mA quiescent drain current rating, and 10:1 VSWR survivability across all phase angles. Per the NXP datasheet MRF6V3090N, the device operates from 470-1215 MHz with large-signal impedance data provided at three reference points. The ceramic TO-270 WB-4 air-cavity package supports continuous-wave duty cycles and is flange-mounted for low thermal resistance.

エンジニアリング参考データ: MRF6V3090NR1 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MRF6V3090NR1 when you need 90 W CW RF power across the full 470-860 MHz UHF TV broadcast band (or extended L-band up to 1215 MHz) with 22 dB gain and 50 V drain bias in a ceramic flange-mount package. It is the right pick for DVB-T/T2 transmitter drivers, broadband linear amplifiers, public-safety base stations, ISM 915 MHz industrial heating, and UHF digital TV repeaters. Choose MRF6V3090NBR1 instead when operating on a single fixed UHF channel and you need maximum efficiency within that slice. Choose MRF6V3090NR5 (50-unit reel) for low-volume prototyping rather than high-volume automated assembly. Choose MRF6VP3091NR1 for pulsed-mode avionics transponder designs. Choose MRF6V4300NBR5 when your design needs 430 W-class output power in the same package family - all variants share the TO-270 WB-4 ceramic flange footprint, enabling PCB and heatsink reuse.

代替品との比較

パラメータ この製品 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5 MRF6VP3091NR1 MRF6V4300NBR5
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package TO-270 WB-4 TO-270 WB-4 - same TO-270 WB-4 - same TO-270 WB-4 - same TO-270 WB-4 - same TO-270 WB-4 family - same
Drain-Source Voltage 50 V 50 V 50 V 50 V 50 V 50 V
Reel Quantity 500 (R1) 50 (R5) 500 (R1) 50 (R5) 500 (R1) 50 (R5)

主な差別化要因

  • 90 W CW at 860 MHz with 22 dB gain - broadband across 470-1215 MHz (vs MRF6V3090NBR1)
  • Same TO-270 WB-4 package family as higher-power MRF6V4300 series (vs MRF6V4300NBR5)
  • 10:1 VSWR survivability at full 90 W CW (vs MRF6VP3091NR1)

設計ノート

The TO-270 WB-4 ceramic air-cavity package requires a bolted heatsink with proper torque (typically 0.5-0.7 N-m per the NXP application note family for similar parts) and a thin layer of thermal compound such as Wakefield-Vol 128 or Shin-Etsu X23-7921-5. At 90 W CW output with typical 50% drain efficiency, the device dissipates roughly 90 W of heat - requiring a substantial extruded heatsink or cold-plate. Estimated dissipation based on 90 W output / 0.5 efficiency - verify with manufacturer thermal curves before final mechanical design. Junction temperature must stay below 200 C per datasheet absolute maximum.

Design the input and output matching networks on low-loss PCB substrate (Rogers RO4350B or RO4003C recommended for UHF, not FR-4) per the reference circuit in NXP datasheet MRF6V3090N. The gate and drain leads each have two parallel pads - both must be bonded to the matching network with minimal trace length to suppress common-mode inductance. Add DC-blocking capacitors on gate and drain paths and RF chokes to gate and drain bias feeds; the NXP reference circuit shows exact component values for 470/860/1215 MHz.

The flange-mount bolt pattern is the SOURCE connection electrically as well as the thermal path. Use stainless-steel M2 or M2.5 screws with star washers to ensure low-inductance source grounding. Maintain at least 3 mm clearance between the ceramic body and surrounding copper to prevent arcing at 90 W output. Place gate and drain bias feed networks on opposite sides of the device to maximize isolation and prevent positive feedback oscillation, which is a common failure mode for high-gain UHF LDMOS designs.

Always sequence gate voltage ON before drain voltage ON, and drain voltage OFF before gate voltage OFF - the NXP datasheet MRF6V3090N recommends this order to prevent hot-switching damage. Never operate without a 50 V drain supply present; if the drain voltage collapses (e.g., due to a blown fuse upstream), immediately remove the gate bias. Avoid operating at 50 V drain with open drain load - the resulting VSWR can exceed 10:1 and damage the device even with its 10:1 rating. For pulsed applications, verify the duty cycle and pulse width stay within the SOA curve provided in the datasheet.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
鉛フリー
Unknown
ハロゲンフリー
Unknown
紛争鉱物
Unknown

Compliance status not explicitly stated in the Verified Web Data. Ceramic-air-cavity RF power packages historically fall under RoHS exemption 7(a) for high-melting-point solders used in the ceramic-to-metal seal. AEC-Q100 not applicable (this is a discrete RF power transistor, not an automotive-grade IC). Engineers must request the latest RoHS/REACH declaration from NXP for binding compliance documentation.

データ検証日: 2026-10-16 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MRF6V3090NR1 MRF6V3090NR1 datasheet NXP MRF6V3090NR1 90W RF LDMOS 860 MHz TO-270 WB-4 RF power transistor DVB-T transmitter driver LDMOS MRF6V3090NR1 vs MRF6V3090NBR1 MRF6V3090NR1 drop-in replacement MRF6V3090NR1 buy price stock UHF TV broadcast RF power amplifier what is the output power of MRF6V3090NR1 MRF6V3090NR1 pinout TO-270

関連部品&用語

NXP Semiconductors MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5 MRF6VP3091NR1 MRF6V4300NBR5 Freescale Semiconductor LDMOS laterally diffused MOSFET RF power transistor UHF TV transmitter DVB-T DVB-T2 continuous-wave VSWR TO-270 WB-4 TO-272-4 ceramic air-cavity package flange mount ISM band avionics transponder ADS-B DME broadcast RF amplifier
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