NXP Semiconductors

MRF8S21100HSR3 - 100W RF Power MOSFET, 2.11-2.17 GHz | NXP

部品番号: MRF8S21100HSR3 ✓ 生産中
在庫あり 1〜3営業日以内に発送
65 V Vdss NI-780S (Case 465A-06), 3-pin ceramic flange Package 2110 MHz to 2170 MHz Speed
開始価格 $65 USD / 個
MOQ: 1 |
価格更新日: 2026-10-15
ボリューム価格
数量 単価 小計
1 $95 $95.00
10 $86.5 $865.00
50 $78.2 $3,910.00
100 $71.4 $7,140.00
500 $65 $32,500.00
ℹ️ すべての価格はUSDです

MRF8S21100HSR3 概要

The NXP MRF8S21100HSR3 is a 28 V N-channel enhancement-mode lateral RF power MOSFET designed for W-CDMA and LTE base-station applications across the 2110-2170 MHz band, rated for 24 W average output power (W-CDMA) and 100 W peak in a NI-780S (Case 465A-06) ceramic package. It is characterized under 100% PAR-tested conditions for guaranteed output capability and supports both Class AB and Class C operation across the cellular base-station modulation formats.

An RF power MOSFET is a lateral-diffusion metal-oxide-semiconductor transistor built on a high-resistivity silicon substrate with a low-parasitic leadless ceramic package optimized for RF matching and thermal dissipation. Within the broader hierarchy, it sits below RF transistor -> power transistor -> discrete semiconductor, with N-channel enhancement-mode operation providing fail-safe bias behavior at gate threshold.

Key features include 18.3 dB typical power gain at 2.14 GHz, 65 V drain-source breakdown voltage (V(BR)DSS), and operation from a 28 V nominal supply. The device is characterized with a series-equivalent large-signal model to simplify Doherty and single-ended PA circuit simulation. Built-in ESD protection and integrated gate-source clamping diodes simplify board design.

Architecturally, the MRF8S21100HSR3 uses laterally diffused metal-oxide-semiconductor (LDMOS) technology with optimized source-via grounding through the ceramic package flange. This geometry minimizes common-source inductance, which is critical at 2.1 GHz where even fractional-nH parasitic losses degrade gain and PAE. Thermal performance is delivered through the NI-780S ceramic flange that bolts directly to the heatsink.

Typical applications include W-CDMA/LTE macro-cell base-station PAs, Doherty final-stage amplifiers, and 2110-2170 MHz band UMTS/3GPP signal-chain transmit sections where linear efficiency is required. The wide bandwidth also makes it suitable for driver stages in multi-band radio units.

When designing with this part, ensure the input and output matching networks are designed for the 2110-2170 MHz band with low-loss substrate; gate bias should be set to Class AB (approximately 2.7 V) for W-CDMA linearity. The flange temperature must remain below the maximum rating during continuous W-CDMA operation.

This page synthesizes NXP official datasheet parameters, distributor pricing as of 2026-10-16, drop-in alternatives within the same NI-780S footprint, and practical design notes not found in the manufacturer datasheet alone.

ドロップイン代替品: MRF8S21100HSR3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MRF8S21100HSR3 (同一形状・フットプリント) — 相違点: Mounting Type, Transistor Type, Frequency Range, Manufacturer, Operating Mode.

NXP Semiconductors
Mounting Type: Surface Mount / bolt-down flange
Transistor Type: LDMOS (N-Channel Enhancement-Mode Lateral MOSFET)
Operating Mode: Class AB (PCN/PCS/cellular, WLL, TD-SCDMA)
比較対象 MRF8S21100HSR3 →
NXP Semiconductors
Mounting Type: Surface Mount (plastic overmold)
Transistor Type: LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Manufacturer: NXP Semiconductors (formerly Freescale Semiconductor)
比較対象 MRF8S21100HSR3 →
NXP Semiconductors
Mounting Type: Through-hole flange-mount with screw attachment
Frequency Range: 2500 MHz to 2700 MHz
比較対象 MRF8S21100HSR3 →
NXP Semiconductors
Transistor Type: LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Manufacturer: NXP Semiconductors
比較対象 MRF8S21100HSR3 →
NXP Semiconductors
Frequency Range: 2110-2170 MHz
Manufacturer: NXP Semiconductors (formerly Freescale)
Operating Mode: Class AB / Class C
比較対象 MRF8S21100HSR3 →

クイック比較ツール — 並列比較する代替部品を選択:

MRF8S21100HR3

✅ ドロップイン
📦 NI-780S (Case 465A-06)
same NI-780S package, same die, H vs HS tape-and-reel orientation only

📋 参考代替品(カタログ未掲載)

MRF8S21120HSR3

✅ ドロップイン
NXP Semiconductors
📦 NI-780S (Case 465A-06)
NXP Semiconductors (formerly Freescale) · MRF8S21120HSR3 · N-Channel Enhancement-Mode Lateral RF Power MOSFET · 2110-2170 MHz · 28 W average, W-CDMA / LTE · 65 V · 28 V · 17.6 dB at 2.17 GHz

✓ 在庫あり

$59.95 / 個

データシートを見る →

MRF8S18120HSR3

✅ ドロップイン
NXP Semiconductors
📦 NI-780S (Case 465A-06)
NXP Semiconductors · MRF8S18120HSR3 · LDMOS, N-Channel Enhancement-Mode Lateral MOSFET · 65 V · 28 V · 800 mA · 1805 MHz to 1880 MHz · 1.81 GHz

✓ 在庫あり

$65 / 個

データシートを見る →

MRF8S21200HSR3

✅ ドロップイン ⚠️ 仕様未検証
📦 NI-780S (Case 465A-06)
same NI-780S package, ~100% higher peak output power (200 W vs 100 W) for higher-power Doherty finals

📋 参考代替品(カタログ未掲載)

MRF8P26080HSR3

✅ ドロップイン
NXP Semiconductors
📦 NI-780S (Case 465A-06)
N-Channel Enhancement-Mode Lateral MOSFET · Gen8 LDMOS (Silicon, Lateral) · 2500 MHz to 2700 MHz · 14 W (W-CDMA, single-carrier) · 80 W · 65 V · 28 V nominal · Typical Doherty Single-Carrier W-CDMA

✓ 在庫あり

$99.85 / 個

データシートを見る →

MRF8S21100HSR3 最大定格&電気的特性

トランジスタタイプ N-Channel Enhancement-Mode Lateral MOSFET
Technology LDMOS (Laterally Diffused MOSFET)
Drain-Source Voltage (V(BR)DSS) 65 V
Operating Drain Voltage (VDD) 28 V nominal
Frequency Range 2110 MHz to 2170 MHz
Test Frequency 2.14 GHz
Output Power (CW, typical) 100 W
Average Output Power (W-CDMA) 24 W
Power Gain (typ) 18.3 dB at 2.14 GHz
パッケージ / ケース NI-780S (Case 465A-06), 3-pin ceramic flange
Configuration Single, push-pull N/A
実装タイプ Chassis / flange mount, screw-down
Operating Class Class AB or Class C
Application W-CDMA, LTE base-station power amplifiers
RoHS ステータス Compliant (per NXP product family)
Lead-Free Yes

MRF8S21100HSR3 ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 Gate — RF input / gate bias
ピン 2 Drain — RF output / drain supply (VDD)
ピン 3 Source — Source / flange ground (chassis-mounted)

安全動作領域 (estimated from datasheet ratings)

DC連続動作

主な用途

MRF8S21100HSR3 の用途: 6 件s: W-CDMA Macro-Cell Base Station PA, LTE Band 1 Doherty Final Stage, UMTS Band 1 Driver Stage, Multi-Band Radio Unit Final PA, Public-Safety / Private LTE PA, 3GPP Test Equipment Amplifier.

🌐

W-CDMA Macro-Cell Base Station PA

The MRF8S21100HSR3 is purpose-built for 2.11-2.17 GHz W-CDMA macro-cell base-station final-stage power amplifiers, where its 24 W average W-CDMA output capability directly translates into the headline Pout of a sector antenna. The 18.3 dB typical gain at 2.14 GHz eliminates the need for an intermediate driver stage, simplifying the PA chain. The 100% PAR-tested characterization guarantees linear performance under 3GPP test models without additional design margin, reducing per-board qualification cost. The 28 V LDMOS supply rail matches standard macro-cell BTS rectifier outputs, and the 65 V V(BR)DSS provides robust VSWR tolerance for outdoor tower-top installations.

📡

LTE Band 1 Doherty Final Stage

In a Doherty final-stage architecture for LTE Band 1 (2110-2170 MHz), the MRF8S21100HSR3 serves as either the carrier (main) amplifier or peaking amplifier. Its 18.3 dB gain and Class AB / Class C dual-mode capability allow the same part to populate both amplifier positions in the Doherty pair, simplifying BOM and inventory. NXP provides a series-equivalent large-signal model that enables accurate Doherty load-line simulation prior to PCB fabrication. The 28 V rail and 65 V breakdown give ample headroom for peaking-stage voltage swings at the load-modulation peak, preserving linearity at 3GPP TM3.1 ACLR targets while maintaining high backoff efficiency.

🖥️

UMTS Band 1 Driver Stage

Used as a driver stage feeding a higher-power final amplifier in UMTS Band 1 radio units, the MRF8S21100HSR3 provides 18.3 dB of small-signal gain at 2.14 GHz with excellent linearity. The ceramic NI-780S flange bolts directly to the system heatsink, supporting continuous W-CDMA operation at 24 W average without thermal runaway. Because the part shares the NI-780S footprint with other family members, the same PCB layout can be reused across 100 W and 120 W Pout variants, allowing a single board design to serve multiple product tiers.

📱

Multi-Band Radio Unit Final PA

In a multi-band remote radio unit (RRU) supporting 2.11-2.17 GHz along with adjacent bands, the MRF8S21100HSR3 occupies the Band 1 PA slot with the same mechanical and thermal interface as other NI-780S family devices on different bands. The standard 28 V rail simplifies shared power-conversion design across the radio. Its lateral N-channel enhancement-mode topology with integrated ESD protection reduces external component count on the PA board, supporting the aggressive size-and-cost targets of small-cell and AAS deployments.

🏭

Public-Safety / Private LTE PA

Public-safety LTE networks operating in Band 14 or shared Band 1 spectrum benefit from the MRF8S21100HSR3's 24 W W-CDMA/LTE average output combined with rugged 65 V breakdown, which is essential for VSWR-mismatch tolerance in mobile vehicular and fixed-installation scenarios. The 28 V supply rail accepts standard vehicle 24 V busses after filtering, enabling rapid deployment in emergency-response vehicle repeaters and portable base stations. The 100% PAR-tested characterization ensures that critical public-safety voice and data links meet mission-critical availability targets.

🛰️

3GPP Test Equipment Amplifier

For laboratory-grade 3GPP test equipment such as device emulators and conformance-test PA chains, the MRF8S21100HSR3 provides a known-good, datasheet-characterized amplification path at 2.11-2.17 MHz. The NXP-supplied series-equivalent large-signal model and S-parameter files enable full simulation of the test bed before hardware is committed, accelerating instrument development. The 100 W CW capability supports the high-peak test signals needed for receiver-desensitization and blocking-test setups, while the 24 W W-CDMA average rating matches typical device-under-test maximum input drive levels.

おすすめ製品の概要

MRF8S21100HR3 Same die, alternate tape orientation 使用用途: W-CDMA Macro-Cell Base Station PA, LTE Band 1 Doherty Final Stage, Public-Safety / Private LTE PA MRF8S21120HSR3 NXP Semiconductors 使用用途: W-CDMA Macro-Cell Base Station PA, UMTS Band 1 Driver Stage, 3GPP Test Equipment Amplifier MRF8P26080HSR3 NXP Semiconductors 使用用途: Multi-Band Radio Unit Final PA
What is the operating frequency range of MRF8S21100HSR3?
The MRF8S21100HSR3 operates from 2110 MHz to 2170 MHz, covering the full UMTS Band 1 / 3GPP LTE Band 1 downlink and uplink spectrum. According to the NXP datasheet MRF8S21100H, the device is characterized at 2.14 GHz test frequency and is suitable for W-CDMA, LTE, and other 2.1 GHz cellular base-station modulation formats in Class AB or Class C operation.
What is the average output power of MRF8S21100HSR3 in W-CDMA?
The MRF8S21100HSR3 delivers 24 W average output power under W-CDMA modulation at 28 V supply. Peak (saturated) CW capability reaches 100 W. Per the NXP datasheet MRF8S21100H, the part is 100% PAR-tested to guarantee this output capability, which is the headline metric for macro-cell PA designers evaluating Doherty final-stage linearity.
What is the power gain of MRF8S21100HSR3 at 2.14 GHz?
The MRF8S21100HSR3 delivers 18.3 dB typical power gain at 2.14 GHz under W-CDMA drive conditions. This level of gain is sufficient to drive a 24 W average PA from a small-signal front-end stage without intermediate driver amplifiers, simplifying multi-stage PA chain design.
What is the difference between MRF8S21100HSR3 and MRF8S21100HR3?
The MRF8S21100HR3 and MRF8S21100HSR3 share the same silicon die and electrical performance; the HSR3 suffix indicates tape-and-reel packaging orientation for the NI-780S ceramic package. Both parts are covered in the same datasheet (MRF8S21100H.pdf) and are drop-in compatible on the same PCB footprint and heatsink pattern.
What is the difference between MRF8S21100HSR3 and MRF8S21120HSR3?
The MRF8S21100HSR3 and MRF8S21120HSR3 are both NXP RF power LDMOS transistors in the NI-780S ceramic package, but the MRF8S21120HSR3 targets a higher output power level (approximately 120 W peak). The MRF8S21100 is the 100 W-class member of the family; for designs requiring more headroom the 21120 is a closer match, while the 21100 is sufficient for typical 24 W W-CDMA average applications.
What is the best drop-in replacement for MRF8S21100HSR3?
The closest drop-in replacement is the MRF8S21100HR3 from NXP, which shares the same NI-780S ceramic package and identical die. For higher-output variants in the same package footprint, MRF8S21120HSR3 (120 W) provides design headroom. Cross-brand equivalents such as the Freescale MRF8P26080 series are NOT drop-in due to different package outlines.
Where can I buy MRF8S21100HSR3 and what is the lead time?
The MRF8S21100HSR3 is available through authorized distributors including Mouser, DigiKey, and Octopart-listed resellers. Rochester Electronics is shown as an authorized stock source on DigiKey. Pricing as of 2026-10-16 starts near $95 unit / $65 at 500-piece quantities. Lead time for ceramic-flange RF MOSFETs is typically 6-10 weeks from authorized channels due to the specialty packaging.
Is MRF8S21100HSR3 the same as MRF8S18120HSR3?
No. The MRF8S21100HSR3 covers 2110-2170 MHz (UMTS/LTE Band 1) at 100 W peak / 24 W W-CDMA average, while the MRF8S18120HSR3 covers 1805-1880 MHz (DCS/PCS) at 120 W peak. They share the NI-780S package family but target different cellular bands and are not interchangeable without re-matching the output network.
Where can I download the MRF8S21100HSR3 datasheet PDF?
The official NXP datasheet is available as a free PDF at https://www.nxp.com/docs/en/data-sheet/MRF8S21100H.pdf. This document covers both the MRF8S21100HR3 and MRF8S21100HSR3 variants and includes S-parameter tables, large-signal model files, application circuit examples, and mechanical drawings for the NI-780S ceramic package.
What package does MRF8S21100HSR3 use and how is it mounted?
The MRF8S21100HSR3 is supplied in the NI-780S ceramic flange package (JEDEC Case 465A-06) with 3 leads (gate, drain, source). The package flange is bolted directly to the system heatsink using standard M3 hardware, and the ceramic body provides low-loss lead inductance critical at 2.1 GHz. Proper torque (per NXP application note) is required for reliable thermal contact.
Can MRF8S21100HSR3 be used in a Doherty amplifier?
Yes. The MRF8S21100HSR3 is widely deployed as the main (carrier) or peaking amplifier in Doherty final-stage PA designs for 2110-2170 MHz macro-cell base stations. Its 100% PAR-tested characterization and series-equivalent large-signal model support Doherty simulation with high confidence. Peaking-stage bias should be set to Class C for proper load modulation.
What is the breakdown voltage of MRF8S21100HSR3?
The MRF8S21100HSR3 has a drain-to-source breakdown voltage V(BR)DSS of 65 V, well above the 28 V nominal operating drain voltage. This provides substantial over-voltage margin against load VSWR transients and supply spikes typical in cellular base-station environments, an important ruggedness criterion for outdoor radio units.
When should I choose MRF8S21100HSR3 over MRF8P26080HSR3?
Choose MRF8S21100HSR3 when designing a 2.11-2.17 GHz UMTS/LTE Band 1 PA at 24 W average W-CDMA output with 100 W peak capability. Choose the MRF8P26080HSR3 instead when the design targets the 2600-2690 MHz LTE Band 7 spectrum at 80 W peak. Both are NXP LDMOS parts but operate in non-overlapping frequency bands and require different matching networks.
What class of operation does MRF8S21100HSR3 support?
The MRF8S21100HSR3 supports both Class AB and Class C operation per the NXP datasheet. Class AB (with gate bias around 2.7 V for quiescent IDQ) is used for W-CDMA/LTE linear amplification, while Class C bias (zero or slightly negative quiescent current) is used for constant-envelope applications such as driver stages or peak-power CW amplifiers.
Is MRF8S21100HSR3 RoHS compliant?
Yes. According to the NXP MRF8S21100 family datasheet and product page, the MRF8S21100HSR3 is RoHS compliant and lead-free. The ceramic NI-780S package contains no lead-bearing solder and complies with current RoHS exemption rules for high-frequency RF power transistors where lead-bearing die-attach alternatives are still in technical evaluation.

エンジニアリング参考データ: MRF8S21100HSR3 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MRF8S21100HSR3 when designing a 2110-2170 MHz UMTS/LTE Band 1 macro-cell or small-cell base-station PA requiring 24 W W-CDMA average and 100 W peak output. The 18.3 dB gain simplifies multi-stage PA design and the NI-780S ceramic package provides a robust mechanical and thermal interface for outdoor radio units. Choose the MRF8S21100HR3 instead when your manufacturing flow prefers its specific tape-and-reel orientation - it is the same die and is a true drop-in replacement. Choose the MRF8S21120HSR3 for higher-power Doherty finals requiring 120 W peak output. Choose the MRF8S18120HSR3 or MRF8P26080HSR3 for 1800 MHz DCS/PCS or 2600 MHz Band 7 designs respectively - these share the NI-780S footprint but require completely different matching networks.

代替品との比較

パラメータ この製品 MRF8S21100HR3 MRF8S21120HSR3 MRF8S18120HSR3 MRF8S21200HSR3 MRF8P26080HSR3
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package NI-780S (Case 465A-06) NI-780S (Case 465A-06) - same NI-780S (Case 465A-06) - same NI-780S (Case 465A-06) - same NI-780S (Case 465A-06) - same NI-780S (Case 465A-06) - same
Frequency Range 2110-2170 MHz 2110-2170 MHz 2110-2170 MHz 1805-1880 MHz 2110-2170 MHz 2600-2690 MHz
Peak Output Power (CW) 100 W 100 W 120 W 120 W 200 W 80 W
Drain Voltage (VDD) 28 V 28 V 28 V 28 V 28 V 28 V
V(BR)DSS 65 V 65 V 65 V 65 V 65 V 65 V

主な差別化要因

  • Hundred-percent PAR-tested characterization (vs MRF8S21100HR3)
  • Higher output-power variant available in same footprint (vs MRF8S21120HSR3)
  • 100 W-class with W-CDMA-specific characterization (vs MRF8P26080HSR3)

設計ノート

Estimated: at 28 V VDD, 24 W W-CDMA average output, and ~38% PAE, internal dissipation reaches approximately (Pout/PAE - Pout) ~ 39 W during W-CDMA. The NI-780S ceramic flange must be bolted to a heatsink sized to keep flange temperature below the maximum rating. Apply uniform thermal compound and follow NXP mounting torque specifications (typically 1.0-1.2 N-m for M3 hardware) to avoid localized thermal resistance.

Estimated: at 2.14 GHz, every 1 nH of common-source inductance reduces gain by approximately 0.5 dB and degrades stability. Use multiple low-inductance source vias directly under the package flange and keep gate/drain leads to microstrip traces as short as possible. Use Rogers RO4350B or RO4003C substrate (not FR-4) for predictable RF performance above 2 GHz; the dielectric constant tolerance of FR-4 at 2.1 GHz typically shifts matching by more than 10%.

Do not exceed 65 V drain transient at any time, including during output VSWR mismatch events. Always include a gate-series resistor (typically 5-10 ohm) for RF stability and to dampen parametric oscillations at high gain. Bias sequencing is not strictly required for enhancement-mode LDMOS (unlike depletion-mode GaN), but a controlled gate ramp prevents in-rush transients on the supply rail.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS and lead-free compliance per NXP MRF8S21100 family product page; halogen-free status not specifically published for the ceramic NI-780S package. AEC-Q100 not applicable - this is a base-station / infrastructure RF power MOSFET, not an automotive-grade part.

データ検証日: 2026-10-16 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MRF8S21100HSR3 MRF8S21100HSR3 datasheet NXP MRF8S21100HSR3 RF power MOSFET 2.1 GHz 100W NI-780S LDMOS W-CDMA base station amplifier MRF8S21100HSR3 vs MRF8S21120HSR3 MRF8S21100HSR3 drop-in replacement MRF8S21100HSR3 price buy Doherty amplifier 2110-2170 MHz NXP MRF8S21100HSR3 NI-780S pinout NXP RF power transistor LTE Band 1

関連部品&用語

NXP Semiconductors MRF8S21100HSR3 MRF8S21100HR3 MRF8S21120HSR3 MRF8S18120HSR3 MRF8S21200HSR3 MRF8P26080HSR3 RF power MOSFET LDMOS N-channel enhancement-mode transistor lateral MOSFET W-CDMA LTE 3GPP UMTS Band 1 LTE Band 1 NI-780S ceramic package Case 465A-06 Doherty amplifier Class AB Class C VSWR PAE (power-added efficiency) PSRR (power supply rejection ratio) S-parameter RoHS base-station power amplifier macro-cell BTS remote radio unit (RRU)
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